TWM597515U - Light-emitting element package structure - Google Patents

Abstract

This creation discloses a light emitting element packaging structure. The light emitting element packaging structure includes: a substrate unit, a light emitting unit and a conductive bonding unit. The substrate unit includes a substrate body and a surrounding frame disposed on the substrate body. The frame has a first predetermined height. The light-emitting unit is disposed on the substrate body, and the light-emitting unit is coupled to the substrate body. The light emitting unit is disposed in a surrounding space formed by the surrounding frame. The light emitting unit has a second predetermined height. The first predetermined height around the frame is smaller than the second predetermined height of the light emitting unit. The conductive bonding unit is coupled between the substrate unit and the light emitting unit.

Description

Light emitting element packaging structure

This creation relates to a packaging structure, in particular to a packaging structure using light emitting elements.

First of all, although there are many different packaging structures and manufacturing methods for providing light-emitting diodes in the prior art, the process efficiency still needs to be improved. For example, in the "multi-chip package structure and its manufacturing method" disclosed in the TW I464920 patent case, the light-emitting element is mainly arranged on the substrate body, and then, a surrounding adhesive material surrounding the light-emitting element is coated on the substrate Ontology. Finally, a encapsulant is formed on the substrate body and covers the light emitting element.

However, in the patent case No. TW I464920, the step of disposing the light-emitting element on the substrate body and then applying a surrounding glue material on the substrate body may easily cause the surrounding glue material coating process to affect the already installed substrate Light emitting element on the body. Furthermore, the process efficiency of the TW I464920 patent case still needs to be improved. In this way, how to propose a light-emitting device packaging structure that improves the production efficiency of the light-emitting device packaging structure to overcome the above-mentioned defects has become one of the important issues to be solved by this business.

The technical problem to be solved in this creation is to provide a light-emitting element packaging structure for the deficiencies of the prior art.

In order to solve the above technical problems, one of the technical solutions adopted in the present creation is to provide a light emitting element packaging structure, which includes: a substrate unit, a light emitting unit, and a conductive bonding unit. The substrate unit includes a substrate body and a surrounding frame disposed on the substrate body, wherein the surrounding frame has a first predetermined height. The light emitting unit is disposed on the substrate body, the light emitting unit is coupled to the substrate body, and the light emitting unit is disposed in a surrounding space formed by the surrounding frame body, wherein the light is emitted The unit has a second predetermined height, and the first predetermined height surrounding the frame is smaller than the second predetermined height of the light emitting unit. The conductive bonding unit is coupled between the substrate unit and the light emitting unit.

One of the beneficial effects of this creation is that the light-emitting element packaging structure provided by this creation can pass the technology of "the first predetermined height around the frame is smaller than the second predetermined height of the light-emitting unit" Scheme to improve the production efficiency of the light emitting element packaging structure.

In order to further understand the characteristics and technical content of this creation, please refer to the following detailed description and drawings of this creation. However, the drawings provided are only for reference and explanation, not to limit this creation.

The following are specific specific examples to illustrate the implementation of the "light emitting element packaging structure" disclosed in this creation. Those skilled in the art can understand the advantages and effects of this creation from the content disclosed in this specification. This creation can be implemented or applied through other different specific embodiments. The details in this specification can also be based on different views and applications, and various modifications and changes can be made without departing from the concept of this creation. In addition, the drawings in this creation are only a schematic illustration, not based on the actual size, and are declared in advance. The following embodiments will further describe the relevant technical content of the creation, but the disclosed content is not intended to limit the protection scope of the creation.

It should be understood that although terms such as “first”, “second”, and “third” may be used herein to describe various elements, these elements should not be limited by these terms. These terms are mainly used to distinguish one element from another. In addition, the term "or" as used herein should include any combination of any one or more of the associated listed items, depending on the actual situation.

[First embodiment]

First, referring to FIGS. 1 to 4, FIG. 1 is a three-dimensional schematic diagram of the light emitting device package structure of the first embodiment, FIG. 2 is a cross-sectional schematic diagram of the II-II cross-section of FIG. 1, FIG. 3 and FIG. 4 are respectively three-dimensional exploded schematic diagrams of the light emitting element packaging structure of the first embodiment of the creation. This creation provides a light-emitting element packaging structure U. The first embodiment will first introduce the overall structure of the light-emitting element packaging structure U. The manufacturing method of the light-emitting element packaging structure U will be described in subsequent embodiments.

In light of the above, please refer to FIG. 1 to FIG. 4 again. The light-emitting device packaging structure U includes a substrate unit 1, a light-emitting unit 2, and a conductive bonding unit 3. The substrate unit 1 may include a substrate body 11 and a surrounding frame 12 disposed on the substrate body 11. The light emitting unit 2 may be disposed on the substrate body 11, the light emitting unit 2 may be coupled to the substrate body 11, and the light emitting unit 2 is disposed in a surrounding space 120 formed by the surrounding frame 12. The conductive bonding unit 3 may be coupled between the substrate unit 1 and the light-emitting unit 2, and the substrate unit 1 and the light-emitting unit 2 are coupled to each other through the conductive bonding unit 3. In addition, the substrate body 11 may include a surface 110, and the light emitting unit 2 and the surrounding frame 12 may be disposed on the surface 110 of the substrate body 11, that is, the light emitting unit 2 and the surrounding frame 12 are disposed on the same one of the substrate body 11 On the surface. In addition, it should be noted that the coupling in the full text of this creation can be a direct electrical connection or an indirect electrical connection, and this creation is not limited to this.

According to the above, for example, the light emitting unit 2 may be a light emitting diode (LED). In addition, the substrate body 11 may be a printed circuit board (PCB), a ceramic substrate, an epoxy tree Epoxy Molding Compound (EMC) substrate and Silicone Molding Compound (SMC) substrate. In addition, the surrounding frame 12 can be provided on the substrate body 11 by coating, so the surrounding frame 12 may be a dam formed after the adhesive material provided on the substrate body 11 is cured. In addition, in other embodiments, the surrounding frame 12 may also be formed integrally with the substrate body 11. In addition, The material surrounding the frame 12 may be epoxy, silicone, acrylic or metal materials. In addition, the material of the conductive bonding unit 3 may be anisotropic conductive adhesive (Anisotropic Conductive Adhesive), different Anisotropic Conductive Film (ACF), tin, gold tin, conductive metal or conductive alloy. However, it should be noted that the examples given above are only one of the feasible implementation forms and are not intended to limit this creation. In addition, this creation is not limited by the way around the frame 12.

Next, please refer to FIG. 2 again, for the purpose of this creation, the surrounding frame 12 disposed on the substrate body 11 may have a first predetermined height H1, and the light emitting unit 2 disposed on the substrate body 11 may have a first Two predetermined heights H2, the size of the first predetermined height H1 surrounding the frame 12 is smaller than the size of the second predetermined height H2 of the light emitting unit 2. In addition, the surrounding frame 12 may be provided on the substrate body 11 by coating. In addition, it is worth noting that the calculated position of the first predetermined height H1 may be the height from the surface 110 of the substrate body 11 to the top surface surrounding the frame 12; the calculated position of the second predetermined height H2 may be the light emitting unit 2 When provided on the surface 110 of the substrate body 11, the height from the surface 110 of the substrate body 11 to the top surface of the light emitting unit 2, that is, the second predetermined height H2 includes the thickness of the conductive bonding unit 3 and the thickness of the light emitting unit 2. In addition, in other embodiments, the second predetermined height H2 may be only the thickness of the light emitting unit 2.

3 and FIG. 4 again, the substrate body 11 may include at least one first conductive pad 111 (pad) disposed on the surface 110, and the light emitting unit 2 includes at least one surface 110 facing the surface 110 of the substrate body 11 Two conductive pads 21 (pad), whereby the first conductive pad 111 and the second conductive pad 21 are opposed to each other. In addition, the conductive bonding unit 3 may be coupled between the first conductive pad 111 of the substrate body 11 and the second conductive pad 21 of the light-emitting unit 2, so that the first conductive pad 111 of the substrate body 11 and the second of the light-emitting unit 2 The conductive pads 21 are coupled to each other. Thereby, the light-emitting unit 2 can be coupled to the substrate body 11. In addition, it should be noted that the drawing in this creation uses the anisotropic conductive film as an example. Therefore, the characteristics of the anisotropic conductive film can be used so that the two first conductive pads 111 on the substrate body 11 will not The short circuit also prevents the two second conductive pads 21 on the light emitting unit 2 from being short circuited.

Next, please refer to FIG. 1 to FIG. 4 again. The light-emitting element packaging structure U further includes a light-transmitting unit 4. The light-transmitting unit 4 can be disposed on the substrate unit 1 and covers the light-emitting unit 2. For example, in the embodiment of FIGS. 1 to 4, the light-transmitting unit 4 can be a lens, and the lens material is glass, quartz, or plastic, but the original creation is not limited to this. Further, the light-transmitting unit 4 can be disposed on the surrounding frame 12 of the substrate unit 1, but the original creation is not limited to this.

Next, please refer to FIG. 5. FIG. 5 is another schematic diagram of the three-dimensional assembly of the light emitting device package structure of the first embodiment. It can be seen from the comparison between FIG. 5 and FIG. 4 that the biggest difference between FIG. 5 and FIG. 4 is that, in terms of the embodiment of FIG. 5, the light-transmitting unit 4 is an encapsulant. Further, the material of the encapsulating colloid can be epoxy or silicone, but this creation is not limited to this. In addition, for example, the material surrounding the frame 12 and the material of the light-transmitting unit 4 may be different. However, in other embodiments, the material surrounding the frame 12 and the material of the light-transmitting unit 4 It can also be the same. In addition, it is worth noting that the encapsulant can be disposed in the surrounding space 120 formed around the frame 12 by coating. In this way, in the embodiment of FIG. 5, the surrounding frame 12 can be used as a limiting frame for limiting the encapsulant.

[Second Embodiment]

First, please refer to FIG. 5, FIG. 6A to FIG. 6D, FIG. 7A and FIG. 7B, FIG. 6A, FIG. 6B, FIG. 6C and FIG. 6D are schematic diagrams of the manufacturing process of the light emitting device package structure of the second embodiment, FIG. 7A is a flowchart of a method of manufacturing a light-emitting device package structure of the second embodiment, and FIG. 7B is a flowchart of step S102 of the manufacturing method of a light-emitting device package structure of the second embodiment. In addition, it is worth noting that the characteristics of each element in the manufacturing method of the light-emitting element package structure provided in the second embodiment are similar to those in the foregoing embodiments, and are not repeated here.

6A, 7A and 7B, as shown in step S102, a substrate unit 1 is provided. The substrate unit 1 includes a substrate body 11 and a surrounding frame 12 disposed on the substrate body 11. The surrounding frame 12 may be convexly arranged relative to the surface 110 of the substrate body 11. Further, in one embodiment, as shown in step S1022, the substrate body 11 may be provided first. In addition, a first conductive pad 111 may be included on the substrate body 11. Next, as shown in step S1024, a surrounding frame 12 is further disposed on the substrate body 11. For example, in the implementation of step S1022 and step S1024, a glue material can be disposed on the substrate body 11 by coating, and the surrounding frame 12 can be formed after the glue material is cured. In addition, in other embodiments, the substrate body 11 and the surrounding frame 12 may also be integrally formed, and the present invention is not limited to the manner of setting the surrounding frame 12.

Next, please refer to FIG. 6B and FIG. 7A again. As shown in step S104, a light-emitting unit 2 is disposed on the substrate body 11 and located in a surrounding space 120 formed by the surrounding frame 12. Further, the light emitting unit 2 may include a second conductive pad 21, and the second conductive pad 21 of the light emitting unit 2 corresponds to the first conductive pad 111 of the substrate body 11. In addition, a conductive bonding unit 3 may be disposed between the first conductive pad 111 of the substrate body 11 and the second conductive pad 21 of the light emitting unit 2. In addition, in other embodiments, a plurality of light-emitting units 2 may be simultaneously disposed on the substrate body 11 and located in a surrounding space 120 (not shown in the figure) formed by the surrounding frame body 12, and the substrate body 11 may also A plurality of first conductive pads 111 may be included, which are respectively coupled to the second conductive pads 21 of the plurality of light emitting units 2.

Next, please refer to FIG. 6C and FIG. 7A again, and perform a heat and pressure bonding process to couple the light emitting unit 2 to the substrate body 11 and fix it on the substrate body 11. Further, in terms of this creation, since this creation uses a heat and pressure bonding process to place the light emitting unit 2 on the substrate unit 1, the surrounding frame 12 may have a first predetermined height H1, and the light emitting unit 2 may It has a second predetermined height H2, and the first predetermined height H1 surrounding the frame 12 is smaller than the second predetermined height H2 of the light emitting unit 2. Therefore, in a preferred embodiment, a plurality of light-emitting units 2 can be simultaneously coupled to the substrate body 11 and fixed on the substrate body 11 at a time by a thermal compression bonding process.

Next, please also refer to FIG. 7C, which is a flowchart of step S106 of the method for manufacturing the light emitting device package structure of the second embodiment. As shown in step S1062, a heated hot pressing unit P is provided. For example, the hot pressing unit P may include a hot pressing base body P1 and a buffer layer P2 disposed on the hot pressing base body P1, the materials of the hot pressing base body P1 and the buffer layer P2 are different, and the hardness of the buffer layer P2 Less than the hardness of the hot-press seat body P1, the buffer layer P2 may have elasticity. Next, as shown in step S1064, the heated hot pressing unit P is pressed against the light emitting unit 2 to indirectly heat and press a conductive bonding unit 3 disposed between the light emitting unit 2 and the substrate body 11 to couple The light emitting unit 2 is connected to the substrate body 11. Thereby, through the buffer layer P2 provided on the hot-pressing base body P1, the deformation of the buffer layer P2 can be used first while the hot-pressing unit P is pressed against the light-emitting unit 2 to prevent the light-emitting unit 2 from being heated The pressing force of the pressing unit P causes displacement. Therefore, it is possible to avoid the problem of short circuit caused by the misalignment of the light emitting unit 2. In addition, for example, the material of the hot pressing base body P1 may be metal, and the material of the buffer layer P2 may be polyethylene terephthalate (PET). However, it should be noted that in other embodiments, the buffer layer P2 may not be provided. Finally, referring to FIG. 6D, as shown in step S1066, the hot pressing unit P pressed against the light emitting unit 2 is removed, thereby forming a light emitting element packaging structure U.

According to the above, in other embodiments, in the step of providing a heated hot-pressing unit P in step S1062, the method further includes heating the substrate body 11. Thereby, the melting speed or solidification speed of the conductive bonding unit 3 provided between the light emitting unit 2 and the substrate body 11 can be further increased.

Next, please refer to FIG. 1 and FIG. 5 again, and refer to FIG. 7D together. FIG. 7D is another flowchart of a method for manufacturing a light emitting device package structure according to a second embodiment. As can be seen from the comparison between FIG. 7D and FIG. 7A, in the embodiment of FIG. 7D, the manufacturing method of the light-emitting element packaging structure U may further include step S108. Further, as shown in step S108, a light-transmitting unit is provided on the substrate unit 1 to cover the light-emitting unit 2. For example, as shown in FIG. 1, the light-transmitting unit 4 may be a lens, and the light-transmitting unit 4 may be disposed on the surrounding frame 12 of the substrate unit 1. In addition, as shown in FIG. 5, the light-transmitting unit 4 may be an encapsulant, and the encapsulant is disposed in a surrounding space 120 formed by the surrounding frame 12 and covering the light-emitting unit 2 by coating.

[Third Embodiment]

First, please refer to FIG. 8, FIG. 9A and FIG. 9B, FIG. 8 is a schematic diagram of the manufacturing process of creating the light emitting device package structure of the second embodiment, and FIG. 9A is the creating process of the light emitting device package structure of the third embodiment. FIG. 9B is a flowchart of step S206 of the manufacturing method of the light emitting element packaging structure of the third embodiment. It can be seen from the comparison between FIG. 8 and FIG. 6C and the comparison between FIG. 9A and FIG. 7A that the biggest difference between the third embodiment and the first embodiment is that a plurality of light-emitting units 2 can be simultaneously provided on the substrate unit using a heat and pressure bonding process 1 on. In addition, it is worth noting that the feature of each element and the manufacturing steps of the light-emitting element package structure in the method for manufacturing the light-emitting element package structure provided in the third embodiment are similar to the previous embodiments, and will not be repeated here.

Next, as shown in step S202, a substrate unit 1 is provided. The substrate unit 1 may include a substrate body 11, a surrounding frame 12 disposed on the substrate body 11, and another surrounding frame 12 disposed on the substrate body 11 . In other words, the substrate body 11 may include a plurality of surrounding frames 12. Therefore, in one of the embodiments, a substrate body 11 can be provided first, and then a plurality of surrounding frames 12 can be provided on the substrate body 11. In addition, in another embodiment, the substrate body 11 and the plurality of surrounding frame bodies 12 may also be integrally formed, and the present invention is not limited to the arrangement manner of the surrounding frame bodies 12.

Next, as shown in step S204, a light-emitting unit 2 is disposed on the substrate body 11 and located in a surrounding space 120 formed by the surrounding frame 12, and another light-emitting unit 2 is disposed on the substrate body 11 and located on the other side A surrounding space 120 is formed by a surrounding frame 12. In other words, a plurality of light-emitting units 2 may be respectively disposed in the surrounding space 120 corresponding to them. In addition, it is worth explaining that please refer to FIG. 10, which is another schematic diagram of the manufacturing process of the light emitting device package structure of the second embodiment. In other embodiments, a plurality of light-emitting units 2 may also be disposed on the substrate body 11 and located in a surrounding space 120 formed by the surrounding frame body 12, that is, as shown in FIG. 10, a surrounding space 120 There may be a plurality of light emitting units 2.

Next, as shown in step S206, a heat and pressure bonding process is performed to couple the light emitting unit 2 and another light emitting unit 2 to the substrate body 11 and fix the substrate body 11. Furthermore, as shown in step S2062, a heated hot pressing unit P may be provided first. Next, as shown in step S2064, the heated hot-pressing unit P is pressed against the light-emitting unit 2 and another light-emitting unit 2 to indirectly heat and pressurize a conductive material disposed between the light-emitting unit 2 and the substrate body 11 The bonding unit 3 and a conductive bonding unit 3 disposed between the other light-emitting unit 2 and the substrate body 11 are coupled to the light-emitting unit 2 and the substrate body 11 and to the other light-emitting unit 2 and the substrate body 11. In this way, as shown in FIG. 8, one hot-pressing unit P can simultaneously heat and press the plurality of light-emitting units 2, and simultaneously couple the plurality of light-emitting units 2 to the substrate body 11 and fix the substrate body 11 to Improve the production efficiency of the light-emitting element packaging structure U. Finally, as shown in step S2066, the thermal pressing unit P pressed against the light emitting unit 2 and another light emitting unit 2 is removed. In addition, it is worth noting that, through the buffer layer P2 provided on the hot-press base body P1, the deformation of the buffer layer P2 can be utilized first while the hot-press unit P is pressed against the plurality of light-emitting units 2 The pressure exerted by the hot pressing unit P on the plurality of light emitting units 2 can be averaged.

In addition, it is worth noting that the manufacturing method of the light-emitting element packaging structure provided in the third embodiment may further include disposing a light-transmitting unit on the substrate unit 1 to cover the light-emitting unit 2 and another light-emitting unit 2. Then, a dicing process is used to separate the two adjacent light-emitting element packaging structures U to form a plurality of separated light-emitting element packaging structures U.

[Beneficial effect of embodiment]

One of the beneficial effects of this creation is that the light-emitting element packaging structure provided by this creation can be improved by the technical solution of “the first predetermined height H1 surrounding the frame 12 is smaller than the second predetermined height H2 of the light-emitting unit 2” Production efficiency of light emitting element packaging structure.

Furthermore, the present invention can use the heat and pressure bonding process to place at least one light-emitting unit 2 or a plurality of light-emitting units 2 on the substrate unit 1, and furthermore, one hot-pressing unit P can simultaneously heat and press multiple light-emitting units 2 The light-emitting unit 2 simultaneously couples the plurality of light-emitting units 2 to the substrate body 11 and is fixed on the substrate body 11 to improve the production efficiency of the light-emitting element packaging structure U.

Furthermore, the present invention can first provide a substrate unit 1 including a frame 12 and then use a heat and pressure bonding process to couple the light-emitting unit 2 to the substrate body 11 and fix it to the substrate body 11 in order. Improve the production efficiency of the light-emitting element packaging structure U.

The content disclosed above is only a preferred and feasible embodiment of this creation, and does not limit the scope of the patent application for this creation, so any equivalent technical changes made by using this creation specification and graphic content are included in this creation application Within the scope of the patent.

U: light emitting element packaging structure 1: substrate unit 11: substrate body 110: surface 111: the first conductive pad 12: around the frame 120: Around the space 2: Light emitting unit 21: Second conductive pad 3: Conductive joint unit 4: Light transmission unit P: Hot pressing unit P1: Hot pressing seat body P2: buffer layer H1: the first predetermined height H2: second predetermined height

FIG. 1 is a schematic perspective view of one of the light-emitting element packaging structures of the first embodiment of the invention.

FIG. 2 is a schematic cross-sectional view of the II-II cross section of FIG. 1.

FIG. 3 is a schematic perspective exploded view of the light emitting element packaging structure of the first embodiment of the invention.

FIG. 4 is another schematic exploded schematic view of the light emitting element packaging structure of the first embodiment of the invention.

FIG. 5 is another schematic three-dimensional assembly diagram of the light emitting element packaging structure of the first embodiment of the invention.

6A, 6B, 6C and 6D are schematic diagrams of the manufacturing process of the light emitting element packaging structure of the second embodiment.

FIG. 7A is a flow chart of a method for manufacturing a light-emitting device packaging structure according to a second embodiment.

FIG. 7B is a flowchart of step S102 of the method for manufacturing the light-emitting element packaging structure of the second embodiment.

7C is a flowchart of step S106 of the method for manufacturing a light-emitting element packaging structure of the second embodiment.

FIG. 7D is another flowchart of the method for manufacturing the light-emitting element packaging structure of the second embodiment.

FIG. 8 is a schematic diagram of the manufacturing process of the light emitting element packaging structure of the second embodiment.

9A is a flowchart of a method for manufacturing a light-emitting element packaging structure of a third embodiment.

FIG. 9B is a flowchart of step S206 of the method for manufacturing the light-emitting element packaging structure of the third embodiment.

FIG. 10 is another schematic diagram of the manufacturing process of the light emitting element packaging structure of the second embodiment.

U: light emitting element packaging structure

1: substrate unit

11: substrate body

111: the first conductive pad

110: surface

12: around the frame

120: Around the space

2: Light emitting unit

21: Second conductive pad

3: Conductive joint unit

4: Light transmission unit

H1: the first predetermined height

H2: second predetermined height

Claims (7)

A light-emitting element packaging structure includes: a substrate unit including a substrate body and a surrounding frame disposed on the substrate body, wherein the surrounding frame has a first predetermined height; A light emitting unit, the light emitting unit is disposed on the substrate body, the light emitting unit is coupled to the substrate body, and the light emitting unit is disposed in a surrounding space formed by the surrounding frame body, wherein, The light emitting unit has a second predetermined height, the first predetermined height surrounding the frame is smaller than the second predetermined height of the light emitting unit; and a conductive bonding unit, the conductive bonding unit is coupled to Between the substrate unit and the light emitting unit. The light-emitting element packaging structure as recited in item 1 of the patent application range, wherein the substrate body includes a first conductive pad, the light-emitting unit includes a second conductive pad, and the conductive bonding unit is coupled to the first Between a conductive pad and the second conductive pad. The light-emitting element packaging structure as described in item 1 of the patent application range, wherein the material of the conductive bonding unit is an anisotropic conductive adhesive material, an anisotropic conductive film, tin, gold tin, a conductive metal, or a conductive alloy. The light-emitting element packaging structure described in item 1 of the scope of the patent application further includes: a light-transmitting unit disposed on the substrate unit and covering the light-emitting unit. The light-emitting element packaging structure as described in item 4 of the patent application range, wherein the material surrounding the frame is different from the material of the light-transmitting unit. The light-emitting element packaging structure as described in item 4 of the patent application range, wherein the light-transmitting unit is an encapsulant, and the material of the encapsulant is epoxy resin or silicone. The light-emitting element packaging structure as described in item 4 of the patent application range, wherein the light-transmitting unit is a lens, and the material of the lens is glass, quartz or plastic.

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