JP2009538761A5 - - Google Patents

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Publication number
JP2009538761A5
JP2009538761A5 JP2009513363A JP2009513363A JP2009538761A5 JP 2009538761 A5 JP2009538761 A5 JP 2009538761A5 JP 2009513363 A JP2009513363 A JP 2009513363A JP 2009513363 A JP2009513363 A JP 2009513363A JP 2009538761 A5 JP2009538761 A5 JP 2009538761A5
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JP
Japan
Prior art keywords
layer
dyads
absorbent
essentially
substrate film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2009513363A
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English (en)
Japanese (ja)
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JP4897880B2 (ja
JP2009538761A (ja
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Publication date
Priority claimed from US11/420,894 external-priority patent/US7223515B1/en
Application filed filed Critical
Publication of JP2009538761A publication Critical patent/JP2009538761A/ja
Publication of JP2009538761A5 publication Critical patent/JP2009538761A5/ja
Application granted granted Critical
Publication of JP4897880B2 publication Critical patent/JP4897880B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2009513363A 2006-05-30 2007-05-09 熱物質転写基材フィルム、ドナー要素、並びにそれを作製及び使用する方法 Active JP4897880B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/420,894 2006-05-30
US11/420,894 US7223515B1 (en) 2006-05-30 2006-05-30 Thermal mass transfer substrate films, donor elements, and methods of making and using same
PCT/US2007/068526 WO2007143322A1 (en) 2006-05-30 2007-05-09 Thermal mass transfer substrate films, donor elements, and methods of making and using same

Publications (3)

Publication Number Publication Date
JP2009538761A JP2009538761A (ja) 2009-11-12
JP2009538761A5 true JP2009538761A5 (enExample) 2010-07-01
JP4897880B2 JP4897880B2 (ja) 2012-03-14

Family

ID=38056735

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009513363A Active JP4897880B2 (ja) 2006-05-30 2007-05-09 熱物質転写基材フィルム、ドナー要素、並びにそれを作製及び使用する方法

Country Status (6)

Country Link
US (2) US7223515B1 (enExample)
JP (1) JP4897880B2 (enExample)
KR (1) KR101320383B1 (enExample)
CN (1) CN101448640A (enExample)
TW (1) TW200806496A (enExample)
WO (1) WO2007143322A1 (enExample)

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US20090130427A1 (en) * 2007-10-22 2009-05-21 The Regents Of The University Of California Nanomaterial facilitated laser transfer
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US8848294B2 (en) 2010-05-20 2014-09-30 Qualcomm Mems Technologies, Inc. Method and structure capable of changing color saturation
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GB201104565D0 (en) 2011-03-17 2011-05-04 Dupont Teijin Films Us Ltd Polyester films
US20130328098A1 (en) * 2012-05-15 2013-12-12 High Power Opto. Inc. Buffer layer structure for light-emitting diode
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JP6497128B2 (ja) * 2015-02-26 2019-04-10 住友金属鉱山株式会社 ドナーシート
ES2928562T3 (es) * 2016-01-12 2022-11-21 Georgia Pacific Mt Holly Llc Sustrato de limpieza no tejido
GB201710213D0 (en) 2017-06-27 2017-08-09 Dupont Teijin Films U S Ltd Partnership Functional film and production method
CN110148678A (zh) * 2019-04-29 2019-08-20 深圳市华星光电半导体显示技术有限公司 辅助电极转移结构及显示面板的制作方法
CN110794595A (zh) * 2019-11-28 2020-02-14 华中科技大学 一种球形颗粒填充液晶的近场辐射热调整器
IL297544A (en) * 2021-10-22 2023-05-01 Wuhan Dr Laser Tech Corp Ltd Sheets and methods for transferring a pattern with a release layer and/or paste mixtures

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US7223515B1 (en) * 2006-05-30 2007-05-29 3M Innovative Properties Company Thermal mass transfer substrate films, donor elements, and methods of making and using same

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