JP2005534587A5 - - Google Patents
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- Publication number
- JP2005534587A5 JP2005534587A5 JP2004524463A JP2004524463A JP2005534587A5 JP 2005534587 A5 JP2005534587 A5 JP 2005534587A5 JP 2004524463 A JP2004524463 A JP 2004524463A JP 2004524463 A JP2004524463 A JP 2004524463A JP 2005534587 A5 JP2005534587 A5 JP 2005534587A5
- Authority
- JP
- Japan
- Prior art keywords
- metal film
- bottom surfaces
- covers
- epoxy resin
- transfer member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 claims 2
- 229920000049 Carbon (fiber) Polymers 0.000 claims 1
- 238000010521 absorption reaction Methods 0.000 claims 1
- 239000004917 carbon fiber Substances 0.000 claims 1
- 239000002131 composite material Substances 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 claims 1
- 239000003365 glass fiber Substances 0.000 claims 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
- 239000011208 reinforced composite material Substances 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US39933702P | 2002-07-29 | 2002-07-29 | |
| PCT/US2002/041652 WO2004011248A1 (en) | 2002-07-29 | 2002-12-02 | Carbon fiber composite transfer member with reflective surfaces |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005534587A JP2005534587A (ja) | 2005-11-17 |
| JP2005534587A5 true JP2005534587A5 (enExample) | 2006-01-05 |
| JP4474601B2 JP4474601B2 (ja) | 2010-06-09 |
Family
ID=31188571
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004524463A Expired - Fee Related JP4474601B2 (ja) | 2002-07-29 | 2002-12-02 | 反射面付き炭素繊維複合移動部材 |
Country Status (13)
| Country | Link |
|---|---|
| US (2) | US7459215B2 (enExample) |
| EP (1) | EP1525088B1 (enExample) |
| JP (1) | JP4474601B2 (enExample) |
| KR (1) | KR100989012B1 (enExample) |
| CN (1) | CN100415505C (enExample) |
| AT (1) | ATE500057T1 (enExample) |
| AU (1) | AU2002361894A1 (enExample) |
| CA (1) | CA2493963C (enExample) |
| DE (1) | DE60239361D1 (enExample) |
| ES (1) | ES2361827T3 (enExample) |
| IL (1) | IL165937A0 (enExample) |
| TW (1) | TW200401704A (enExample) |
| WO (1) | WO2004011248A1 (enExample) |
Families Citing this family (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6929299B2 (en) * | 2002-08-20 | 2005-08-16 | Asm America, Inc. | Bonded structures for use in semiconductor processing environments |
| JP2006091244A (ja) * | 2004-09-22 | 2006-04-06 | Konica Minolta Business Technologies Inc | 転写ベルト |
| DE102006007428A1 (de) * | 2006-02-17 | 2007-08-30 | Airbus Deutschland Gmbh | Verstärkungsmaterial zur lokalen Verstärkung eines mit einem Verbundmaterial gebildeten Bauteils sowie Verfahren |
| US8284557B2 (en) * | 2007-10-18 | 2012-10-09 | Kyocera Corporation | Circuit board, mounting structure, and method for manufacturing circuit board |
| TWI372717B (en) * | 2007-12-14 | 2012-09-21 | Prime View Int Co Ltd | Apparatus for transferring substrate |
| JP2009285823A (ja) * | 2008-05-28 | 2009-12-10 | Meian Kokusai Gigyo Kofun Yugenkoshi | ロボットアーム、並びに、その保持手段の構成材及び該構成材の製造方法 |
| NL2002888A1 (nl) * | 2008-06-12 | 2009-12-15 | Asml Netherlands Bv | Lithographic apparatus, composite material and manufacturing method. |
| JP5169696B2 (ja) * | 2008-09-30 | 2013-03-27 | Ｎｏｋ株式会社 | 密封装置および密封構造 |
| JP2011171591A (ja) * | 2010-02-19 | 2011-09-01 | Disco Corp | ウエーハの搬出入装置 |
| US8827339B2 (en) * | 2010-03-04 | 2014-09-09 | Jx Nippon Oil & Energy Corporation | Robot hand |
| KR20120050835A (ko) * | 2010-11-11 | 2012-05-21 | 삼성전기주식회사 | 금속박 적층판 및 그 제조방법, 방열기판 |
| JP5597566B2 (ja) * | 2011-02-10 | 2014-10-01 | パナソニック株式会社 | 筐体、および電子機器 |
| KR102008540B1 (ko) * | 2011-07-28 | 2019-08-07 | 미쯔비시 케미컬 주식회사 | 탄소 섬유 강화 탄소 복합체 및 그의 제조 방법 |
| JP5447470B2 (ja) * | 2011-09-22 | 2014-03-19 | 株式会社安川電機 | ハンドおよびロボット |
| WO2013050805A1 (de) * | 2011-10-06 | 2013-04-11 | Roth & Rau Ag | Substratwendeeinrichtung |
| CN102582146B (zh) * | 2011-12-31 | 2015-03-11 | 杭州超探新材料科技有限公司 | 以镁合金为基体的复合材料及其制造方法 |
| CN105392843A (zh) * | 2013-03-11 | 2016-03-09 | 艾欧尼克斯先进材料股份有限公司 | 用于制备热塑性复合材料的组合物和方法 |
| US9884426B2 (en) | 2013-06-27 | 2018-02-06 | De-Sta-Co Europe Gmbh | Boom utilized in a geometric end effector system |
| CN104512075B (zh) | 2013-10-04 | 2017-06-23 | 财团法人工业技术研究院 | 离型层、基板结构、与柔性电子元件工艺 |
| US20150290815A1 (en) * | 2014-04-11 | 2015-10-15 | Varian Semiconductor Equipment Associates, Inc. | Planar end effector and method of making a planar end effector |
| KR101683511B1 (ko) * | 2015-03-16 | 2016-12-07 | 현대자동차 주식회사 | 자동차용 범퍼 백 빔 |
| WO2017025945A1 (en) * | 2015-08-10 | 2017-02-16 | Ozat 2000 (1999) Ltd. | Tools made of composite material structures instead of steel and methods thereof |
| US20180284845A1 (en) * | 2015-09-18 | 2018-10-04 | Toray Industries, Inc. | Housing |
| NL2018244B1 (en) * | 2017-01-27 | 2018-08-07 | Suss Microtec Lithography Gmbh | Endeffektor |
| US10109517B1 (en) * | 2018-01-10 | 2018-10-23 | Lam Research Corporation | Rotational indexer with additional rotational axes |
| TWI701213B (zh) * | 2018-05-21 | 2020-08-11 | 態金材料科技股份有限公司 | 碳纖維芯材表面以合金膜層熔接成型製作複合材之方法及其製品。 |
| KR20220081216A (ko) * | 2020-12-08 | 2022-06-15 | 주식회사 글린트머티리얼즈 | 내열성 및 전도성을 갖는 반도체 웨이퍼 이송용 미끄럼 방지 패드 |
| JP2022102893A (ja) * | 2020-12-25 | 2022-07-07 | 京セラ株式会社 | 試料搬送部材 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1562569A (en) * | 1975-12-04 | 1980-03-12 | United Glass Ltd | Materials for handling hot glassware and other hot articles |
| AT384189B (de) * | 1983-10-10 | 1987-10-12 | Fischer Gmbh | Bauplatte |
| US4888247A (en) * | 1986-08-27 | 1989-12-19 | General Electric Company | Low-thermal-expansion, heat conducting laminates having layers of metal and reinforced polymer matrix composite |
| US4961994A (en) * | 1987-12-16 | 1990-10-09 | General Electric Company | Protective coated composite material |
| JPH01277665A (ja) * | 1988-04-30 | 1989-11-08 | Toyoda Gosei Co Ltd | エンジンヘッドカバー |
| JPH06144223A (ja) * | 1992-11-09 | 1994-05-24 | Railway Technical Res Inst | 鉄道車両用構造体 |
| JPH11354607A (ja) * | 1998-06-10 | 1999-12-24 | Mitsubishi Chemical Corp | 搬送装置用ハンド |
| JP4345188B2 (ja) * | 2000-03-28 | 2009-10-14 | 宇部興産株式会社 | フレキシブル金属箔積層体およびその製造方法 |
| EP1360067B1 (en) * | 2000-12-12 | 2007-02-21 | C-Core Technologies Inc. | Lightweight circuit board with conductive constraining cores |
-
2002
- 2002-12-02 CA CA 2493963 patent/CA2493963C/en not_active Expired - Fee Related
- 2002-12-02 EP EP20020797524 patent/EP1525088B1/en not_active Expired - Lifetime
- 2002-12-02 CN CNB028294033A patent/CN100415505C/zh not_active Expired - Fee Related
- 2002-12-02 ES ES02797524T patent/ES2361827T3/es not_active Expired - Lifetime
- 2002-12-02 DE DE60239361T patent/DE60239361D1/de not_active Expired - Lifetime
- 2002-12-02 AT AT02797524T patent/ATE500057T1/de active
- 2002-12-02 AU AU2002361894A patent/AU2002361894A1/en not_active Abandoned
- 2002-12-02 KR KR1020057001568A patent/KR100989012B1/ko not_active Expired - Fee Related
- 2002-12-02 US US10/519,029 patent/US7459215B2/en not_active Expired - Fee Related
- 2002-12-02 IL IL16593702A patent/IL165937A0/xx unknown
- 2002-12-02 JP JP2004524463A patent/JP4474601B2/ja not_active Expired - Fee Related
- 2002-12-02 TW TW91134930A patent/TW200401704A/zh unknown
- 2002-12-02 WO PCT/US2002/041652 patent/WO2004011248A1/en not_active Ceased
-
2008
- 2008-10-28 US US12/259,816 patent/US7871705B2/en not_active Expired - Fee Related