JP2006013369A - 回路装置およびその製造方法 - Google Patents
回路装置およびその製造方法 Download PDFInfo
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- JP2006013369A JP2006013369A JP2004191883A JP2004191883A JP2006013369A JP 2006013369 A JP2006013369 A JP 2006013369A JP 2004191883 A JP2004191883 A JP 2004191883A JP 2004191883 A JP2004191883 A JP 2004191883A JP 2006013369 A JP2006013369 A JP 2006013369A
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- H01L24/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
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Abstract
【解決手段】回路装置は、金属性の基材140と、基材140の上に設けられた絶縁樹脂膜122と、前記絶縁樹脂膜122に埋め込まれた複数の半導体素子142a、半導体素子142bや受動素子144を備え、少なくとも1つ以上の半導体素子142a、半導体素子142bや受動素子144の少なくとも一方の面に熱伝導性部材304が埋め込まれた凹部が形成されている。上記構成において、熱伝導性部材としては、金属または半導体素子が用いられる。
【選択図】図6
Description
Claims (4)
- 金属性の基材と、
前記基材の上に設けられた絶縁樹脂膜と、
前記絶縁樹脂膜に埋め込まれた複数の回路素子と、
を備え、
少なくとも1つ以上の前記回路素子の少なくとも一方の面に熱伝導性部材が埋め込まれた凹部が形成されていることを特徴とする回路装置。 - 前記熱伝導性部材が、金属または半導体素子であることを特徴とする請求項1に記載の回路装置。
- 前記基材の表面に絶縁膜が形成されていることを特徴とする請求項1または2に記載の回路装置。
- 複数の回路素子のうち、少なくとも1つ以上の回路素子の少なくとも一方の面に凹部を形成する工程と、
前記凹部に熱伝導性部材を埋め込む工程と、
前記複数の回路素子を絶縁樹脂膜に埋め込む工程と、
前記絶縁樹脂膜を前記基材に接合する工程と、
を備えることを特徴とする回路装置の製造方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004191883A JP2006013369A (ja) | 2004-06-29 | 2004-06-29 | 回路装置およびその製造方法 |
TW094120741A TW200605169A (en) | 2004-06-29 | 2005-06-22 | Circuit device and process for manufacture thereof |
US11/168,655 US8022533B2 (en) | 2004-06-29 | 2005-06-29 | Circuit apparatus provided with asperities on substrate surface |
CN2008102128216A CN101419949B (zh) | 2004-06-29 | 2005-06-29 | 电路装置及其制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004191883A JP2006013369A (ja) | 2004-06-29 | 2004-06-29 | 回路装置およびその製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2006013369A true JP2006013369A (ja) | 2006-01-12 |
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ID=35780212
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Application Number | Title | Priority Date | Filing Date |
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JP2004191883A Pending JP2006013369A (ja) | 2004-06-29 | 2004-06-29 | 回路装置およびその製造方法 |
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JP (1) | JP2006013369A (ja) |
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2004
- 2004-06-29 JP JP2004191883A patent/JP2006013369A/ja active Pending
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