JP2005530886A5 - - Google Patents

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Publication number
JP2005530886A5
JP2005530886A5 JP2004515393A JP2004515393A JP2005530886A5 JP 2005530886 A5 JP2005530886 A5 JP 2005530886A5 JP 2004515393 A JP2004515393 A JP 2004515393A JP 2004515393 A JP2004515393 A JP 2004515393A JP 2005530886 A5 JP2005530886 A5 JP 2005530886A5
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JP
Japan
Prior art keywords
present
hydrogen
carbon atoms
carboxyl
hydroxyl
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004515393A
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English (en)
Japanese (ja)
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JP2005530886A (ja
Filing date
Publication date
Priority claimed from US10/176,648 external-priority patent/US6918984B2/en
Application filed filed Critical
Publication of JP2005530886A publication Critical patent/JP2005530886A/ja
Publication of JP2005530886A5 publication Critical patent/JP2005530886A5/ja
Pending legal-status Critical Current

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JP2004515393A 2002-06-24 2003-06-24 光硬化性接着剤組成物、低いハロゲン化物イオン含量を有するその反応生成物 Pending JP2005530886A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/176,648 US6918984B2 (en) 2002-06-24 2002-06-24 Photocurable adhesive compositions, reaction products of which have low halide ion content
PCT/IE2003/000096 WO2004000965A1 (en) 2002-06-24 2003-06-24 Photocurable adhesive compositions, reaction products of which have low halide ion content

Publications (2)

Publication Number Publication Date
JP2005530886A JP2005530886A (ja) 2005-10-13
JP2005530886A5 true JP2005530886A5 (https=) 2006-01-05

Family

ID=29999068

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004515393A Pending JP2005530886A (ja) 2002-06-24 2003-06-24 光硬化性接着剤組成物、低いハロゲン化物イオン含量を有するその反応生成物

Country Status (6)

Country Link
US (2) US6918984B2 (https=)
EP (1) EP1516030A1 (https=)
JP (1) JP2005530886A (https=)
CN (1) CN100408647C (https=)
AU (1) AU2003253228A1 (https=)
WO (1) WO2004000965A1 (https=)

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US8076185B1 (en) 2006-08-23 2011-12-13 Rockwell Collins, Inc. Integrated circuit protection and ruggedization coatings and methods
US8637980B1 (en) 2007-12-18 2014-01-28 Rockwell Collins, Inc. Adhesive applications using alkali silicate glass for electronics
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US8616266B2 (en) * 2008-09-12 2013-12-31 Rockwell Collins, Inc. Mechanically compliant thermal spreader with an embedded cooling loop for containing and circulating electrically-conductive liquid
US8309633B2 (en) * 2008-07-17 2012-11-13 Henkel Ireland Ltd. Low temperature, cationically curable compositions with improved cure speed and toughness
US8119040B2 (en) 2008-09-29 2012-02-21 Rockwell Collins, Inc. Glass thick film embedded passive material
US9093448B2 (en) 2008-11-25 2015-07-28 Lord Corporation Methods for protecting a die surface with photocurable materials
CN102224583B (zh) * 2008-11-25 2014-09-10 洛德公司 使用光固化性材料保护晶片表面的方法
JP5444702B2 (ja) * 2008-12-05 2014-03-19 デクセリアルズ株式会社 新規なスルホニウムボレート錯体
CN102842565A (zh) * 2011-06-21 2012-12-26 上海长丰智能卡有限公司 一种带线圈的智能卡模块及其实现方式
CN102842566A (zh) * 2011-06-21 2012-12-26 上海长丰智能卡有限公司 一种带线圈的智能卡载带
CN102311681A (zh) * 2011-08-25 2012-01-11 浙江科创新材料科技有限公司 Uv固化型银纳米线墨水及其制备方法和使用方法
US10109606B2 (en) 2011-10-27 2018-10-23 Global Circuit Innovations, Inc. Remapped packaged extracted die
US10147660B2 (en) 2011-10-27 2018-12-04 Global Circuits Innovations, Inc. Remapped packaged extracted die with 3D printed bond connections
US9870968B2 (en) 2011-10-27 2018-01-16 Global Circuit Innovations Incorporated Repackaged integrated circuit and assembly method
US9966319B1 (en) 2011-10-27 2018-05-08 Global Circuit Innovations Incorporated Environmental hardening integrated circuit method and apparatus
US10177054B2 (en) 2011-10-27 2019-01-08 Global Circuit Innovations, Inc. Method for remapping a packaged extracted die
US10002846B2 (en) 2011-10-27 2018-06-19 Global Circuit Innovations Incorporated Method for remapping a packaged extracted die with 3D printed bond connections
US9935028B2 (en) 2013-03-05 2018-04-03 Global Circuit Innovations Incorporated Method and apparatus for printing integrated circuit bond connections
US10128161B2 (en) 2011-10-27 2018-11-13 Global Circuit Innovations, Inc. 3D printed hermetic package assembly and method
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CN104922725A (zh) * 2015-06-08 2015-09-23 苏州乔纳森新材料科技有限公司 一种光固化粘合剂及其制备方法
CN105489562A (zh) * 2015-10-18 2016-04-13 魏赛琦 一种智能卡卡芯及其制备方法
US11104802B2 (en) 2016-09-26 2021-08-31 University Of Washington PDMS resin for stereolithographic 3D-printing of PDMS
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CN108018011B (zh) * 2017-12-05 2021-03-30 烟台德邦科技股份有限公司 一种适用于非透光材质粘接的紫外光固化胶黏剂
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JP2002097443A (ja) * 2000-09-21 2002-04-02 Hitachi Chem Co Ltd 接着剤組成物及びこれを用いた回路接続材料並びに接続体

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