JP2006045523A5 - - Google Patents
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- Publication number
- JP2006045523A5 JP2006045523A5 JP2005188276A JP2005188276A JP2006045523A5 JP 2006045523 A5 JP2006045523 A5 JP 2006045523A5 JP 2005188276 A JP2005188276 A JP 2005188276A JP 2005188276 A JP2005188276 A JP 2005188276A JP 2006045523 A5 JP2006045523 A5 JP 2006045523A5
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin composition
- composition according
- photocationically polymerizable
- polymerizable epoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 claims 31
- 229920000647 polyepoxide Polymers 0.000 claims 31
- 239000000203 mixture Substances 0.000 claims 22
- 238000010538 cationic polymerization reaction Methods 0.000 claims 9
- 239000003112 inhibitor Substances 0.000 claims 6
- -1 aromatic sulfonium salt Chemical class 0.000 claims 5
- 150000001875 compounds Chemical class 0.000 claims 5
- 238000004132 cross linking Methods 0.000 claims 4
- 125000003700 epoxy group Chemical group 0.000 claims 4
- 125000003709 fluoroalkyl group Chemical group 0.000 claims 4
- 125000001424 substituent group Chemical group 0.000 claims 4
- 239000002685 polymerization catalyst Substances 0.000 claims 3
- 239000000758 substrate Substances 0.000 claims 3
- 238000012663 cationic photopolymerization Methods 0.000 claims 2
- 238000006243 chemical reaction Methods 0.000 claims 2
- 239000003999 initiator Substances 0.000 claims 2
- 238000000059 patterning Methods 0.000 claims 2
- 239000003505 polymerization initiator Substances 0.000 claims 2
- 239000000126 substance Substances 0.000 claims 2
- 239000004593 Epoxy Substances 0.000 claims 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims 1
- 125000002091 cationic group Chemical group 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 229940125904 compound 1 Drugs 0.000 claims 1
- SBTSVTLGWRLWOD-UHFFFAOYSA-L copper(ii) triflate Chemical group [Cu+2].[O-]S(=O)(=O)C(F)(F)F.[O-]S(=O)(=O)C(F)(F)F SBTSVTLGWRLWOD-UHFFFAOYSA-L 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 claims 1
- 238000000206 photolithography Methods 0.000 claims 1
- 230000000379 polymerizing effect Effects 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
- 239000002904 solvent Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005188276A JP4498232B2 (ja) | 2004-06-28 | 2005-06-28 | 光カチオン重合性エポキシ樹脂組成物、並びに、これを用いた微細構造体の製造方法及びインクジェットヘッドの製造方法 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004190478 | 2004-06-28 | ||
| JP2005188276A JP4498232B2 (ja) | 2004-06-28 | 2005-06-28 | 光カチオン重合性エポキシ樹脂組成物、並びに、これを用いた微細構造体の製造方法及びインクジェットヘッドの製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006045523A JP2006045523A (ja) | 2006-02-16 |
| JP2006045523A5 true JP2006045523A5 (cg-RX-API-DMAC7.html) | 2008-08-14 |
| JP4498232B2 JP4498232B2 (ja) | 2010-07-07 |
Family
ID=36024478
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005188276A Expired - Fee Related JP4498232B2 (ja) | 2004-06-28 | 2005-06-28 | 光カチオン重合性エポキシ樹脂組成物、並びに、これを用いた微細構造体の製造方法及びインクジェットヘッドの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4498232B2 (cg-RX-API-DMAC7.html) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102005002960A1 (de) | 2005-01-21 | 2006-08-03 | Leibniz-Institut Für Neue Materialien Gemeinnützige Gmbh | Kompositzusammensetzung für mikrogemusterte Schichten mit hohem Relaxationsvermögen, hoher chemischer Beständigkeit und mechanischer Stabilität |
| JP5110677B2 (ja) * | 2006-05-17 | 2012-12-26 | 東洋ゴム工業株式会社 | 研磨パッド |
| JP2007307639A (ja) * | 2006-05-17 | 2007-11-29 | Toyo Tire & Rubber Co Ltd | 研磨パッド |
| WO2007144967A1 (ja) * | 2006-06-13 | 2007-12-21 | Sekisui Chemical Co., Ltd. | パターン膜の製造方法及び感光性樹脂組成物 |
| DE102006033280A1 (de) * | 2006-07-18 | 2008-01-24 | Leibniz-Institut Für Neue Materialien Gemeinnützige Gmbh | Kompositzusammensetzung für mikrostrukturierte Schichten |
| US20080292993A1 (en) * | 2006-12-22 | 2008-11-27 | Canon Kabushiki Kaisha | Photo-cationic polymerizable epoxy resin composition, liquid discharge head, and manufacturing method thereof |
| JP2010210648A (ja) * | 2007-07-05 | 2010-09-24 | Sharp Corp | ガラス基板の修復方法、ガラス基板の製造方法、ガラス基板、およびフラットパネルディスプレイ |
| JP5787720B2 (ja) * | 2010-12-16 | 2015-09-30 | キヤノン株式会社 | 感光性ネガ型樹脂組成物 |
| JP5783854B2 (ja) * | 2011-09-01 | 2015-09-24 | キヤノン株式会社 | 液体吐出ヘッドの製造方法、および液体吐出ヘッド |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0570562A (ja) * | 1991-09-10 | 1993-03-23 | Toshiba Chem Corp | 封止用樹脂組成物および半導体封止装置 |
| JPH05127369A (ja) * | 1991-10-31 | 1993-05-25 | Nec Corp | レジスト材料 |
| JPH07109333A (ja) * | 1993-10-08 | 1995-04-25 | Three Bond Co Ltd | 光硬化性樹脂組成物 |
| JP3368094B2 (ja) * | 1995-04-21 | 2003-01-20 | キヤノン株式会社 | インクジェット記録ヘッドの製造方法 |
| JPH1129621A (ja) * | 1997-07-09 | 1999-02-02 | Hitachi Ltd | フェノール化合物，エポキシ化合物及び該化合物を含む樹脂組成物 |
| JP3824286B2 (ja) * | 1998-02-18 | 2006-09-20 | Ｊｓｒ株式会社 | 光硬化性樹脂組成物 |
| JP2001089639A (ja) * | 1999-09-24 | 2001-04-03 | Mitsubishi Heavy Ind Ltd | エネルギー線硬化樹脂組成物 |
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2005
- 2005-06-28 JP JP2005188276A patent/JP4498232B2/ja not_active Expired - Fee Related