JP2006013311A5 - - Google Patents
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- JP2006013311A5 JP2006013311A5 JP2004191295A JP2004191295A JP2006013311A5 JP 2006013311 A5 JP2006013311 A5 JP 2006013311A5 JP 2004191295 A JP2004191295 A JP 2004191295A JP 2004191295 A JP2004191295 A JP 2004191295A JP 2006013311 A5 JP2006013311 A5 JP 2006013311A5
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- Prior art keywords
- emitting device
- light emitting
- light
- manufacturing
- curable composition
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Claims (8)
リード電極を有する台座上に発光素子を実装して、リード電極と前記発光素子とを電気的に接続するステップと、
蛍光物質を含有する熱硬化性樹脂からなる硬化性組成物を前記発光素子の上面から周囲にかけて供給するステップと、
供給された前記硬化性組成物上に熱可塑性樹脂からなる成形型を被せ、その成形型の荷重により前記発光素子を前記硬化性組成物で均一に被覆させるステップと、
前記成形型を構成する熱可塑性樹脂の融点以上の温度で加熱するステップと、
加熱により変形した成形型を前記発光素子から除去するステップと、
を有することを特徴とする発光装置の製造方法。 A method for manufacturing a light emitting device comprising: a light emitting element; and a fluorescent material that converts a part of light emitted from the light emitting element to a different wavelength,
Mounting a light emitting element on a pedestal having a lead electrode, and electrically connecting the lead electrode and the light emitting element;
Supplying a curable composition comprising a thermosetting resin containing a fluorescent material from the top surface to the periphery of the light emitting device;
Covering the supplied curable composition with a mold made of a thermoplastic resin, and uniformly coating the light emitting element with the curable composition by the load of the mold;
Heating at a temperature equal to or higher than the melting point of the thermoplastic resin constituting the mold;
Removing the mold deformed by heating from the light emitting element;
A method for manufacturing a light-emitting device, comprising:
前記加熱するステップが、前記硬化性組成物を硬化させる第１の温度で加熱するステップと、その後前記成形型を溶融させる第２の温度で加熱されるステップの二段階で行われることを特徴とする発光装置の製造方法。 A method of manufacturing a light emitting device according to claim 1,
The heating step is performed in two stages, a step of heating at a first temperature for curing the curable composition and a step of heating at a second temperature for melting the mold. A method for manufacturing a light emitting device.
前記硬化性組成物は、前記発光素子と前記台座との間で前記リード電極が接続される間隙部分に含浸する粘度に調整されてなることを特徴とする発光装置の製造方法。 It is a manufacturing method of the light-emitting device according to claim 1 or 2,
The method of manufacturing a light emitting device, wherein the curable composition is adjusted to have a viscosity that impregnates a gap portion where the lead electrode is connected between the light emitting element and the pedestal.
前記成形型の、発光素子と対向する成形面を、前記硬化性組成物の成形厚さ分に相当する凹状に成形してなることを特徴とする発光装置の製造方法。 The light-emitting device according to claim 1,
A method of manufacturing a light emitting device, wherein a molding surface of the molding die facing a light emitting element is molded into a concave shape corresponding to a molding thickness of the curable composition.
前記成形型の、発光素子と対向する成形面を曲面状に成形してなることを特徴とする発光装置の製造方法。 The light-emitting device according to claim 1,
A method of manufacturing a light emitting device, wherein a molding surface of the molding die facing a light emitting element is molded into a curved surface.
前記成形型を構成する熱可塑性樹脂が、前記硬化性組成物と離型性を有する樹脂であることを特徴とする発光装置の製造方法。 The light-emitting device according to claim 1,
A method for manufacturing a light-emitting device, wherein the thermoplastic resin constituting the mold is a resin having releasability from the curable composition.
前記成形型を構成する熱可塑性樹脂がアクリルもしくはメタクリル酸系の樹脂であることを特徴とする発光装置の製造方法。 The light-emitting device according to claim 1,
A method for manufacturing a light-emitting device, wherein the thermoplastic resin constituting the mold is an acrylic or methacrylic acid resin.
前記硬化性組成物が、シリコーン樹脂であることを特徴とする発光装置の製造方法。 The light-emitting device according to claim 1,
The method of manufacturing a light emitting device, wherein the curable composition is a silicone resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004191295A JP4608966B2 (en) | 2004-06-29 | 2004-06-29 | Method for manufacturing light emitting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004191295A JP4608966B2 (en) | 2004-06-29 | 2004-06-29 | Method for manufacturing light emitting device |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006013311A JP2006013311A (en) | 2006-01-12 |
| JP2006013311A5 true JP2006013311A5 (en) | 2007-08-02 |
| JP4608966B2 JP4608966B2 (en) | 2011-01-12 |
Family
ID=35780159
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004191295A Expired - Lifetime JP4608966B2 (en) | 2004-06-29 | 2004-06-29 | Method for manufacturing light emitting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4608966B2 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007227791A (en) * | 2006-02-24 | 2007-09-06 | Nichia Chem Ind Ltd | Luminescent device manufacturing method and light emitting device manufactured thereby |
| WO2008026717A1 (en) * | 2006-08-29 | 2008-03-06 | Panasonic Corporation | Electroluminescent phos phor- converted light source and method for manufacturing the same |
| KR101202169B1 (en) | 2006-09-29 | 2012-11-15 | 서울반도체 주식회사 | Method of fabricating light emitting diode package having multi-molding members |
| US20090230409A1 (en) * | 2008-03-17 | 2009-09-17 | Philips Lumileds Lighting Company, Llc | Underfill process for flip-chip leds |
| US8889439B2 (en) * | 2012-08-24 | 2014-11-18 | Tsmc Solid State Lighting Ltd. | Method and apparatus for packaging phosphor-coated LEDs |
| JP6940775B2 (en) | 2018-10-30 | 2021-09-29 | 日亜化学工業株式会社 | Manufacturing method of light emitting device |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3900144B2 (en) * | 1998-02-17 | 2007-04-04 | 日亜化学工業株式会社 | Method for forming light emitting diode |
| JP2000208822A (en) * | 1999-01-11 | 2000-07-28 | Matsushita Electronics Industry Corp | Semiconductor light-emitting device |
| JP2002134792A (en) * | 2000-10-25 | 2002-05-10 | Matsushita Electric Ind Co Ltd | Manufacturing method of white semiconductor light- emitting device |
| JP4211359B2 (en) * | 2002-03-06 | 2009-01-21 | 日亜化学工業株式会社 | Manufacturing method of semiconductor device |
-
2004
- 2004-06-29 JP JP2004191295A patent/JP4608966B2/en not_active Expired - Lifetime
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