JP2005516425A - フィン対空気の接触面積が大きいヒートシンク - Google Patents

フィン対空気の接触面積が大きいヒートシンク Download PDF

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Publication number
JP2005516425A
JP2005516425A JP2003565213A JP2003565213A JP2005516425A JP 2005516425 A JP2005516425 A JP 2005516425A JP 2003565213 A JP2003565213 A JP 2003565213A JP 2003565213 A JP2003565213 A JP 2003565213A JP 2005516425 A JP2005516425 A JP 2005516425A
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Japan
Prior art keywords
air
heat
cooling device
plate
generating component
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Pending
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JP2003565213A
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English (en)
Japanese (ja)
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JP2005516425A5 (enExample
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エレル，デイビット
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Individual
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Publication of JP2005516425A publication Critical patent/JP2005516425A/ja
Publication of JP2005516425A5 publication Critical patent/JP2005516425A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2003565213A 2002-01-30 2003-01-27 フィン対空気の接触面積が大きいヒートシンク Pending JP2005516425A (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US35225202P 2002-01-30 2002-01-30
US37479802P 2002-04-24 2002-04-24
US39451302P 2002-07-10 2002-07-10
PCT/IL2003/000066 WO2003065775A2 (en) 2002-01-30 2003-01-27 Heat-sink with large fins-to-air contact area

Publications (2)

Publication Number Publication Date
JP2005516425A true JP2005516425A (ja) 2005-06-02
JP2005516425A5 JP2005516425A5 (enExample) 2005-12-22

Family

ID=27670643

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003565213A Pending JP2005516425A (ja) 2002-01-30 2003-01-27 フィン対空気の接触面積が大きいヒートシンク

Country Status (6)

Country Link
US (1) US20050145366A1 (enExample)
EP (1) EP1472919A2 (enExample)
JP (1) JP2005516425A (enExample)
AU (1) AU2003209610A1 (enExample)
CA (1) CA2474781A1 (enExample)
WO (1) WO2003065775A2 (enExample)

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Publication number Priority date Publication date Assignee Title
JP2010524249A (ja) * 2007-04-10 2010-07-15 エーティーアイ・テクノロジーズ・ユーエルシー 電子装置のための熱管理システム
JP2011122815A (ja) * 2009-12-03 2011-06-23 Boeing Co:The 延長プラグコールドプレート

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JP4278643B2 (ja) * 2005-08-30 2009-06-17 三菱電機株式会社 車両用回転電機
US7324339B2 (en) * 2005-12-21 2008-01-29 International Business Machines Corporation Dual impeller push-pull axial fan heat sink
US7347251B2 (en) 2005-12-21 2008-03-25 International Business Machines Corporation Heat sink for distributing a thermal load
US8230908B2 (en) 2006-01-05 2012-07-31 International Business Machines Corporation Heat sink for dissipating a thermal load
US7583502B2 (en) * 2006-06-13 2009-09-01 Taiwan Semiconductor Manufacturing Co., Ltd. Method and apparatus for increasing heat dissipation of high performance integrated circuits (IC)
JP5252204B2 (ja) * 2006-09-19 2013-07-31 日本電気株式会社 冷却装置
US8360847B2 (en) 2006-11-13 2013-01-29 Igt Multimedia emulation of physical reel hardware in processor-based gaming machines
US8210922B2 (en) 2006-11-13 2012-07-03 Igt Separable game graphics on a gaming machine
US8357033B2 (en) 2006-11-13 2013-01-22 Igt Realistic video reels
JP2008140802A (ja) * 2006-11-30 2008-06-19 Fuji Electric Fa Components & Systems Co Ltd ヒートシンク
EP1998108B1 (en) * 2007-05-30 2015-04-29 OSRAM GmbH Cooling apparatus
US20080302507A1 (en) * 2007-06-05 2008-12-11 Topower Computer Industrial Co., Ltd. Adjustable cooling apparatus
US7905274B2 (en) * 2007-08-21 2011-03-15 Ching-Sung Kuo Wing-spanning thermal-dissipating device
US8758144B2 (en) * 2007-10-23 2014-06-24 Igt Separable backlighting system
TWM341878U (en) * 2008-03-07 2008-10-01 Ting-Wei Hsu Heat sink module
US8559175B2 (en) * 2008-07-25 2013-10-15 Koninlijke Philips N.V. Cooling device for cooling a semiconductor die
CN101998807A (zh) * 2009-08-19 2011-03-30 富瑞精密组件（昆山）有限公司 散热装置
CN101950197A (zh) * 2010-05-24 2011-01-19 深圳市傲星泰科技有限公司 一种计算机电源
US8425316B2 (en) 2010-08-03 2013-04-23 Igt Methods and systems for improving play of a bonus game on a gaming machine and improving security within a gaming establishment
JP2013115083A (ja) * 2011-11-25 2013-06-10 Fujitsu Semiconductor Ltd 半導体装置及びその製造方法
WO2014181221A2 (en) * 2013-05-08 2014-11-13 Ashwin Bharadwaj Heat sink
US10148155B2 (en) 2013-12-04 2018-12-04 Barrett Technology, Llc Method and apparatus for connecting an ultracompact, high-performance motor controller to an ultracompact, high-performance brushless DC motor
US9603282B2 (en) * 2014-01-03 2017-03-21 Microsoft Technology Licensing, Llc Datacenter and cooling control fault-tolerance using compute resources
US10085363B2 (en) * 2014-05-22 2018-09-25 General Electric Company Integrated compact impingement on extended heat surface
US10103081B2 (en) * 2014-09-08 2018-10-16 Ashwin Bharadwaj Heat sink
US9643233B2 (en) 2014-09-22 2017-05-09 Dell Products, L.P. Bi-directional airflow heatsink
CN106827594B (zh) * 2015-12-03 2019-04-23 中材科技风电叶片股份有限公司 风电叶片的腹板的避雷孔加工方法及预埋孔加工工装
US11421945B1 (en) * 2020-06-25 2022-08-23 Softronics, Ltd. Heat dissipation system with cross-connected heatsink
CN112097559A (zh) * 2020-09-21 2020-12-18 瑞德(新乡)路业有限公司 一种节能型冷却系统
CN113163671A (zh) * 2021-03-03 2021-07-23 上海应用技术大学 一种矿用隔爆型变频器箱及其散热系统
CN113365485B (zh) * 2021-08-11 2021-12-07 深圳比特微电子科技有限公司 液冷板散热器
CN114717551B (zh) * 2021-09-09 2024-04-02 安徽夏晟机电科技有限公司 液压支架激光熔覆设备
CN115267268B (zh) * 2022-05-27 2024-10-29 苏州联讯仪器股份有限公司 一种芯片测试装置
CN117140830B (zh) * 2023-09-21 2024-02-20 伟达塑胶工业（南通）有限公司 一种pvc改性健身球体加工设备及方法
CN117172160B (zh) * 2023-11-02 2024-01-26 北京蓝威技术有限公司 一种基于反距离加权均值的翅片散热器热阻值获取方法
US12305657B1 (en) * 2024-11-13 2025-05-20 Zhen Kuang Bidirectional blowing fireplace fan
TWI897758B (zh) * 2024-12-10 2025-09-11 技嘉科技股份有限公司 散熱模組
CN119509075B (zh) * 2025-01-20 2025-04-01 烟台首钢电装有限公司 一种组合式预冷蒸发器
CN119920791A (zh) * 2025-04-03 2025-05-02 成都贡爵微电子有限公司 一种高可靠三维异构集成射频微模组

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US5526875A (en) * 1994-10-14 1996-06-18 Lin; Shih-Jen Cooling device for CPU
US5502619A (en) * 1994-12-12 1996-03-26 Tennmax Trading Corp. Heat sink assembly for computer chips
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US5785116A (en) * 1996-02-01 1998-07-28 Hewlett-Packard Company Fan assisted heat sink device
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US6125920A (en) * 1997-10-16 2000-10-03 Herbert; Edward Fan with heat sink using stamped heat sink fins
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US6244331B1 (en) * 1999-10-22 2001-06-12 Intel Corporation Heatsink with integrated blower for improved heat transfer
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US6747865B2 (en) * 2001-04-27 2004-06-08 Aavid Thermalloy, Llc Heat sink for electronic components

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010524249A (ja) * 2007-04-10 2010-07-15 エーティーアイ・テクノロジーズ・ユーエルシー 電子装置のための熱管理システム
JP2011122815A (ja) * 2009-12-03 2011-06-23 Boeing Co:The 延長プラグコールドプレート

Also Published As

Publication number Publication date
WO2003065775A3 (en) 2004-03-18
US20050145366A1 (en) 2005-07-07
WO2003065775A2 (en) 2003-08-07
EP1472919A2 (en) 2004-11-03
AU2003209610A1 (en) 2003-09-02
CA2474781A1 (en) 2003-08-07

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