JP2006013030A - 回路基板用部材およびその製造方法 - Google Patents

回路基板用部材およびその製造方法 Download PDF

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Publication number
JP2006013030A
JP2006013030A JP2004186007A JP2004186007A JP2006013030A JP 2006013030 A JP2006013030 A JP 2006013030A JP 2004186007 A JP2004186007 A JP 2004186007A JP 2004186007 A JP2004186007 A JP 2004186007A JP 2006013030 A JP2006013030 A JP 2006013030A
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JP
Japan
Prior art keywords
circuit board
layer
plating
metal layer
flexible film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004186007A
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English (en)
Japanese (ja)
Other versions
JP2006013030A5 (https=
Inventor
Nobuo Fuji
信男 藤
Takayoshi Akamatsu
孝義 赤松
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Industries Inc
Original Assignee
Toray Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries Inc filed Critical Toray Industries Inc
Priority to JP2004186007A priority Critical patent/JP2006013030A/ja
Publication of JP2006013030A publication Critical patent/JP2006013030A/ja
Publication of JP2006013030A5 publication Critical patent/JP2006013030A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP2004186007A 2004-06-24 2004-06-24 回路基板用部材およびその製造方法 Pending JP2006013030A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004186007A JP2006013030A (ja) 2004-06-24 2004-06-24 回路基板用部材およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004186007A JP2006013030A (ja) 2004-06-24 2004-06-24 回路基板用部材およびその製造方法

Publications (2)

Publication Number Publication Date
JP2006013030A true JP2006013030A (ja) 2006-01-12
JP2006013030A5 JP2006013030A5 (https=) 2007-08-02

Family

ID=35779917

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004186007A Pending JP2006013030A (ja) 2004-06-24 2004-06-24 回路基板用部材およびその製造方法

Country Status (1)

Country Link
JP (1) JP2006013030A (https=)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008270311A (ja) * 2007-04-17 2008-11-06 Hitachi Cable Ltd 半導体装置用テープキャリアの製造方法
JP2009094128A (ja) * 2007-10-04 2009-04-30 Phoenix Precision Technology Corp 回路板およびその製造方法
JP2010226075A (ja) * 2009-03-23 2010-10-07 Ibiden Co Ltd 配線板及びその製造方法
KR101232541B1 (ko) * 2006-05-16 2013-02-12 엘지디스플레이 주식회사 가요성 기판의 제조 방법
KR101534849B1 (ko) * 2008-08-27 2015-07-07 엘지이노텍 주식회사 플립칩 패키지 및 그 제조방법
JP2017045794A (ja) * 2015-08-25 2017-03-02 大日本印刷株式会社 部品実装薄膜配線基材の製造方法
JP2019080063A (ja) * 2017-10-24 2019-05-23 啓耀光電股▲分▼有限公司 電子装置及びその製造方法
KR20220034596A (ko) * 2020-09-11 2022-03-18 삼성전자주식회사 반도체 패키지
KR20230001098U (ko) * 2021-11-23 2023-05-31 칩본드 테크놀러지 코포레이션 반도체 패키지 구조

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101232541B1 (ko) * 2006-05-16 2013-02-12 엘지디스플레이 주식회사 가요성 기판의 제조 방법
JP2008270311A (ja) * 2007-04-17 2008-11-06 Hitachi Cable Ltd 半導体装置用テープキャリアの製造方法
JP2009094128A (ja) * 2007-10-04 2009-04-30 Phoenix Precision Technology Corp 回路板およびその製造方法
KR101534849B1 (ko) * 2008-08-27 2015-07-07 엘지이노텍 주식회사 플립칩 패키지 및 그 제조방법
JP2010226075A (ja) * 2009-03-23 2010-10-07 Ibiden Co Ltd 配線板及びその製造方法
JP2017045794A (ja) * 2015-08-25 2017-03-02 大日本印刷株式会社 部品実装薄膜配線基材の製造方法
JP2019080063A (ja) * 2017-10-24 2019-05-23 啓耀光電股▲分▼有限公司 電子装置及びその製造方法
KR20220034596A (ko) * 2020-09-11 2022-03-18 삼성전자주식회사 반도체 패키지
KR102894034B1 (ko) * 2020-09-11 2025-12-04 삼성전자주식회사 반도체 패키지
KR20230001098U (ko) * 2021-11-23 2023-05-31 칩본드 테크놀러지 코포레이션 반도체 패키지 구조
KR200498112Y1 (ko) * 2021-11-23 2024-06-27 칩본드 테크놀러지 코포레이션 반도체 패키지 구조
US12412825B2 (en) 2021-11-23 2025-09-09 Chipbond Technology Corporation Semiconductor package

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