KR100989012B1 - 반사 표면을 갖는 탄소섬유 복합물 전달 부재 - Google Patents

반사 표면을 갖는 탄소섬유 복합물 전달 부재 Download PDF

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KR100989012B1
KR100989012B1 KR1020057001568A KR20057001568A KR100989012B1 KR 100989012 B1 KR100989012 B1 KR 100989012B1 KR 1020057001568 A KR1020057001568 A KR 1020057001568A KR 20057001568 A KR20057001568 A KR 20057001568A KR 100989012 B1 KR100989012 B1 KR 100989012B1
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South Korea
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carbon fiber
metal film
fiber reinforced
reflective surface
transfer member
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Expired - Fee Related
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KR1020057001568A
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English (en)
Korean (ko)
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KR20050059048A (ko
Inventor
크리스 엘. 밀러
다이스께 우찌다
다까시 고바야시
겐이찌 아오야기
신이찌 다께무라
Original Assignee
신닛뽄 세끼유 가부시끼가이샤
이 아이 듀폰 디 네모아 앤드 캄파니
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Publication of KR20050059048A publication Critical patent/KR20050059048A/ko
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Publication of KR100989012B1 publication Critical patent/KR100989012B1/ko
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
    • B25J19/0075—Means for protecting the manipulator from its environment or vice versa
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/0009—Constructional details, e.g. manipulator supports, bases
    • B25J9/0012—Constructional details, e.g. manipulator supports, bases making use of synthetic construction materials, e.g. plastics, composites
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    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
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    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
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    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
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    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
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    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T428/31511—Of epoxy ether
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T74/20207—Multiple controlling elements for single controlled element
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  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Laminated Bodies (AREA)
  • Inorganic Fibers (AREA)
  • Carbon And Carbon Compounds (AREA)
  • Chemical Or Physical Treatment Of Fibers (AREA)
KR1020057001568A 2002-07-29 2002-12-02 반사 표면을 갖는 탄소섬유 복합물 전달 부재 Expired - Fee Related KR100989012B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US39933702P 2002-07-29 2002-07-29
US60/399,337 2002-07-29

Publications (2)

Publication Number Publication Date
KR20050059048A KR20050059048A (ko) 2005-06-17
KR100989012B1 true KR100989012B1 (ko) 2010-10-20

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KR1020057001568A Expired - Fee Related KR100989012B1 (ko) 2002-07-29 2002-12-02 반사 표면을 갖는 탄소섬유 복합물 전달 부재

Country Status (13)

Country Link
US (2) US7459215B2 (enExample)
EP (1) EP1525088B1 (enExample)
JP (1) JP4474601B2 (enExample)
KR (1) KR100989012B1 (enExample)
CN (1) CN100415505C (enExample)
AT (1) ATE500057T1 (enExample)
AU (1) AU2002361894A1 (enExample)
CA (1) CA2493963C (enExample)
DE (1) DE60239361D1 (enExample)
ES (1) ES2361827T3 (enExample)
IL (1) IL165937A0 (enExample)
TW (1) TW200401704A (enExample)
WO (1) WO2004011248A1 (enExample)

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JP5169696B2 (ja) * 2008-09-30 2013-03-27 Ｎｏｋ株式会社 密封装置および密封構造
JP2011171591A (ja) * 2010-02-19 2011-09-01 Disco Corp ウエーハの搬出入装置
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KR20120050835A (ko) * 2010-11-11 2012-05-21 삼성전기주식회사 금속박 적층판 및 그 제조방법, 방열기판
JP5597566B2 (ja) * 2011-02-10 2014-10-01 パナソニック株式会社 筐体、および電子機器
KR102008540B1 (ko) * 2011-07-28 2019-08-07 미쯔비시 케미컬 주식회사 탄소 섬유 강화 탄소 복합체 및 그의 제조 방법
JP5447470B2 (ja) * 2011-09-22 2014-03-19 株式会社安川電機 ハンドおよびロボット
WO2013050805A1 (de) * 2011-10-06 2013-04-11 Roth & Rau Ag Substratwendeeinrichtung
CN102582146B (zh) * 2011-12-31 2015-03-11 杭州超探新材料科技有限公司 以镁合金为基体的复合材料及其制造方法
CN105392843A (zh) * 2013-03-11 2016-03-09 艾欧尼克斯先进材料股份有限公司 用于制备热塑性复合材料的组合物和方法
US9884426B2 (en) 2013-06-27 2018-02-06 De-Sta-Co Europe Gmbh Boom utilized in a geometric end effector system
CN104512075B (zh) 2013-10-04 2017-06-23 财团法人工业技术研究院 离型层、基板结构、与柔性电子元件工艺
US20150290815A1 (en) * 2014-04-11 2015-10-15 Varian Semiconductor Equipment Associates, Inc. Planar end effector and method of making a planar end effector
KR101683511B1 (ko) * 2015-03-16 2016-12-07 현대자동차 주식회사 자동차용 범퍼 백 빔
WO2017025945A1 (en) * 2015-08-10 2017-02-16 Ozat 2000 (1999) Ltd. Tools made of composite material structures instead of steel and methods thereof
US20180284845A1 (en) * 2015-09-18 2018-10-04 Toray Industries, Inc. Housing
NL2018244B1 (en) * 2017-01-27 2018-08-07 Suss Microtec Lithography Gmbh Endeffektor
US10109517B1 (en) * 2018-01-10 2018-10-23 Lam Research Corporation Rotational indexer with additional rotational axes
TWI701213B (zh) * 2018-05-21 2020-08-11 態金材料科技股份有限公司 碳纖維芯材表面以合金膜層熔接成型製作複合材之方法及其製品。
KR20220081216A (ko) * 2020-12-08 2022-06-15 주식회사 글린트머티리얼즈 내열성 및 전도성을 갖는 반도체 웨이퍼 이송용 미끄럼 방지 패드
JP2022102893A (ja) * 2020-12-25 2022-07-07 京セラ株式会社 試料搬送部材

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US20090061242A1 (en) 2009-03-05
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JP4474601B2 (ja) 2010-06-09
EP1525088B1 (en) 2011-03-02
AU2002361894A1 (en) 2004-02-16
AU2002361894A8 (en) 2004-02-16
ATE500057T1 (de) 2011-03-15
US20060153669A1 (en) 2006-07-13
KR20050059048A (ko) 2005-06-17
US7871705B2 (en) 2011-01-18
ES2361827T3 (es) 2011-06-22
DE60239361D1 (de) 2011-04-14
JP2005534587A (ja) 2005-11-17
EP1525088A1 (en) 2005-04-27
TW200401704A (en) 2004-02-01
CN100415505C (zh) 2008-09-03
CA2493963A1 (en) 2004-02-05
US7459215B2 (en) 2008-12-02
IL165937A0 (en) 2006-01-15

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