JP2005530886A5 - - Google Patents
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- Publication number
- JP2005530886A5 JP2005530886A5 JP2004515393A JP2004515393A JP2005530886A5 JP 2005530886 A5 JP2005530886 A5 JP 2005530886A5 JP 2004515393 A JP2004515393 A JP 2004515393A JP 2004515393 A JP2004515393 A JP 2004515393A JP 2005530886 A5 JP2005530886 A5 JP 2005530886A5
- Authority
- JP
- Japan
- Prior art keywords
- present
- hydrogen
- carbon atoms
- carboxyl
- hydroxyl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052739 hydrogen Inorganic materials 0.000 claims description 8
- 239000001257 hydrogen Substances 0.000 claims description 8
- 125000000217 alkyl group Chemical group 0.000 claims description 6
- 125000004432 carbon atom Chemical group C* 0.000 claims description 6
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 6
- 229910052736 halogen Inorganic materials 0.000 claims description 6
- 150000002367 halogens Chemical class 0.000 claims description 6
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 6
- -1 if any is present Chemical group 0.000 claims description 4
- 239000012952 cationic photoinitiator Substances 0.000 claims description 2
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims 3
- 150000002431 hydrogen Chemical class 0.000 description 4
- LWNGJAHMBMVCJR-UHFFFAOYSA-N (2,3,4,5,6-pentafluorophenoxy)boronic acid Chemical compound OB(O)OC1=C(F)C(F)=C(F)C(F)=C1F LWNGJAHMBMVCJR-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- BOXSCYUXSBYGRD-UHFFFAOYSA-N cyclopenta-1,3-diene;iron(3+) Chemical group [Fe+3].C=1C=C[CH-]C=1.C=1C=C[CH-]C=1 BOXSCYUXSBYGRD-UHFFFAOYSA-N 0.000 description 1
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/176,648 US6918984B2 (en) | 2002-06-24 | 2002-06-24 | Photocurable adhesive compositions, reaction products of which have low halide ion content |
| PCT/IE2003/000096 WO2004000965A1 (en) | 2002-06-24 | 2003-06-24 | Photocurable adhesive compositions, reaction products of which have low halide ion content |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005530886A JP2005530886A (ja) | 2005-10-13 |
| JP2005530886A5 true JP2005530886A5 (https=) | 2006-01-05 |
Family
ID=29999068
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004515393A Pending JP2005530886A (ja) | 2002-06-24 | 2003-06-24 | 光硬化性接着剤組成物、低いハロゲン化物イオン含量を有するその反応生成物 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US6918984B2 (https=) |
| EP (1) | EP1516030A1 (https=) |
| JP (1) | JP2005530886A (https=) |
| CN (1) | CN100408647C (https=) |
| AU (1) | AU2003253228A1 (https=) |
| WO (1) | WO2004000965A1 (https=) |
Families Citing this family (58)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6674158B2 (en) * | 1998-09-03 | 2004-01-06 | Micron Technology, Inc. | Semiconductor die package having a UV cured polymeric die coating |
| SE528250C2 (sv) * | 2004-02-27 | 2006-10-03 | Calignum Technologies Ab | Komposition innefattande en initiator och ett förfarande för att behandla trä med kompositionen |
| JP2005281611A (ja) * | 2004-03-30 | 2005-10-13 | Toho Tenax Co Ltd | エポキシ樹脂組成物を用いたプリプレグ |
| JP2005281606A (ja) * | 2004-03-30 | 2005-10-13 | Toho Tenax Co Ltd | 放射線硬化用エポキシ樹脂組成物 |
| EP1619726A1 (fr) * | 2004-07-22 | 2006-01-25 | St Microelectronics S.A. | Boîtier optique pour capteur semiconducteur |
| WO2007017341A1 (de) * | 2005-08-11 | 2007-02-15 | Siemens Aktiengesellschaft | Fluxing encapsulants - giessharze für dca-anwendungen auf basis kationisch härtbarer epoxidharze |
| US7915527B1 (en) | 2006-08-23 | 2011-03-29 | Rockwell Collins, Inc. | Hermetic seal and hermetic connector reinforcement and repair with low temperature glass coatings |
| US8637980B1 (en) | 2007-12-18 | 2014-01-28 | Rockwell Collins, Inc. | Adhesive applications using alkali silicate glass for electronics |
| US8084855B2 (en) * | 2006-08-23 | 2011-12-27 | Rockwell Collins, Inc. | Integrated circuit tampering protection and reverse engineering prevention coatings and methods |
| US8166645B2 (en) | 2006-08-23 | 2012-05-01 | Rockwell Collins, Inc. | Method for providing near-hermetically coated, thermally protected integrated circuit assemblies |
| US8174830B2 (en) * | 2008-05-06 | 2012-05-08 | Rockwell Collins, Inc. | System and method for a substrate with internal pumped liquid metal for thermal spreading and cooling |
| US8076185B1 (en) | 2006-08-23 | 2011-12-13 | Rockwell Collins, Inc. | Integrated circuit protection and ruggedization coatings and methods |
| US8617913B2 (en) | 2006-08-23 | 2013-12-31 | Rockwell Collins, Inc. | Alkali silicate glass based coating and method for applying |
| US8581108B1 (en) | 2006-08-23 | 2013-11-12 | Rockwell Collins, Inc. | Method for providing near-hermetically coated integrated circuit assemblies |
| US8363189B2 (en) * | 2007-12-18 | 2013-01-29 | Rockwell Collins, Inc. | Alkali silicate glass for displays |
| US8084553B2 (en) * | 2008-01-10 | 2011-12-27 | Trillion Science, Inc. | Curable adhesive compositions, process, and applications |
| US8616266B2 (en) * | 2008-09-12 | 2013-12-31 | Rockwell Collins, Inc. | Mechanically compliant thermal spreader with an embedded cooling loop for containing and circulating electrically-conductive liquid |
| US8017872B2 (en) * | 2008-05-06 | 2011-09-13 | Rockwell Collins, Inc. | System and method for proportional cooling with liquid metal |
| US8650886B2 (en) * | 2008-09-12 | 2014-02-18 | Rockwell Collins, Inc. | Thermal spreader assembly with flexible liquid cooling loop having rigid tubing sections and flexible tubing sections |
| US8221089B2 (en) * | 2008-09-12 | 2012-07-17 | Rockwell Collins, Inc. | Thin, solid-state mechanism for pumping electrically conductive liquids in a flexible thermal spreader |
| US8205337B2 (en) * | 2008-09-12 | 2012-06-26 | Rockwell Collins, Inc. | Fabrication process for a flexible, thin thermal spreader |
| US8309633B2 (en) * | 2008-07-17 | 2012-11-13 | Henkel Ireland Ltd. | Low temperature, cationically curable compositions with improved cure speed and toughness |
| US8119040B2 (en) | 2008-09-29 | 2012-02-21 | Rockwell Collins, Inc. | Glass thick film embedded passive material |
| US9093448B2 (en) | 2008-11-25 | 2015-07-28 | Lord Corporation | Methods for protecting a die surface with photocurable materials |
| EP2359395B1 (en) * | 2008-11-25 | 2013-08-14 | Lord Corporation | Methods for protecting a die surface with photocurable materials |
| JP5444702B2 (ja) * | 2008-12-05 | 2014-03-19 | デクセリアルズ株式会社 | 新規なスルホニウムボレート錯体 |
| CN102842565A (zh) * | 2011-06-21 | 2012-12-26 | 上海长丰智能卡有限公司 | 一种带线圈的智能卡模块及其实现方式 |
| CN102842566A (zh) * | 2011-06-21 | 2012-12-26 | 上海长丰智能卡有限公司 | 一种带线圈的智能卡载带 |
| CN102311681A (zh) * | 2011-08-25 | 2012-01-11 | 浙江科创新材料科技有限公司 | Uv固化型银纳米线墨水及其制备方法和使用方法 |
| US10177054B2 (en) | 2011-10-27 | 2019-01-08 | Global Circuit Innovations, Inc. | Method for remapping a packaged extracted die |
| US9966319B1 (en) | 2011-10-27 | 2018-05-08 | Global Circuit Innovations Incorporated | Environmental hardening integrated circuit method and apparatus |
| US9935028B2 (en) | 2013-03-05 | 2018-04-03 | Global Circuit Innovations Incorporated | Method and apparatus for printing integrated circuit bond connections |
| US10002846B2 (en) | 2011-10-27 | 2018-06-19 | Global Circuit Innovations Incorporated | Method for remapping a packaged extracted die with 3D printed bond connections |
| US10128161B2 (en) | 2011-10-27 | 2018-11-13 | Global Circuit Innovations, Inc. | 3D printed hermetic package assembly and method |
| US9870968B2 (en) | 2011-10-27 | 2018-01-16 | Global Circuit Innovations Incorporated | Repackaged integrated circuit and assembly method |
| US10147660B2 (en) | 2011-10-27 | 2018-12-04 | Global Circuits Innovations, Inc. | Remapped packaged extracted die with 3D printed bond connections |
| US10109606B2 (en) | 2011-10-27 | 2018-10-23 | Global Circuit Innovations, Inc. | Remapped packaged extracted die |
| KR101355855B1 (ko) * | 2011-12-19 | 2014-01-29 | 제일모직주식회사 | 이방성 도전 필름 |
| US9594999B2 (en) | 2012-04-03 | 2017-03-14 | X-Card Holdings, Llc | Information carrying card comprising crosslinked polymer composition, and method of making the same |
| US9122968B2 (en) | 2012-04-03 | 2015-09-01 | X-Card Holdings, Llc | Information carrying card comprising a cross-linked polymer composition, and method of making the same |
| US9435915B1 (en) | 2012-09-28 | 2016-09-06 | Rockwell Collins, Inc. | Antiglare treatment for glass |
| KR102090456B1 (ko) * | 2012-11-30 | 2020-03-18 | 엘지디스플레이 주식회사 | 비 전도성 타입 접착수단과 이를 구비한 표시장치 |
| CN105190651B (zh) | 2013-03-15 | 2019-06-04 | X卡控股有限公司 | 用于制作信息携带卡的芯层的方法以及结果产品 |
| CN106165074B (zh) * | 2014-03-19 | 2020-05-12 | 三星电子株式会社 | 制造半导体装置的方法 |
| CN104922725A (zh) * | 2015-06-08 | 2015-09-23 | 苏州乔纳森新材料科技有限公司 | 一种光固化粘合剂及其制备方法 |
| CN105489562A (zh) * | 2015-10-18 | 2016-04-13 | 魏赛琦 | 一种智能卡卡芯及其制备方法 |
| US11104802B2 (en) | 2016-09-26 | 2021-08-31 | University Of Washington | PDMS resin for stereolithographic 3D-printing of PDMS |
| WO2018095856A1 (de) | 2016-11-22 | 2018-05-31 | Basf Se | Verfahren zur herstellung von 1,3-butadien aus n-butenen durch oxidative dehydrierung umfassend eine methacrolein-abtrennung bei der aufarbeitung |
| TWI651362B (zh) * | 2017-03-29 | 2019-02-21 | Taiflex Scientific Co., Ltd. | 感光性絕緣組成物 |
| CN108018011B (zh) * | 2017-12-05 | 2021-03-30 | 烟台德邦科技股份有限公司 | 一种适用于非透光材质粘接的紫外光固化胶黏剂 |
| US10115645B1 (en) | 2018-01-09 | 2018-10-30 | Global Circuit Innovations, Inc. | Repackaged reconditioned die method and assembly |
| US11361204B2 (en) | 2018-03-07 | 2022-06-14 | X-Card Holdings, Llc | Metal card |
| CN108913072A (zh) * | 2018-05-10 | 2018-11-30 | 昆山西微美晶电子新材料科技有限公司 | 用于智能卡芯片保护包封胶及其制备方法 |
| EP3747925A1 (en) | 2019-06-07 | 2020-12-09 | Henkel AG & Co. KGaA | Radiation-curable composition by anionic polymerization |
| US11508680B2 (en) | 2020-11-13 | 2022-11-22 | Global Circuit Innovations Inc. | Solder ball application for singular die |
| US12394536B2 (en) | 2022-10-07 | 2025-08-19 | Ekc Technology, Inc. | Silver nanowire and noble-metal coated silver nanowire conductive polymer composites with low loading percolation conduction |
| US12528279B2 (en) | 2022-10-20 | 2026-01-20 | X-Card Holdings, Llc | Core layer for information carrying card, resulting information carrying card, and methods of making the same |
| US12220897B2 (en) | 2022-10-20 | 2025-02-11 | X-Card Holdings, Llc | Core layer for information carrying card, resulting information carrying card, and methods of making the same |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3806738C1 (https=) | 1988-03-02 | 1989-09-07 | Espe Stiftung & Co Produktions- Und Vertriebs Kg, 8031 Seefeld, De | |
| JPH0491118A (ja) * | 1990-08-06 | 1992-03-24 | Yokohama Rubber Co Ltd:The | 光硬化性樹脂組成物 |
| FR2688783A1 (fr) | 1992-03-23 | 1993-09-24 | Rhone Poulenc Chimie | Nouveaux borates d'onium ou de complexe organometallique amorceurs cationiques de polymerisation. |
| US6147184A (en) | 1992-03-23 | 2000-11-14 | Rhone-Poulenc Chimie | Onium borates/borates of organometallic complexes and cationic initiation of polymerization therewith |
| US5721289A (en) * | 1994-11-04 | 1998-02-24 | Minnesota Mining And Manufacturing Company | Stable, low cure-temperature semi-structural pressure sensitive adhesive |
| SG48462A1 (en) * | 1995-10-26 | 1998-04-17 | Ibm | Lead protective coating composition process and structure thereof |
| US5863970A (en) | 1995-12-06 | 1999-01-26 | Polyset Company, Inc. | Epoxy resin composition with cycloaliphatic epoxy-functional siloxane |
| US5777903A (en) | 1996-01-22 | 1998-07-07 | Motorola, Inc. | Solar cell powered smart card with integrated display and interface keypad |
| US5721451A (en) | 1996-12-02 | 1998-02-24 | Motorola, Inc. | Integrated circuit assembly adhesive and method thereof |
| FR2761368B1 (fr) | 1997-03-25 | 2005-10-21 | Rhodia Chimie Sa | Composition (e. g. encre ou vernis) polymerisable et/ou reticulable sous irradiation par voie cationique et/ou radicalaire, a base d'une matrice organique, d'un diluant silicone et d'un photo-amorceur |
| SG91249A1 (en) * | 1999-01-14 | 2002-09-17 | Lintec Corp | Process for producing non-contact data carrier |
| JP2002062649A (ja) * | 2000-08-21 | 2002-02-28 | Ngk Spark Plug Co Ltd | プリント配線基板用感光性樹脂組成物、プリント配線基板 |
| JP2002097443A (ja) * | 2000-09-21 | 2002-04-02 | Hitachi Chem Co Ltd | 接着剤組成物及びこれを用いた回路接続材料並びに接続体 |
-
2002
- 2002-06-24 US US10/176,648 patent/US6918984B2/en not_active Expired - Fee Related
-
2003
- 2003-06-24 JP JP2004515393A patent/JP2005530886A/ja active Pending
- 2003-06-24 WO PCT/IE2003/000096 patent/WO2004000965A1/en not_active Ceased
- 2003-06-24 EP EP03760851A patent/EP1516030A1/en not_active Withdrawn
- 2003-06-24 CN CNB038171414A patent/CN100408647C/zh not_active Expired - Fee Related
- 2003-06-24 AU AU2003253228A patent/AU2003253228A1/en not_active Abandoned
-
2004
- 2004-11-08 US US10/982,840 patent/US20050133152A1/en not_active Abandoned
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