JP2006013311A5 - - Google Patents

Download PDF

Info

Publication number
JP2006013311A5
JP2006013311A5 JP2004191295A JP2004191295A JP2006013311A5 JP 2006013311 A5 JP2006013311 A5 JP 2006013311A5 JP 2004191295 A JP2004191295 A JP 2004191295A JP 2004191295 A JP2004191295 A JP 2004191295A JP 2006013311 A5 JP2006013311 A5 JP 2006013311A5
Authority
JP
Japan
Prior art keywords
emitting device
light emitting
light
manufacturing
curable composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2004191295A
Other languages
English (en)
Japanese (ja)
Other versions
JP4608966B2 (ja
JP2006013311A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2004191295A priority Critical patent/JP4608966B2/ja
Priority claimed from JP2004191295A external-priority patent/JP4608966B2/ja
Publication of JP2006013311A publication Critical patent/JP2006013311A/ja
Publication of JP2006013311A5 publication Critical patent/JP2006013311A5/ja
Application granted granted Critical
Publication of JP4608966B2 publication Critical patent/JP4608966B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2004191295A 2004-06-29 2004-06-29 発光装置の製造方法 Expired - Fee Related JP4608966B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004191295A JP4608966B2 (ja) 2004-06-29 2004-06-29 発光装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004191295A JP4608966B2 (ja) 2004-06-29 2004-06-29 発光装置の製造方法

Publications (3)

Publication Number Publication Date
JP2006013311A JP2006013311A (ja) 2006-01-12
JP2006013311A5 true JP2006013311A5 (zh) 2007-08-02
JP4608966B2 JP4608966B2 (ja) 2011-01-12

Family

ID=35780159

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004191295A Expired - Fee Related JP4608966B2 (ja) 2004-06-29 2004-06-29 発光装置の製造方法

Country Status (1)

Country Link
JP (1) JP4608966B2 (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007227791A (ja) * 2006-02-24 2007-09-06 Nichia Chem Ind Ltd 発光装置の製造方法および発光装置
WO2008026717A1 (en) * 2006-08-29 2008-03-06 Panasonic Corporation Electroluminescent phos phor- converted light source and method for manufacturing the same
KR101202169B1 (ko) 2006-09-29 2012-11-15 서울반도체 주식회사 다중 몰딩부재를 갖는 발광 다이오드 패키지 제조방법
US20090230409A1 (en) * 2008-03-17 2009-09-17 Philips Lumileds Lighting Company, Llc Underfill process for flip-chip leds
US8889439B2 (en) * 2012-08-24 2014-11-18 Tsmc Solid State Lighting Ltd. Method and apparatus for packaging phosphor-coated LEDs
JP6940775B2 (ja) * 2018-10-30 2021-09-29 日亜化学工業株式会社 発光装置の製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3900144B2 (ja) * 1998-02-17 2007-04-04 日亜化学工業株式会社 発光ダイオードの形成方法
JP2000208822A (ja) * 1999-01-11 2000-07-28 Matsushita Electronics Industry Corp 半導体発光装置
JP2002134792A (ja) * 2000-10-25 2002-05-10 Matsushita Electric Ind Co Ltd 白色半導体発光装置の製造方法
JP4211359B2 (ja) * 2002-03-06 2009-01-21 日亜化学工業株式会社 半導体装置の製造方法

Similar Documents

Publication Publication Date Title
EP1657758A3 (en) Light emitting diode with molded lens and method of manufacturing the same
US7780313B2 (en) Package structure for light emitting diode
KR101569830B1 (ko) 휴대단말기 케이스 또는 커버의 사출성형물 두께 속에 내장되는 안테나 방사체의 윗면에 최소 두께로 박막사출성형시켜 휴대단말기 케이스 또는 커버와 안테나를 모듈화시켜 제조되는 휴대단말기 안테나 모듈 및 그 금형의 제조방법
JP2008252136A5 (zh)
JP2008252135A5 (zh)
US7923272B2 (en) Method of forming a resin cover lens of LED assembly
JP2010177501A (ja) 光学素子パッケージおよび光学素子パッケージの製造方法
JP2009051107A (ja) 光素子の樹脂封止成形方法及び装置
JP4917644B2 (ja) プラスチック光学素子の熱圧着成形
JP2006013311A5 (zh)
JP5953601B2 (ja) 樹脂モールド装置及び樹脂モールド方法
CN106058027A (zh) 一种带透镜的led光源及其制作方法
TWM313317U (en) LED assembly having molded glass lens
US20140008678A1 (en) Light emitting diode device
JP2009200172A (ja) 光半導体装置の製造方法、および光半導体装置の製造装置
CN114784172A (zh) 显示面板及其制备方法
TW201437725A (zh) 背光模組及背光模組的製作方法
JP2005353814A5 (zh)
TWI483418B (zh) 發光二極體封裝方法
JP5202016B2 (ja) 樹脂封止方法および樹脂封止装置
CN104966691B (zh) 注胶装置及发光装置的制造方法
CN214279975U (zh) 一种零间隙的光学微结构
TWI779188B (zh) 發光元件封裝結構及其製作方法
JP5359732B2 (ja) 発光装置の製造方法
KR100930863B1 (ko) Ｌｅｄ렌즈 성형몰드