JP2005516425A5 - - Google Patents

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Publication number
JP2005516425A5
JP2005516425A5 JP2003565213A JP2003565213A JP2005516425A5 JP 2005516425 A5 JP2005516425 A5 JP 2005516425A5 JP 2003565213 A JP2003565213 A JP 2003565213A JP 2003565213 A JP2003565213 A JP 2003565213A JP 2005516425 A5 JP2005516425 A5 JP 2005516425A5
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JP
Japan
Prior art keywords
fin
air
cover
heat sink
holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003565213A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005516425A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/IL2003/000066 external-priority patent/WO2003065775A2/en
Publication of JP2005516425A publication Critical patent/JP2005516425A/ja
Publication of JP2005516425A5 publication Critical patent/JP2005516425A5/ja
Pending legal-status Critical Current

Links

JP2003565213A 2002-01-30 2003-01-27 フィン対空気の接触面積が大きいヒートシンク Pending JP2005516425A (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US35225202P 2002-01-30 2002-01-30
US37479802P 2002-04-24 2002-04-24
US39451302P 2002-07-10 2002-07-10
PCT/IL2003/000066 WO2003065775A2 (en) 2002-01-30 2003-01-27 Heat-sink with large fins-to-air contact area

Publications (2)

Publication Number Publication Date
JP2005516425A JP2005516425A (ja) 2005-06-02
JP2005516425A5 true JP2005516425A5 (enExample) 2005-12-22

Family

ID=27670643

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003565213A Pending JP2005516425A (ja) 2002-01-30 2003-01-27 フィン対空気の接触面積が大きいヒートシンク

Country Status (6)

Country Link
US (1) US20050145366A1 (enExample)
EP (1) EP1472919A2 (enExample)
JP (1) JP2005516425A (enExample)
AU (1) AU2003209610A1 (enExample)
CA (1) CA2474781A1 (enExample)
WO (1) WO2003065775A2 (enExample)

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US7324339B2 (en) * 2005-12-21 2008-01-29 International Business Machines Corporation Dual impeller push-pull axial fan heat sink
US8230908B2 (en) 2006-01-05 2012-07-31 International Business Machines Corporation Heat sink for dissipating a thermal load
US7583502B2 (en) * 2006-06-13 2009-09-01 Taiwan Semiconductor Manufacturing Co., Ltd. Method and apparatus for increasing heat dissipation of high performance integrated circuits (IC)
US8432695B2 (en) * 2006-09-19 2013-04-30 Nec Corporation Cooling device
US8360847B2 (en) 2006-11-13 2013-01-29 Igt Multimedia emulation of physical reel hardware in processor-based gaming machines
US8357033B2 (en) 2006-11-13 2013-01-22 Igt Realistic video reels
US8210922B2 (en) 2006-11-13 2012-07-03 Igt Separable game graphics on a gaming machine
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US7905274B2 (en) * 2007-08-21 2011-03-15 Ching-Sung Kuo Wing-spanning thermal-dissipating device
US8758144B2 (en) * 2007-10-23 2014-06-24 Igt Separable backlighting system
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US8559175B2 (en) * 2008-07-25 2013-10-15 Koninlijke Philips N.V. Cooling device for cooling a semiconductor die
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US8720828B2 (en) * 2009-12-03 2014-05-13 The Boeing Company Extended plug cold plate
CN101950197A (zh) * 2010-05-24 2011-01-19 深圳市傲星泰科技有限公司 一种计算机电源
US8425316B2 (en) 2010-08-03 2013-04-23 Igt Methods and systems for improving play of a bonus game on a gaming machine and improving security within a gaming establishment
JP2013115083A (ja) * 2011-11-25 2013-06-10 Fujitsu Semiconductor Ltd 半導体装置及びその製造方法
WO2014181221A2 (en) * 2013-05-08 2014-11-13 Ashwin Bharadwaj Heat sink
US10148155B2 (en) 2013-12-04 2018-12-04 Barrett Technology, Llc Method and apparatus for connecting an ultracompact, high-performance motor controller to an ultracompact, high-performance brushless DC motor
US9603282B2 (en) * 2014-01-03 2017-03-21 Microsoft Technology Licensing, Llc Datacenter and cooling control fault-tolerance using compute resources
US10085363B2 (en) * 2014-05-22 2018-09-25 General Electric Company Integrated compact impingement on extended heat surface
US10103081B2 (en) * 2014-09-08 2018-10-16 Ashwin Bharadwaj Heat sink
US9643233B2 (en) 2014-09-22 2017-05-09 Dell Products, L.P. Bi-directional airflow heatsink
CN106827594B (zh) * 2015-12-03 2019-04-23 中材科技风电叶片股份有限公司 风电叶片的腹板的避雷孔加工方法及预埋孔加工工装
US11421945B1 (en) * 2020-06-25 2022-08-23 Softronics, Ltd. Heat dissipation system with cross-connected heatsink
CN112097559A (zh) * 2020-09-21 2020-12-18 瑞德(新乡)路业有限公司 一种节能型冷却系统
CN113163671A (zh) * 2021-03-03 2021-07-23 上海应用技术大学 一种矿用隔爆型变频器箱及其散热系统
CN113365485B (zh) 2021-08-11 2021-12-07 深圳比特微电子科技有限公司 液冷板散热器
CN114717551B (zh) * 2021-09-09 2024-04-02 安徽夏晟机电科技有限公司 液压支架激光熔覆设备
CN114689910B (zh) * 2022-05-27 2022-08-16 苏州联讯仪器有限公司 一种芯片可靠性测试装置
CN117140830B (zh) * 2023-09-21 2024-02-20 伟达塑胶工业（南通）有限公司 一种pvc改性健身球体加工设备及方法
CN117172160B (zh) * 2023-11-02 2024-01-26 北京蓝威技术有限公司 一种基于反距离加权均值的翅片散热器热阻值获取方法
US12305657B1 (en) * 2024-11-13 2025-05-20 Zhen Kuang Bidirectional blowing fireplace fan
TWI897758B (zh) * 2024-12-10 2025-09-11 技嘉科技股份有限公司 散熱模組
CN119509075B (zh) * 2025-01-20 2025-04-01 烟台首钢电装有限公司 一种组合式预冷蒸发器
CN119920791A (zh) * 2025-04-03 2025-05-02 成都贡爵微电子有限公司 一种高可靠三维异构集成射频微模组

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US6747865B2 (en) * 2001-04-27 2004-06-08 Aavid Thermalloy, Llc Heat sink for electronic components

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