JP2006019940A - Method for manufacturing piezo-oscillator - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide the manufacturing method of a piezo-oscillator for obtaining a compact piezo-oscillator that is simply handled and is superior in productivity. <P>SOLUTION: A motherboard 15 is prepared, which has an oscillator substrate region 20 having two spaces 16a, 16b, and a sacrificial marginal region 21 having a characteristic control data write terminal 17 and a characteristic measurement terminal 18. Then, a crystal oscillator element 5 is mounted to the front main surface side of each oscillator substrate region 20 on the motherboard 15 for airtight sealing by a lid body before electric characteristics are measured in the crystal oscillator element 5. An integrated circuit element 7 is mounted onto an inside bottom surface at the space 16b on a rear main surface. Characteristic control data are inputted to the integrated circuit element 7 in each oscillator substrate region 20 via the characteristic control data write terminal 17. The characteristic control data are stored in a memory in the integrated circuit element 7. The motherboard 15 is cut along the outer periphery of the each oscillator substrate region 20. As a result, the piezo-oscillator is manufactured by separating each oscillator substrate region 20 from the sacrificial marginal region 21. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a method for manufacturing a piezoelectric oscillator used in an electronic device such as a portable communication device, and more particularly to a method for manufacturing a piezoelectric oscillator suitable for downsizing.

  Conventionally, piezoelectric oscillators have been used in electronic devices such as portable communication devices. As such a conventional piezoelectric oscillator, for example, in a temperature-compensated crystal oscillator which is one of the piezoelectric oscillators, a piezoelectric element is formed on the upper surface of a frame-shaped substrate 51 having a plurality of external terminals 52 attached to the lower surface. Is attached to the container body 53 in which the crystal resonator element 54 is accommodated, and the cavity portion 55 surrounded by the inner wall surface of the frame-shaped substrate 51 and the lower surface of the container body 53 is adapted to vibrate the crystal resonator element 54. An integrated circuit element 56 for controlling the oscillation output based on this and an electronic component element 57 such as a capacitor are provided, and the integrated circuit element 56 and the electronic component element 57 are mounted on the lower surface of the container body 53. (For example, refer to Patent Document 1).

  The substrate of the container body 53 and the frame-shaped base 51 described above are usually integrally formed of a ceramic material such as glass-ceramic, and a wiring conductor is formed inside and on the surface. It is manufactured by adopting a known ceramic green sheet lamination method or the like. In addition, a measurement terminal for measuring the electrical characteristics of the crystal resonator element 54 is generally formed on the inside or the outer surface of the container body 53. (For example, refer to Patent Document 2).

  Furthermore, a temperature compensation circuit for correcting the oscillation output of the crystal oscillator based on the temperature compensation data created according to the temperature characteristic of the crystal resonator element 54 is provided inside the integrated circuit element 56, After assembling the temperature-compensated crystal oscillator, in order to store the above-mentioned temperature compensation data in the memory in the integrated circuit element 56, the characteristic control data for writing the temperature compensation data on the lower surface or the outer surface of the frame-like substrate 51 Generally, a write terminal (not shown) is provided.

  The following literature is disclosed about the manufacturing method of the above piezoelectric oscillators.

JP 2000-151283 A (FIGS. 2 and 5) JP 2002-190710 A (FIG. 1)

  In addition, the applicant has not found any prior art documents related to the present invention by the time of filing of the present application other than the prior art documents specified by the above prior art document information.

  However, in the conventional piezoelectric oscillator described above, a characteristic control data write terminal for writing temperature compensation data is provided on the lower surface and the outer surface of the frame-shaped substrate 51, and these characteristic control data write terminals are provided. Since a wide space for the arrangement is required on the surface of the frame-shaped substrate 51, the area of the frame-shaped substrate 51 is increased in the surface direction or the thickness direction, and there is a disadvantage that the entire structure is not miniaturized. In addition, when the piezoelectric oscillator is mounted on an external electric circuit such as a mother board, a part of the conductive bonding material used for bonding the two adheres to the characteristic control data writing terminal and externally connects the piezoelectric oscillator. There is a risk of short-circuiting with the terminal for the product, and therefore the handling of the product is complicated, such as the freedom of the electrode shape on the motherboard side corresponding to the external terminal. There was also a disadvantage that.

  Similarly, a measurement terminal for measuring the electrical characteristics of the piezoelectric vibration element is provided in the interior, and a large space is required inside the container body to arrange these measurement terminals. There was a disadvantage that it was not suitable for. Further, when the measurement terminal is formed in the same manner, there is a drawback that stray capacitance is generated between the integrated circuit element and the measurement terminal when the integrated circuit element is mounted, which affects the electrical characteristics.

  Further, when the above-mentioned characteristic control data writing terminal is arranged on the outer side surface of the frame-shaped base 51, a through hole is formed in the ceramic mother substrate used for manufacturing the frame-shaped base 51, and the inner surface thereof is formed. A complicated processing process such as deposition of an electrode pattern is required, which leads to a decrease in productivity, and writing to a characteristic control data writing terminal provided on the outer surface of the frame-shaped substrate 51 Since it is extremely difficult to perform writing work by directly applying the probe needle of the device, it is necessary to write the characteristic control data by attaching individual piezoelectric oscillators to the socket for writing characteristic control data. In that case, manufacturing equipment such as a socket is required separately, and complicated steps such as mounting individual piezoelectric oscillators on the socket are required, which has the disadvantage that the manufacturing process becomes complicated.

  Further, in the conventional piezoelectric oscillator described above, the container body 53 is integrally formed by a ceramic green sheet lamination method or the like, and the integrated circuit element 56 is mounted on the lower surface of the container body 23 obtained by such a manufacturing method. Thus, when the piezoelectric oscillator is manufactured by the method of “multiple picking”, when the integrated circuit element 56 is mounted on the mother substrate from which the container body 23 is cut out, the mother substrate is divided. Is directly transmitted to the integrated circuit element 56, and this impact induces a defect that causes damage to the integrated circuit element 56 itself or a joint between the integrated circuit element 56 and the container 53. Therefore, in the conventional manufacturing process, usually, only the container body 53 is manufactured by the “multi-piece” technique, and the crystal resonator element 54 and the integrated circuit element 56 are individually mounted on each individual piece obtained after the division. In that case, since it is necessary to mount the integrated circuit element 26 and the like after mounting the individual pieces on the carrier and holding them, the manufacturing equipment accordingly. And the manufacturing process is complicated.

  The present invention has been devised in view of the above-mentioned drawbacks, and an object of the present invention is to provide a method of manufacturing a piezoelectric oscillator capable of obtaining a small piezoelectric oscillator that is easy to handle and excellent in productivity. is there.

The method for manufacturing a piezoelectric oscillator according to the present invention includes forming a concave first space portion on a front main surface of an insulating substrate and a concave second space portion on a back main surface of the substrate, A piezoelectric vibration element is mounted in the first space, a lid is placed over the first space opening to hermetically seal the first space, and the piezoelectric vibration element is disposed in the second space. In an integrated circuit element incorporating an oscillation circuit that is electrically connected to a piezoelectric oscillator, or a method of manufacturing a piezoelectric oscillator including the integrated circuit element and the electronic component element,
A rectangular oscillator substrate region in which a first space portion is formed on the front main surface and a second space portion is formed on the back main surface, and an integration mounted in the second space portion on the outer peripheral side surface of the oscillator substrate region Forming an abbreviated area having a characteristic control data writing terminal electrically connected to the circuit element and a characteristic measuring terminal electrically connected to the piezoelectric vibration element mounted in the first space; A step A for forming a mother substrate in which a plurality of the oscillator substrate regions formed on the outer periphery are arranged in a matrix and configured integrally;
A piezoelectric vibration element is mounted in the first space portion formed on the front main surface of each oscillator substrate region of the mother substrate, and a lid is disposed so as to close the opening of each first space portion. Then, after hermetically sealing the first space portion, measuring the characteristics of the piezoelectric vibration element from the characteristic measurement terminal, and determining whether the characteristic value is good or not,
An integrated circuit element that is electrically connected to the piezoelectric vibration element in the second space formed on the back main surface of the oscillator substrate region on which the piezoelectric vibration element determined to have good characteristics in the step B is mounted. Alternatively, after the integrated circuit element and the electronic element are mounted, the oscillation characteristic control data is input to the integrated circuit element from the characteristic control data write terminal, and the oscillation characteristic control data is stored in the memory in the integrated circuit element. C
Cutting the mother board along the outer periphery of each of the oscillator substrate areas, the characteristic control data writing terminal electrically connecting each of the oscillator board areas to each electronic element mounted in the oscillation device board area; And a step D of obtaining a plurality of piezoelectric oscillators simultaneously by separating from each of the abandoned regions provided with the characteristic measurement terminals.

  The temperature compensated crystal oscillator manufacturing method of the present invention is formed in the abandoned region by mounting the integrated circuit element in each oscillator substrate region forming the mother substrate in the step C. The characteristic control data write terminal and the integrated circuit element are electrically connected to each other through a wiring conductor formed on the surface of the oscillator substrate region and / or the mother substrate and / or inside thereof. It is also a manufacturing method of the piezoelectric oscillator.

  According to the present invention, the characteristic control data writing terminal used for writing the characteristic control data to the integrated circuit element and the characteristic measuring terminal for measuring various characteristics of the piezoelectric vibration element are provided in the abandoned area of the mother board. In addition, since the separation is completed after the determination of the quality of the piezoelectric vibration element and the writing of the characteristic control data are completed, a wide space for arranging the characteristic control data writing terminal and the characteristic measuring terminal in the substrate region Becomes unnecessary, and the entire structure of the piezoelectric oscillator can be reduced in size.

  Similarly, since characteristic measurement terminals are provided in the abandoned area of the mother board and the electrical characteristics of the piezoelectric vibration element are measured and then separated, the area can be secured above a certain level. Can be made easier. Moreover, in this case, the manufacturing process of the piezoelectric oscillator is relatively simple, and no equipment such as a socket for writing the characteristic control data to each piezoelectric oscillator is required, thereby maintaining high productivity of the piezoelectric oscillator. You can also

  In addition, since the piezoelectric oscillator obtained by the manufacturing method of the present invention does not have the characteristic control data writing terminal as described above, when the piezoelectric oscillator is mounted on an external electric circuit such as a mother board, it is used for joining the two. There is no inconvenience that a part of the conductive bonding material is attached to the characteristic control data writing terminal to cause a short circuit, and the product can be handled easily.

  In the case of the present invention, the mother board is divided after the integrated circuit element is mounted, and when the integrated circuit element is mounted, the mother board itself functions as a carrier for mounting the integrated circuit element. The carrier for mounting an integrated circuit element as described in the section of the conventional example is unnecessary, and the complicated work of mounting individual child boards obtained by dividing the mother board on the carrier is not required at all. This also improves the productivity of the piezoelectric oscillator.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.
FIG. 1 is a perspective view of a temperature-compensated crystal oscillator that is one of the piezoelectric oscillators manufactured by the manufacturing method of the present invention, and FIG. 2 is a sectional view of the temperature-compensated crystal oscillator shown in FIG. FIG. 3A is a perspective view of the mother board and the cover plate used in the manufacturing method of the present invention as viewed from the front main surface side on which the crystal resonator element is mounted, and FIG. It is the expansion perspective view which expanded a part (one oscillator board | substrate area | region and the surplus area | region with respect to it) of the mother board | substrate shown in a). 4A is a perspective view of the mother board shown in FIG. 3A as viewed from the back main surface side on which the integrated circuit elements and the like are mounted, and FIG. 4B is a mother board shown in FIG. It is the expansion perspective view which expanded a part of substrate (one oscillator board | substrate area | region and the surplus area | region with respect to it). In FIG. 1 to FIG. 4, a part of the structure is not shown and the dimensions are partly exaggerated for the sake of clarity. In particular, the thickness dimension of each part is shown in a deformed form for easy understanding of the present invention.

  The temperature-compensated crystal oscillator shown in these drawings has a structure in which a crystal vibrating element 5 that is a piezoelectric element is accommodated in the upper surface of a container body 1 and an integrated circuit element 7 is attached to the lower surface of the container body 1. have. The container body 1 is made of, for example, a substrate 2 made of a ceramic material such as glass-ceramic or alumina ceramic, a seal ring 3 made of a metal such as 42 alloy, Kovar, or phosphor bronze, and a metal similar to the seal ring 3. The container body 1 is formed by attaching the seal ring 3 to the upper surface of the substrate 2 and placing and fixing the cover body 4 on the upper surface of the substrate 2, and is located inside the seal ring 3. A crystal resonator element 5 is mounted on the upper surface of the substrate 2.

  The container body 1 is for hermetically sealing the quartz resonator element 5 in its interior, specifically, in a space surrounded by the upper surface of the substrate 2, the inner surface of the seal ring 3, and the lower surface of the lid body 4. A pair of mounting pads 8a connected to the vibration electrodes of the crystal resonator element 5 are provided on the upper surface of the substrate 2, and a plurality of pads are connected to the connection pads 7a of the integrated circuit element 7 on the lower surface of the substrate 2. The electrode pads 8b and the like are respectively provided, and these pads are electrically connected to each other by a wiring pattern on the surface of the substrate, a via-hole conductor embedded in the substrate, or the like.

  On the other hand, the quartz crystal vibrating element 5 accommodated in the container body 1 is formed by attaching and forming a pair of vibrating electrodes on both main surfaces of a crystal piece cut along a predetermined crystal axis, and a variable voltage from the outside. Is applied to the quartz piece via a pair of vibrating electrodes, thickness shear vibration is caused at a predetermined frequency.

  Here, if the metal lid 4 of the container body 1 is connected to the external terminal 9 for a ground terminal, which will be described later, via the wiring conductor of the container body 1, the lid body 4 is grounded during use. Since the shield function is given by the above, the crystal resonator element 5 and the integrated circuit element 7 described later can be protected better than the unnecessary electric action from the outside. Therefore, the lid body 4 of the container body 1 is preferably connected to the external terminal 9a for the ground terminal via the wiring conductor 8 of the container body 1. And the integrated circuit element 7 attached to the lower surface of the container 1 mentioned above is arranged in parallel so that it may be located in the center part of the wall part in which the integrated circuit element 7 is enclosed. The four external terminals 9 including the ground terminal external terminals 9a described above are electrically connected to the circuit wiring of the external electric circuit when the temperature-compensated crystal oscillator is mounted on an external electric circuit such as a mother board. It has become.

  On the other hand, as the integrated circuit element 7 attached to the lower surface of the container body 1, a rectangular flip chip IC having a plurality of connection pads 7 a connected to the electrode pads 8 b of the container body 1 on the upper surface. The circuit forming surface has a temperature sensing element (thermistor) for detecting the ambient temperature state, and temperature compensation data for controlling and compensating the temperature characteristics of the crystal resonator element 5, and based on the temperature compensation data. A temperature compensation circuit that corrects the vibration characteristics of the crystal resonator element 5 according to a temperature change, an oscillation circuit that is connected to the temperature compensation circuit and generates a predetermined oscillation output, and the like are provided. The oscillation output generated by the oscillation circuit of the integrated circuit element 7 is output to the outside and then used as a reference signal such as a clock signal.

Next, a manufacturing method of the above-described temperature compensated crystal oscillator will be described.
(Process A)
First, on each of the four side surfaces of a rectangular oscillator substrate region 20 having a first space portion 16a on which the crystal resonator element is mounted on the front main surface and a second space portion 16b on which the integrated circuit element is mounted on the back main surface. Then, a spare area 21 having a plurality of characteristic control data write terminals 17 and measurement terminals 18 is formed, and a mother board 15 is prepared in which these are arranged in a matrix. Such a base substrate 15 is formed of a low-temperature fired substrate material such as glass-ceramic, a ceramic material such as alumina ceramic, and the like, and can be fired at a relatively low temperature of, for example, 800 ° C. to 1200 ° C. It is configured by laminating a plurality of dielectric layers made of materials, etc., and conductors made of metal materials such as Ag, Cu, W, and Mo provided on each dielectric layer form circuit wiring and connection pads, respectively. is doing. The thickness of each dielectric layer forming the rectangular wiring board is set to 20 μm to 300 μm, for example. A predetermined wiring pattern including the characteristic control data writing terminal 17 and the external terminal 9 is formed on the mother board 15.

  The first space portion 16a and the second space portion 16b formed in the oscillator substrate region 20 of the mother substrate 15 have a rectangular shape and are formed so as to cut the oscillator substrate region 20 vertically. The predetermined first space 16a and second 16b are formed by punching each oscillator substrate region 20 of the mother substrate 15 manufactured as described above into a rectangular shape by punching or the like. On the back main surface side of the mother board 15, a plurality of external terminals 9 are provided in the oscillator board area 20, and a plurality of characteristic control data writing terminals 17 and characteristic measuring terminals 18 are provided in the spare area 21. It has been.

(Process B)
Next, the crystal resonator element 5 is accommodated on the upper surface of each oscillator substrate region 20 of the mother substrate 15, and the cover plate 12 is attached so as to close the plurality of first spaces 16a. The electrical characteristics of the crystal resonator element 5 in each first space portion 16a are measured via a plurality of characteristic measurement terminals 18 provided in the 15 surplus areas 21. As described above, the container body 1 is composed of the substrate 2, the seal ring 3, and the lid body 4, and the crystal resonator element 5 is accommodated in the first space portion 16a therein.

  For example, when the substrate 2 is formed of a ceramic material, a conductive paste serving as a wiring conductor is printed and applied in a predetermined pattern on the surface of a ceramic green sheet obtained by adding and mixing an appropriate organic solvent to the ceramic material powder. At the same time, after stacking a plurality of the substrates and press-molding them, the substrate 2 is manufactured by firing at a high temperature, and the crystal resonator element 5 is mounted on the upper surface of the obtained substrate 2. At this time, the vibration electrode of the crystal resonator element 5 and the mounting pad 8 a on the upper surface of the substrate are electrically and mechanically connected via the conductive bonding material 10. Then, the seal ring 3 is placed and fixed on the upper surface of the substrate 2 so as to surround the crystal resonator element 5, and the lid body 4 is joined to the upper surface of the seal ring 3 by conventionally known resistance welding or the like. The container body 1 is assembled.

  The seal ring 3 and the lid 4 are manufactured by forming a metal such as 42 alloy into a predetermined shape using a conventionally known metal processing method, and the seal ring 3 is applied to the upper surface of the substrate 2 in advance. It is fixed to the substrate 2 by brazing to the conductor layer that has been applied. Further, as described above, when the seal ring 3 and the lid 4 are joined by resistance welding, a Ni plating layer, an Au plating layer, or the like is previously deposited on the surfaces of the seal ring 3 and the lid 4.

(Process C)
The mother board 15 is turned upside down, and the integrated circuit element 7 is mounted on the inner bottom surface of the second space 16b. Next, temperature compensation data, which is characteristic control data, is input to the integrated circuit element 7 in each oscillator substrate area 20 via a plurality of characteristic control data write terminals 17 provided in the abandoned area 21 of the mother board 15. The temperature compensation data is stored in the memory in the integrated circuit element 7. On the other hand, as described above, the integrated circuit element 7 has a plurality of connection pads 7 a at positions facing the electrode pads 8 b formed on the inner bottom surface of the second space portion 16 b of the container body 1. A rectangular flip chip type IC is used.

  In the integrated circuit element 7, a plurality of connection pads 7a provided on one surface thereof are soldered or metal bumps or the like on the electrode pads 8b exposed in the second space portion 16b on the back main surface side of the mother board 15. The conductive bonding material 11 is placed on the container body 1 so as to be in contact with the conductive bonding material 11, and then the conductive bonding material 11 is melted by application of heat or the like, so that the bonding pad 7 a and the electrode pad are melted. The integrated circuit element 7 is mounted on the container body 1 by bonding 8b via the conductive bonding material 11.

  In the process C, the integrated circuit element 7 is mounted in each of the second space portions 16b, whereby the electronic circuit in the integrated circuit element 7 is vibrated through the wiring conductor formed in the mother board 15 or the like. At the same time, the characteristic control data writing terminal 17 and the integrated circuit element 7 in the abandoned region 20 correspond to each other through a wiring conductor formed on the mother board 15. Elements or terminals are electrically connected to each other.

  Here, since the mother board 15 and the integrated circuit element 7 are bonded via the conductive bonding material 11 and there is a predetermined gap in the non-bonded portion between them, the integrated circuit element 7 is soldered. When mounting on the inner bottom surface of the second space portion 16b via the conductive bonding material 11 such as a metal bump, the heat necessary for this bonding is transferred between the container body 1 and the integrated circuit element 7 from the above-described gap or the like. Therefore, the integrated circuit element 7 can be mounted efficiently and reliably. Thereby, the reliability and productivity of the temperature compensated crystal oscillator can be improved.

  The temperature compensation data writing operation is created according to the temperature characteristics of the crystal resonator element 5 by placing the probe needle of the temperature compensation data writing device (not shown) on the characteristic control data writing terminal 17. This is done by inputting the temperature compensation data into a memory provided in the temperature compensation circuit of the integrated circuit element 7 and storing it. Here, the temperature compensation data written to the integrated circuit element 7 is for correcting the temperature characteristic variation for each crystal oscillation element 5, and the temperature of the crystal oscillation element 5 used in the temperature compensated crystal oscillator. It is obtained by measuring the characteristics in advance. In this case, there is no need for any equipment such as a socket for writing temperature compensation data in the integrated circuit element 7 of each temperature compensation crystal oscillator, which can also be used to improve the productivity of the temperature compensation crystal oscillator. .

(Process D)
Finally, the mother substrate 15 is cut along the outer periphery of each oscillator substrate region 20 to separate each oscillator substrate region 20 from the abandoned region 21 formed around the periphery. The mother substrate 15 is cut by conventionally known dicing or the like, and the mother substrate 15 is divided into individual oscillator substrate regions through the cutting process. As a result, a plurality of temperature compensated crystal oscillators each having the integrated circuit element 7 mounted thereon can be obtained simultaneously.

  In this case, the mother board 15 is divided after the integrated circuit element 7 is mounted. When the integrated circuit element 7 is mounted, the mother board 15 itself functions as a carrier for mounting the integrated circuit element. Therefore, there is no need for a carrier for mounting an integrated circuit element as described in the section of the conventional example, and there is no need for complicated operations such as mounting individual small pieces of substrates obtained by dividing the mother board 15 on the carrier. Become. This also improves the productivity of the temperature compensated crystal oscillator.

  In the manufacturing process described above, the characteristic control data write terminal 17 and the characteristic measurement terminal 18 are provided in the abandoned region 21 of the mother board 15 and after the temperature compensation data has been written, the crystal vibration element 5 Since the electrical characteristics are measured and then disconnected, a large space for disposing the characteristic control data writing terminal 17 and the characteristic measuring terminal 18 on the inner surface of the second space portion 16b is not necessary, and the temperature The overall structure of the compensation type crystal oscillator can be reduced in size.

  In addition, since the temperature compensated crystal oscillator of the final product obtained through the above-described steps A to D does not have the characteristic control data write terminal 17, the temperature compensated crystal oscillator is connected to an external electric circuit such as a motherboard. When mounted on the product, it is easy to handle the product without causing the inconvenience that a part of the conductive bonding material used to bond the two adheres to the characteristic control data writing terminal and causes a short circuit. be able to.

  The present invention is not limited to the above-described embodiments and examples. For example, the characteristic control data input to the integrated circuit element is limited to the temperature characteristic data, and the mounted piezoelectric element is limited to the crystal vibration element. Instead, various modifications and improvements can be made without departing from the scope of the present invention.

  Further, in the above-described embodiment, the characteristic control data writing terminal 17 and the measurement terminal 18 in the separation area 21 are arranged in parallel along the array of the external terminals 9. The characteristic control data write terminal 17 and the characteristic measurement terminal 18 in the area 21 may be arranged in a direction orthogonal to the arrangement of the external terminals 9.

  Furthermore, in the above-described embodiment, the lid 4 of the container body 1 is bonded to the substrate 2 via the seal ring 3. Instead, a metallized pattern for bonding is formed on the upper surface of the substrate 2. In addition, the lid 4 may be directly welded to the metallized pattern.

FIG. 1 is a perspective view of a temperature compensated crystal oscillator manufactured by the manufacturing method of the present invention. FIG. 2 is a sectional view of the temperature compensated crystal oscillator shown in FIG. 3, (a) is a perspective view of the mother board and the cover plate used in the manufacturing method of the present invention as seen from the front main surface side on which the crystal resonator element is mounted, and (b) is shown in (a). It is the elements on larger scale which expanded a part (one oscillator board | substrate area | region and the surplus area | region with respect to it) of the mother board which carried out. 4A is a perspective view of the mother board shown in FIG. 3A as viewed from the back main surface side on which the integrated circuit elements and the like are mounted, and FIG. 4B is a mother board shown in FIG. It is the elements on larger scale which expanded a part (one oscillator board | substrate area | region and the surplus area | region with respect to it). FIG. 5 is a cross-sectional view of a temperature compensated crystal oscillator manufactured by a conventional manufacturing method.

Explanation of symbols

DESCRIPTION OF SYMBOLS 2 ... Board | substrate 3 ... Seal ring 4 ... Lid body 5 ... Quartz vibration element 7 ... Integrated circuit element 15 ... Mother board 16a ... 1st space part 16b ... 2nd 17 ... Characteristic control data writing terminal 18 ... Characteristic measurement terminal 20 ... Oscillator substrate area 21 ... Disposal area

Claims (2)

A concave first space portion is formed on the front main surface of the insulating substrate, and a concave second space portion is formed on the back main surface of the substrate, and a piezoelectric vibration element is formed in the first space portion. The first space portion is hermetically sealed by mounting and covering the first space portion opening, and an oscillation circuit that is electrically connected to the piezoelectric vibration element is incorporated in the second space portion. In the manufacturing method of the piezoelectric oscillator on which the integrated circuit element or the integrated circuit element and the electronic component element are mounted,
A rectangular oscillator substrate region in which a first space portion is formed on the front main surface and a second space portion is formed on the back main surface, and an integration mounted in the second space portion on the outer peripheral side surface of the oscillator substrate region Forming an abbreviated area having a characteristic control data writing terminal electrically connected to the circuit element and a characteristic measuring terminal electrically connected to the piezoelectric vibration element mounted in the first space; A step A for forming a mother substrate in which a plurality of the oscillator substrate regions formed on the outer periphery are arranged in a matrix and configured integrally;
A piezoelectric vibration element is mounted in the first space portion formed on the front main surface of each oscillator substrate region of the mother substrate, and a lid is disposed so as to close the opening of each first space portion. Then, after hermetically sealing the first space portion, measuring the characteristics of the piezoelectric vibration element from the characteristic measurement terminal, and determining whether the characteristic value is good or not,
An integrated circuit element electrically connected to the piezoelectric vibration element in the second space formed on the back main surface of the oscillator substrate region on which the piezoelectric vibration element determined to have good characteristics in Step B is mounted Alternatively, after the integrated circuit element and the electronic element are mounted, the oscillation characteristic control data is input to the integrated circuit element from the characteristic control data writing terminal, and the oscillation characteristic control data is stored in the memory in the integrated circuit element. C
Cutting the mother board along the outer periphery of each of the oscillator substrate regions, and the characteristic control data writing terminal electrically connecting each of the oscillator substrate regions to each electronic element mounted in the oscillation device plate region; And a step D of obtaining a plurality of piezoelectric oscillators simultaneously by separating from each of the abandoned regions provided with the characteristic measurement terminals.   In the step C, by mounting the integrated circuit element on each of the oscillator substrate regions forming the mother substrate, the characteristic control data writing terminal and the integrated circuit element formed in the surplus region are 2. The method of manufacturing a piezoelectric oscillator according to claim 1, wherein the piezoelectric oscillator is electrically connected via an oscillator substrate region and a wiring conductor formed on a surface and / or inside of the mother substrate.

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