TWI779188B - Light-emitting element package structure and manufacturing method thereof - Google Patents

Abstract

The present invention provides a light-emitting element package structure and a manufacturing method thereof. The light-emitting element package structure includes a substrate unit, a light-emitting unit, and a conductive bonding unit. The substrate unit includes a substrate body and a surrounding frame disposed on the substrate body. The surrounding frame has a first predetermined height. The light-emitting unit is disposed on the substrate body and coupled to the substrate body. The light-emitting unit is disposed in a surrounding space formed by the surrounding frame. The light-emitting unit has a second predetermined height. The first predetermined height of the surrounding frame is less than the second predetermined height of the light-emitting unit. The conductive bonding unit is coupled between the substrate unit and the light-emitting unit.

Description

Light-emitting element packaging structure and manufacturing method thereof

The invention relates to a packaging structure and a manufacturing method thereof, in particular to a light-emitting element packaging structure and a manufacturing method thereof.

Firstly, although there are many different packaging structures and fabrication methods for providing light-emitting diodes in the prior art, the process efficiency still needs to be improved. For example, in the "multi-chip packaging structure and its manufacturing method" disclosed in the TW I464920 patent case, the light-emitting element is first arranged on the substrate body, and then a surrounding adhesive material surrounding the light-emitting element is coated on the substrate. ontology. Finally, an encapsulant is formed on the substrate body and covers the light-emitting element.

However, in the TW I464920 patent case, the light-emitting element is arranged on the substrate body first, and then the step of coating a surrounding adhesive material on the substrate body is likely to affect the surrounding adhesive material coating process. The light emitting element on the body. Furthermore, the process efficiency of the TW I464920 patent still needs to be improved. Therefore, how to propose a light-emitting element packaging structure and a manufacturing method thereof to improve the production efficiency of the light-emitting element packaging structure to overcome the above-mentioned defects has become one of the important issues to be solved by this business.

The technical problem to be solved by the present invention is to provide a light-emitting element packaging structure and a manufacturing method thereof in view of the deficiencies of the prior art.

In order to solve the above-mentioned technical problems, one of the technical solutions adopted by the present invention is to provide a light-emitting device packaging structure, which includes: a substrate unit, a light-emitting unit, and a conductive joint unit. The substrate unit includes a substrate body and a surrounding frame disposed on the substrate body, wherein the surrounding frame has a first predetermined height. The light emitting unit is disposed on the substrate body, the light emitting unit is coupled to the substrate body, and the light emitting unit is disposed in a surrounding space formed by the surrounding frame, wherein the light emitting The unit has a second predetermined height, and the first predetermined height of the surrounding frame is smaller than the second predetermined height of the light emitting unit. The conductive joint unit is coupled between the substrate unit and the light emitting unit.

In order to solve the above technical problems, another technical solution adopted by the present invention is to provide a method for manufacturing a light-emitting element packaging structure, which includes: providing a substrate unit, the substrate unit includes a substrate body and a A surrounding frame on the substrate body, wherein the surrounding frame has a first predetermined height; a light emitting unit is arranged on the substrate body and located in a surrounding space formed by the surrounding frame, wherein, The light-emitting unit has a second predetermined height, the first predetermined height of the surrounding frame is smaller than the second predetermined height of the light-emitting unit; The unit is coupled to the substrate body and fixed on the substrate body.

One of the beneficial effects of the present invention is that the light-emitting element packaging structure and manufacturing method provided by the present invention can pass "the first predetermined height of the surrounding frame is smaller than the second predetermined height of the light-emitting unit." "High" technical solution to improve the production efficiency of the light-emitting element packaging structure.

In order to further understand the features and technical content of the present invention, please refer to the following detailed description and drawings related to the present invention. However, the provided drawings are only for reference and description, and are not intended to limit the present invention.

The following is an illustration of the implementation of the "light-emitting element packaging structure and manufacturing method" disclosed in the present invention through specific specific examples. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various modifications and changes can be made to the details in this specification based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only for simple illustration, and are not drawn according to the actual size, which is stated in advance. The following embodiments will further describe the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the protection scope of the present invention.

It should be understood that although terms such as "first", "second" and "third" may be used herein to describe various elements, these elements should not be limited by these terms. These terms are mainly used to distinguish one element from another. In addition, the term "or" used herein may include any one or a combination of more of the associated listed items depending on the actual situation.

[first embodiment]

First, referring to Fig. 1 to Fig. 4, Fig. 1 is a three-dimensional combination schematic diagram of the light-emitting element packaging structure of the first embodiment of the present invention, Fig. 2 is a schematic cross-sectional view of the II-II section of Fig. 1, Fig. 3 and Fig. 4 are three-dimensional exploded schematic diagrams of the packaging structure of the light-emitting element according to the first embodiment of the present invention. The present invention provides a light-emitting element packaging structure U and a manufacturing method of the light-emitting element packaging structure U. The first embodiment will first introduce the overall structure of the light-emitting element packaging structure U, and the manufacturing method of the light-emitting element packaging structure U will be described in subsequent embodiments. .

Based on the above, please refer to FIG. 1 to FIG. 4 again, the light emitting element packaging structure U includes a substrate unit 1 , a light emitting unit 2 and a conductive bonding unit 3 . The substrate unit 1 may include a substrate body 11 and a surrounding frame 12 disposed on the substrate body 11 . The light emitting unit 2 can be disposed on the substrate body 11 , the light emitting unit 2 can be coupled to the substrate body 11 , and the light emitting unit 2 is disposed in a surrounding space 120 formed by the surrounding frame 12 . The conductive bonding unit 3 can be coupled between the substrate unit 1 and the light emitting unit 2 , and the substrate unit 1 and the light emitting unit 2 are coupled to each other through the conductive bonding unit 3 . In addition, the substrate body 11 may include a surface 110, and the light-emitting unit 2 and the surrounding frame body 12 may be disposed on the surface 110 of the substrate body 11, that is, the light-emitting unit 2 and the surrounding frame body 12 may be disposed on the same surface of the substrate body 11. On the surface. In addition, it should be noted that the coupling in the context of the present invention may be a direct electrical connection or an indirect electrical connection, and the present invention is not limited thereto.

Based on the above, for example, the light emitting unit 2 can be a light emitting diode (Light emitting diode, LED. In addition, the substrate body 11 can be a printed circuit board (Printed circuit board, PCB), a ceramic substrate, epoxy resin Ester molding material (Epoxy Molding Compound, EMC) substrate, silicone rubber molding material (Silicone Molding Compound, SMC) substrate. In addition, can utilize the mode of coating, will surround frame 12 to be arranged on the substrate body 11, therefore, surround frame 12 can be a frame body (dam) formed after the adhesive material set on the substrate body 11 is cured. In addition, in other implementations, the surrounding frame body 12 can also be integrally formed with the substrate body 11. In addition, The material surrounding the frame body 12 can be epoxy resin (Epoxy), silicone (Silicone), acrylic or metal material. In addition, the material of the conductive bonding unit 3 can be anisotropic conductive adhesive material (Anisotropic Conductive Adhesive), isotropic Anisotropic Conductive Film (Anisotropic Conductive Film, ACF), tin, gold tin, conductive metal or conductive alloy. However, it should be noted that the above-mentioned examples are only one of the feasible implementations and are not intended to limit the present invention In addition, the present invention is not limited by the arrangement around the frame body 12 .

Next, as shown in FIG. 2 , according to the present invention, the surrounding frame 12 disposed on the substrate body 11 may have a first predetermined height H1, and the light emitting unit 2 disposed on the substrate body 11 may have a first predetermined height H1. Two predetermined heights H2, the size of the first predetermined height H1 surrounding the frame body 12 is smaller than the size of the second predetermined height H2 of the light emitting unit 2 . In addition, the surrounding frame body 12 may be disposed on the substrate body 11 by coating. In addition, it is worth noting that the calculated position of the first predetermined height H1 may be the height between the surface 110 of the substrate body 11 and the top surface surrounding the frame 12; the calculated position of the second predetermined height H2 may be the height between the light emitting unit 2 When disposed on the surface 110 of the substrate body 11 , the height between the surface 110 of the substrate body 11 and the top surface of the light emitting unit 2 , that is, the second predetermined height H2 includes the thickness of the conductive bonding unit 3 and the thickness of the light emitting unit 2 . In addition, in other embodiments, the second predetermined height H2 may also be only the thickness of the light emitting unit 2 .

Next, please refer to FIG. 3 and FIG. 4 again, the substrate body 11 may include at least one first conductive pad 111 (pad) disposed on the surface 110, and the light emitting unit 2 includes at least one first conductive pad 111 (pad) facing the surface 110 of the substrate body 11. Two conductive pads 21 (pads), whereby the first conductive pad 111 and the second conductive pad 21 are opposite to each other. In addition, the conductive bonding unit 3 can be coupled between the first conductive pad 111 of the substrate body 11 and the second conductive pad 21 of the light emitting unit 2 , so that the first conductive pad 111 of the substrate body 11 and the second conductive pad 21 of the light emitting unit 2 The conductive pads 21 are coupled to each other. Accordingly, the light emitting unit 2 can be coupled to the substrate body 11 . In addition, it should be noted that the anisotropic conductive film is used as an example in the figures of the present invention. Therefore, the characteristics of the anisotropic conductive film can be utilized so that the two first conductive pads 111 on the substrate body 11 will not The short circuit also prevents the two second conductive pads 21 on the light emitting unit 2 from short circuiting.

Next, please refer to FIG. 1 to FIG. 4 , the light-emitting element packaging structure U further includes a light-transmitting unit 4 , which can be disposed on the substrate unit 1 and cover the light-emitting unit 2 . For example, in the embodiments of FIGS. 1 to 4 , the light-transmitting unit 4 can be a lens, and the material of the lens is glass, quartz or plastic, but the present invention is not limited thereto. Further, the light-transmitting unit 4 can be disposed on the surrounding frame 12 of the substrate unit 1 , but the present invention is not limited thereto.

Next, please refer to FIG. 5 . FIG. 5 is another schematic perspective view of the packaging structure of the light emitting device according to the first embodiment of the present invention. From the comparison of FIG. 5 and FIG. 4 , it can be seen that the biggest difference between FIG. 5 and FIG. 4 is that, in the embodiment of FIG. 5 , the light-transmitting unit 4 is an encapsulant. Furthermore, the material of the encapsulant can be epoxy resin (Epoxy) or silicone resin (Silicone), but the present invention is not limited thereto. In addition, for example, the material surrounding the frame 12 and the material of the light-transmitting unit 4 may be different, however, it should be noted that, in other implementations, the material surrounding the frame 12 and the material of the light-transmitting unit 4 It can also be the same. In addition, it is worth noting that the encapsulant can be disposed in the surrounding space 120 formed around the frame body 12 by means of coating. Thus, in the embodiment shown in FIG. 5 , the surrounding frame 12 can be used as a limiting frame for limiting the encapsulant.

[Second embodiment]

First, please refer to FIG. 5, FIG. 6A to FIG. 6D, FIG. 7A and FIG. 7B. FIG. 6A, FIG. 6B, FIG. 6C and FIG. FIG. 7A is one of the flow charts of the manufacturing method of the light-emitting device packaging structure according to the second embodiment of the present invention, and FIG. 7B is a flowchart of step S102 of the manufacturing method of the light-emitting device packaging structure according to the second embodiment of the present invention. In addition, it is worth noting that the features of each element in the manufacturing method of the light-emitting element packaging structure provided by the second embodiment are similar to those of the foregoing embodiments, and will not be repeated here.

Next, please refer to FIG. 6A , FIG. 7A and FIG. 7B . As shown in step S102 , a substrate unit 1 is provided. The substrate unit 1 includes a substrate body 11 and a surrounding frame 12 disposed on the substrate body 11 . The surrounding frame 12 may be protruding relative to the surface 110 of the substrate body 11 . Further, in one of the implementation aspects, as shown in step S1022 , the substrate body 11 may be provided first. In addition, the substrate body 11 may include a first conductive pad 111 . Next, as shown in step S1024 , the surrounding frame 12 is set on the substrate body 11 again. For example, in the implementation of step S1022 and step S1024 , an adhesive material can be disposed on the substrate body 11 by coating, and the surrounding frame 12 can be formed after the adhesive material is cured. In addition, in other embodiments, the substrate body 11 and the surrounding frame body 12 may also be integrally formed, and the present invention is not limited to the arrangement of the surrounding frame body 12 .

Next, please refer to FIG. 6B and FIG. 7A , as shown in step S104 , a light emitting unit 2 is disposed on the substrate body 11 and located in a surrounding space 120 formed by the surrounding frame 12 . Further, the light emitting unit 2 may include a second conductive pad 21 , and the second conductive pad 21 of the light emitting unit 2 corresponds to the first conductive pad 111 of the substrate body 11 . In addition, a conductive bonding unit 3 may be disposed between the first conductive pad 111 of the substrate body 11 and the second conductive pad 21 of the light emitting unit 2 . In addition, in other embodiments, multiple light-emitting units 2 can also be arranged on the substrate body 11 at the same time and located in a surrounding space 120 (not shown in the figure) formed by the surrounding frame body 12, and the substrate body 11 also It may include a plurality of first conductive pads 111 respectively coupled to the second conductive pads 21 of the plurality of light emitting units 2 .

Next, as shown in FIG. 6C and FIG. 7A , a heating and pressure bonding process is performed to couple the light emitting unit 2 to the substrate body 11 and fix it on the substrate body 11 . Further speaking, as far as the present invention is concerned, since the present invention uses a heating and pressure bonding process to arrange the light-emitting unit 2 on the substrate unit 1, the surrounding frame 12 can have a first predetermined height H1, and the light-emitting unit 2 can be It has a second predetermined height H2, and the first predetermined height H1 surrounding the frame body 12 is smaller than the second predetermined height H2 of the light emitting unit 2 . Thereby, in a preferred embodiment, multiple light emitting units 2 can be simultaneously coupled to the substrate body 11 and fixed on the substrate body 11 at one time by using a thermocompression bonding process.

Next, please also refer to FIG. 7C , which is a flow chart of step S106 of the manufacturing method of the light-emitting element packaging structure according to the second embodiment of the present invention. As shown in step S1062, a heated heat-press unit P is provided. For example, the heat press unit P may include a heat press base body P1 and a buffer layer P2 disposed on the heat press base body P1. The materials of the heat press base body P1 and the buffer layer P2 are different, and the hardness of the buffer layer P2 is The hardness of the buffer layer P2 may be less than the hardness of the heat press seat body P1. Next, as shown in step S1064, the heated heat-pressing unit P is pressed against the light-emitting unit 2 to indirectly heat and press a conductive bonding unit 3 disposed between the light-emitting unit 2 and the substrate body 11 to couple The light emitting unit 2 and the substrate body 11 are connected. In this way, through the buffer layer P2 provided on the heat press seat body P1, the deformation of the buffer layer P2 can be used first during the process of the heat press unit P pressing against the light emitting unit 2, thereby preventing the light emitting unit 2 from being damaged by heat. The pressing of the pressing unit P generates displacement. Therefore, it is possible to avoid the problem of short circuit caused by misalignment of the light emitting unit 2 . In addition, for example, the material of the heat press seat body P1 can be metal, and the material of the buffer layer P2 can be polyethylene terephthalate (PET). However, it should be noted that in other implementation manners, the buffer layer P2 may not be provided. Finally, please refer to FIG. 6D , as shown in step S1066 , the heat-pressing unit P pressed against the light-emitting unit 2 is removed, thereby forming a light-emitting element packaging structure U.

Based on the above, in other implementation aspects, the step of providing a heated heat-pressing unit P in step S1062 further includes heating the substrate body 11 . Thereby, the melting speed or curing speed of the conductive bonding unit 3 disposed between the light emitting unit 2 and the substrate body 11 can be further increased.

Next, please refer again to FIG. 1 and FIG. 5 , and please also refer to FIG. 7D . FIG. 7D is another flow chart of the manufacturing method of the light emitting device packaging structure according to the second embodiment of the present invention. From the comparison of FIG. 7D and FIG. 7A , it can be seen that in the embodiment shown in FIG. 7D , the method for manufacturing the light-emitting element packaging structure U may further include step S108 . Further, as shown in step S108 , a light-transmitting unit is disposed on the substrate unit 1 to cover the light-emitting unit 2 . For example, as shown in FIG. 1 , the light-transmitting unit 4 can be a lens, and the light-transmitting unit 4 can be disposed on the surrounding frame 12 of the substrate unit 1 . In addition, as shown in FIG. 5 , the light-transmitting unit 4 can be an encapsulant, and the encapsulant is applied in a surrounding space 120 formed by the surrounding frame 12 and covers the light-emitting unit 2 .

[Third embodiment]

First, please refer to FIG. 8, FIG. 9A and FIG. 9B. FIG. 8 is a schematic diagram of the manufacturing process of the light-emitting element packaging structure according to the second embodiment of the present invention, and FIG. 9A is a schematic diagram of the light-emitting element packaging structure according to the third embodiment of the present invention. The flowchart of the manufacturing method, FIG. 9B is a flowchart of step S206 of the manufacturing method of the light-emitting element packaging structure according to the third embodiment of the present invention. From the comparison of FIG. 8 with FIG. 6C and the comparison of FIG. 9A with FIG. 7A, it can be seen that the biggest difference between the third embodiment and the first embodiment is that multiple light-emitting units 2 can be placed on the substrate unit at the same time using the heating and pressure bonding process. 1 on. In addition, it is worth noting that the characteristics of each element and the manufacturing steps of the light emitting element packaging structure in the manufacturing method of the light emitting element packaging structure provided by the third embodiment are similar to those of the foregoing embodiments, and will not be repeated here.

Next, as shown in step S202, a substrate unit 1 is provided, and the substrate unit 1 may include a substrate body 11, a surrounding frame 12 disposed on the substrate body 11 and another surrounding frame 12 disposed on the substrate body 11 . In other words, the substrate body 11 may include a plurality of surrounding frames 12 . Accordingly, in one of the implementation aspects, a substrate body 11 may be provided first, and then a plurality of surrounding frames 12 are disposed on the substrate body 11 . In addition, in another embodiment, the substrate body 11 and the plurality of surrounding frames 12 may also be integrally formed, and the present invention is not limited to the arrangement of the surrounding frames 12 .

Next, as shown in step S204, a light-emitting unit 2 is arranged on the substrate body 11 and located in a surrounding space 120 formed by the surrounding frame body 12, and another light-emitting unit 2 is arranged on the substrate body 11 and located by another In another surrounding space 120 formed around the frame body 12 . In other words, a plurality of light emitting units 2 can be respectively arranged in their corresponding surrounding spaces 120 . In addition, it is worth noting that please refer to FIG. 10 , which is another schematic diagram of the manufacturing process of the light emitting element packaging structure according to the second embodiment of the present invention. In other embodiments, multiple light-emitting units 2 can also be arranged on the substrate body 11 at the same time and located in a surrounding space 120 formed by the surrounding frame 12, that is, as shown in FIG. 10, a surrounding space 120 A plurality of light-emitting units 2 can be arranged in it.

Next, as shown in step S206 , a heating and pressure bonding process is performed to couple the light emitting unit 2 and another light emitting unit 2 to the substrate body 11 and fix them on the substrate body 11 . Furthermore, as shown in step S2062, a heated heat-press unit P may be provided first. Next, as shown in step S2064, the heated heat-pressing unit P is pressed against the light-emitting unit 2 and another light-emitting unit 2 to indirectly heat and press a conductive material disposed between the light-emitting unit 2 and the substrate body 11. The bonding unit 3 and a conductive bonding unit 3 disposed between the other light emitting unit 2 and the substrate body 11 couple the light emitting unit 2 to the substrate body 11 and couple the other light emitting unit 2 to the substrate body 11 . Thereby, as shown in FIG. 8 , a heat-pressing unit P can be used to heat and press a plurality of light-emitting units 2 at the same time, and simultaneously couple a plurality of light-emitting units 2 to the substrate body 11 and fix them on the substrate body 11, so as to The production efficiency of the packaging structure U of the light-emitting element is improved. Finally, as shown in step S2066 , the heat pressing unit P pressed against the light emitting unit 2 and another light emitting unit 2 is removed. In addition, it is worth noting that, through the buffer layer P2 provided on the heat press body P1, the deformation of the buffer layer P2 can be used first during the process of pressing the heat press unit P against the plurality of light emitting units 2, so that The pressure applied by the thermal pressure unit P to the plurality of light emitting units 2 can be averaged.

In addition, it is worth noting that the manufacturing method of the light-emitting element packaging structure provided by the third embodiment may further include disposing a light-transmitting unit on the substrate unit 1 to cover the light-emitting unit 2 and another light-emitting unit 2 . Next, a dicing process is used to separate two adjacent light-emitting element packaging structures U to form a plurality of separated light-emitting element packaging structures U.

[Advantageous Effects of Embodiment]

One of the beneficial effects of the present invention is that the light-emitting element packaging structure and its manufacturing method provided by the present invention can pass the technology that "the first predetermined height H1 of the surrounding frame body 12 is smaller than the second predetermined height H2 of the light-emitting unit 2" A solution to improve the production efficiency of the light-emitting element packaging structure.

Furthermore, the present invention can utilize a heating and pressure bonding process to arrange at least one light-emitting unit 2 or multiple light-emitting units 2 on the substrate unit 1, and further, can use one heat-pressing unit P to heat and press multiple light-emitting units simultaneously. The light emitting unit 2 is coupled to the substrate body 11 and fixed on the substrate body 11 at the same time, so as to improve the production efficiency of the light emitting element packaging structure U.

Furthermore, the present invention can firstly provide a substrate unit 1 that surrounds the frame body 12, and then use a heating and pressure bonding process to couple the light-emitting unit 2 to the substrate body 11 and fix it on the substrate body 11, thereby enabling The production efficiency of the packaging structure U of the light-emitting element is improved.

The content disclosed above is only a preferred feasible embodiment of the present invention, and does not therefore limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made by using the description and drawings of the present invention are included in the application of the present invention. within the scope of the patent.

U: Light-emitting element packaging structure 1: Substrate unit 11: Substrate body 110: surface 111: the first conductive pad 12: Around the frame 120: around space 2: Lighting unit 21: Second conductive pad 3: Conductive junction unit 4: Translucent unit P: heat press unit P1: Hot pressing seat body P2: buffer layer H1: the first predetermined height H2: second predetermined height

FIG. 1 is a schematic diagram of a three-dimensional combination of a light-emitting device packaging structure according to a first embodiment of the present invention.

FIG. 2 is a schematic cross-sectional view of the II-II section in FIG. 1 .

FIG. 3 is an exploded perspective view of the packaging structure of the light emitting device according to the first embodiment of the present invention.

FIG. 4 is another perspective exploded schematic view of the packaging structure of the light emitting device according to the first embodiment of the present invention.

FIG. 5 is another schematic perspective view of the packaging structure of the light emitting device according to the first embodiment of the present invention.

FIG. 6A , FIG. 6B , FIG. 6C and FIG. 6D are schematic diagrams of the manufacturing process of the light emitting device packaging structure according to the second embodiment of the present invention.

FIG. 7A is one of the flow charts of the manufacturing method of the light emitting device packaging structure according to the second embodiment of the present invention.

FIG. 7B is a flow chart of step S102 of the manufacturing method of the light-emitting element packaging structure according to the second embodiment of the present invention.

FIG. 7C is a flow chart of step S106 of the manufacturing method of the light emitting element packaging structure according to the second embodiment of the present invention.

FIG. 7D is another flow chart of the manufacturing method of the light emitting element packaging structure according to the second embodiment of the present invention.

FIG. 8 is one of the schematic diagrams of the manufacturing process of the light emitting device packaging structure according to the second embodiment of the present invention.

FIG. 9A is a flowchart of a manufacturing method of a light-emitting element packaging structure according to a third embodiment of the present invention.

FIG. 9B is a flow chart of step S206 of the manufacturing method of the light emitting element packaging structure according to the third embodiment of the present invention.

FIG. 10 is another schematic diagram of the manufacturing process of the light-emitting element packaging structure according to the second embodiment of the present invention.

U: Light-emitting element packaging structure

1: Substrate unit

11: Substrate body

111: the first conductive pad

110: surface

12: Around the frame

120: around space

2: Lighting unit

21: Second conductive pad

3: Conductive junction unit

4: Translucent unit

H1: the first predetermined height

H2: second predetermined height

Claims (13)

A light-emitting element packaging structure, which includes: a substrate unit, the substrate unit includes a substrate body and a surrounding frame disposed on the substrate body, wherein the surrounding frame has a first predetermined height; A light-emitting unit, the light-emitting unit is arranged on the substrate body, the light-emitting unit is coupled to the substrate body, and the light-emitting unit is arranged in a surrounding space formed by the surrounding frame, wherein , the light-emitting unit has a second predetermined height, the first predetermined height of the surrounding frame is smaller than the second predetermined height of the light-emitting unit; a light-transmitting unit, the light-transmitting unit is arranged on the on the substrate unit and cover the light-emitting unit, wherein the light-transmitting unit does not protrude from the outer surface of the surrounding frame in the horizontal direction; and a conductive joint unit, the conductive joint unit is coupled to Between the substrate unit and the light emitting unit. According to the light-emitting element packaging structure described in item 1 of the patent scope of the application, the substrate body includes a first conductive pad, the light-emitting unit includes a second conductive pad, and the conductive bonding unit is coupled to the first conductive pad. Between a conductive pad and the second conductive pad. The light-emitting element packaging structure described in item 1 of the scope of the patent application, wherein the material of the conductive bonding unit is anisotropic conductive adhesive, anisotropic conductive film, tin, gold tin, conductive metal or conductive alloy. The light-emitting element packaging structure described in claim 1 of the patent claims, wherein the material of the surrounding frame is different from the material of the light-transmitting unit. According to the light-emitting element packaging structure described in item 1 of the scope of the patent application, the light-transmitting unit is an encapsulant, and the material of the encapsulant is epoxy resin or silicone. The light-emitting element packaging structure described in item 1 of the scope of the patent application, wherein the light-transmitting unit is a lens, and the material of the lens is glass, quartz or plastic. A method for manufacturing a light-emitting element packaging structure, which includes: providing a substrate unit, the substrate unit includes a substrate body and a surrounding frame disposed on the substrate body, wherein the surrounding frame has a first A predetermined height; a light-emitting unit is arranged on the substrate body and is located in a surrounding space formed by the surrounding frame, wherein the light-emitting unit has a second predetermined height, and all of the surrounding frame The first predetermined height is smaller than the second predetermined height of the light-emitting unit; a heating and pressure bonding process is performed to couple the light-emitting unit to the substrate body and fix it on the substrate body; and setting A light-transmitting unit is on the substrate unit to cover the light-emitting unit, wherein the light-transmitting unit does not protrude beyond the outer surface of the surrounding frame in the horizontal direction. The method for manufacturing a light-emitting element packaging structure as described in item 7 of the scope of the patent application, wherein, in the step of performing the heating and pressing bonding process, it includes: providing a heated heating and pressing unit; The heat pressing unit presses against the light-emitting unit to indirectly heat and press a conductive bonding unit disposed between the light-emitting unit and the substrate body, thereby coupling the light-emitting unit and the substrate body; and removing the heat pressing unit pressed against the light emitting unit. The method for manufacturing a light-emitting element packaging structure as described in claim 8 of the scope of the patent application, wherein the heat press unit includes a heat press base body and a buffer layer arranged on the heat press base body, and the heat press unit The material of the seat body is different from that of the buffer layer, and the hardness of the buffer layer is smaller than that of the hot-press seat body. The manufacturing method of the light-emitting element packaging structure described in item 8 of the scope of the patent application, Wherein, in the step of providing the heated heat-pressing unit, heating the substrate body is further included. The method for manufacturing a light-emitting element packaging structure as described in claim 8 of the scope of the patent application, wherein, in the step of arranging the light-emitting unit on the substrate body, it further includes: arranging another light-emitting unit on the substrate body and located in another surrounding space formed by another surrounding frame. The method for manufacturing a light-emitting element packaging structure as described in claim 11 of the scope of the patent application, wherein, in the step of pressing the heated heat-pressing unit against the light-emitting unit, the heated heat-pressing unit is simultaneously The pressing unit presses against the light emitting unit and the other light emitting unit. The method for manufacturing a light-emitting element packaging structure as described in item 7 of the patent scope of the application, wherein the step of providing the substrate unit includes: providing the substrate body; and arranging the surrounding frame on the substrate body .

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