JP2005526379A5 - - Google Patents

Download PDF

Info

Publication number
JP2005526379A5
JP2005526379A5 JP2003544761A JP2003544761A JP2005526379A5 JP 2005526379 A5 JP2005526379 A5 JP 2005526379A5 JP 2003544761 A JP2003544761 A JP 2003544761A JP 2003544761 A JP2003544761 A JP 2003544761A JP 2005526379 A5 JP2005526379 A5 JP 2005526379A5
Authority
JP
Japan
Prior art keywords
trench
width
ferromagnetic cladding
metal layer
cladding region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003544761A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005526379A (ja
Filing date
Publication date
Priority claimed from US10/010,574 external-priority patent/US6559511B1/en
Application filed filed Critical
Publication of JP2005526379A publication Critical patent/JP2005526379A/ja
Publication of JP2005526379A5 publication Critical patent/JP2005526379A5/ja
Pending legal-status Critical Current

Links

JP2003544761A 2001-11-13 2002-10-30 Mramデバイスのクラッド磁界強化 Pending JP2005526379A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US1057401P 2001-11-13 2001-11-13
US10/010,574 US6559511B1 (en) 2001-11-13 2001-11-13 Narrow gap cladding field enhancement for low power programming of a MRAM device
PCT/US2002/034954 WO2003043019A1 (en) 2001-11-13 2002-10-30 Cladding field enhancement of an mram device

Publications (2)

Publication Number Publication Date
JP2005526379A JP2005526379A (ja) 2005-09-02
JP2005526379A5 true JP2005526379A5 (enExample) 2010-11-25

Family

ID=39865441

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003544761A Pending JP2005526379A (ja) 2001-11-13 2002-10-30 Mramデバイスのクラッド磁界強化

Country Status (3)

Country Link
US (1) US6559511B1 (enExample)
JP (1) JP2005526379A (enExample)
WO (1) WO2003043019A1 (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030075778A1 (en) * 1997-10-01 2003-04-24 Patrick Klersy Programmable resistance memory element and method for making same
US6661688B2 (en) * 2001-12-05 2003-12-09 Hewlett-Packard Development Company, L.P. Method and article for concentrating fields at sense layers
US6927072B2 (en) * 2002-03-08 2005-08-09 Freescale Semiconductor, Inc. Method of applying cladding material on conductive lines of MRAM devices
JP3906145B2 (ja) * 2002-11-22 2007-04-18 株式会社東芝 磁気ランダムアクセスメモリ
US7056749B2 (en) * 2003-03-03 2006-06-06 Hewlett-Packard Development Company, L.P. Simplified magnetic memory cell
US6925000B2 (en) 2003-12-12 2005-08-02 Maglabs, Inc. Method and apparatus for a high density magnetic random access memory (MRAM) with stackable architecture
US7033881B2 (en) * 2004-06-15 2006-04-25 International Business Machines Corporation Method for fabricating magnetic field concentrators as liners around conductive wires in microelectronic devices
US7061037B2 (en) * 2004-07-06 2006-06-13 Maglabs, Inc. Magnetic random access memory with multiple memory layers and improved memory cell selectivity
KR100558012B1 (ko) * 2004-07-16 2006-03-06 삼성전자주식회사 반도체 메모리 소자
US7075818B2 (en) * 2004-08-23 2006-07-11 Maglabs, Inc. Magnetic random access memory with stacked memory layers having access lines for writing and reading
JP2006173472A (ja) * 2004-12-17 2006-06-29 Toshiba Corp 磁気記憶装置およびその製造方法
US7835116B2 (en) * 2005-09-09 2010-11-16 Seagate Technology Llc Magnetoresistive stack with enhanced pinned layer
JP5076373B2 (ja) * 2006-06-27 2012-11-21 Tdk株式会社 磁気記憶装置、磁気記憶方法
US7456029B2 (en) * 2006-06-28 2008-11-25 Magic Technologies, Inc. Planar flux concentrator for MRAM devices
JP5076387B2 (ja) * 2006-07-26 2012-11-21 Tdk株式会社 磁気記憶装置
US7442647B1 (en) * 2008-03-05 2008-10-28 International Business Machines Corporation Structure and method for formation of cladded interconnects for MRAMs
US9472749B2 (en) 2014-03-20 2016-10-18 International Business Machines Corporation Armature-clad MRAM device

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4822266B1 (enExample) * 1969-04-26 1973-07-04
JPS4965742A (enExample) * 1972-10-26 1974-06-26
JPS63224341A (ja) * 1987-03-13 1988-09-19 Nec Corp 半導体装置の配線構造
US5075247A (en) * 1990-01-18 1991-12-24 Microunity Systems Engineering, Inc. Method of making hall effect semiconductor memory cell
US5659499A (en) * 1995-11-24 1997-08-19 Motorola Magnetic memory and method therefor
US5926414A (en) * 1997-04-04 1999-07-20 Magnetic Semiconductors High-efficiency miniature magnetic integrated circuit structures
JPH11220023A (ja) * 1998-02-02 1999-08-10 Sharp Corp 半導体装置及びその製造方法
DE19836567C2 (de) * 1998-08-12 2000-12-07 Siemens Ag Speicherzellenanordnung mit Speicherelementen mit magnetoresistivem Effekt und Verfahren zu deren Herstellung
US6351409B1 (en) * 2001-01-04 2002-02-26 Motorola, Inc. MRAM write apparatus and method
WO2002058167A1 (en) * 2001-01-19 2002-07-25 Matsushita Electric Industrial Co., Ltd. Spin switch and magnaetic storage elemet using it
JP2002289807A (ja) * 2001-03-27 2002-10-04 Toshiba Corp 磁気メモリ装置および磁気抵抗効果素子
US6430085B1 (en) * 2001-08-27 2002-08-06 Motorola, Inc. Magnetic random access memory having digit lines and bit lines with shape and induced anisotropy ferromagnetic cladding layer and method of manufacture

Similar Documents

Publication Publication Date Title
JP2005526379A5 (enExample)
TWI282162B (en) Magnetic yoke structures in MRAM devices to reduce programming power consumption and a method to make the same
TW594755B (en) Magnetic memory and method of operation thereof
US9105670B2 (en) Magnetic tunnel junction structure
US7579197B1 (en) Method of forming a magnetic tunnel junction structure
US7582923B2 (en) Magnetic memory and manufacturing method for the same
WO2003077258A3 (en) Magnetic flux concentrating cladding material on conductive lines of mram
CN102272844A (zh) 自旋力矩转移磁性随机存取存储器单元结构
WO2001071777A3 (en) Method of fabricating flux concentrating layer for use with magnetoresistive random access memories
EP1398795A3 (en) Magnetic memory cell
ATE421757T1 (de) Magetspeicherzellenfeld mit wahlfreiem zugriff mit dünnen elektrisch leitfähigen lese- und schreibleitungen
KR970067116A (ko) 자기 저항 변환기 및 그 제조 방법
TWI277201B (en) Resistive memory elements with reduced roughness
US6559511B1 (en) Narrow gap cladding field enhancement for low power programming of a MRAM device
JP2002538614A5 (enExample)
EP1359589A3 (en) Conductor structure for a magnetic memory
TW200507241A (en) Method for manufacturing a magnetic memory device, and a magnetic memory device
JP2004266254A (ja) 磁気抵抗性ラム及びその製造方法
TW200624816A (en) Probe needle, method of manufacturing probe needle, and method of manufacturing three dimensional solid structure
TW200522199A (en) Dry etching process and method for manufacturing magnetic memory device
JPH01211311A (ja) 薄膜磁気ヘッドの製造方法
JP3089828B2 (ja) 強磁性磁気抵抗素子
WO2004114334A3 (en) Method of patterning a magnetic memory cell bottom electrode before magnetic stack deposition
KR100505166B1 (ko) 집적 회로 장치
TW200423252A (en) A method for fabricating a flux concentrating system for use in a magnetoelectronics device