JP2005521065A - 移動レンズマルチビームスキャナを備えた暗視野検出装置およびその方法 - Google Patents
移動レンズマルチビームスキャナを備えた暗視野検出装置およびその方法 Download PDFInfo
- Publication number
- JP2005521065A JP2005521065A JP2003580839A JP2003580839A JP2005521065A JP 2005521065 A JP2005521065 A JP 2005521065A JP 2003580839 A JP2003580839 A JP 2003580839A JP 2003580839 A JP2003580839 A JP 2003580839A JP 2005521065 A JP2005521065 A JP 2005521065A
- Authority
- JP
- Japan
- Prior art keywords
- dark field
- beams
- specimen
- scanning
- spot
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 30
- 238000001514 detection method Methods 0.000 title description 24
- 230000003287 optical effect Effects 0.000 claims abstract description 22
- 238000007689 inspection Methods 0.000 claims abstract description 14
- 238000003384 imaging method Methods 0.000 claims description 12
- 239000000835 fiber Substances 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 4
- 230000001902 propagating effect Effects 0.000 claims description 3
- 239000013307 optical fiber Substances 0.000 claims 2
- 230000000903 blocking effect Effects 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 abstract description 6
- 235000012431 wafers Nutrition 0.000 description 33
- 238000001444 catalytic combustion detection Methods 0.000 description 20
- 238000005286 illumination Methods 0.000 description 17
- 238000010586 diagram Methods 0.000 description 16
- 238000012545 processing Methods 0.000 description 8
- 238000012546 transfer Methods 0.000 description 7
- 230000007547 defect Effects 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 230000004044 response Effects 0.000 description 5
- 239000013078 crystal Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 239000005350 fused silica glass Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000010287 polarization Effects 0.000 description 3
- 238000000275 quality assurance Methods 0.000 description 3
- 230000003252 repetitive effect Effects 0.000 description 3
- 230000001934 delay Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 210000001747 pupil Anatomy 0.000 description 2
- 230000001360 synchronised effect Effects 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 101100509792 Oncorhynchus mykiss tck1 gene Proteins 0.000 description 1
- 239000006117 anti-reflective coating Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
- G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B21/00—Microscopes
- G02B21/0004—Microscopes specially adapted for specific applications
- G02B21/002—Scanning microscopes
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B21/00—Microscopes
- G02B21/06—Means for illuminating specimens
- G02B21/08—Condensers
- G02B21/12—Condensers affording bright-field illumination
- G02B21/125—Condensers affording bright-field illumination affording both dark- and bright-field illumination
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/29—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the position or the direction of light beams, i.e. deflection
- G02F1/33—Acousto-optical deflection devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
- G01N2021/8822—Dark field detection
- G01N2021/8825—Separate detection of dark field and bright field
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Pathology (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Nonlinear Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Length Measuring Devices By Optical Means (AREA)
Abstract
Description
Claims (31)
- 標本検査システムであって、
ビームを供給する光源を備え、
活性領域を有し、各々が焦点を有する複数の移動レンズを前記活性領域に同時に生成するようにRF入力信号に対して応答する移動レンズ音響光学デバイスを備え、前記移動レンズ音響光学デバイスが、生成された移動レンズの各々の焦点のそれぞれで、光ビームを受け、複数の走査スポットビームを生成するように動作し、前記複数のスポットビームが、前記標本の第1の表面を走査することによって、反射ビームおよび透過ビームの少なくとも1つの対応する複数のビームが生成され、反射ビームおよび透過ビームの少なくとも1つが、明視野および暗視野成分を備え、
暗視野成分を収集および検出するための暗視野光学系を備える、システム。 - 前記暗視野光学系が、標本の表面の暗視野像を検出するように動作可能である、請求項1に記載のシステム。
- 前記暗視野光学系が、被検査標本の第1の表面のギャップレス暗視野像を検出するように動作可能である、請求項2に記載のシステム。
- 前記暗視野光学系が、複数の収集ゾーンを画成する、請求項1に記載のシステム。
- 前記複数の収集ゾーンが、少なくとも1つの空間フィルタと、リキッドライトガイドまたはファイバである複数の物体によって画成される、請求項4に記載のシステム。
- 前記収集ゾーンが、部分的に重複する、請求項4に記載のシステム。
- 前記暗視野光学系が、少なくとも1つの暗視野ビームスプリッタを更に備える、請求項1に記載のシステム。
- 前記少なくとも1つの暗視野ビームスプリッタに、少なくとも1つの空間フィルタと、リキッドライトガイドまたは光ファイバである複数の物体が後続する、請求項7に記載のシステム。
- 前記暗視野光学系が、空間フィルタで、標本で形成された暗視野像を撮像する撮像レンズを備える、請求項1に記載のシステム。
- 前記RF入力信号の供給源を更に備え、前記信号が、チャープRFパルスを含み、各パルスが、前記活性領域において伝播レンズを生成するように動作する、請求項1に記載のシステム。
- 第1の複数のスポット走査ビームを受け、前記ビームの各々を第2の複数のスポット走査ビームに分割するように動作するビームスプリッタを更に備える、請求項1に記載のシステム。
- 前記光源が、UVレーザであり、前記UVレーザと前記移動レンズ音響光学デバイスとの間の光路に位置するビーム形成器を更に備える、請求項1に記載のシステム。
- 前記暗視野光学系が、PMT検出器を備える、請求項1に記載のシステム。
- 暗視野成分内に含まれる干渉ローブを阻止するための追加の光学系を更に備える、請求項1に記載のシステム。
- 明視野成分を検出するための明視野光学系を更に備える、請求項1に記載のシステム。
- 標本検査方法であって、
単一の光源から複数のスポットビームを供給するステップと、
標本の表面で前記複数のスポットビームを走査するステップであって、反射ビームおよび透過ビームの少なくとも1つの対応する複数のビームが生成され、反射ビームおよび透過ビームの少なくとも1つが、明視野および暗視野成分を備える、前記ステップと、
暗視野成分検出するステップと、
を含む、方法。 - 検出された暗視野成分から暗視野像を生成するステップを更に含む、請求項16に記載の方法。
- 検出された暗視野成分からギャップレスの暗視野像を生成するステップを更に含む、請求項17に記載の方法。
- 収集ステップが、複数の収集ゾーンで暗視野成分を収集することを含む、請求項16に記載の方法。
- 前記複数の収集ゾーンが、リキッドライトガイドまたは光ファイバである複数の物体と、少なくとも1つの空間フィルタによって画成される、請求項19に記載の方法。
- 前記収集ステップが、暗視野成分を分割することと、分割された暗視野成分を収集ゾーンに向けることとを含む、請求項20に記載の方法。
- 前記収集ゾーンが、部分的に重複する、請求項19に記載の方法。
- 前記走査ステップが、前記標本の異なるセクションで前記複数のビームのそれぞれを同時に走査することを含む、請求項16に記載の方法。
- 前記走査ステップが、一連のチャープRF信号を入力することを含み、各チャープRF信号が、前記複数のスポットビームのそれぞれの走査を制御する、請求項16に記載の方法。
- 第1の複数のスポット走査ビームにビームスプリッタを通過させ、第2の複数のスポット走査ビームを作り出すステップを更に含む、請求項16に記載の方法。
- 選択的移動レンズを与えるように前記RF信号を変化させるステップを更に含む、請求項16に記載の方法。
- 前記走査が、前記標本を移動させるステップを更に含む、請求項16に記載の方法。
- 暗視野成分内に含まれる干渉ローブを阻止するステップを更に含む、請求項16に記載の方法。
- 明視野成分を検出するステップを更に含む、請求項16に記載の方法。
- 明視野成分および暗視野成分を同時に検出するステップを更に含む、請求項16に記載の方法。
- 明視野成分を検出するための明視野光学系を更に備え、明視野成分および暗視野成分が同時に検出される、請求項1に記載のシステム。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/103,560 US6809808B2 (en) | 2002-03-22 | 2002-03-22 | Wafer defect detection system with traveling lens multi-beam scanner |
PCT/US2003/006706 WO2003083450A1 (en) | 2002-03-22 | 2003-03-14 | Dark field detection apparatus with traveling lens multi-beam scanner and a method thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005521065A true JP2005521065A (ja) | 2005-07-14 |
JP4439268B2 JP4439268B2 (ja) | 2010-03-24 |
Family
ID=28040422
Family Applications (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003580839A Expired - Fee Related JP4439268B2 (ja) | 2002-03-22 | 2003-03-14 | 移動レンズマルチビームスキャナを備えた暗視野検出装置およびその方法 |
JP2003580838A Expired - Fee Related JP4423046B2 (ja) | 2002-03-22 | 2003-03-14 | 移動レンズを備えた音響光学デバイスおよびその動作方法 |
JP2009240418A Expired - Fee Related JP5523788B2 (ja) | 2002-03-22 | 2009-10-19 | 移動レンズマルチビームスキャナを備えたウェハ欠陥検出システム |
JP2009240412A Expired - Fee Related JP5523787B2 (ja) | 2002-03-22 | 2009-10-19 | 移動レンズマルチビームスキャナを備えたウェハ欠陥検出システム |
Family Applications After (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003580838A Expired - Fee Related JP4423046B2 (ja) | 2002-03-22 | 2003-03-14 | 移動レンズを備えた音響光学デバイスおよびその動作方法 |
JP2009240418A Expired - Fee Related JP5523788B2 (ja) | 2002-03-22 | 2009-10-19 | 移動レンズマルチビームスキャナを備えたウェハ欠陥検出システム |
JP2009240412A Expired - Fee Related JP5523787B2 (ja) | 2002-03-22 | 2009-10-19 | 移動レンズマルチビームスキャナを備えたウェハ欠陥検出システム |
Country Status (7)
Country | Link |
---|---|
US (3) | US6809808B2 (ja) |
EP (3) | EP1490669A4 (ja) |
JP (4) | JP4439268B2 (ja) |
KR (3) | KR101108305B1 (ja) |
CN (3) | CN100593113C (ja) |
AU (2) | AU2003213623A1 (ja) |
WO (2) | WO2003083450A1 (ja) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008241377A (ja) * | 2007-03-27 | 2008-10-09 | Olympus Corp | 外観検査装置 |
JP2009523228A (ja) * | 2005-12-27 | 2009-06-18 | ケーエルエー−テンカー テクノロジィース コーポレイション | 複数画像の同時高速取得を行う方法および装置 |
WO2011155345A1 (ja) * | 2010-06-08 | 2011-12-15 | 株式会社日立ハイテクノロジーズ | 欠陥検査方法および欠陥検査装置 |
JP2012211926A (ja) * | 2006-08-30 | 2012-11-01 | Hitachi High-Technologies Corp | 検査装置、及び検査方法 |
JP2015017987A (ja) * | 2010-10-10 | 2015-01-29 | アプライド マテリアルズ イスラエル リミテッド | 検査システム及び高速焦点変更方法 |
JP2020519957A (ja) * | 2017-05-12 | 2020-07-02 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | フレキシブルモード走査光学顕微鏡法、及び検査システム |
Families Citing this family (72)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7049586B2 (en) * | 2002-02-21 | 2006-05-23 | Applied Material Israel, Ltd. | Multi beam scanning with bright/dark field imaging |
US6809808B2 (en) * | 2002-03-22 | 2004-10-26 | Applied Materials, Inc. | Wafer defect detection system with traveling lens multi-beam scanner |
US7359045B2 (en) * | 2002-05-06 | 2008-04-15 | Applied Materials, Israel, Ltd. | High speed laser scanning inspection system |
DE102004004761A1 (de) * | 2004-01-30 | 2005-09-08 | Leica Microsystems Semiconductor Gmbh | Vorrichtung und Verfahren zur Inspektion eines Wafers |
US7440091B2 (en) * | 2004-10-26 | 2008-10-21 | Applied Materials, Inc. | Sensors for dynamically detecting substrate breakage and misalignment of a moving substrate |
KR20070086657A (ko) * | 2004-11-29 | 2007-08-27 | 코닌클리케 필립스 일렉트로닉스 엔.브이. | 방사빔 발생장치 |
US7468506B2 (en) * | 2005-01-26 | 2008-12-23 | Applied Materials, Israel, Ltd. | Spot grid array scanning system |
US7468507B2 (en) * | 2005-01-26 | 2008-12-23 | Applied Materials, Israel, Ltd. | Optical spot grid array scanning system |
WO2006087213A2 (de) * | 2005-02-18 | 2006-08-24 | Schott Ag | Verfahren und vorrichtung zur erfassung und/oder klassifizierung von fehlstellen |
US7345754B1 (en) | 2005-09-16 | 2008-03-18 | Kla-Tencor Technologies Corp. | Fourier filters and wafer inspection systems |
US7684048B2 (en) * | 2005-11-15 | 2010-03-23 | Applied Materials Israel, Ltd. | Scanning microscopy |
US7847929B2 (en) * | 2006-08-23 | 2010-12-07 | Applied Materials Israel, Ltd. | Methods and apparatus for inspecting a plurality of dies |
JP2008051773A (ja) * | 2006-08-28 | 2008-03-06 | Hamamatsu Photonics Kk | 蛍光画像取得装置、及び蛍光画像取得方法 |
US7576348B2 (en) * | 2006-09-20 | 2009-08-18 | Applied Materials, Israel, Ltd. | One-dimensional phase contrast microscopy with a traveling lens generated by a step function change |
US7528940B2 (en) * | 2006-10-30 | 2009-05-05 | Applied Materials, Israel, Ltd. | System and method for inspecting an object using an acousto-optic device |
KR100814628B1 (ko) * | 2007-02-08 | 2008-03-18 | 주식회사 디이엔티 | 자동 프로브 검사장치 |
US7990546B2 (en) * | 2007-07-16 | 2011-08-02 | Applied Materials Israel, Ltd. | High throughput across-wafer-variation mapping |
US8402785B2 (en) * | 2007-11-09 | 2013-03-26 | Corning Incorporated | Method and apparatus for measuring surface shape profile |
SG157977A1 (en) * | 2008-06-23 | 2010-01-29 | Semiconductor Tech & Instr Inc | System and method for inspection of semiconductor packages |
KR101477569B1 (ko) * | 2008-07-29 | 2014-12-30 | 어플라이드 머티리얼즈 이스라엘 리미티드 | 기판의 편차 맵핑 |
US8276959B2 (en) | 2008-08-08 | 2012-10-02 | Applied Materials, Inc. | Magnetic pad for end-effectors |
SG164292A1 (en) * | 2009-01-13 | 2010-09-29 | Semiconductor Technologies & Instruments Pte | System and method for inspecting a wafer |
US8894259B2 (en) * | 2009-09-22 | 2014-11-25 | Cyberoptics Corporation | Dark field illuminator with large working area |
US8388204B2 (en) * | 2009-09-22 | 2013-03-05 | Cyberoptics Corporation | High speed, high resolution, three dimensional solar cell inspection system |
US8670031B2 (en) * | 2009-09-22 | 2014-03-11 | Cyberoptics Corporation | High speed optical inspection system with camera array and compact, integrated illuminator |
US8872912B2 (en) * | 2009-09-22 | 2014-10-28 | Cyberoptics Corporation | High speed distributed optical sensor inspection system |
US8681211B2 (en) * | 2009-09-22 | 2014-03-25 | Cyberoptics Corporation | High speed optical inspection system with adaptive focusing |
JP5637841B2 (ja) | 2010-12-27 | 2014-12-10 | 株式会社日立ハイテクノロジーズ | 検査装置 |
US9318870B2 (en) | 2011-05-06 | 2016-04-19 | Kla-Tencor Corporation | Deep ultra-violet light sources for wafer and reticle inspection systems |
US8896827B2 (en) | 2012-06-26 | 2014-11-25 | Kla-Tencor Corporation | Diode laser based broad band light sources for wafer inspection tools |
US9395340B2 (en) | 2013-03-15 | 2016-07-19 | Kla-Tencor Corporation | Interleaved acousto-optical device scanning for suppression of optical crosstalk |
EP2781912B1 (en) * | 2013-03-19 | 2021-05-05 | Hennecke Systems GmbH | Inspection system |
KR101358112B1 (ko) * | 2013-04-29 | 2014-02-05 | 주식회사 서울금속 | 대상물의 복수 부분을 검사하기 위한 비전 검사 장치 |
EP2816585A1 (en) * | 2013-06-17 | 2014-12-24 | ICT Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH | Charged particle beam system and method of operating thereof |
AT514332B1 (de) * | 2013-08-27 | 2014-12-15 | Swarovski D Kg | Anordnung zur Analyse eines durch Brechung und Reflexion an einem Schmuckstein hervorgerufenen Lichtmusters |
CN103646889A (zh) * | 2013-11-29 | 2014-03-19 | 上海华力微电子有限公司 | 晶圆缺陷检测方法 |
US9500599B2 (en) * | 2014-01-23 | 2016-11-22 | Samsung Electronics Co., Ltd. | Surface inspection apparatus for semiconductor chips |
US9546962B2 (en) | 2014-02-12 | 2017-01-17 | Kla-Tencor Corporation | Multi-spot scanning collection optics |
US9645097B2 (en) * | 2014-06-20 | 2017-05-09 | Kla-Tencor Corporation | In-line wafer edge inspection, wafer pre-alignment, and wafer cleaning |
US9606069B2 (en) * | 2014-06-25 | 2017-03-28 | Kla-Tencor Corporation | Method, apparatus and system for generating multiple spatially separated inspection regions on a substrate |
US9439568B2 (en) | 2014-07-03 | 2016-09-13 | Align Technology, Inc. | Apparatus and method for measuring surface topography optically |
US9261358B2 (en) * | 2014-07-03 | 2016-02-16 | Align Technology, Inc. | Chromatic confocal system |
US9726615B2 (en) * | 2014-07-22 | 2017-08-08 | Kla-Tencor Corporation | System and method for simultaneous dark field and phase contrast inspection |
SG11201702573VA (en) | 2014-09-29 | 2017-04-27 | Manjusha Mehendale | Non-destructive acoustic metrology for void detection |
IL243165B (en) * | 2014-12-18 | 2021-09-30 | Camtek Imaging Tech Suzhou Co Ltd | Polarization-enhanced optical inspection |
DE102014119027B4 (de) * | 2014-12-18 | 2024-08-08 | Carl Zeiss Microscopy Gmbh | Vorrichtung zur Multispot-Scan-Mikroskopie |
IL243163B (en) * | 2014-12-18 | 2021-02-28 | Gordon Noam | Lighting method for simulating specular reflections from a wide range of angles in a visual inspection system |
CN107209126B (zh) * | 2015-02-04 | 2019-11-26 | 博世包装技术株式会社 | 检查装置以及检查系统 |
US9891175B2 (en) * | 2015-05-08 | 2018-02-13 | Kla-Tencor Corporation | System and method for oblique incidence scanning with 2D array of spots |
WO2017001897A1 (pt) * | 2015-06-30 | 2017-01-05 | Bosch Car Multimedia Portugal, S.A. | Dispositivo e método para deteção de defeitos em superfícies especulares com luz difusa estruturada |
US9784689B2 (en) * | 2015-07-10 | 2017-10-10 | Applied Materials Israel Ltd. | Method and system for inspecting an object with an array of beams |
US9535014B1 (en) * | 2015-07-15 | 2017-01-03 | Applied Materials Israel Ltd. | Systems and methods for inspecting an object |
EP3362778B1 (en) * | 2015-10-13 | 2022-08-03 | Omega Biosystems Incorporated | Multi-modal fluorescence imaging flow cytometry system |
CN105865339B (zh) * | 2016-05-12 | 2018-06-05 | 哈尔滨工业大学 | 分瞳式移相干涉共焦微位移测量装置 |
CN105865347B (zh) * | 2016-05-12 | 2018-10-26 | 哈尔滨工业大学 | 分瞳移焦型共焦显微差分测量方法及装置 |
CN106152972A (zh) * | 2016-08-11 | 2016-11-23 | 广西师范大学 | 一种相移式光投影三维测量系统及方法 |
DE102017123510A1 (de) * | 2017-10-10 | 2019-04-11 | Carl Zeiss Microscopy Gmbh | Digitales Mikroskop und Verfahren zum Aufnehmen eines Stapels von mikroskopischen Bildern einer Probe |
US10217252B1 (en) * | 2018-07-05 | 2019-02-26 | Mistubishi Electric Research Laboratories, Inc. | See-through sensing for image reconstruction of structure of target object |
US10295476B1 (en) * | 2018-08-14 | 2019-05-21 | Applied Materials Israel Ltd. | System and method for multiple mode inspection of a sample |
EP3837580B1 (en) * | 2018-08-14 | 2024-08-07 | Femtonics Kft. | Method of scanning an optical beam using an acousto-optic deflector driven by chirped acoustic signals |
TWI668426B (zh) * | 2018-08-15 | 2019-08-11 | 國立清華大學 | 光學量測裝置 |
CN110057726A (zh) * | 2019-03-19 | 2019-07-26 | 中国科学院上海光学精密机械研究所 | 三色光源共光轴颗粒粒度测量装置 |
WO2021066984A1 (en) * | 2019-09-30 | 2021-04-08 | Applied Materials, Inc. | Conveyor inspection system, substrate rotator, and test system having the same |
CN110996074B (zh) * | 2020-01-04 | 2021-03-16 | 盛广济 | 幕墙玻璃爆裂分区监控方法 |
JP7392582B2 (ja) * | 2020-06-12 | 2023-12-06 | オムロン株式会社 | 検査システムおよび検査方法 |
CN113970567B (zh) * | 2020-07-22 | 2023-01-31 | 同方威视技术股份有限公司 | 背散射成像装置、控制方法及检查系统 |
US11526086B2 (en) | 2021-03-08 | 2022-12-13 | Kla Corporation | Multi-field scanning overlay metrology |
US12092941B2 (en) | 2021-05-18 | 2024-09-17 | Applied Materials Israel Ltd. | System for illuminating a substrate using an acousto-optic device |
CN113533351B (zh) * | 2021-08-20 | 2023-12-22 | 合肥御微半导体技术有限公司 | 一种面板缺陷检测装置及检测方法 |
JP2023092933A (ja) * | 2021-12-22 | 2023-07-04 | 株式会社ヴィーネックス | 検査装置及び検査方法 |
CN114384081B (zh) * | 2021-12-22 | 2023-07-28 | 西安工程大学 | 纺织布匹缺陷检测装置及其检测方法 |
US12092584B2 (en) | 2022-04-26 | 2024-09-17 | Applied Materials Israel Ltd. | High throughput defect detection |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61232427A (ja) * | 1985-04-08 | 1986-10-16 | Fuji Photo Film Co Ltd | 光走査記録装置 |
JPS61232428A (ja) * | 1985-04-08 | 1986-10-16 | Fuji Photo Film Co Ltd | 光走査装置 |
JPS61252538A (ja) * | 1985-05-01 | 1986-11-10 | Fuji Photo Film Co Ltd | 音響光学素子アレイ |
JPS61278824A (ja) * | 1985-06-05 | 1986-12-09 | Fuji Photo Film Co Ltd | 光合波装置 |
JPS62121340A (ja) * | 1985-11-19 | 1987-06-02 | カ−ル・ツアイス−スチフツング | 走査形光学顕微鏡による暗視野での被観測対象物体の表示方法及び装置 |
JPS63211621A (ja) * | 1987-02-26 | 1988-09-02 | Fujitsu Ltd | レ−ザ描画方法 |
JP2000108316A (ja) * | 1998-10-06 | 2000-04-18 | Dakku Engineering Kk | 品質検査装置 |
JP2000509591A (ja) * | 1997-02-04 | 2000-07-25 | ソニー インターナショナル(ヨーロッパ)ゲゼルシャフト ミット ベシュレンクテル ハフツング | 3次元画像生成方法及び装置 |
WO2000068673A1 (en) * | 1999-05-11 | 2000-11-16 | Applied Materials, Inc. | Inspection systems performing two-dimensional imaging with line light spot |
JP2005521064A (ja) * | 2002-03-22 | 2005-07-14 | アプライド マテリアルズ イスラエル リミテッド | 移動レンズマルチビームスキャナを備えたウェハ欠陥検出システム |
Family Cites Families (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1306428A (en) * | 1970-11-23 | 1973-02-14 | Nippon Telegraph & Telephone | Arrangement for acousto-optical light deflection |
US3771124A (en) * | 1972-01-21 | 1973-11-06 | Sperry Rand Corp | Coherent optical processor fingerprint identification apparatus |
JPS50147286A (ja) * | 1974-05-15 | 1975-11-26 | ||
US4441124A (en) * | 1981-11-05 | 1984-04-03 | Western Electric Company, Inc. | Technique for inspecting semiconductor wafers for particulate contamination |
JPS61211621A (ja) * | 1985-03-14 | 1986-09-19 | Rinnai Corp | 加熱制御方法 |
JPH0526966Y2 (ja) * | 1986-04-21 | 1993-07-08 | ||
US4992880A (en) * | 1989-05-24 | 1991-02-12 | The United States Of America As Represented By The Secretary Of The Navy | High definition video-rate laser-addressed liquid-crystal light-valve projection display |
US5045932A (en) * | 1989-06-29 | 1991-09-03 | Eastman Kodak Company | Method and apparatus for generating a high definition electronic signal from a line scan of a color original |
US5065008A (en) | 1989-10-18 | 1991-11-12 | Fuji Photo Film Co., Ltd. | Scanning microscope and scanning mechanism for the same |
US6112114A (en) * | 1991-12-16 | 2000-08-29 | Laser Diagnostic Technologies, Inc. | Eye examination apparatus employing polarized light probe |
JP3140838B2 (ja) * | 1992-06-04 | 2001-03-05 | 大日本印刷株式会社 | 画像の位置ずれ補正方法及びその装置及び画像検査装置 |
JP3207931B2 (ja) * | 1992-08-24 | 2001-09-10 | 大日本印刷株式会社 | 画像検査装置 |
US5641954A (en) * | 1993-09-09 | 1997-06-24 | The United States Of American As Represented By The Secretary Of The Air Force | Programmable delay line using laser diode taps |
US5493423A (en) * | 1994-10-28 | 1996-02-20 | Xerox Corporation | Resettable pixel amplifier for an image sensor array |
US5633747A (en) * | 1994-12-21 | 1997-05-27 | Tencor Instruments | Variable spot-size scanning apparatus |
JPH10148778A (ja) * | 1996-11-18 | 1998-06-02 | Minolta Co Ltd | マルチビーム発生装置 |
JP3703587B2 (ja) * | 1996-12-06 | 2005-10-05 | 富士写真フイルム株式会社 | 光ビーム走査装置およびその制御方法 |
JP3363089B2 (ja) * | 1997-03-21 | 2003-01-07 | ダルサ・インコーポレーテッド | タップ付きccdアレイ構造 |
JP3411780B2 (ja) * | 1997-04-07 | 2003-06-03 | レーザーテック株式会社 | レーザ顕微鏡及びこのレーザ顕微鏡を用いたパターン検査装置 |
JPH1155573A (ja) * | 1997-07-30 | 1999-02-26 | Sony Corp | Ccd固体撮像素子及びその駆動方法 |
US6236454B1 (en) * | 1997-12-15 | 2001-05-22 | Applied Materials, Inc. | Multiple beam scanner for an inspection system |
JP3978528B2 (ja) * | 1998-04-16 | 2007-09-19 | レーザーテック株式会社 | パターン欠陥検査装置及びレーザ顕微鏡 |
US6256093B1 (en) * | 1998-06-25 | 2001-07-03 | Applied Materials, Inc. | On-the-fly automatic defect classification for substrates using signal attributes |
US6208411B1 (en) * | 1998-09-28 | 2001-03-27 | Kla-Tencor Corporation | Massively parallel inspection and imaging system |
US6628381B1 (en) * | 2000-06-20 | 2003-09-30 | Applied Materials, Inc. | Optical inspection method and apparatus utilizing a collection angle design |
JP3858571B2 (ja) * | 2000-07-27 | 2006-12-13 | 株式会社日立製作所 | パターン欠陥検査方法及びその装置 |
US6636301B1 (en) * | 2000-08-10 | 2003-10-21 | Kla-Tencor Corporation | Multiple beam inspection apparatus and method |
US6670598B1 (en) * | 2000-09-06 | 2003-12-30 | Xerox Corporation | Low power autozero of pixel amplifier |
US6731384B2 (en) * | 2000-10-10 | 2004-05-04 | Hitachi, Ltd. | Apparatus for detecting foreign particle and defect and the same method |
JP3190913B1 (ja) * | 2000-10-18 | 2001-07-23 | レーザーテック株式会社 | 撮像装置及びフォトマスクの欠陥検査装置 |
US6538730B2 (en) * | 2001-04-06 | 2003-03-25 | Kla-Tencor Technologies Corporation | Defect detection system |
EP1393115B1 (en) * | 2001-05-03 | 2011-11-30 | KLA-Tencor Technologies Corporation | Systems and methods for scanning a beam of light across a specimen |
US6560005B2 (en) * | 2001-08-07 | 2003-05-06 | Tkd, Inc. | Acousto-optic devices |
US6884982B2 (en) * | 2002-02-19 | 2005-04-26 | Massachusetts Institute Of Technology | Methods and apparatus for improving resolution and reducing the effects of signal coupling in an electronic imager |
US6756563B2 (en) * | 2002-03-07 | 2004-06-29 | Orbotech Ltd. | System and method for forming holes in substrates containing glass |
-
2002
- 2002-03-22 US US10/103,560 patent/US6809808B2/en not_active Expired - Lifetime
-
2003
- 2003-03-14 JP JP2003580839A patent/JP4439268B2/ja not_active Expired - Fee Related
- 2003-03-14 EP EP03711306A patent/EP1490669A4/en not_active Withdrawn
- 2003-03-14 WO PCT/US2003/006706 patent/WO2003083450A1/en active Application Filing
- 2003-03-14 EP EP13182467.4A patent/EP2677299A1/en not_active Withdrawn
- 2003-03-14 KR KR1020107024440A patent/KR101108305B1/ko active IP Right Grant
- 2003-03-14 CN CN03809497A patent/CN100593113C/zh not_active Expired - Lifetime
- 2003-03-14 KR KR1020047014887A patent/KR101120219B1/ko active IP Right Grant
- 2003-03-14 EP EP03713910A patent/EP1490670A4/en not_active Withdrawn
- 2003-03-14 CN CN038090481A patent/CN1646894B/zh not_active Expired - Lifetime
- 2003-03-14 WO PCT/US2003/006160 patent/WO2003083449A1/en active Application Filing
- 2003-03-14 KR KR1020107024438A patent/KR101108353B1/ko active IP Right Grant
- 2003-03-14 AU AU2003213623A patent/AU2003213623A1/en not_active Abandoned
- 2003-03-14 JP JP2003580838A patent/JP4423046B2/ja not_active Expired - Fee Related
- 2003-03-14 AU AU2003217935A patent/AU2003217935A1/en not_active Abandoned
- 2003-03-14 CN CN200910266307.5A patent/CN101738398B/zh not_active Expired - Lifetime
- 2003-07-11 US US10/617,449 patent/US6853475B2/en not_active Expired - Lifetime
- 2003-07-11 US US10/617,448 patent/US7053395B2/en not_active Expired - Lifetime
-
2009
- 2009-10-19 JP JP2009240418A patent/JP5523788B2/ja not_active Expired - Fee Related
- 2009-10-19 JP JP2009240412A patent/JP5523787B2/ja not_active Expired - Fee Related
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61232427A (ja) * | 1985-04-08 | 1986-10-16 | Fuji Photo Film Co Ltd | 光走査記録装置 |
JPS61232428A (ja) * | 1985-04-08 | 1986-10-16 | Fuji Photo Film Co Ltd | 光走査装置 |
JPS61252538A (ja) * | 1985-05-01 | 1986-11-10 | Fuji Photo Film Co Ltd | 音響光学素子アレイ |
JPS61278824A (ja) * | 1985-06-05 | 1986-12-09 | Fuji Photo Film Co Ltd | 光合波装置 |
JPS62121340A (ja) * | 1985-11-19 | 1987-06-02 | カ−ル・ツアイス−スチフツング | 走査形光学顕微鏡による暗視野での被観測対象物体の表示方法及び装置 |
JPS63211621A (ja) * | 1987-02-26 | 1988-09-02 | Fujitsu Ltd | レ−ザ描画方法 |
JP2000509591A (ja) * | 1997-02-04 | 2000-07-25 | ソニー インターナショナル(ヨーロッパ)ゲゼルシャフト ミット ベシュレンクテル ハフツング | 3次元画像生成方法及び装置 |
JP2000108316A (ja) * | 1998-10-06 | 2000-04-18 | Dakku Engineering Kk | 品質検査装置 |
WO2000068673A1 (en) * | 1999-05-11 | 2000-11-16 | Applied Materials, Inc. | Inspection systems performing two-dimensional imaging with line light spot |
JP2005521064A (ja) * | 2002-03-22 | 2005-07-14 | アプライド マテリアルズ イスラエル リミテッド | 移動レンズマルチビームスキャナを備えたウェハ欠陥検出システム |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009523228A (ja) * | 2005-12-27 | 2009-06-18 | ケーエルエー−テンカー テクノロジィース コーポレイション | 複数画像の同時高速取得を行う方法および装置 |
JP2012211926A (ja) * | 2006-08-30 | 2012-11-01 | Hitachi High-Technologies Corp | 検査装置、及び検査方法 |
JP2008241377A (ja) * | 2007-03-27 | 2008-10-09 | Olympus Corp | 外観検査装置 |
WO2011155345A1 (ja) * | 2010-06-08 | 2011-12-15 | 株式会社日立ハイテクノロジーズ | 欠陥検査方法および欠陥検査装置 |
JP2011257222A (ja) * | 2010-06-08 | 2011-12-22 | Hitachi High-Technologies Corp | 欠陥検査方法および欠陥検査装置 |
US9535013B2 (en) | 2010-06-08 | 2017-01-03 | Hitachi High-Technologies Corporation | Method and apparatus for inspecting defect |
JP2015017987A (ja) * | 2010-10-10 | 2015-01-29 | アプライド マテリアルズ イスラエル リミテッド | 検査システム及び高速焦点変更方法 |
JP2020519957A (ja) * | 2017-05-12 | 2020-07-02 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | フレキシブルモード走査光学顕微鏡法、及び検査システム |
Also Published As
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4439268B2 (ja) | 移動レンズマルチビームスキャナを備えた暗視野検出装置およびその方法 | |
US7365836B2 (en) | High speed laser scanning inspection system | |
JP6562420B2 (ja) | ウェハ検査システム | |
JP3411780B2 (ja) | レーザ顕微鏡及びこのレーザ顕微鏡を用いたパターン検査装置 | |
JP4704040B2 (ja) | 光学的検査のための照明システム | |
JP3978528B2 (ja) | パターン欠陥検査装置及びレーザ顕微鏡 | |
JP2016500849A (ja) | 光学顕微鏡および顕微鏡観察方法 | |
JPH10326587A (ja) | 電動スキャニングテーブル付き共焦点顕微鏡 | |
JP2009162593A (ja) | 微細構造物の欠陥検査方法及び欠陥検査装置 | |
US7528940B2 (en) | System and method for inspecting an object using an acousto-optic device | |
KR100970022B1 (ko) | 이동 렌즈 다중-빔 스캐너를 갖춘 암시야 검출 장치 및그의 제조 방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20060301 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20081104 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20090202 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20090209 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20090224 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20090303 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20090401 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20090408 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20090417 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20090818 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20091112 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20091208 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20100105 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130115 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130115 Year of fee payment: 3 |
|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130115 Year of fee payment: 3 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130115 Year of fee payment: 3 |
|
RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: R3D02 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |