JP2006003370A5 - - Google Patents

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Publication number
JP2006003370A5
JP2006003370A5 JP2005238300A JP2005238300A JP2006003370A5 JP 2006003370 A5 JP2006003370 A5 JP 2006003370A5 JP 2005238300 A JP2005238300 A JP 2005238300A JP 2005238300 A JP2005238300 A JP 2005238300A JP 2006003370 A5 JP2006003370 A5 JP 2006003370A5
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JP
Japan
Prior art keywords
electron beam
sample
beam apparatus
electron
defect
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2005238300A
Other languages
English (en)
Japanese (ja)
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JP2006003370A (ja
JP4147233B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2005238300A priority Critical patent/JP4147233B2/ja
Priority claimed from JP2005238300A external-priority patent/JP4147233B2/ja
Publication of JP2006003370A publication Critical patent/JP2006003370A/ja
Publication of JP2006003370A5 publication Critical patent/JP2006003370A5/ja
Application granted granted Critical
Publication of JP4147233B2 publication Critical patent/JP4147233B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2005238300A 2005-08-19 2005-08-19 電子線装置 Expired - Fee Related JP4147233B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005238300A JP4147233B2 (ja) 2005-08-19 2005-08-19 電子線装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005238300A JP4147233B2 (ja) 2005-08-19 2005-08-19 電子線装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2001084232A Division JP3973372B2 (ja) 2001-03-23 2001-03-23 荷電粒子線を用いた基板検査装置および基板検査方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2008055956A Division JP4728361B2 (ja) 2008-03-06 2008-03-06 荷電粒子線を用いた基板検査装置および基板検査方法

Publications (3)

Publication Number Publication Date
JP2006003370A JP2006003370A (ja) 2006-01-05
JP2006003370A5 true JP2006003370A5 (cg-RX-API-DMAC7.html) 2006-05-11
JP4147233B2 JP4147233B2 (ja) 2008-09-10

Family

ID=35771851

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005238300A Expired - Fee Related JP4147233B2 (ja) 2005-08-19 2005-08-19 電子線装置

Country Status (1)

Country Link
JP (1) JP4147233B2 (cg-RX-API-DMAC7.html)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007086400A1 (ja) * 2006-01-25 2007-08-02 Ebara Corporation 試料表面検査方法及び検査装置
JP5117080B2 (ja) 2007-03-07 2013-01-09 株式会社日立ハイテクノロジーズ 試料観察条件設定方法及び装置、並びに試料観察方法及び装置
WO2016121009A1 (ja) 2015-01-28 2016-08-04 株式会社 日立ハイテクノロジーズ 荷電粒子線装置
CN117309921A (zh) * 2023-09-15 2023-12-29 上海华力集成电路制造有限公司 获取缺陷形貌的方法

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