JP2006049859A5 - - Google Patents
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- Publication number
- JP2006049859A5 JP2006049859A5 JP2005189573A JP2005189573A JP2006049859A5 JP 2006049859 A5 JP2006049859 A5 JP 2006049859A5 JP 2005189573 A JP2005189573 A JP 2005189573A JP 2005189573 A JP2005189573 A JP 2005189573A JP 2006049859 A5 JP2006049859 A5 JP 2006049859A5
- Authority
- JP
- Japan
- Prior art keywords
- film
- semiconductor device
- thin film
- element group
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000010408 film Substances 0.000 claims 33
- 239000004065 semiconductor Substances 0.000 claims 28
- 239000010409 thin film Substances 0.000 claims 22
- 238000000034 method Methods 0.000 claims 16
- 238000004519 manufacturing process Methods 0.000 claims 15
- 239000000463 material Substances 0.000 claims 14
- 239000000758 substrate Substances 0.000 claims 10
- 238000000926 separation method Methods 0.000 claims 3
- 208000031872 Body Remains Diseases 0.000 claims 2
- 229910052581 Si3N4 Inorganic materials 0.000 claims 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 1
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 238000005530 etching Methods 0.000 claims 1
- 229910052736 halogen Inorganic materials 0.000 claims 1
- -1 halogen fluoride Chemical class 0.000 claims 1
- 239000007788 liquid Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 238000007650 screen-printing Methods 0.000 claims 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims 1
- 229910052814 silicon oxide Inorganic materials 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005189573A JP2006049859A (ja) | 2004-06-29 | 2005-06-29 | 半導体装置およびその作製方法 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004192117 | 2004-06-29 | ||
| JP2005189573A JP2006049859A (ja) | 2004-06-29 | 2005-06-29 | 半導体装置およびその作製方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012185122A Division JP5509280B2 (ja) | 2004-06-29 | 2012-08-24 | 半導体装置の作製方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2006049859A JP2006049859A (ja) | 2006-02-16 |
| JP2006049859A5 true JP2006049859A5 (de) | 2008-06-19 |
Family
ID=36027999
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005189573A Withdrawn JP2006049859A (ja) | 2004-06-29 | 2005-06-29 | 半導体装置およびその作製方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2006049859A (de) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5469799B2 (ja) * | 2006-03-15 | 2014-04-16 | 株式会社半導体エネルギー研究所 | 無線通信によりデータの交信を行う半導体装置 |
| JP2010026457A (ja) * | 2008-07-24 | 2010-02-04 | Technology Research Association For Advanced Display Materials | 薄膜半導体基板およびその製造装置 |
| KR20100027526A (ko) * | 2008-09-02 | 2010-03-11 | 삼성전기주식회사 | 박막 소자 제조방법 |
| KR101004849B1 (ko) | 2008-09-02 | 2010-12-28 | 삼성전기주식회사 | 박막소자 제조방법 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1159036A (ja) * | 1997-08-21 | 1999-03-02 | Hitachi Maxell Ltd | 非接触ｉｃカード及びその製造方法 |
| FR2781925B1 (fr) * | 1998-07-30 | 2001-11-23 | Commissariat Energie Atomique | Transfert selectif d'elements d'un support vers un autre support |
| JP4748859B2 (ja) * | 2000-01-17 | 2011-08-17 | 株式会社半導体エネルギー研究所 | 発光装置の作製方法 |
| JP2002236896A (ja) * | 2001-02-07 | 2002-08-23 | Toppan Printing Co Ltd | ヒートシール性を有するｉｃタグ |
| JP4211256B2 (ja) * | 2001-12-28 | 2009-01-21 | セイコーエプソン株式会社 | 半導体集積回路、半導体集積回路の製造方法、電気光学装置、電子機器 |
-
2005
- 2005-06-29 JP JP2005189573A patent/JP2006049859A/ja not_active Withdrawn
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