JP2006015210A - Coating apparatus and manufacturing method for plasma display panel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a coating apparatus that is capable of precisely molding a belt-like pattern even in use for a long term and is capable of easily processing fine discharge apertures, and to provide a manufacturing method for a plasma display panel. <P>SOLUTION: The coating apparatus forms a belt-like pattern of a material on a substrate by conducting the relative displacement of the substrate and a coating die 60 in a state in which the coating die 60 having the discharge apertures 70 to discharge the material formed is in opposition with the substrate. The coating die 60 is provided with a lengthy first block 61 and a second block 66, and a plurality of the discharge apertures 70 with a first side 63 of the trough width (a) and a second side 64 of the trough depth (b) are installed at predetermined intervals (c). The discharge apertures 70 are opposite to a recessed part 62 for the discharge apertures installed at the first block 61 and a planar face 67 for the discharge apertures installed at the second block 66 and is formed by binding these. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a coating apparatus and a method for manufacturing a plasma display panel.

Conventionally, a belt-like pattern is drawn and formed by applying a paste-like material on a substrate. These paste material pattern drawing forming methods are used, for example, to manufacture plasma display panels.
In the production of this plasma display panel, a phosphor layer forming step of forming a phosphor layer in a band shape between partitions arranged opposite to each other on a substrate, and a visible light absorbing pattern between electrodes provided on the substrate are formed. A strip pattern drawing formation method is applied to a black stripe (BS) layer forming process for forming a strip.
Examples of a method for forming a pattern of these paste materials include a high-definition screen printing method (for example, see Patent Document 1) and a high-definition dispenser application method (for example, see Patent Document 2).

The outline of the high-definition screen printing method of patent document 1 is demonstrated using FIG.
In FIG. 1, a glass substrate 101 on which a stripe-shaped partition wall 100 is formed is placed on a stage of a screen printing apparatus 102. On the plane of the top 100A of the partition wall 100, a screen 103 made of a mesh material patterned with an emulsion is stretched at a predetermined interval. The paste material 104 is stacked on the screen 103, and the squeegee 105 is moved in the direction of the arrow X while pressing the squeegee 105 against the screen 103, so that the paste material 104 on the screen passes through the formation pattern and is partitioned by the striped partition walls. The space 106 of the display cell is filled, and a strip pattern 107 is formed.

The outline of the high-definition dispenser application method of Patent Document 2 will be described with reference to FIG.
In FIG. 2, the glass substrate 101 on which the stripe-shaped partition wall 100 is formed is placed on the stage of the dispenser coating apparatus 200. The dispenser coating apparatus 200 includes a dispenser nozzle 201, and an application head 202 is projected from the dispenser nozzle 201. A discharge hole 203 having a true circular cross section is provided at the tip of the coating head 202. A paste material (not shown) filled in the nozzle is discharged from the discharge hole 203. The dispenser nozzle 201 moves in the direction of the arrow X while discharging the paste material, whereby the paste material is filled into the display cell space 106 partitioned by the stripe-shaped partition wall 100, and a band-shaped pattern 107 is formed.

JP 2004-25766 (see FIG. 1) JP 2002-21715 (see FIG. 2)

  However, in the high-definition screen printing method of Patent Document 1, the squeegee 105 is pressed against the screen 103, so that the screen 103 expands as it is used, and a desired pattern cannot be printed. Further, the screen 103 expands and contracts depending on the use environment, particularly the ambient temperature during use, and a desired pattern cannot be printed. In the manufacture of a plasma display panel, for example, the panel has a large screen, so that the screen itself is enlarged and difficult to maintain.

  In the high-definition dispenser application method of Patent Document 2, the application head 202 of the dispenser nozzle 201 is formed so as to protrude, and the cross-sectional shape of the discharge hole 203 at the tip of the application head 202 is a perfect circle. Normally, the discharge holes 203 are formed on the micron order by drilling, but it is very difficult to provide such high-definition holes in the coating head 202. In addition, as the hole diameter of the discharge hole 203 becomes smaller, the pressure loss difference becomes larger. When a high viscosity fluid is discharged at a high speed, a very large pressure is required and a large load is generated in each part of the apparatus. As an example. Further, since the cross-sectional shape of the discharge hole 203 is a perfect circle, there is a concern that the film thickness of the band-shaped pattern formed on the substrate is uneven.

  Here, an object of the present invention is to provide a coating apparatus and a plasma display panel manufacturing method that can form a strip-like pattern with high precision even after long-term use and can easily process minute discharge holes. Is to provide.

  According to the first aspect of the present invention, the substrate and the coating die are relatively moved in a state where the coating die in which the discharge holes for discharging the material are formed are opposed to the substrate, and the band of the material is formed on the substrate. In the coating apparatus for forming the pattern, the coating die faces a first block having a first surface on which a plurality of recesses are formed at predetermined intervals, and the recesses face each other. A second block having a second surface that is a flat surface, the first surface and the second surface are brought into close contact with each other, and the discharge hole is formed by the concave portion and the flat surface. The discharge hole has a first side corresponding to the width of the band-shaped pattern, and has a shape having a width in a direction intersecting with the first side. .

  According to a fifth aspect of the present invention, a plasma display panel is manufactured by discharging a material from the discharge holes while relatively moving the coating die having the discharge holes formed thereon and the substrate to form a strip pattern on the substrate. The coating die has a first block having a first surface in which a plurality of recesses are formed at predetermined intervals, and a surface facing the recesses is a flat surface. A second block having a second surface, the first surface and the second surface are in close contact with each other, and the discharge hole is formed by the concave portion and the flat surface. The substrate and the coating along a direction having a first side corresponding to the width of the strip-shaped pattern and intersecting the direction of the first side with the coating die facing the substrate Plasma display characterized by moving relative to the die Is a Ipaneru method of manufacturing.

<Configuration of the entire coating device>
Hereinafter, an embodiment of the present invention will be described with reference to the drawings. FIG. 3 is a perspective view of the entire coating apparatus of the present embodiment, and FIG. 4 is a schematic configuration diagram of the coating apparatus. 3 and 4, the coating apparatus 1 according to this embodiment includes a base 2, a stage unit 10, a coating processing unit 20, a thickness sensor unit 30, a material supply unit 40, and a control unit 50.

  In FIG. 3, a stage unit 10, a coating processing unit 20, and a thickness sensor unit 30 are provided on the base 2. A pair of guide groove rails 3 is provided on the upper surface of the base 2, and the stage portion 10 is provided along the longitudinal direction of the guide groove rails 3 so as to be reciprocally movable. Here, the reciprocating direction of the stage unit 10 is the X direction, the direction orthogonal to the X direction on the horizontal plane to which the X direction belongs is the Y direction, and the direction perpendicular to the horizontal plane to which the X direction belongs is the Z direction. Define.

The stage unit 10 includes a stage 11, a moving mechanism 14, and a stage position sensor 17. The stage 11 is disposed on the guide groove rail 3 so as to be reciprocally movable in the X direction, and a stage leg 12 and a nut-like connector 13 are provided on the lower surface thereof. The stage leg 12 protrudes from the lower surface of the stage 11 so as to correspond to the guide groove rail 3 and is reciprocally movable in the X direction, and is slidably fitted to the guide groove rail 3.
The moving mechanism 14 includes a feed screw 15 composed of a ball screw and a motor 16. The feed screw 15 is screwed into a connector 13 fixed to the lower surface of the stage 11, and extends through the connector 13 along the guide groove rail 3. One end of the feed screw 15 is rotatably supported by a bearing (not shown), and a motor 16 is connected to one end of the feed screw 15. The stage position sensor 17 is provided on the lower surface of the stage 11 and detects the movement position of the stage 11.

  The coating processing unit 20 includes a coating die 60, a die support unit 21, and an elevating mechanism 22. The die support portion 21 is disposed on the center side of the upper surface of the base 2 and is composed of a columnar body standing upright in the Z direction and a columnar body extending in the Y direction in a cantilever shape, and has an inverted L shape. ing. An elevating mechanism 22 is attached to the tip of the die support 21 so as to be movable in the Z direction, and a coating die 60 is attached to the lower end of the elevating mechanism 22. The elevating mechanism 22 has a horizontal adjustment mechanism (not shown), and thereby the horizontal adjustment of the coating die 60 can be performed. Further, the lifting mechanism 22 is provided with a discharge hole position adjusting mechanism (not shown), whereby the coating die 60 can be moved horizontally in the Y direction to finely adjust the position of the coating die 60.

  The thickness sensor unit 30 is located on one end side of the upper surface of the base 2 and includes a sensor support unit 31, a thickness sensor 32, and a lift actuator 33. The sensor support portion 31 includes a columnar body that stands upright in the Z direction and a columnar body that extends in a cantilever shape along the Y direction, and has an inverted L shape. The front end of the sensor support portion 31 extends to the upper center between the pair of guide groove rails 3, and an elevating actuator 33 is attached to the front end portion. Further, a thickness sensor 32 is attached to the lift actuator 33 downward. As the thickness sensor 32, a laser displacement meter, an electronic micro displacement meter, an ultrasonic thickness meter, or the like can be used.

  As shown in FIG. 4, the material supply unit 40 includes a tank 41 and a syringe pump 42. The tank 41 contains a paste-like material therein, and the material is sucked by the syringe pump 42 and supplied to the coating die 60 in a pressurized state. In the present embodiment, a plasma display panel material or other materials are used as the material.

  The control unit 50 includes a computer 51 and a sequencer 52. The computer 51 is electrically connected to the thickness sensor 32, the lift actuator 33, the syringe pump 42, and the sequencer 52, and operation information of each part of the apparatus is input from these. In response to the operation information, the computer 51 outputs an operation command to the elevating actuator 33, the syringe pump 42, and the sequencer 52.

  The sequencer 52 is electrically connected to the stage motor 16, the stage position sensor 17, the lifting mechanism 22 and the computer 51. The sequencer 52 controls the operations of the stage motor 16 and the lifting mechanism 22 in sequence. The sequencer 52 includes a signal indicating the operating state of the stage motor 16, a signal from the stage position sensor 17, a signal indicating the operating state of the lifting mechanism 22, and a sensor (not shown) that detects the operating state of the coating die 60. Signal is input. On the other hand, a signal indicating a sequence operation is output from the sequencer 52 to the computer 51.

<Configuration of coating die>
Next, the detail of the coating die 60 mentioned above is demonstrated based on drawing. As is apparent from FIG. 3, the coating die 60 extends between the pair of guide groove rails 3 along the Y direction. 5A, 5B, and 5C are respectively a front view, an exploded side view, and an exploded bottom view of the coating die 60 of the present embodiment.

  In FIG. 5, the coating die 60 is composed of a long first block 61 and a second block 66, respectively, and is formed integrally with each other so that the joint surfaces of these blocks 61 and 66 are located in the vertical plane. Has been. A plurality of fine discharge holes 70 are provided at equal intervals on the bottom surface of the coating die 60, and a liquid reservoir 71 is provided inside the coating die 60. In addition, as a material of these 1st block 61 and 2nd block 66, a metal can be used, for example.

  In the first block 61, a plurality of discharge hole recesses 62 are formed at the lower end portion of the joint surface with the second block 66, and a liquid pool recess 65 is formed at the center of the surface. The bottom surface of the first block 61 is a flat surface. The discharge hole recess 62 has a first side 63 having a groove width a and a second side 64 having a groove depth b, and is a fine rectangular groove extending in the vertical direction. A plurality of the discharge hole recesses 62 are arranged in parallel in the groove width direction at a predetermined interval c. In the discharge hole recess 62, the groove width a of the first side 63 coincides with the pattern width a of the belt-like pattern formed on the substrate, and the interval c between the respective discharge hole recesses 62 is determined on the substrate. This coincides with the pattern gap c of the belt-like pattern formed in the above.

  The liquid reservoir recess 65 is formed by being wound in a long rectangular parallelepiped shape from one end of the long block 61 to the other end at the center of the surface joined to the second block 66. The groove depth of the liquid reservoir recess 65 is formed deeper than the groove depth b of the discharge hole recess 62, and the lower portion of the liquid reservoir recess 65 is connected to the upper end of the discharge hole recess 62 in a tapered shape. Has been. Thereby, the material filled in the liquid reservoir 71 flows into the upper end side of the discharge hole recess 62 from the lower surface of the liquid reservoir recess 65 and is uniformly discharged from the lower end side of the discharge hole recess 62. .

  The second block 66 is provided with a discharge hole flat surface 67 at the lower end of the joint surface with the first block 61, and faces the liquid reservoir recess 65 of the first block 61 at the center of the surface. A liquid reservoir recess 68 is provided. The bottom surface of the second block 66 is a flat surface. When the first block 61 and the second block 66 are integrally bonded to each other at the joint surface, a flat surface is formed on the bottom surface 69 of the coating die 60, and the discharge hole recess 62 and the discharge hole flat surface 67 are formed. A discharge hole 70 is formed, and a liquid reservoir 71 is formed from the liquid reservoir recess 65 and the liquid reservoir recess 68.

  The discharge hole recess 62, the liquid reservoir recess 65, and the liquid reservoir recess 68 can be formed by machining, and a conventional grooving method such as a slicer, an end mill, or a milling cutter can be used. For this reason, the dimension a of the first side 63 and the dimension b of the second side 64 in the discharge hole recess 62 can be arbitrarily changed. Accordingly, in pattern formation on the substrate, the pattern width a and the pattern gap c can be set to desired dimensions, and the groove depth b of the discharge hole 70 can be changed, so that the amount of paint discharged can be adjusted as appropriate. . Further, the discharge hole flat surface 67 of the second block can be formed by simple mechanical polishing.

<Plasma display panel structure>
Next, the structure of the plasma display panel manufactured using the coating apparatus 1 of this embodiment is demonstrated based on drawing. FIG. 6 is an exploded perspective view showing the internal structure of the plasma display panel. FIG. 7 is a schematic cross-sectional view for explaining a part of the manufacturing process of the plasma display panel, where (A) is the first step, (B) is the second step, and (C) is the third step. . The plasma display panel of FIG. 6 has a structure shown in Japanese Patent Laid-Open No. 10-27550, and the manufacturing process of the plasma display panel of FIG. 7 is shown in Japanese Patent Application Laid-Open No. 2004-95355.

In FIG. 6, the plasma display panel includes a back substrate 300 and a front substrate 400 that are disposed to face each other via a discharge space. On the inner surface side of the back substrate 300 of the plasma display panel, a plurality of partition walls 301 are arranged to face each other at a predetermined interval, and cells 302R, 302G, and 302B are formed from spaces between these partition walls 301, and these cells 302R are formed. , 302G, and 302B are provided with column electrodes 303 on the bottom surfaces thereof.
In the cells 302R, 302G, and 302B, strip-shaped phosphor layers 304R, 304G, and 304B of three primary colors of red (R), green (G), and blue (B) are sequentially formed. A rare gas is sealed in the discharge space, and ultraviolet light generated in the discharge space excites the phosphor layers 304R, 304G, and 304B to emit visible light.

  6 and 7, the front substrate 400 that is the display surface side of the plasma display panel has a plurality of transparent electrode pairs 401a and 401b, a plurality of bus electrode pairs 402a and 402b, and a plurality of black stripe layers 404 on the inner surface side. Are provided at predetermined intervals and in parallel to a direction orthogonal to the partition walls 301 of the rear substrate 300. Further, the dielectric layer 405 and the protective layer 406 cover the plurality of transparent electrode pairs 401a and 401b, the plurality of bus electrode pairs 402a and 402b, and the plurality of black stripe layers 404.

  In the plasma display panel manufacturing process shown in FIG. 7A, a plurality of transparent electrode pairs 401 a and 401 b made of a transparent conductive film such as wide ITO are provided on the substrate 400 with a space 403 therebetween. In this space 403, a strip-shaped black stripe layer 404 is provided. Next, in order to supplement the conductivity of the transparent electrode pairs 401a and 401b, a plurality of bus electrode pairs 402a and 402b made of a narrow metal film are paired on the transparent electrode pairs 401a and 401b with the space 403 interposed therebetween. It is provided one by one. The black stripe layer 404 is made of a visible light absorbing material such as a black inorganic pigment, and is provided in order to prevent display contrast from being deteriorated by reflection of external light.

  In the step shown in FIG. 7B, the dielectric layer 405 is formed on the front substrate 400 on the transparent electrode pair 401a, 401b, the bus electrode pair 402a, 402b, and the black stripe layer 404 provided on the inner surface side of the front substrate 400. 400 Cover the entire area on the inner surface side. In the step shown in FIG. 7C, a protective layer 406 made of MgO covers the dielectric layer 405 in order to protect the dielectric layer 405.

<Plasma display panel manufacturing method>
Next, a method for manufacturing the plasma display panel of this embodiment will be described. First, a method for manufacturing the back substrate 300 will be described with reference to the drawings.
FIG. 8 is a perspective view showing a process of forming the red phosphor layer 304R on the back substrate 300 of the plasma display panel using the coating apparatus 1 according to the present embodiment. FIG. 9 is an enlarged view of a main part of FIG.

As shown in FIGS. 8 and 9, in advance, as shown in FIGS. 8 and 9, a plurality of partition walls 301 are formed on the back substrate 300 so as to face each other by a predetermined procedure, and cells 302R and 302G formed between the partition walls 301 are formed. , 302B is prepared with a back substrate 300 provided with column electrodes 303 on the bottom surfaces thereof.
Next, the process proceeds to a step of sequentially forming strip-shaped phosphor layers 304R, 304G, and 304B of three primary colors of red (R), green (G), and blue (B) in these cells 302R, 302G, and 302B, respectively. . In the present embodiment, the phosphor layers 304R, 304G, and 304B are formed by using the above-described coating apparatus 1, and each of the phosphor pastes of red (R), green (G), and blue (B) is used. Three types of corresponding coating dies 60 are prepared in advance.

First, a process of forming the phosphor layer 304R by applying a red phosphor paste will be described.
3 and 4, the stage 11 is moved to below the thickness sensor 32 when the origin return of each operation unit of the coating apparatus 1 is performed. At this time, the red phosphor paste in the tank 41 is sucked by the syringe pump 42 and carried to the liquid reservoir 71 of the coating die 60.

  When the back substrate 300 is placed on the stage 11 of the coating apparatus 1 so that the cells 302R are parallel to the X direction, the thickness sensor 32 descends to the vicinity of the back substrate 300, and the thickness of the back substrate 300 is increased. Measure the thickness. After measuring the thickness of the back substrate 300, the thickness sensor 32 rises to the original position.

  Next, the stage moves in the X direction, the back substrate 300 is disposed under the coating die 60, and the coating die 60 is lowered until the distance between the back substrate 300 and the discharge holes 70 reaches a predetermined clearance. . This clearance is several times the thickness of the pattern to be formed, for example, about 0.05 to 0.20 mm, and the thickness of the back substrate 300 measured by the thickness sensor 32 is taken into consideration and the stage 11 and the discharge. It is accurately determined based on a signal from a distance sensor (not shown) that measures the distance to the hole 70.

  8 and 9, the position of the coating die 60 is adjusted to be parallel to the back substrate 300 by a horizontal adjustment mechanism (not shown). The coating die 60 is horizontally moved in the Y direction by a discharge hole position adjusting mechanism (not shown), and finely adjusted so that the cells 302R formed on the back substrate 300 and the discharge holes 70 face each other at a desired position. Is done. When these fine adjustments of the coating die 60 are performed, the stage 11 is moved to a desired position where pattern formation starts, and the alignment of the coating die 60 is completed. Here, a pattern can be formed on the back substrate 300.

  When the pattern formation is started, the red phosphor paste filled in the liquid reservoir 71 of the coating die 60 is discharged from the discharge hole 70 at a constant discharge speed by a constant pressure applied from the syringe pump 42. At the same time, the stage 11 moves relative to the bottom surface 69 of the coating die 60 in the X direction at a constant speed. As a result, a strip-shaped red phosphor layer 304R having a pattern width a and a pattern gap c is simultaneously and uniformly formed on the back substrate 300. Here, since the discharge speed of the red phosphor paste and the moving speed of the stage 11 are constant, the film thickness of the red phosphor layer 304R can be adjusted to a desired dimension by changing the stage moving speed.

  When the stage 11 is moved while the pattern is being formed and the discharge hole 70 is positioned on the finish line, the movement of the stage 11 is stopped, and at the same time, the discharge operation by the syringe pump 42 is stopped. Immediately after the discharge operation is stopped, the red phosphor paste remaining in the discharge hole 70 is slightly sucked to the pump side by the syringe pump 42. Thereby, dripping from the discharge hole 70 can be prevented. After the pattern formation is completed, the coating die 60 is raised to the original position, and the red phosphor paste adhering to the bottom surface of the coating die 60 is wiped off by a cleaner (not shown).

Further, the green phosphor layer 304G is formed, and then the blue phosphor layer 304B is formed. The green phosphor layer 304G and the blue phosphor layer 304B are formed in the same manner as the red phosphor layer 304R described above. The same. A coating die 60 corresponding to each phosphor paste of the green phosphor layer 304G and the blue phosphor layer 304B is installed in the coating apparatus 1, and the phosphor layers 304G and 304B are sequentially formed on the cell 302G and the cell 302B. The
When the phosphor layers 304R, 304G, and 304B of three colors of red, green, and blue are formed on the back substrate 300, the process proceeds to a firing process for the phosphor layers 304R, 304G, and 304B. This baking process is performed by a normal procedure.

  The film thicknesses of the phosphor layers 304R, 304G, and 304B can be adjusted as appropriate by changing the stage moving speed or the dimension of the groove depth b of the discharge hole recess 62. However, this film thickness is the film thickness after coating, and the phosphor layers 304R, 304G, and 304B in the finished product of the back substrate 300 are formed by the firing process of the phosphor layers 304R, 304G, and 304B. It becomes thinner than the film thickness after application. Therefore, the film thickness after coating must be determined in consideration of the contracted film thickness after firing.

Next, the manufacturing method of the front substrate 400 of a plasma display panel is demonstrated based on drawing.
FIG. 10 is a perspective view showing a process of forming the black stripe layer 404 on the front substrate 400 of the plasma display panel using the coating apparatus 1 according to this embodiment. The formation of the black stripe layer 404 on the front substrate 400 is also similar to the manufacturing method of the back substrate 300, and here, differences from the above will be described.

  First, as a pre-process, as shown in FIG. 10, a pattern of a plurality of transparent electrode pairs 401 a and 401 b and a plurality of bus electrode pairs 402 a and 401 b is formed on the front substrate 400 at a predetermined interval by a predetermined procedure. A front substrate 400 on which is formed is prepared. Note that the coating die 60 is used in alignment with the pattern width a and the pattern gap c of the space 403.

  In FIG. 10, when the front substrate 400 is placed on the stage 11 of the coating apparatus 1 as described above, the coating die 60 is aligned, and pattern formation is started. The black stripe paste is discharged at the discharge speed, and at the same time, the stage 11 moves relative to the coating die 60 in the X direction at a constant speed. As a result, a strip-like pattern of the plurality of black stripe layers 404 is simultaneously and uniformly formed in the space 403 on the front substrate 400.

  Thereafter, the process proceeds to the firing process of the black stripe layer 404, and as shown in FIG. 7B, the transparent electrode pair 401a, 401b, the bus electrode pair 402a, 402b provided on the inner surface side of the front substrate 400, and The dielectric layer 405 and the protective layer 406 cover the entire surface of the front substrate 400 on the black stripe layer 404.

The film thickness of the black stripe layer 404 can be adjusted as appropriate by changing the stage moving speed or the dimension of the groove depth b of the discharge hole recess 62. However, this film thickness is only the film thickness after application, and the film thickness of the black stripe layer 404 in the completed front substrate 400 becomes smaller than the film thickness after application by the baking process of the black stripe layer 404. Therefore, the film thickness after coating must be determined in consideration of the contracted film thickness after firing.
The plasma display panel is manufactured by arranging the rear substrate 300 and the front substrate 400 manufactured as described above so as to face each other as usual.

<Effect of embodiment>
As described above, the present embodiment is configured such that the coating die 60 having the plurality of discharge holes 70 and the stage 11 move relative to each other, so that a plurality of belt-like patterns are simultaneously formed on the substrate. And it can form uniformly. In addition, the coating apparatus 1 of the present embodiment can achieve an effect equal to or higher than that of the conventional high-definition screen printing method without using a screen, and the problems associated with the above-described conventional high-definition screen printing method are solved. In other words, even when used for a long period of time, a belt-like pattern can be formed with high accuracy, the ambient temperature during use does not affect the pattern formation, and maintenance of the coating apparatus 1 is easy.

  Further, in the present embodiment, the coating die 60 is divided into a first block 61 and a second block 66, and the discharge hole 70 is formed with the discharge hole recess 62 of the first block 61 and the second block 61. The discharge hole flat surface 67 of the block 66 is opposed to each other and is integrally bonded. Therefore, in the processing of the coating die 60, the discharge hole recess 62 of the first block 61 is exposed to the front surface, so that the fine discharge hole 70 having a desired size is not cut by a conventional cutting method. Can be easily formed. Further, the discharge hole recess 62 of the first block 61 can be formed by a simple cutting process, and the discharge hole flat surface 67 of the second block 61 can be formed by simple mechanical polishing. Mass production processing can be performed by continuously operating the processing.

In the present embodiment, when manufacturing the plasma display panel, the band-shaped pattern is formed on the substrate using the coating die 60 having the above-described structure, and thus the minute band-shaped pattern necessary for the plasma display is formed with high accuracy. be able to.
Also,
Since the phosphor layer is formed as a strip pattern on the back substrate 300 of the plasma display panel, the phosphor layer can be easily formed on the back substrate 300.
Furthermore, since the black stripe of the visible light absorbing material is formed as a strip pattern on the front substrate 400 of the plasma display panel, the black stripe can be easily formed on the front substrate 400.

  The discharge hole 70 of the coating die 60 has a rectangular shape having a first side 63 having a groove width a and a second side 64 having a groove depth b, and is formed at a predetermined interval c. The groove depth b of the second side 64 of the discharge hole 70 can be appropriately adjusted by changing the dimension of the groove depth b of the discharge hole recess 62 by machining. Therefore, on the back substrate 300 and the front substrate 400 of the plasma display panel, a strip-like pattern having a desired dimension can be uniformly formed without changing the pattern width a, and the discharge amount of the phosphor paste and the black stripe paste Therefore, it is possible to reduce the pressure loss difference that occurs during pattern formation.

Further, according to the present embodiment, a pattern having a desired thickness can be quickly created by increasing the dimension of the groove depth b of the discharge hole recess 62 and increasing the stage moving speed. . That is, the working time can be shortened.
Further, a liquid reservoir recess 65 is formed in the first block 61, and a liquid reservoir recess 68 is formed in the second block 67, and the liquid reservoir 71 is formed from the liquid reservoir recess 65 and the liquid reservoir recess 68. Configured. Therefore, a large amount of paste-like material can be stored in a stable state in the liquid reservoir 71, and a large amount of paste-like material can be discharged while maintaining a stable state by reducing the dimensions of the discharge holes 70. .

<Modification of Embodiment>
It should be noted that the present invention is not limited to the above-described embodiments, and modifications, improvements, and the like within the scope that can achieve the object of the present invention are included in the present invention.
For example, in the above-described embodiment, the tip opening of the discharge hole 70 is formed in a rectangular shape. However, in the present invention, the shape of the discharge hole 70 is not limited to that in the above-described embodiment. It may be a shape.
That is, as shown in FIG. 11A, the tip opening of the discharge hole 70 of the coating die 60 may be semicircular, and the tip of the discharge hole 70 of the coating die 60 is shown in FIG. The opening may be a triangle. In these modified examples as well, the discharge hole 70 has a first side having a groove width a corresponding to the width a of the belt-like pattern and a width b in a direction intersecting the side. For this reason, also in these coating dies 60, the pattern width a and the pattern gap c of the pattern formed on the substrate can be set to desired dimensions, and the width b of the discharge hole 70 can be changed. The discharge amount can be adjusted as appropriate.
Moreover, in the said embodiment, although the bottom face 69 of the coating die 60 was formed in planar shape, in this invention, as shown in FIG. 12, from the triangular notch etc. between the discharge holes 70 adjacent in the bottom face 69. A structure may be provided in which each step 72 is formed. In this structure, even when a paste-like material having a low viscosity is discharged, there is no possibility that the material discharged from the adjacent discharge hole 70 will be in contact with the stepped portion 72, thereby ensuring accurate discharge of the material. can do.

In the embodiment, the coating die 60 is fixed and the stage 11 is moved. However, in the present invention, the stage 11 is fixed and the coating die 60 is moved, or the stage 11 and the coating die 60 are moved. It is possible to adopt a configuration in which both are moved together.
Further, in the present invention, there may be a configuration in which the liquid reservoir 71 is not provided inside the coating die 60 but the liquid reservoir 71 is provided outside the coating die 60.
In the embodiment, the liquid reservoir 71 is formed from the liquid reservoir recess 65 of the first block 61 and the liquid reservoir recess 68 of the first block 61. However, the present invention is not limited to this. A configuration may be adopted in which a liquid reservoir recess is formed in only one of the first block 61 and the second block 66. For example, a configuration in which the discharge hole recess 62 and the liquid pool recess 65 are formed only in the first block 61 and the second block 66 is flat on the joint surface with the first block 61 is exemplified.

  In the above-described embodiment, the phosphor layers 304R, 304G, and 304B on the back substrate 300 are configured to be sequentially formed using different coating apparatuses 1, but each of the three colors is formed on one coating apparatus 1. The coating die 60, the coating processing unit 20, and the material supply unit 40 are attached, and the three coating dies 60 are attached to each other in the moving direction of the stage 11, and each strip pattern forming operation is appropriately adjusted by the control unit 50. Thus, the three-color phosphor layers 304R, 304G, and 304B may be simultaneously formed by moving the stage once.

<Effects of Embodiment>
In the present embodiment, the substrate and the coating die 60 are moved relative to each other in a state where the coating die 60 in which the discharge holes 70 for discharging the material are formed are opposed to the substrate, and a belt-like pattern of the material is formed on the substrate. In the coating apparatus 1 to be formed, the coating die 60 includes a first block 61 in which a plurality of discharge hole recesses 62 are formed at predetermined intervals c, and the discharge hole recesses 62. A second block 66 provided with a flat surface 67 for discharge holes on the opposite surface, and a discharge hole 70 is formed by the concave portion 62 for discharge holes and the flat surface 67 for discharge holes. Since the first side 63 corresponding to the width a of the band-shaped pattern is provided and the second side 64 having the width b is formed in a direction intersecting with the first side, a plurality of patterns are formed on the substrate. A band-like pattern can be formed simultaneously and uniformly, and even when used for a long time. It can be molded to the pattern with high precision. Moreover, there is no influence on pattern formation by the ambient temperature at the time of use, and maintenance of the coating apparatus 1 is easy. Further, the discharge hole 70 can be easily formed in a desired dimension by a conventional cutting method that does not use drilling. The discharge hole 70 has a second side 64 having a groove depth b. By changing the groove depth b, the discharge amount of the material can be adjusted as appropriate, and the pressure loss difference that occurs during pattern formation is reduced. it can.

Schematic of the conventional high-definition screen printing method. Schematic of the conventional high-definition dispenser application method. The perspective view which shows the whole coating apparatus concerning one Embodiment of this invention. The schematic block diagram of the coating apparatus of the said embodiment. The coating die | dye of the said embodiment is shown, (A) is a front view, (B) is an exploded side view, (C) is an exploded bottom view. The disassembled perspective view which shows the internal structure of a plasma display panel. The typical sectional view explaining the formation process of the front substrate of a plasma display panel. The perspective view for demonstrating the process of forming a red fluorescent substance layer in the back substrate of a plasma display panel using the coating apparatus of the said embodiment. The figure which expanded the principal part of the coating apparatus of FIG. The perspective view for demonstrating the process of forming a black stripe layer in the front substrate of a plasma display panel using the coating apparatus of the said embodiment. 9A and 9B show modified examples of the present invention, in which FIG. 9A is an exploded bottom view when the discharge hole shape is semicircular, and FIG. 5B is an exploded bottom view when the discharge hole shape is triangular. The front view of the coating die which shows the different modification of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Coating apparatus 11 Stage 60 Coating die 61 1st block 62 Discharge hole recessed part 65 Liquid reservoir recessed part 66 2nd block 67 Flat surface for discharge hole 68 Liquid reservoir recessed part 70 Discharge hole 71 Liquid reservoir (filling part) )
300 Rear substrate 301 Partition 304R Red phosphor layer 304G Green phosphor layer 304B Blue phosphor layer 400 Front substrate 403 Space 404 Black stripe layer

Claims (7)

A coating apparatus for forming a strip pattern of the material on the substrate by moving the substrate and the coating die relative to each other in a state where the coating die having a discharge hole for discharging the material is opposed to the substrate. There,
The coating die has a first block having a first surface in which a plurality of recesses are formed at predetermined intervals, and a second surface in which the surface facing the recesses is a flat surface. A second block, wherein the first surface and the second surface are in close contact with each other, and the discharge hole is formed by the concave portion and the flat surface, and the discharge hole has a width of the band-shaped pattern. The coating apparatus is characterized by having a first side corresponding to, and having a width in a direction intersecting with the first side. In the coating apparatus according to claim 1,
A coating apparatus, wherein a step portion is provided between the plurality of ejection holes in a portion of the coating die facing the substrate. In the coating apparatus according to claim 1 or claim 2,
The discharge hole has a rectangular shape, and one side of the rectangular shape is the first side. In the coating apparatus described in any one of Claims 1-3,
A recess is formed in at least one of the first block and the second block, and a space including the recess is a filling portion that communicates with the discharge hole and is filled with the material. Coating equipment. A method of manufacturing a plasma display panel by forming a strip-shaped pattern on a substrate by discharging material from the discharge holes while relatively moving a coating die and a substrate in which discharge holes are formed,
The coating die has a first block having a first surface in which a plurality of recesses are formed at predetermined intervals, and a second surface in which the surface facing the recesses is a flat surface. A second block, wherein the first surface and the second surface are in close contact with each other, and the discharge hole is formed by the concave portion and the flat surface, and the discharge hole has a width of the band-shaped pattern. The substrate and the coating die are relatively moved along a direction intersecting the direction of the first side with the coating die facing the substrate. A method of manufacturing a plasma display panel. In the manufacturing method of the plasma display according to claim 5,
The method for manufacturing a plasma display panel, wherein the band-shaped pattern is a phosphor layer, and the band-shaped pattern is formed between partitions provided on the substrate. In the manufacturing method of the plasma display according to claim 5,
The method for manufacturing a plasma display panel, wherein the band-shaped pattern is a pattern of a visible light absorbing material, and the band-shaped pattern is formed between electrodes provided on the substrate.

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