JP2005534587A5 - - Google Patents

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Publication number
JP2005534587A5
JP2005534587A5 JP2004524463A JP2004524463A JP2005534587A5 JP 2005534587 A5 JP2005534587 A5 JP 2005534587A5 JP 2004524463 A JP2004524463 A JP 2004524463A JP 2004524463 A JP2004524463 A JP 2004524463A JP 2005534587 A5 JP2005534587 A5 JP 2005534587A5
Authority
JP
Japan
Prior art keywords
metal film
bottom surfaces
covers
epoxy resin
transfer member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2004524463A
Other languages
English (en)
Japanese (ja)
Other versions
JP4474601B2 (ja
JP2005534587A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2002/041652 external-priority patent/WO2004011248A1/en
Publication of JP2005534587A publication Critical patent/JP2005534587A/ja
Publication of JP2005534587A5 publication Critical patent/JP2005534587A5/ja
Application granted granted Critical
Publication of JP4474601B2 publication Critical patent/JP4474601B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2004524463A 2002-07-29 2002-12-02 反射面付き炭素繊維複合移動部材 Expired - Fee Related JP4474601B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US39933702P 2002-07-29 2002-07-29
PCT/US2002/041652 WO2004011248A1 (en) 2002-07-29 2002-12-02 Carbon fiber composite transfer member with reflective surfaces

Publications (3)

Publication Number Publication Date
JP2005534587A JP2005534587A (ja) 2005-11-17
JP2005534587A5 true JP2005534587A5 (https=) 2006-01-05
JP4474601B2 JP4474601B2 (ja) 2010-06-09

Family

ID=31188571

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004524463A Expired - Fee Related JP4474601B2 (ja) 2002-07-29 2002-12-02 反射面付き炭素繊維複合移動部材

Country Status (13)

Country Link
US (2) US7459215B2 (https=)
EP (1) EP1525088B1 (https=)
JP (1) JP4474601B2 (https=)
KR (1) KR100989012B1 (https=)
CN (1) CN100415505C (https=)
AT (1) ATE500057T1 (https=)
AU (1) AU2002361894A1 (https=)
CA (1) CA2493963C (https=)
DE (1) DE60239361D1 (https=)
ES (1) ES2361827T3 (https=)
IL (1) IL165937A0 (https=)
TW (1) TW200401704A (https=)
WO (1) WO2004011248A1 (https=)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6929299B2 (en) * 2002-08-20 2005-08-16 Asm America, Inc. Bonded structures for use in semiconductor processing environments
JP2006091244A (ja) * 2004-09-22 2006-04-06 Konica Minolta Business Technologies Inc 転写ベルト
DE102006007428A1 (de) * 2006-02-17 2007-08-30 Airbus Deutschland Gmbh Verstärkungsmaterial zur lokalen Verstärkung eines mit einem Verbundmaterial gebildeten Bauteils sowie Verfahren
US8284557B2 (en) * 2007-10-18 2012-10-09 Kyocera Corporation Circuit board, mounting structure, and method for manufacturing circuit board
TWI372717B (en) * 2007-12-14 2012-09-21 Prime View Int Co Ltd Apparatus for transferring substrate
JP2009285823A (ja) * 2008-05-28 2009-12-10 Meian Kokusai Gigyo Kofun Yugenkoshi ロボットアーム、並びに、その保持手段の構成材及び該構成材の製造方法
NL2002888A1 (nl) * 2008-06-12 2009-12-15 Asml Netherlands Bv Lithographic apparatus, composite material and manufacturing method.
JP5169696B2 (ja) * 2008-09-30 2013-03-27 Nok株式会社 密封装置および密封構造
JP2011171591A (ja) * 2010-02-19 2011-09-01 Disco Corp ウエーハの搬出入装置
WO2011108676A1 (ja) * 2010-03-04 2011-09-09 Jx日鉱日石エネルギー株式会社 ロボットハンド
KR20120050835A (ko) * 2010-11-11 2012-05-21 삼성전기주식회사 금속박 적층판 및 그 제조방법, 방열기판
JP5597566B2 (ja) * 2011-02-10 2014-10-01 パナソニック株式会社 筐体、および電子機器
WO2013015101A1 (ja) * 2011-07-28 2013-01-31 三菱樹脂株式会社 炭素繊維強化炭素複合体およびその製造方法
JP5447470B2 (ja) * 2011-09-22 2014-03-19 株式会社安川電機 ハンドおよびロボット
EP2764536A1 (de) * 2011-10-06 2014-08-13 Roth & Rau AG Substratwendeeinrichtung
CN102582146B (zh) * 2011-12-31 2015-03-11 杭州超探新材料科技有限公司 以镁合金为基体的复合材料及其制造方法
JP2016510829A (ja) * 2013-03-11 2016-04-11 エオニックス・アドバンスト・マテリアルズ・コーポレイションAonix Advanced Materials Corp. 熱可塑性複合材を製造するための組成物および方法
US9884426B2 (en) 2013-06-27 2018-02-06 De-Sta-Co Europe Gmbh Boom utilized in a geometric end effector system
CN104512075B (zh) 2013-10-04 2017-06-23 财团法人工业技术研究院 离型层、基板结构、与柔性电子元件工艺
US20150290815A1 (en) * 2014-04-11 2015-10-15 Varian Semiconductor Equipment Associates, Inc. Planar end effector and method of making a planar end effector
KR101683511B1 (ko) * 2015-03-16 2016-12-07 현대자동차 주식회사 자동차용 범퍼 백 빔
US20190134803A1 (en) * 2015-08-10 2019-05-09 Ozat 2000 (1999) Ltd. Tools Made of Composite Material Structures Instead of Steel and Methods Thereof
JP6942961B2 (ja) * 2015-09-18 2021-09-29 東レ株式会社 電子機器筐体
NL2018244B1 (en) * 2017-01-27 2018-08-07 Suss Microtec Lithography Gmbh Endeffektor
US10109517B1 (en) * 2018-01-10 2018-10-23 Lam Research Corporation Rotational indexer with additional rotational axes
TWI701213B (zh) * 2018-05-21 2020-08-11 態金材料科技股份有限公司 碳纖維芯材表面以合金膜層熔接成型製作複合材之方法及其製品。
KR20220081216A (ko) * 2020-12-08 2022-06-15 주식회사 글린트머티리얼즈 내열성 및 전도성을 갖는 반도체 웨이퍼 이송용 미끄럼 방지 패드
JP2022102893A (ja) * 2020-12-25 2022-07-07 京セラ株式会社 試料搬送部材

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1562569A (en) * 1975-12-04 1980-03-12 United Glass Ltd Materials for handling hot glassware and other hot articles
AT384189B (de) * 1983-10-10 1987-10-12 Fischer Gmbh Bauplatte
US4888247A (en) * 1986-08-27 1989-12-19 General Electric Company Low-thermal-expansion, heat conducting laminates having layers of metal and reinforced polymer matrix composite
US4961994A (en) * 1987-12-16 1990-10-09 General Electric Company Protective coated composite material
JPH01277665A (ja) * 1988-04-30 1989-11-08 Toyoda Gosei Co Ltd エンジンヘッドカバー
JPH06144223A (ja) * 1992-11-09 1994-05-24 Railway Technical Res Inst 鉄道車両用構造体
JPH11354607A (ja) * 1998-06-10 1999-12-24 Mitsubishi Chemical Corp 搬送装置用ハンド
JP4345188B2 (ja) * 2000-03-28 2009-10-14 宇部興産株式会社 フレキシブル金属箔積層体およびその製造方法
US6869664B2 (en) * 2000-12-12 2005-03-22 Thermalworks, Inc. Lightweight circuit board with conductive constraining cores

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