JP2006041296A - 薄型金属パッケージおよびその製造方法 - Google Patents
薄型金属パッケージおよびその製造方法 Download PDFInfo
- Publication number
- JP2006041296A JP2006041296A JP2004221039A JP2004221039A JP2006041296A JP 2006041296 A JP2006041296 A JP 2006041296A JP 2004221039 A JP2004221039 A JP 2004221039A JP 2004221039 A JP2004221039 A JP 2004221039A JP 2006041296 A JP2006041296 A JP 2006041296A
- Authority
- JP
- Japan
- Prior art keywords
- thin metal
- base member
- electronic device
- thin
- metal package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 85
- 239000002184 metal Substances 0.000 title claims abstract description 85
- 238000004519 manufacturing process Methods 0.000 title claims description 12
- 239000000919 ceramic Substances 0.000 claims abstract description 38
- 238000000576 coating method Methods 0.000 claims abstract description 15
- 239000011248 coating agent Substances 0.000 claims abstract description 11
- 239000010408 film Substances 0.000 claims description 42
- 239000013078 crystal Substances 0.000 claims description 28
- 239000011810 insulating material Substances 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 18
- 230000002093 peripheral effect Effects 0.000 claims description 14
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 13
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 11
- 238000002844 melting Methods 0.000 claims description 9
- 238000007789 sealing Methods 0.000 claims description 9
- 229910034327 TiC Inorganic materials 0.000 claims description 8
- 229910010413 TiO 2 Inorganic materials 0.000 claims description 8
- 238000005229 chemical vapour deposition Methods 0.000 claims description 8
- 229910052839 forsterite Inorganic materials 0.000 claims description 8
- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 claims description 8
- 230000008018 melting Effects 0.000 claims description 8
- 229910003465 moissanite Inorganic materials 0.000 claims description 8
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 7
- 238000001465 metallisation Methods 0.000 claims description 7
- 230000015572 biosynthetic process Effects 0.000 claims description 6
- 238000009413 insulation Methods 0.000 claims description 6
- 229910001220 stainless steel Inorganic materials 0.000 claims description 6
- 239000010935 stainless steel Substances 0.000 claims description 6
- 239000000443 aerosol Substances 0.000 claims description 5
- 238000000151 deposition Methods 0.000 claims description 5
- 230000008021 deposition Effects 0.000 claims description 5
- 239000007769 metal material Substances 0.000 claims description 5
- 239000011888 foil Substances 0.000 claims description 4
- 239000010409 thin film Substances 0.000 claims description 3
- 238000001746 injection moulding Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 abstract description 6
- 239000010453 quartz Substances 0.000 abstract description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 5
- 239000003566 sealing material Substances 0.000 description 7
- 239000011521 glass Substances 0.000 description 6
- 125000006850 spacer group Chemical group 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 239000010419 fine particle Substances 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000005219 brazing Methods 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 239000012945 sealing adhesive Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920003217 poly(methylsilsesquioxane) Polymers 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
Images
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004221039A JP2006041296A (ja) | 2004-07-29 | 2004-07-29 | 薄型金属パッケージおよびその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004221039A JP2006041296A (ja) | 2004-07-29 | 2004-07-29 | 薄型金属パッケージおよびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2006041296A true JP2006041296A (ja) | 2006-02-09 |
| JP2006041296A5 JP2006041296A5 (https=) | 2007-06-28 |
Family
ID=35905951
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004221039A Withdrawn JP2006041296A (ja) | 2004-07-29 | 2004-07-29 | 薄型金属パッケージおよびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2006041296A (https=) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100930144B1 (ko) * | 2007-03-22 | 2009-12-07 | 엡슨 토요콤 가부시키 가이샤 | 수정 디바이스 및 그 시일링 방법 |
| WO2013172442A1 (ja) * | 2012-05-18 | 2013-11-21 | 株式会社村田製作所 | 水晶振動子 |
| WO2013172441A1 (ja) * | 2012-05-18 | 2013-11-21 | 株式会社村田製作所 | 水晶振動子 |
| WO2015083433A1 (ja) * | 2013-12-05 | 2015-06-11 | 株式会社村田製作所 | 水晶振動装置 |
| JP2020014064A (ja) * | 2018-07-13 | 2020-01-23 | 日本電波工業株式会社 | 圧電デバイス |
-
2004
- 2004-07-29 JP JP2004221039A patent/JP2006041296A/ja not_active Withdrawn
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100930144B1 (ko) * | 2007-03-22 | 2009-12-07 | 엡슨 토요콤 가부시키 가이샤 | 수정 디바이스 및 그 시일링 방법 |
| WO2013172442A1 (ja) * | 2012-05-18 | 2013-11-21 | 株式会社村田製作所 | 水晶振動子 |
| WO2013172441A1 (ja) * | 2012-05-18 | 2013-11-21 | 株式会社村田製作所 | 水晶振動子 |
| JPWO2013172442A1 (ja) * | 2012-05-18 | 2016-01-12 | 株式会社村田製作所 | 水晶振動子 |
| US9627603B2 (en) | 2012-05-18 | 2017-04-18 | Murata Manufacturing Co., Ltd. | Quartz vibrator having a dome-shaped cap |
| WO2015083433A1 (ja) * | 2013-12-05 | 2015-06-11 | 株式会社村田製作所 | 水晶振動装置 |
| JP2020014064A (ja) * | 2018-07-13 | 2020-01-23 | 日本電波工業株式会社 | 圧電デバイス |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6599694B2 (ja) | 圧電デバイス | |
| JP2006041296A (ja) | 薄型金属パッケージおよびその製造方法 | |
| JP5911349B2 (ja) | 水晶デバイス | |
| JP2015154371A (ja) | 水晶デバイス | |
| JP2010239342A (ja) | 圧電デバイス | |
| JP2016220058A (ja) | 水晶振動子 | |
| JP6825188B2 (ja) | 水晶素子パッケージ及びその製造方法 | |
| US11063574B2 (en) | Piezoelectric resonator unit | |
| JP5368135B2 (ja) | 圧電デバイス | |
| JP2014236301A (ja) | 水晶デバイス | |
| JP2015050520A (ja) | 水晶デバイス | |
| JP2015050531A (ja) | 水晶デバイス | |
| JP2017212622A (ja) | 水晶デバイス及びその製造方法 | |
| JP6487150B2 (ja) | 水晶デバイス | |
| JP2015142218A (ja) | 水晶デバイス | |
| JP2014107649A (ja) | 水晶デバイス | |
| JP2015126344A (ja) | 水晶デバイス | |
| JP2004007236A (ja) | 水晶振動子用パッケージ及びその製造方法 | |
| JP2015070386A (ja) | 水晶デバイス | |
| JP2014011664A (ja) | 水晶デバイス | |
| JP2013232736A (ja) | 水晶デバイス | |
| JP2016181889A (ja) | 水晶デバイス | |
| JP2017046205A (ja) | 水晶デバイス | |
| JP2014225837A (ja) | 水晶デバイス | |
| JP2015070504A (ja) | 水晶デバイス |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Written amendment |
Effective date: 20070515 Free format text: JAPANESE INTERMEDIATE CODE: A523 |
|
| A621 | Written request for application examination |
Effective date: 20070515 Free format text: JAPANESE INTERMEDIATE CODE: A621 |
|
| A761 | Written withdrawal of application |
Free format text: JAPANESE INTERMEDIATE CODE: A761 Effective date: 20080728 |