JP2005521034A - 再構成可能検出器アレイ - Google Patents
再構成可能検出器アレイ Download PDFInfo
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- JP2005521034A JP2005521034A JP2003567085A JP2003567085A JP2005521034A JP 2005521034 A JP2005521034 A JP 2005521034A JP 2003567085 A JP2003567085 A JP 2003567085A JP 2003567085 A JP2003567085 A JP 2003567085A JP 2005521034 A JP2005521034 A JP 2005521034A
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- 230000035945 sensitivity Effects 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 4
- 230000008569 process Effects 0.000 claims description 3
- 238000003491 array Methods 0.000 abstract description 4
- 238000010276 construction Methods 0.000 abstract 1
- 230000005855 radiation Effects 0.000 description 6
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 5
- 229910052719 titanium Inorganic materials 0.000 description 5
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- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 238000001931 thermography Methods 0.000 description 2
- 241000234314 Zingiber Species 0.000 description 1
- 235000006886 Zingiber officinale Nutrition 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 239000005387 chalcogenide glass Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 235000008397 ginger Nutrition 0.000 description 1
- 230000004886 head movement Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
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- 230000003287 optical effect Effects 0.000 description 1
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- 230000002123 temporal effect Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N5/00—Details of television systems
- H04N5/30—Transforming light or analogous information into electric information
- H04N5/33—Transforming infrared radiation
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/20—Circuitry of solid-state image sensors [SSIS]; Control thereof for transforming only infrared radiation into image signals
- H04N25/21—Circuitry of solid-state image sensors [SSIS]; Control thereof for transforming only infrared radiation into image signals for transforming thermal infrared radiation into image signals
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/40—Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled
- H04N25/46—Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled by combining or binning pixels
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
Landscapes
- Multimedia (AREA)
- Signal Processing (AREA)
- Engineering & Computer Science (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
- Radiation Pyrometers (AREA)
- Image Input (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Air Bags (AREA)
- Measurement Of Radiation (AREA)
- Polysaccharides And Polysaccharide Derivatives (AREA)
- Measuring Pulse, Heart Rate, Blood Pressure Or Blood Flow (AREA)
- Fire-Detection Mechanisms (AREA)
- Control Of Motors That Do Not Use Commutators (AREA)
Abstract
Description
検出器のxかけるyアレイを搭載する基板と、を有し、各検出器はピクセルを構成し、
各検出器から独立して電気信号を受信する電極と、
を有し、独立して読まれうる別々の検出器を接続し、効率的なインピーダンスを実質的に変更することなく要求されたより大きなグループ内に接続することを特徴とする。
Claims (9)
- xかけるyアレイの検出器(4,14,15)を搭載する基板(2)とを有し、各検出器がピクセルを構成し、
独立して各検出器から電気信号を受信する電極(5,6,7)と、を有する、再構成可能な検出器アレイであって、
別々に読むために別の検出器を接続し、効果的なインピーダンスを実質的に変更することなく要求されたより大きなグループ内に接続する接続手段(S,a,b,c,d)を有することを特徴とする、再構成可能な検出器アレイ - 検出器が抵抗ボロメータであることを特徴とする請求項1に記載のアレイ。
- アレイが、3乃至14μmの範囲内の温度検出器感度のアレイであることを特徴とする請求項1に記載のアレイ。
- 少なくとも1つのx及びyの値が、24乃至96の範囲であることを特徴とする請求項1に記載のアレイ。
- 基板が、各検出器の出力を処理し、検出器のグループ内にアレイを再構築する電子回路を搭載することを特徴とする請求項1に記載のアレイ。
- 検出器が、2×2構成を与える4つの隣接する検出器のグループに一緒に接続されることを特徴とする請求項1に記載のアレイ。
- 検出器が、4×4構成を与える16の隣接する検出器のグループに一緒に接続されることを特徴とする請求項1に記載のアレイ。
- アレイにシーンを差し向けるための手段を含むことを特徴とする請求項1に記載のアレイ。
- アレイ及び基板が、周囲の環境から隔離された検出器を備えた単一のモジュールにカプセル化されることを特徴とする請求項1に記載のアレイ。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GBGB0202506.2A GB0202506D0 (en) | 2002-02-02 | 2002-02-02 | Reconfigurable detector array |
PCT/GB2003/000430 WO2003067874A1 (en) | 2002-02-02 | 2003-01-31 | Reconfigurable detector array |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2005521034A true JP2005521034A (ja) | 2005-07-14 |
JP2005521034A5 JP2005521034A5 (ja) | 2006-03-02 |
JP4206043B2 JP4206043B2 (ja) | 2009-01-07 |
Family
ID=9930334
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003567085A Expired - Fee Related JP4206043B2 (ja) | 2002-02-02 | 2003-01-31 | 再構成可能検出器アレイ |
Country Status (9)
Country | Link |
---|---|
US (1) | US7253411B2 (ja) |
EP (1) | EP1470704B1 (ja) |
JP (1) | JP4206043B2 (ja) |
AT (1) | ATE372644T1 (ja) |
AU (1) | AU2003207014A1 (ja) |
DE (1) | DE60316114T2 (ja) |
ES (1) | ES2289260T3 (ja) |
GB (1) | GB0202506D0 (ja) |
WO (1) | WO2003067874A1 (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007507968A (ja) * | 2003-10-02 | 2007-03-29 | オプガル リミテッド | 制御可能な感度を持つ赤外線センサ |
JP2007333464A (ja) * | 2006-06-13 | 2007-12-27 | Mitsubishi Electric Corp | 2波長イメージセンサ |
JP2008076373A (ja) * | 2006-09-22 | 2008-04-03 | Seiko Npc Corp | 赤外線検出器 |
JP2011095044A (ja) * | 2009-10-28 | 2011-05-12 | Nec Corp | 赤外線撮像装置および赤外線撮像方法 |
KR101808375B1 (ko) | 2011-06-10 | 2017-12-12 | 플리어 시스템즈, 인크. | 저전력 소형 폼 팩터 적외선 이미징 |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080142713A1 (en) * | 1992-05-05 | 2008-06-19 | Automotive Technologies International, Inc. | Vehicular Occupant Sensing Using Infrared |
GB0424934D0 (en) * | 2004-11-12 | 2004-12-15 | Qinetiq Ltd | Infrared detector |
US7791670B2 (en) | 2005-05-11 | 2010-09-07 | Delphi Technologies, Inc. | Method of operation for a vision-based occupant sensing system |
DE102007040689A1 (de) * | 2007-08-29 | 2009-03-05 | Behr-Hella Thermocontrol Gmbh | Bolometeranordnung |
US9211498B2 (en) | 2013-03-15 | 2015-12-15 | Makefield Llc | Functional desiccants |
US9731853B2 (en) | 2014-08-05 | 2017-08-15 | Makefield Llc | Networked notification for dispensable units |
EP3268706B1 (en) * | 2015-03-12 | 2020-10-28 | Laser Components GmbH | Differential circuit for pyroelectric infrared detector |
CN108414093B (zh) * | 2018-01-12 | 2020-02-28 | 武汉高德红外股份有限公司 | 一种非制冷红外焦平面探测器的读出电路及提高良率的方法 |
US20200068145A1 (en) * | 2018-08-21 | 2020-02-27 | Bae Systems Information And Electronic Systems Integration Inc. | Multi-resolution uncooled microbolometer focal plane array |
KR20220092141A (ko) * | 2020-12-24 | 2022-07-01 | 삼성전자주식회사 | 열형 적외선 검출 장치 |
KR20240109656A (ko) * | 2023-01-04 | 2024-07-12 | 삼성전자주식회사 | 열화상 픽셀, 열화상 센서, 및 볼로미터 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5021663B1 (en) * | 1988-08-12 | 1997-07-01 | Texas Instruments Inc | Infrared detector |
US5229609A (en) * | 1989-05-18 | 1993-07-20 | Sat (Societe Anonyme De Telecommunications) | Detection assembly for an infrared monitoring system |
US5129595A (en) * | 1991-07-03 | 1992-07-14 | Alliant Techsystems Inc. | Focal plane array seeker for projectiles |
DE69218755T2 (de) * | 1992-01-24 | 1997-07-10 | Rockwell International Corp | Ausleseverstärker für starrende Infrarotbildebenenanlage |
US5452004A (en) * | 1993-06-17 | 1995-09-19 | Litton Systems, Inc. | Focal plane array imaging device with random access architecture |
AU1416797A (en) * | 1995-12-07 | 1997-06-27 | Diasense, Inc. | Array combining many photoconductive detectors in a compact package |
JPH10122957A (ja) * | 1996-10-22 | 1998-05-15 | Nikon Corp | 熱型赤外線イメージセンサ |
GB2332800B (en) * | 1997-12-18 | 2000-09-27 | Simage Oy | Device for imaging radiation |
GB2332585B (en) * | 1997-12-18 | 2000-09-27 | Simage Oy | Device for imaging radiation |
US6801258B1 (en) * | 1998-03-16 | 2004-10-05 | California Institute Of Technology | CMOS integration sensor with fully differential column readout circuit for light adaptive imaging |
JP2003526231A (ja) * | 1999-02-24 | 2003-09-02 | サーノフ コーポレイション | 表示出力のデュアル解像度小区画化方法及び装置 |
WO2001064481A2 (en) * | 2000-03-02 | 2001-09-07 | Donnelly Corporation | Video mirror systems incorporating an accessory module |
JP2004529359A (ja) * | 2001-05-21 | 2004-09-24 | プレスコ テクノロジー インコーポレーテッド | 自動化されたプロセス制御物品検査アプリケーションの中でスナップショット動作熱赤外線イメージングを提供するための装置および方法 |
-
2002
- 2002-02-02 GB GBGB0202506.2A patent/GB0202506D0/en not_active Ceased
-
2003
- 2003-01-31 ES ES03704754T patent/ES2289260T3/es not_active Expired - Lifetime
- 2003-01-31 JP JP2003567085A patent/JP4206043B2/ja not_active Expired - Fee Related
- 2003-01-31 AU AU2003207014A patent/AU2003207014A1/en not_active Abandoned
- 2003-01-31 DE DE60316114T patent/DE60316114T2/de not_active Expired - Lifetime
- 2003-01-31 WO PCT/GB2003/000430 patent/WO2003067874A1/en active IP Right Grant
- 2003-01-31 AT AT03704754T patent/ATE372644T1/de not_active IP Right Cessation
- 2003-01-31 US US10/503,312 patent/US7253411B2/en not_active Expired - Fee Related
- 2003-01-31 EP EP03704754A patent/EP1470704B1/en not_active Expired - Lifetime
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007507968A (ja) * | 2003-10-02 | 2007-03-29 | オプガル リミテッド | 制御可能な感度を持つ赤外線センサ |
JP2007333464A (ja) * | 2006-06-13 | 2007-12-27 | Mitsubishi Electric Corp | 2波長イメージセンサ |
JP2008076373A (ja) * | 2006-09-22 | 2008-04-03 | Seiko Npc Corp | 赤外線検出器 |
JP2011095044A (ja) * | 2009-10-28 | 2011-05-12 | Nec Corp | 赤外線撮像装置および赤外線撮像方法 |
KR101808375B1 (ko) | 2011-06-10 | 2017-12-12 | 플리어 시스템즈, 인크. | 저전력 소형 폼 팩터 적외선 이미징 |
Also Published As
Publication number | Publication date |
---|---|
US20050067556A1 (en) | 2005-03-31 |
US7253411B2 (en) | 2007-08-07 |
ES2289260T3 (es) | 2008-02-01 |
AU2003207014A1 (en) | 2003-09-02 |
EP1470704B1 (en) | 2007-09-05 |
EP1470704A1 (en) | 2004-10-27 |
JP4206043B2 (ja) | 2009-01-07 |
GB0202506D0 (en) | 2002-03-20 |
DE60316114T2 (de) | 2008-06-05 |
DE60316114D1 (de) | 2007-10-18 |
WO2003067874A1 (en) | 2003-08-14 |
ATE372644T1 (de) | 2007-09-15 |
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