JP2006005924A - 音響共振器 - Google Patents
音響共振器 Download PDFInfo
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- JP2006005924A JP2006005924A JP2005169397A JP2005169397A JP2006005924A JP 2006005924 A JP2006005924 A JP 2006005924A JP 2005169397 A JP2005169397 A JP 2005169397A JP 2005169397 A JP2005169397 A JP 2005169397A JP 2006005924 A JP2006005924 A JP 2006005924A
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 238000005137 deposition process Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
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- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02007—Details of bulk acoustic wave devices
- H03H9/02086—Means for compensation or elimination of undesirable effects
- H03H9/02118—Means for compensation or elimination of undesirable effects of lateral leakage between adjacent resonators
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02007—Details of bulk acoustic wave devices
- H03H9/02086—Means for compensation or elimination of undesirable effects
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02007—Details of bulk acoustic wave devices
- H03H9/02086—Means for compensation or elimination of undesirable effects
- H03H9/02149—Means for compensation or elimination of undesirable effects of ageing changes of characteristics, e.g. electro-acousto-migration
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/171—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
- H03H9/172—Means for mounting on a substrate, i.e. means constituting the material interface confining the waves to a volume
- H03H9/173—Air-gaps
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- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
【解決手段】本発明の一態様によれば、基板、第1電極、圧電材料のレイヤ、第2電極、及び引っ込み領域を含む音響共振器が提供される。基板は、第1表面を備えている。第1電極は、基板の第1表面に隣接している。圧電材料のレイヤは、第1電極に隣接している。第2電極は、圧電材料のレイヤに隣接している。第2電極は、多角形として成形された第2電極外辺部を備えている。引っ込み領域は、第2電極に隣接している。引っ込み領域は、引っ込み領域外辺部を定義する形状を備えている。引っ込み領域外辺部は、第2電極外辺部よりも引っ込んでいる。
【選択図】図4
Description
42、72 基板
44、74 窪み
46、76 第1電極
47、77 第1表面
48、78 圧電材料レイヤ
50、80 第2電極
60、90 引っ込み領域
100 第2引っ込み領域
Claims (10)
- 第1表面を備える基板と、
前記基板の前記第1表面に隣接する第1電極と、
前記第1電極に隣接する圧電材料のレイヤと、
前記圧電材料のレイヤに隣接する第2電極であって、多角形として成形された第2電極外辺部を備える第2電極と、
前記第2電極に隣接する引っ込み領域であって、前記第2電極外辺部よりも引っ込んでいる引っ込み領域外辺部を定義する形状を備える引っ込み領域と、
を有する音響共振器。 - 前記基板の前記第1表面内に窪みが形成されており、前記第1電極が該窪みの上方にまたがっている、請求項1記載の音響共振器。
- 前記第1電極の一部、前記圧電材料のレイヤの一部、前記第2電極の一部、及び前記引っ込み領域を含み、並列周波数を備える主領域と、
前記第1電極の一部、前記圧電材料のレイヤの一部、及び前記第2電極の一部を含み、直列周波数を備える外辺部領域と、
を更に有し、
前記主領域の前記並列周波数は、前記外辺部領域の前記直列周波数の90〜100%である、請求項2記載の音響共振器。 - 前記音響共振器が共振周波数を備え、前記引っ込み領域外辺部から前記第2電極外辺部への距離は、該共振周波数の1波長である、請求項2記載の音響共振器。
- 前記音響共振器が共振周波数を備え、前記引っ込み領域外辺部から前記第2電極外辺部への距離は、該共振周波数の波長の約0.25〜2.5倍であるか、又は約0.5〜7.5ミクロンである、請求項2記載の音響共振器。
- 前記引っ込み領域の大きさは、前記共振器の大きさの合計の0〜10%である、請求項2記載の音響共振器。
- 前記引っ込み領域に隣接する第2引っ込み領域を更に有し、前記第2引っ込み領域は、第2引っ込み領域外辺部を定義する形状を備え、該第2引っ込み領域外辺部は前記第2電極外辺部よりも引っ込んでいる、請求項2記載の音響共振器。
- 前記第2引っ込み領域外辺部が前記引っ込み領域外辺部よりも引っ込んでいる、請求項8記載の音響共振器。
- 前記窪みが窪み外辺部を定義する形状を備え、前記引っ込み領域外辺部が前記窪み外辺部よりも引っ込んでいる、請求項2記載の音響共振器。
- 音響共振器を製造する方法であって、
表面を有する基板を提供するステップと、
前記基板の前記表面に隣接して第1電極を堆積させるステップと、
前記第1電極に隣接して圧電材料のレイヤを形成するステップと、
前記圧電材料のレイヤに隣接して第2電極を堆積させるステップであって、該第2電極は、多角形として成形された第2電極外辺部を備えるように堆積される、ステップと、
前記第2電極に隣接して引っ込み領域を形成するステップであって、該引っ込み領域は、引っ込み領域外辺部を定義する形状を備えるように形成される、ステップと、
を有し、
前記引っ込み領域外辺部は、前記第2電極外辺部よりも引っ込むように形成される、方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/867,540 | 2004-06-14 | ||
US10/867,540 US7161448B2 (en) | 2004-06-14 | 2004-06-14 | Acoustic resonator performance enhancements using recessed region |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006005924A true JP2006005924A (ja) | 2006-01-05 |
JP4721779B2 JP4721779B2 (ja) | 2011-07-13 |
Family
ID=34862181
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Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005169397A Expired - Fee Related JP4721779B2 (ja) | 2004-06-14 | 2005-06-09 | 音響共振器 |
Country Status (3)
Country | Link |
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US (1) | US7161448B2 (ja) |
JP (1) | JP4721779B2 (ja) |
GB (1) | GB2415307B (ja) |
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Also Published As
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US20050275486A1 (en) | 2005-12-15 |
JP4721779B2 (ja) | 2011-07-13 |
GB0511765D0 (en) | 2005-07-20 |
US7161448B2 (en) | 2007-01-09 |
GB2415307A (en) | 2005-12-21 |
GB2415307B (en) | 2008-02-27 |
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