JP2006041204A - Method for manufacturing ceramic molded object for electronic parts - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a ceramic molded object for electronic parts wherein freedom in designing without limited processing position and dimension or the like is great, and the processing for micro size or complicated shape is realized. <P>SOLUTION: In the same manner as the ceramic molded object for electronic parts is obtained from a lamination, a lamination that is formed by stacking a plurality of sheet members having at least an insulator material and a vanishing material is given vanishing treatment, so as to form a three dimensional shape. Thus, the ceramic molded object for electronic parts is manufactured. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a wound electronic component and a material processing method, and provides a manufacturing method and a processing method of a ceramic shaped article for an electronic component such as a ceramic core material that does not depend on press molding or grinding.

  Conventionally, in a method for manufacturing a ceramic core, for example, the manufacture of a ceramic core that becomes the core of a wound inductor element has been made through molding, firing, and, if necessary, a grinding process (Patent Document 1). 2).

  In Patent Document 1, a through-hole is formed in a combustible sheet, and this is filled with a ceramic paste or a ceramic sheet. These are laminated and fired to obtain a sintered body of a core. Discloses a drum core having a total length of 2.0 mm having a square ridge of 1 mm and a thickness of 0.5 mm. In Patent Document 1, there is a limitation on the three-dimensional shape of a finished product that can be formed in that a combustible sheet is processed with a mold and then filled with a ceramic material.

  In addition, Patent Document 1 also shows an example in which a laminated body is cut or punched with a punch after laminating sheets, but these cause deformation, burrs, and chipping, and promote further deterioration in accuracy and yield. become.

  In Patent Document 2, after processing a ferrite magnetic raw material into a sheet shape, a predetermined contour shape is punched and fired to produce a thin ferrite magnetic core having a thickness of 1 mm or less. In Patent Document 2, since a ferrite sheet is processed with a mold, it is difficult to process a complicated three-dimensional shape, and the accuracy of a finished product is not sufficient. Mold processing causes deformation, burrs, and chipping, and promotes deterioration in accuracy and yield.

Further, in Patent Document 2, it is the level of formation accuracy when the green sheet is one layer, the controllability in the layer thickness direction is inferior, and the formation of a homogeneous layer is difficult.
JP 2003-249413 A JP 2003-234227 A

Thus, the conventional method for manufacturing a ceramic core has the following problems:
When the shape is determined only by molding, it is impossible to make a shape ignoring the taper angle with respect to the molding die.
Depending on the grinding method after molding, the processing position, dimensions, and the like are limited, that is, the degree of freedom in design is impaired due to processing limitations.
Depending on the combination of the size of the element and the processing machine, there is a limit to fine and complex shape processing.

  The present invention has been made in view of the above-mentioned problems, and is divided into layers in advance and subjected to predetermined processing on each layer, and there is a material that disappears during firing in portions other than the material, and when the ceramic green sheets are laminated This makes it possible to prevent bobbin-shaped machining that is difficult to remove. Furthermore, since it is not necessary to consider restrictions or the like due to processing equipment, any shape processing of the target product can be performed. In addition, by introducing a photolithography processing technique, it becomes possible to perform more complicated, finer, and higher-precision shape and dimensional processing than before.

In one embodiment of the present invention, a disappearance treatment is performed on a laminate formed by laminating a plurality of sheet-like members having at least an insulator material and a disappearance material so that a ceramic shaped article for electronic parts can be obtained from the laminate. By this, it is a manufacturing method of the ceramic molded article for electronic components characterized by forming a three-dimensional shape.
According to a further embodiment of the present invention, the electronic material as described above is characterized in that the three-dimensional shape is formed at the same time as the three-dimensional shape is formed by performing the disappearance treatment on the laminate. It is a manufacturing method of the ceramic molded article for components.

  A further embodiment of the present invention is the method for producing a ceramic shaped article for an electronic component as described above, wherein the sheet-like member is a substantially flat layer.

  Another embodiment of the present invention is that at least one of the disappearing material and the insulator material has photosensitivity, and the thickness of the disappearing material and the insulator material is adjusted by exposure and development processing. It is the manufacturing method of the ceramic molded article for electronic components as described above, which is characterized.

  Still another embodiment of the present invention is the method for producing a ceramic shaped article for electronic parts as described above, wherein the disappearing material is a material that can be dissolved in a solvent, and the disappearing treatment is dissolution. It is.

  Another embodiment of the present invention is the method for producing a ceramic shaped article for electronic parts as described above, wherein the disappearance treatment is heating or firing.

  Yet another embodiment of the present invention is that, in the step of producing each layer for forming the ceramic molded article for electronic parts, the layer is appropriately designed as necessary, and a layer and a part that require an electrode or the like are provided. The method for producing a ceramic shaped article for electronic parts as described above, wherein the electrode material is preferably formed by an electrodeposition technique.

  Yet another embodiment of the present invention is the above-described method for manufacturing a ceramic shaped article for an electronic component, wherein the insulator material pattern is formed by an electrodeposition method.

  The three-dimensional shape referred to here is not only a simple shape such as a cube, a rectangular parallelepiped or a cylinder, but also a drum block with a flange used for a core, a ceramic block having an L-shaped through hole used for an electronic component, It refers to a shaped object that is difficult to process and mold and has a complicated shape, such as a cylindrical shape with a spiral groove cut.

  The present invention has an extremely remarkable effect by adopting the above-described configuration. That is, by using a photosensitive sheet, a ceramic core or the like can be processed with higher accuracy than conventional mold processing. In addition, since no mold is used, there is no chipping, burrs, deformation, or dropout during mold processing, and accuracy deterioration and yield reduction are suppressed.

  Furthermore, the dimensional accuracy of the sintered body can be further improved by adjusting the thicknesses of the disappearing material and the insulator material during the production of the ceramic green sheet and using, for example, a substantially flattened layer. This effect can also be obtained by using a layer that is substantially flattened by electrodeposition or filled and formed with good controllability. In other words, by using this substantially flattened ceramic green sheet, sheet misalignment is unlikely to occur at the time of stacking, and thereby the deformation of the target ceramic shaped object at the time of forming the laminate is extremely remarkably suppressed, and an accurate outer shape is achieved. A shape can be formed, and thereby deformation after firing can be remarkably suppressed.

  Moreover, when producing the ceramic molded article for electronic components which has a terminal electrode, a complicated retrofit process of a terminal electrode is not required and a manufacturing process can be simplified. Furthermore, since various ceramic green sheets are produced, laminated, and pressed to form a laminated body, and then the terminal electrode is formed simultaneously with the firing of the laminated body, peeling of the terminal electrode is suppressed.

  The ceramic shaped article for an electronic component according to the present invention is formed by laminating a plurality of sheet-like members made of at least an insulator material and a disappearing material and optionally a conductive material so that the ceramic shaped article for an electronic component is obtained from the laminate. It is manufactured by forming a three-dimensional shape by subjecting the laminated body to a disappearance treatment. In particular, by making fine adjustment of the thickness of the insulator material and the disappearance material into a substantially flat sheet-like member by photolithography or electrodeposition method, the dimensional accuracy of the outer shape of the target ceramic shaped object is improved. Can do.

  In addition, it is desirable that the disappearing material used in the present invention disappears by performing a specific treatment and that the treatment does not adversely affect the material constituting the ceramic green sheet laminate. As specific examples of the disappearing material and the processing method, when the disappearing material is a water-soluble acrylic resin, water-soluble wax, or the like, a removal method by washing with water, and when the disappearing material is paraffin, grease or the like, a high-temperature treatment is performed. If the disappearing material is a positive resist or the like, the removal method by exposure and development, and if the disappearing material is a negative resist or various resins, include removal by baking treatment, etc. is not.

  Hereinafter, the present invention will be described in detail with reference to the drawings. FIG. 1 to FIG. 5 are flowcharts showing the steps of the main part in the method for manufacturing a ceramic molded article for electronic parts according to the present invention. FIGS. 1 to 5 show cross sections of main parts such as a base and a sheet.

  As shown in FIG. 1, an arbitrary shape is formed so that a plurality of outer shapes obtained by dividing a solid, which becomes a core or the like into layers, are arranged on a sheet made of a base material 1 and a ceramic slurry 2 having a size on the premise of taking a plurality of pieces. The through groove 3 is processed by the method. When photosensitivity is imparted to the sheet, the through groove can be formed by a photolithography technique. This through-groove portion is filled with a disappearing material 4 made of an acrylic resin or the like that can disappear (burn out) later. In this way, each layer forming a solid such as a core is similarly produced. A plurality of these sheets are laminated and pressed to form a laminate (laminate 5), and then fired to separate the individual solids (cores) simultaneously in the firing process, and the solids that have been fired ( A ceramic core 6) is obtained.

  As shown in FIG. 2, there are a plurality of outer shapes in which a solid body, which is a core or the like, is divided into layers on a sheet made of a base material 1 having a size on the premise of taking a plurality of pieces and a ceramic slurry 2 imparted with photosensitivity. The through-grooves 3 are processed by a photolithography technique (not shown) so that they are lined up. By using the photosensitive performance in the thickness direction of the sheet under the exposure conditions, it is possible to finely adjust the formation and thickness of the through groove by exposure and development processing. The through groove portion is filled with a disappearing material 4 made of a photosensitive material such as a photoresist that can disappear (burn out) later. Similarly, this disappearing material can also be made to substantially match the thickness of the sheet previously formed by exposure and development processing by making good use of the photosensitive performance in the thickness direction. In this way, substantially flat layers forming a solid such as a core are similarly produced. A plurality of these sheets are laminated and pressed to form a laminate (laminate 5), and then fired to separate the individual solids (cores) simultaneously in the firing process, and the solids that have been fired ( A ceramic core 6) is obtained.

  As shown in FIG. 3, a layer made of a disappearing material 4 having a photosensitive performance such as a resist material is formed on a base material 1, and an outer shape portion obtained by dividing a solid to be a core or the like into layers is exposed and developed. Remove (not shown). A space corresponding to the outer shape portion is filled with the ceramic slurry 2. In this case, if the base material 1 is made of a light-transmitting material and the ceramic slurry has a photosensitivity, using the photosensitive performance in the thickness direction of the sheet according to the exposure conditions after drying and solidification, Grooves can be formed and the thickness can be finely adjusted by exposure and development. In this way, each layer forming a solid such as a core is similarly produced. A plurality of these sheets are laminated and pressed to form a laminate (laminate 5), and then fired to separate the individual solids (cores) simultaneously in the firing process, and the solids that have been fired ( A ceramic core 6) is obtained.

  As shown in FIG. 4, a layer made of a disappearing material 4 having a photosensitive performance such as a resist material is formed on a conductive base material 1, and an outer shape portion in which a solid that becomes a core or the like is divided into layers is formed. It is removed by exposure development processing (not shown). A space corresponding to the outer shape portion is filled with an insulating material 9 such as dielectric powder or magnetic powder by electrodeposition. When the base material is made of a light-transmitting material that has been subjected to a conductive treatment, and a layer is formed by co-depositing the insulator powder and the photosensitive resin material, and the formed layer has a desired light transmittance, This layer is formed first, and after drying and solidification, it is possible to form a groove and finely adjust the thickness by exposure and development processing using the photosensitive performance in the thickness direction of the sheet according to the exposure conditions. The disappearing material 4 may be formed in this groove by electrodeposition or the like. In this way, each layer forming a solid such as a core is similarly produced. A plurality of these sheets are laminated and pressed to form a laminate (laminate 5), and then fired to separate the individual solids (cores) simultaneously in the firing process, and the solids that have been fired ( A ceramic core 6) is obtained.

  As shown in FIG. 5, an outer shape portion in which a layer made of a disappearance material 4 made of a resist material or the like and having a photosensitive property is formed on a conductive base material 1, and a solid that becomes a core or the like later is divided into layers. Are removed by exposure and development (not shown). A space corresponding to the outer shape portion is filled with an insulating material 9 such as dielectric powder or magnetic powder by electrodeposition. When the base material is made of a light-transmitting material that has been subjected to a conductive treatment, and a layer is formed by co-depositing the insulator powder and the photosensitive resin material, and the formed layer has a desired light transmittance, By using the photosensitive performance in the thickness direction of the sheet according to the exposure conditions after drying and solidification, it is possible to form grooves and finely adjust the thickness by exposure and development processing. In this way, each layer forming a solid such as a core is similarly produced. The layer is appropriately designed as necessary, and the through-groove 3 is processed by an arbitrary method in the layer and the portion requiring the electrode, and the electrode material 7 is preferably formed by an electrodeposition technique. Each of these sheets is laminated and pressed to form a laminate (laminate 5), and then fired to separate the individual solids (cores) simultaneously in the firing process, and the solids (electrodes) that have been fired The attached ceramic core 6) is obtained.

  Although the said Example illustrated the case where the several ceramic modeling thing for electronic components as a preferable embodiment of this invention was manufactured simultaneously, only one ceramic modeling thing for electronic components is obtained similarly, It will be understood by those skilled in the art. For example, in the process of prototyping the final product, when different types of products are manufactured separately and the effect is confirmed to determine the direction of the product, rather than manufacturing a plurality of similar products, Only one product may be manufactured. In such a case, in the conventional method, it is necessary to manufacture dies for each type and manufacture different products. However, in the method of the present invention, as shown in FIG. 6, the ceramic green sheets 8a and 8b Different types of stacked products can be manufactured simply by changing the thickness or the number of sheets. FIG. 6 shows an example in which the notch (groove) length of the dielectric filter core is different.

It is process drawing which shows an example of the manufacturing method of the ceramic core of this invention. It is process drawing which shows another example of the manufacturing method of the ceramic core of this invention. It is process drawing which shows another example of the manufacturing method of the ceramic core of this invention. It is process drawing which shows another example of the manufacturing method of the ceramic core of this invention. It is process drawing which shows another example of the manufacturing method of the ceramic core of this invention. It is process drawing which shows one example of manufacture of the dielectric filter core from which notch (groove) length differs.

Explanation of symbols

1: Substrate 2: Ceramic slurry 3: Through groove 4: Disappearing material 5: Laminate 6: Ceramic core 7: Electrode material 8a, 8b: Ceramic green sheet 9: Insulator material

Claims (8)

So that the ceramic molding for electronic parts can be obtained from the laminate,
By applying a disappearance treatment to a laminate formed by laminating a plurality of sheet-like members having at least an insulator material and a disappearing material,
It is characterized by forming a three-dimensional shape,
Manufacturing method of ceramic molded article for electronic parts.   The manufacturing of the ceramic shaped article for an electronic component according to claim 1, wherein the three-dimensional shape is formed at the same time as the three-dimensional shape is formed by performing the disappearance process on the laminated body. Method.   The method for producing a ceramic shaped article for an electronic component according to claim 1, wherein the sheet-like member is a substantially flat layer.   The at least one of the disappearance material and the insulator material has photosensitivity, and adjustment of the thickness of the disappearance material and the insulator material is performed by exposure and development processing. The manufacturing method of the ceramic molded article for electronic components of any one of 3 items | terms.   5. The ceramic molding for electronic parts according to claim 1, wherein the disappearing material is a material that can be dissolved in a solvent, and the disappearing treatment is dissolution. 6. Manufacturing method.   The method for producing a ceramic shaped article for an electronic component according to any one of claims 1, 2, 3, or 4, wherein the disappearance treatment is heating or firing. In the step of forming each layer forming the ceramic molded article for electronic parts,
The layer is appropriately designed as necessary, and an electrode material is preferably formed on the layer and the portion requiring the electrode, etc., preferably by an electrodeposition technique. The manufacturing method of the ceramic molded article for electronic components of any one of 6 items. The manufacturing method of the ceramic molded article for electronic components of Claim 7 with which an insulator material pattern is formed by the electrodeposition method.

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