JP2005353814A5 - - Google Patents

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Publication number
JP2005353814A5
JP2005353814A5 JP2004172424A JP2004172424A JP2005353814A5 JP 2005353814 A5 JP2005353814 A5 JP 2005353814A5 JP 2004172424 A JP2004172424 A JP 2004172424A JP 2004172424 A JP2004172424 A JP 2004172424A JP 2005353814 A5 JP2005353814 A5 JP 2005353814A5
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JP
Japan
Prior art keywords
light
emitting diode
power distribution
mount
diode lamp
Prior art date
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Granted
Application number
JP2004172424A
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Japanese (ja)
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JP2005353814A (en
JP4485856B2 (en
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Publication date
Application filed filed Critical
Priority to JP2004172424A priority Critical patent/JP4485856B2/en
Priority claimed from JP2004172424A external-priority patent/JP4485856B2/en
Publication of JP2005353814A publication Critical patent/JP2005353814A/en
Publication of JP2005353814A5 publication Critical patent/JP2005353814A5/ja
Application granted granted Critical
Publication of JP4485856B2 publication Critical patent/JP4485856B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Claims (7)

金属製のマウント部と金属製の配電部と、を含む基板部と、A substrate part including a metal mount part and a metal power distribution part;
前記マウント部に配置され、かつ、前記配電部と電気的に接続された発光ダイオード素子と、  A light-emitting diode element disposed on the mount and electrically connected to the power distribution unit;
前記発光ダイオード素子を取り囲み、かつ、所定の高さを有し、かつ、前記基板上に形成されるケース部と、を有する発光ダイオードランプにおいて、  A light-emitting diode lamp that surrounds the light-emitting diode element and has a predetermined height and has a case portion formed on the substrate;
前記マウント部と前記配電部は、前記ケース部と同一のアイ量によって構成され、前記マウント部と前記配電部の間の板厚部分にある連結部によって接合していること、  The mount part and the power distribution part are configured with the same eye amount as the case part, and are joined by a connecting part in a plate thickness part between the mount part and the power distribution part,
を特徴とする発光ダイオードランプ。  Light emitting diode lamp characterized by. 更に、前記ケース部上方にレンズを備えることを特徴とする発光ダイオードランプ。The light emitting diode lamp further comprises a lens above the case portion. 前記マウント部と前記配電部の間の板厚分は、梨地面とされていること、を特徴とする請求項１または請求項２に記載の発光ダイオードランプ。3. The light-emitting diode lamp according to claim 1, wherein a plate thickness portion between the mount portion and the power distribution portion is a matte surface. 4. 金属製のマウント部と金属製の配電部と、を含む基板部を準備する第一の工程と、樹脂成形により前記基板部上方にケース部を形成すると同時に前記マウント部と前記配電部を板厚部分で接続して一体化する第二の工程と、A first step of preparing a substrate part including a metal mount part and a metal power distribution part, and simultaneously forming the case part above the substrate part by resin molding, and simultaneously mounting the mount part and the power distribution part A second step of connecting and integrating at a part;
発光ダイオード素子を前記マウント部にダイボンドする第三の工程と、前記発光ダイオード素子と前記配電部との間をワイヤーボンドする第四の工程と、  A third step of die-bonding the light-emitting diode element to the mount portion; a fourth step of wire-bonding between the light-emitting diode element and the power distribution portion;
を含むことを特徴とする発光ダイオードランプの製造方法。A method for manufacturing a light-emitting diode lamp, comprising: 更に、第四の工程の後に、前記ケース部上方にレンズを固定する第五の工程を含むこと、Furthermore, after the fourth step, including a fifth step of fixing the lens above the case portion,
を特徴とする施急行４に記載の発光ダイオードランプの製造方法。The manufacturing method of the light-emitting-diode lamp of Claim 4 characterized by these. 更に、前記第二の工程の前に、前記マウント部と前記配電部の板厚部分に梨地面を形成する第六の工程を含むこと、Furthermore, before the second step, including a sixth step of forming a matte ground on the plate portion of the mount portion and the power distribution portion,
を特徴とする請求項４または請求項５に記載の発光ダイオードランプの製造方法。A method for manufacturing a light-emitting diode lamp according to claim 4 or 5. 前記第六の工程は、薬品による腐食処理によってされること、The sixth step is a chemical corrosion treatment;
を特徴とする請求項６に記載の発光ダイオードランプの製造方法。A method of manufacturing a light emitting diode lamp according to claim 6.
JP2004172424A 2004-06-10 2004-06-10 LED lamp for high power Expired - Fee Related JP4485856B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004172424A JP4485856B2 (en) 2004-06-10 2004-06-10 LED lamp for high power

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004172424A JP4485856B2 (en) 2004-06-10 2004-06-10 LED lamp for high power

Publications (3)

Publication Number Publication Date
JP2005353814A JP2005353814A (en) 2005-12-22
JP2005353814A5 true JP2005353814A5 (en) 2007-06-28
JP4485856B2 JP4485856B2 (en) 2010-06-23

Family

ID=35588022

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004172424A Expired - Fee Related JP4485856B2 (en) 2004-06-10 2004-06-10 LED lamp for high power

Country Status (1)

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JP (1) JP4485856B2 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4793029B2 (en) * 2006-03-03 2011-10-12 三菱化学株式会社 Lighting device
WO2009002090A2 (en) * 2007-06-25 2008-12-31 Inix Co., Ltd. Light emitting diode module
WO2009014387A2 (en) * 2007-07-26 2009-01-29 Fawoo Technology Co., Ltd. Stick-type led lighting apparatus
JP5310672B2 (en) 2009-10-15 2013-10-09 日亜化学工業株式会社 Light emitting device and manufacturing method thereof
JP6094700B2 (en) * 2013-03-04 2017-03-15 信越化学工業株式会社 Vehicle direction indicator
JP2014197527A (en) * 2013-03-04 2014-10-16 信越化学工業株式会社 Vehicle direction indicator

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3186408B2 (en) * 1994-03-25 2001-07-11 日立電線株式会社 Multilayer lead frame and manufacturing method thereof
JPH09321341A (en) * 1996-05-30 1997-12-12 Nichia Chem Ind Ltd Photo-semiconductor device and manufacture thereof
JP4211359B2 (en) * 2002-03-06 2009-01-21 日亜化学工業株式会社 Manufacturing method of semiconductor device
JP4280050B2 (en) * 2002-10-07 2009-06-17 シチズン電子株式会社 White light emitting device

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