JP5146177B2 - Die coating method and plasma display panel manufacturing method - Google Patents

Description

  The present invention relates to a method for manufacturing a plasma display panel (hereinafter referred to as PDP) known as a thin image display device, and more particularly to a die coating method in which a material is applied to a substrate.

  In recent years, a PDP is a typical display device suitable for thinness. This PDP includes a front plate and a back plate that are arranged to face each other. A transparent electrode, a bus electrode, a black stripe, a dielectric layer, and a protective layer are sequentially formed on the front substrate serving as the substrate of the front plate. An address electrode and a dielectric layer are formed on a back substrate serving as a back plate substrate, and a partition is formed thereon. A phosphor layer is applied and formed between the barrier ribs.

  A discharge gas (for example, a mixed gas of Ne—Xe) is sealed in the discharge space between the front plate and the back plate at a pressure of 55 kPa to 80 kPa. A plasma display device is completed by attaching a drive circuit to the PDP having the above configuration.

Here, in the method of manufacturing the front plate and the back plate, a die coating method is widely used in forming a thick film such as a dielectric layer of the front plate and a partition wall of the back plate (for example, see Non-Patent Document 1). .
2001 FPD Technology Taizen, Electronic Journal, Inc., October 25, 2000, p654-p658

  In recent years, in order to greatly improve the production capacity of PDPs, a so-called multi-sided process is employed in which a plurality of sheets are produced from one large substrate when the front plate or the back plate is formed. However, the above-described die coating method may cause problems.

  For example, when a dielectric layer is formed by a die coating method, it is necessary to apply a dielectric paste to a plurality of regions while avoiding electrode terminal portions for supplying a voltage. Here, considering production efficiency, it is ideal to apply a dielectric paste to each application region by a plurality of die heads. However, when a plurality of die heads are used, problems that cannot occur with a single die head, such as interference of each die head, substrate displacement, and coating film thickness variation, occur.

  The present invention has an effect of eliminating these problems, and can perform a die coating method with high production efficiency and high accuracy.

In order to achieve the above object, the die coating method of the present invention applies a paste material by a plurality of die heads, and the application direction of any one of the die heads is a different direction on the same straight line as the application direction of the other die head. There is a period in which the period of application by the die head overlaps the period of application by the other die head .

  Here, the application direction of one of the die heads may be opposite to the application direction of the other die head. Further, there may be a period in which the period of application by any die head overlaps the period of application by another die head, and the application direction of any die head and the application direction of another die head may be opposite. A plurality of application areas to be applied by a plurality of die heads exist in the application direction of any of the die heads, and an application area to be applied by any of the die heads may not be adjacent to an application area to be applied by another die head. .

  Further, the odd-numbered area and the other odd-numbered area are coated with the different die heads counted from the coating direction of any of the die heads, or the even-numbered areas and the other even-numbered areas counted from the coating direction. These areas may be applied by the plurality of die heads.

  Further, the PDP manufacturing method of the present invention is a PDP manufacturing method including a step of applying paste material to a plurality of regions by a plurality of die heads, wherein the paste material is applied by the die coating method. is there.

  ADVANTAGE OF THE INVENTION According to this invention, the die coating method which can apply | coat paste material with high production efficiency and stable quality can be used with respect to the application | coating area | region which exists separately in several application directions, and high quality PDP Can be realized.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. Since the present invention relates to a die coating method and a PDP manufacturing method, the structure and manufacturing method of the PDP will be described first. FIG. 1 is a perspective view showing the structure of PDP 1 in the present embodiment.

  On the front glass substrate 3 of the front plate 2, a pair of strip-like display electrodes 6 and light-shielding layers (black stripes) 7 composed of the scanning electrodes 4 and the sustain electrodes 5 are arranged in a plurality of rows in parallel with each other. A dielectric layer 8 serving as a capacitor is formed on the front glass substrate 3 so as to cover the display electrode 6 and the light shielding layer 7, and a protective layer 9 made of magnesium oxide (MgO) is formed on the surface. Has been.

  On the back glass substrate 11 of the back plate 10, a plurality of strip-like address electrodes 12 are arranged in parallel to each other in a direction orthogonal to the scanning electrodes 4 and the sustain electrodes 5 of the front plate 2. Layer 13 is covering. Further, a partition wall 14 having a predetermined height is formed on the base dielectric layer 13 between the address electrodes 12 to divide the discharge space 16. For each address electrode 12, a phosphor layer 15 that emits red, blue, and green light by ultraviolet rays is sequentially applied to the grooves between the barrier ribs 14 and formed. A discharge cell is formed at a position where the scan electrode 4 and the sustain electrode 5 intersect with the address electrode 12, and the discharge cell having red, blue and green phosphor layers 15 arranged in the direction of the display electrode 6 is used for color display. Become a pixel.

  The front plate 2 and the back plate 10 formed as described above are arranged to face each other, and the outer peripheral portion thereof is hermetically sealed with a sealing material made of glass frit or the like. The discharge space 16 inside the sealed PDP 1 is filled with a discharge gas such as Ne and Xe at a pressure of 55 kPa to 80 kPa.

FIG. 2 is a cross-sectional view of the front plate 2 showing the configuration of the dielectric layer 8 of the PDP in the present embodiment. 2 is shown upside down from FIG. As shown in FIG. 2, a display electrode 6 and a light shielding layer 7 including scanning electrodes 4 and sustain electrodes 5 are formed in a pattern on a front glass substrate 3 manufactured by a float method or the like. Scan electrode 4 and sustain electrode 5 are made of transparent electrodes 4a and 5a made of ITO, SnO ₂ or the like, metal bus electrodes 4b and 5b made of a conductive material mainly composed of silver material, ruthenium compounds and ruthenium oxides, respectively. , Copper-iron-based, cobalt black complex oxide, and black electrodes 4c and 5c made of glass powder.

  The metal bus electrodes 4b and 5b are used for the purpose of imparting electrical conductivity in the longitudinal direction of the transparent electrodes 4a and 5a, and the black electrodes 4c and 5c are used for the purpose of suppressing the reflection of external light and improving the bright place contrast. . Therefore, for these purposes, black electrodes 4c and 5c are formed on the transparent electrodes 4a and 5a, and metal bus electrodes 4b and 5b are formed on the black electrodes 4c and 5c.

  The front plate 2 includes a dielectric layer 8 formed on the front glass substrate 3 so as to cover the transparent electrodes 4a and 5a, the metal bus electrodes 4b and 5b, and the light shielding layer 7, and further on the dielectric layer 8. A protective layer 9 is formed.

  Next, a method for manufacturing the PDP 1 will be described. First, the scan electrode 4, the sustain electrode 5, and the light shielding layer 7 are formed on the front glass substrate 3. The transparent electrodes 4a and 5a, the metal bus electrodes 4b and 5b, and the black electrodes 4c and 5c are formed by patterning using a photolithography method or the like. The transparent electrodes 4a and 5a are formed using a thin film process or the like, and the metal bus electrodes 4b and 5b are solidified by baking a paste containing a silver material at a desired temperature. The black electrodes 4c and 5c and the light shielding layer 7 are formed in the same step by screen printing a paste containing a black pigment or forming a black pigment on the entire surface of the glass substrate, and then patterning and baking using a photolithography method. Is formed.

  Next, a dielectric paste is applied on the front glass substrate 3 by a die coating method or the like so as to cover the scan electrode 4, the sustain electrode 5, and the light shielding layer 7, thereby forming a dielectric paste layer (dielectric material layer). After the dielectric paste is applied, the surface of the applied dielectric paste is leveled by leaving it to stand for a predetermined time, so that a flat surface is obtained. Thereafter, the dielectric paste layer is baked and solidified to form the dielectric layer 8 that covers the scan electrode 4, the sustain electrode 5, and the light shielding layer 7. The dielectric paste is a paint containing a dielectric material such as glass powder, a binder and a solvent. Next, a protective layer 9 made of magnesium oxide (MgO) is formed on the dielectric layer 8 by a vacuum deposition method. Through the above steps, predetermined components (scanning electrode 4, sustaining electrode 5, light shielding layer 7, dielectric layer 8, and protective layer 9) are formed on front glass substrate 3, and front plate 2 is completed.

  On the other hand, the back plate 10 is formed as follows. First, the structure for the address electrode 12 is formed by a method of screen printing a paste containing silver (Ag) material on the rear glass substrate 11 or a method of patterning using a photolithography method after forming a metal film on the entire surface. An address electrode 12 is formed by forming a material layer to be an object and firing it at a desired temperature. Next, a dielectric paste is applied on the rear glass substrate 11 on which the address electrodes 12 are formed by a die coating method so as to cover the address electrodes 12 to form a dielectric paste layer. Thereafter, the base dielectric layer 13 is formed by firing the dielectric paste layer. The dielectric paste is a paint containing a dielectric material such as glass powder, a binder and a solvent.

  Next, a partition wall forming paste containing a partition wall material is applied on the underlying dielectric layer 13 by a screen printing method, a die coating method, or the like, and patterned into a predetermined shape to form a partition wall material layer, followed by firing. Thus, the partition wall 14 is formed. Here, as a method of patterning the partition wall paste applied on the base dielectric layer 13, a photolithography method or a sand blast method can be used. Next, the phosphor layer 15 is formed by applying a phosphor paste containing a phosphor material on the base dielectric layer 13 between the adjacent barrier ribs 14 and on the side surfaces of the barrier ribs 14 and baking it. Through the above steps, the back plate 10 having predetermined components on the back glass substrate 11 is completed.

  In this way, the front plate 2 and the back plate 10 provided with predetermined constituent members are arranged to face each other with high precision so that the scanning electrodes 4 and the address electrodes 12 are orthogonal to each other, and the periphery thereof is sealed with glass frit, The PDP 1 is completed by enclosing a discharge gas containing Ne, Xe or the like in the discharge space 16.

  Here, the die coating method used in the PDP manufacturing method will be described by taking the dielectric layer 8 as an example.

  The die coating method is a method of discharging a paste from the slit of the die head and moving the die head or the substrate in the coating direction to form a coating film, and is suitable for thick film coating. The paste is injected into a sealed container such as a tank, and the inside of the tank is pressurized to be supplied from the tank through a pipe to a syringe pump or the like, and further supplied to the die head by mechanical pressure feeding such as a syringe pump.

  Further, in order to stabilize the coating film thickness, a manifold is provided in the die head for equalizing the internal pressure due to the pressure of the paste in the coating width direction. Also, since the internal pressure until the paste is ejected from the slit of the die head is not transmitted directly at the start end at the start of coating, the coating speed is partially adjusted to adjust the film thickness and shape, and the coating is completed. At the end of the time, the supply of paste is stopped by stopping mechanical pumping such as a syringe pump, and the film thickness and shape are adjusted.

  When adjusting the film thickness at the end, the internal pressure of the paste does not disappear immediately even if mechanical pumping is stopped.Therefore, a valve for releasing the internal pressure is provided in the middle of the pipe and the paste is sheared by the shear stress of the paste. In order to stabilize the shape of the end portion by cutting the die head, the die head is raised immediately after the end portion is applied.

  A coating method for coating the dielectric layer 8 on the front glass substrate 3 by this die coating method will be described with reference to FIG. In the step of applying the dielectric layer 8 as described above, the display electrodes 6 are already formed on the front glass substrate 3, but these are not shown in the figure. Further, here, a method of coating by fixing the front glass substrate 3 and operating the die head 17 will be described as an example.

  First, in the head cleaning step, the head cleaning unit 18 performs head cleaning in order to clean the lip that is the slit exit of the die head 17. In this step, the front glass substrate 3 is fixed by vacuum suction on the stage. The die head 17 includes a laser displacement meter 19 (FIG. 3A).

  Next, in the substrate thickness measurement step, the thickness of the front glass substrate 3 (including the display electrode 6 already formed) is measured by the laser displacement meter 19. At this time, the laser displacement meter 19 operates in synchronization with the die head 17, thereby measuring the substrate thickness with the laser light 20 and moving the die head 17 to the coating start position. The substrate thickness measurement step may be performed before the head cleaning step. Moreover, you may measure the thickness of the front glass substrate 3 by the method of using means other than the laser displacement meter 19 (FIG.3 (b)).

  Next, in a coating step, a dielectric paste is applied on the front glass substrate 3 to form a coating film 21. At this time, the die head 17 moves up and down in accordance with the undulation of the thickness of the front glass substrate 3 measured in the base material thickness measurement step, thereby controlling the gap between the front glass substrate 3 and the lip of the die head 17 to be constant. Thus, a more uniform dielectric paste coating film 21 is obtained (FIG. 3C).

  Next, in the step of moving to the head cleaning position, the die head 17 that has finished coating is moved to the cleaning position, and the coating ends. The front glass substrate 3 with the dielectric paste coating film 21 is transferred to the next process, and the next front glass substrate 3 to be processed is transferred to the die coating process (FIG. 3D).

  In addition to the example described above, there is a method in which the die head 17 is fixed and the front glass substrate 3 operates. However, since the same operation is performed relatively, it can be said that the method is the same.

  By the way, in recent years, in the above-described coating method, in order to greatly improve the production capacity, a so-called multi-sided process in which a plurality of sheets are produced from one large substrate is employed as the formation of the front plate 2 and the back plate 10. ing. However, as described above, there may be a problem caused by the multi-chamfer process. Hereinafter, the problem will be described.

  First, the example of arrangement | positioning of the front plate 2 with respect to the large sized board | substrate 22 in the case of multi-surface drawing is shown in FIG. FIG. 4A is a diagram showing before cleaving, and FIG. 4B is a diagram showing after cleaving. FIG. 4 is an example of 16 chamfering, and four surfaces can be arranged on the long side of the PDP 1 and four surfaces can be arranged on the short side. Thus, after forming the component 23 of each front plate 2 on the large-sized substrate 22 (FIG. 4A), it is cleaved to produce 16 precursors 24 of the front plate 2 (FIG. 4 ( b)).

  That is, when the dielectric layer 8 is formed before the precursor 24 is cleaved, the dielectric paste is not applied to the front surface of the large-sized substrate 22, but is applied only to the component 23 forming regions of the precursor 24. It will be necessary.

  FIG. 5 shows a plan view when the dielectric layer 8 is applied to the large substrate 22. For example, as shown in FIG. 5A, when coating is performed using a die head 17 corresponding to the entire length of the large substrate 22 in the Y direction, the dielectric paste of the die head 17 and the slit to be discharged are divided to be discharged. The dielectric paste can be controlled to be divided into widths y1, y2, y3, and y4. On the other hand, in the X direction, the die head 17 must be moved up and down at every coating distance x1, x2, x3, and x4 to apply intermittently.

  However, as described above, in the die coating method, it is necessary to measure the base material thickness before applying the paste material on the substrate, and the die head needs to substantially move the distance of the application region twice. .

  Further, once the application by the die head 17 is interrupted (for example, when x1 is applied and then x2 is applied), the lip of the die head 17 has a dielectric paste remaining on the lip at the end of the application and the inside of the head or piping. In many cases, a dielectric paste that is slightly ejected by the residual internal pressure adheres. For this reason, when the next region is applied, the film thickness, shape and the like of the starting end portion of the coating film 21 cannot be controlled, resulting in a defective product. For this reason, it is necessary to always return to the position of the head cleaning unit 18 installed outside the substrate after the application of a certain application region and perform the above-described head cleaning process. That is, the coating time on a large substrate becomes long and the production efficiency is extremely deteriorated.

  On the other hand, a method is conceivable in which a die head 17 corresponding to the number of application regions (the number of regions in FIGS. 4 and 5 is 4) is provided to apply each application region simultaneously. An example of this is shown in FIG. However, in this case, since the equipment cost is high, it is necessary to provide a head cleaning process time for each die head 17 and a cleaning device. Therefore, the die head to be arranged inside the substrate (x2 in FIGS. 4 and 5). And the die head for applying x3) must be moved from the outside of the large substrate 22 before application, and the application time is not substantially shortened.

  Further, as a result of investigations by the inventors, it has been found that when a plurality of die heads 17 are moved in the same direction to perform coating, displacement or deflection of the substrate occurs, the area / position of the coating region changes, and accuracy decreases. did. This is a phenomenon that occurs even when the large substrate 22 is fixed to a coating stage by vacuum suction. A portion with a different thickness of the dielectric layer 8 is generated, resulting in a defective product such as a spot or unevenness when displaying an image. It becomes.

  Such a phenomenon is not limited to the dielectric layer 8 of the front glass substrate 3, but the same can be said for the underlying dielectric layer 13 and the partition 14 formed on the rear glass substrate 11.

  For these problems, the die coating method in the embodiment of the present invention is characterized in that a paste material is applied by a plurality of die heads, and the application direction of any one of the die heads is different from the application direction of the other die heads. It is. Here, the application direction of one of the die heads may be opposite to the application direction of the other die head. Further, there may be a period in which the period of application by any die head overlaps the period of application by another die head, and the application direction of any die head and the application direction of another die head may be opposite. A plurality of application areas to be applied by a plurality of die heads exist in the application direction of any of the die heads, and an application area to be applied by any of the die heads may not be adjacent to an application area to be applied by another die head. . Further, the odd-numbered area and the other odd-numbered area are coated with the different die heads counted from the coating direction of any of the die heads, or the even-numbered areas and the other even-numbered areas counted from the coating direction. These areas may be applied by the plurality of die heads.

  In addition, the PDP manufacturing method according to the embodiment of the present invention is a PDP manufacturing method including a step of applying a paste material to a plurality of regions by a plurality of die heads, wherein the paste material is applied by the die coating method. It is a feature.

  Note that the direct opposite described here means that the coating direction of any one of the above-described die heads and the other die heads is substantially on the same straight line, and the respective directions are opposite to each other. The details will be described later with reference to FIGS.

  By taking such a form, it is possible to ensure high production efficiency without interfering with a plurality of die heads, and to maintain the shape accuracy and quality of the dielectric layer.

  From here, said die-coating method is demonstrated in detail using FIGS. 6-10. Here, as in FIG. 4 and FIG. 5, a case where a 16-side substrate is cut from the large substrate 22 is shown as an example. That is, it corresponds to the case of dividing into 4 in the long side direction and 4 in the short side direction. The die coating manufacturing apparatus has two first stages 25 and second stages 26, each of which has two die heads 17a and 17b on the first stage 25 and two die heads 17c and 17d on the second stage 26, respectively. have. Then, the following operations (1) to (5) are performed.

  (1) First, in each stage, the large substrate 22 is carried in from above the paper surface with the die head stopped above the stage end. Then, the large substrate 22 stops at a predetermined position on the first stage 25, and is vacuum-sucked and fixed. Thereafter, as the die head 17a moves from the left side of the drawing, the undulation of the large substrate 22 in the region A is measured by a laser displacement meter (not shown) in the same manner as the base material thickness measurement step described above. Similarly, as the die head 17b moves from the right side of the drawing, the undulation of the large substrate 22 in the region C is measured by a laser displacement meter (not shown) (FIG. 6).

  Here, when the large substrate 22 is carried in, the time for the die head 17b to move the distance of the region D can be shortened by positioning the die head 17b at the boundary between the region C and the region D. This is not preferable because it becomes an obstacle when the substrate 22 is carried in.

  (2) Next, the die head 17a applies the four dielectric layers 8 to the area A on the large substrate 22 while moving to the left in the drawing. At the same time, the die head 17b applies the four dielectric layers 8 to the region C on the large substrate 22 while moving to the right side of the drawing.

  At this time, it is necessary to apply the die head 17a and the die head 17b while moving in the opposite directions. This is because when the coating is performed while moving in the same direction, the large substrate 22 moves slightly following it, and the coating area is displaced. Thereafter, each of the die head 17a and the die head 17b returns to the initial stop position at the end of the first stage 25 (FIG. 7).

  (3) Next, the large substrate 22 is unloaded from the first stage 25 and loaded into the second stage 26. Then, the large substrate 22 to which the dielectric layer 8 is applied next is carried into the first stage 25, and the large substrate 22 is vacuum-adsorbed and fixed on each stage (FIG. 8).

  (4) Next, in the second stage 26, as the die head 17c moves from the left side of the drawing, the undulation of the large substrate 22 in the region B is detected with a laser displacement meter (not shown) as in the above-described base material thickness measurement step. ) To measure. Similarly, the undulation of the large substrate 22 in the region D is measured by a laser displacement meter (not shown) while the die head 17d moves from the right side of the drawing. On the other hand, in the first stage 25, the same process as the operation (1) is performed on the new large substrate 22 (FIG. 9).

  (5) Next, the die head 17c applies the four dielectric layers 8 to the region B on the large substrate 22 while moving to the left of the drawing. At the same time, the die head 17d applies the four dielectric layers 8 to the region D on the large substrate 22 while moving to the right in the drawing. At this time, the reason why the die head 17c and the die head 17d are applied while moving in the opposite direction is the same as described above. In the first stage 25, the same process as the operation (2) is performed on the new large substrate 22 (FIG. 10).

  Finally, each die head returns to the initial position, and 16 layers of the dielectric layer 8 are applied. Then, each large substrate 22 is carried out to the next process.

  Here, in the operations (1) and (2), it is also conceivable that the die head 17a applies the base material thickness measurement and the dielectric layer 8 application to the region B and the die head 17b applies to the region C. However, in this case, since it is necessary to apply the die head 17a and the die head 17d while moving in opposite directions, it is necessary to move each die head to the boundary between the region B and the region C in the initial stage of the operation (1).

  However, the area of the large substrate 22 needs to be as small as possible, and the area where the dielectric layer 8 is not formed is extremely small. Therefore, in the above case, the mutual die heads 17 interfere with each other, and a stable operation cannot be performed. In other words, when applying to a large substrate having a plurality of die heads, it is necessary not to apply adjacent application regions simultaneously.

  In the embodiment of the present invention, the die coating method is shown in which the substrate thickness is measured by the die head, and then the die head is returned to the coating start position to apply the paste. However, the present invention is not limited to this, and the same effect as that of the present invention can be obtained in a die coating method in which paste is applied while measuring the substrate thickness and reflecting the data in the immediate die head control. In other words, the same effect as that of the present invention can be obtained in the direction of the die head in which the paste is applied while measuring the thickness of the substrate, because the direction of application of one of the die heads and the other die head is different.

  In the embodiment of the present invention, a die coating method in which a plurality of die heads are applied simultaneously has been shown. For this reason, when apply | coating an adjacent application | coating area | region, there is a concern that each operation | movement may interfere with the shape of a some die head. However, even in the case where adjacent application regions are applied, it is possible to avoid interference between the respective die heads by intentionally shifting the time when the respective die heads start application. Even in this case, the same effect as that of the present invention can be achieved by changing the coating direction of any of the die heads and the other die heads.

  As described above, in the embodiment of the present invention, when the dielectric layer 8 is applied to the large substrate 22, the plurality of die heads 17a and the die heads 17b are applied while moving in opposite directions with respect to the die head 17c. The die head 17d is applied while moving in the opposite direction.

  Further, the application areas of the die head 17a and the die head 17b are not adjacent to each other, and the application areas of the die head 17c and the die head 17d are not adjacent to each other. Further, for example, the coating is first applied to the odd-numbered regions (region A and region C in FIG. 6), and then even-numbered regions (regions in FIG. 6 are counted from the moving direction from the initial position of the die head 17a. B and region D) (note that even-numbered regions are applied first when counted from the direction of movement of the die head 17b from the initial position).

  As a result, it is possible to use a die coating method that can apply a paste material with high production efficiency and stable quality to a plurality of application regions that are divided in the application direction, and manufacture a high-quality PDP. A method can be realized.

  The present invention is useful in that it can provide a high-quality PDP with high production efficiency.

The perspective view which shows the structure of the plasma display panel in embodiment of this invention Sectional drawing which shows the structure of the front plate of the panel The figure explaining the coating method by the die-coating method in embodiment of this invention Diagram for explaining the multi-chamfer process The figure for explaining the problem when applying by the die coating method The figure explaining the coating method by the die-coating method in embodiment of this invention The figure explaining the coating method by the die-coating method in embodiment of this invention The figure explaining the coating method by the die-coating method in embodiment of this invention The figure explaining the coating method by the die-coating method in embodiment of this invention The figure explaining the coating method by the die-coating method in embodiment of this invention

Explanation of symbols

17 Die head 18 Head cleaning unit 21 Coating film 22 Large substrate 25 First stage 26 Second stage

Claims (4)

A paste material is applied by a plurality of die heads, and the application direction of any of the die heads is a different direction on the same straight line as the application direction of the other die heads ,
A die coating method, characterized in that there is a period in which a period of application by any one of the die heads overlaps a period of application by the other die head . There are a plurality of application areas to be applied by the plurality of die heads in the application direction of any of the die heads, and the application area to be applied by any of the die heads is not adjacent to the application area to be applied by the other die head. The die coating method according to claim 1, wherein The odd-numbered area and the other odd-numbered area are coated with the different die heads counted from the coating direction of any of the die heads, or the even-numbered area and the other even-numbered areas counted from the coating direction. 3. The die coating method according to claim 1 , wherein the region is applied by the plurality of die heads. A plasma display panel manufacturing method comprising a step of applying paste material to a plurality of regions by a plurality of die heads, wherein the paste material is applied by a die coating method according to claim 1 . Production method.

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