JP2005516406A5 - - Google Patents
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- Publication number
- JP2005516406A5 JP2005516406A5 JP2003564109A JP2003564109A JP2005516406A5 JP 2005516406 A5 JP2005516406 A5 JP 2005516406A5 JP 2003564109 A JP2003564109 A JP 2003564109A JP 2003564109 A JP2003564109 A JP 2003564109A JP 2005516406 A5 JP2005516406 A5 JP 2005516406A5
- Authority
- JP
- Japan
- Prior art keywords
- glass transition
- polymer
- composition
- uncured
- crosslinkable polymer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920000642 polymer Polymers 0.000 claims 19
- 230000009477 glass transition Effects 0.000 claims 18
- 239000000203 mixture Substances 0.000 claims 15
- 238000000034 method Methods 0.000 claims 13
- 230000002401 inhibitory effect Effects 0.000 claims 12
- 239000000758 substrate Substances 0.000 claims 10
- 239000003607 modifier Substances 0.000 claims 8
- 239000000178 monomer Substances 0.000 claims 6
- 238000010438 heat treatment Methods 0.000 claims 3
- 229920001187 thermosetting polymer Polymers 0.000 claims 3
- 239000004634 thermosetting polymer Substances 0.000 claims 3
- 239000004793 Polystyrene Substances 0.000 claims 2
- 150000001875 compounds Chemical class 0.000 claims 2
- FQQOMPOPYZIROF-UHFFFAOYSA-N cyclopenta-2,4-dien-1-one Chemical group O=C1C=CC=C1 FQQOMPOPYZIROF-UHFFFAOYSA-N 0.000 claims 2
- 150000001993 dienes Chemical class 0.000 claims 2
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 claims 2
- 238000004377 microelectronic Methods 0.000 claims 2
- 229920000412 polyarylene Polymers 0.000 claims 2
- 229920002223 polystyrene Polymers 0.000 claims 2
- 239000002904 solvent Substances 0.000 claims 2
- YUOGUVUAZGQYFR-UHFFFAOYSA-N 1,3,5-tris(2-phenylethynyl)benzene Chemical group C1=CC=CC=C1C#CC1=CC(C#CC=2C=CC=CC=2)=CC(C#CC=2C=CC=CC=2)=C1 YUOGUVUAZGQYFR-UHFFFAOYSA-N 0.000 claims 1
- 125000003118 aryl group Chemical group 0.000 claims 1
- 239000007795 chemical reaction product Substances 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 229920006037 cross link polymer Polymers 0.000 claims 1
- 238000001704 evaporation Methods 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
- 230000001629 suppression Effects 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US33805401P | 2001-11-07 | 2001-11-07 | |
| PCT/US2002/035756 WO2003064495A2 (en) | 2001-11-07 | 2002-11-06 | Planarized microelectronic substrates |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005516406A JP2005516406A (ja) | 2005-06-02 |
| JP2005516406A5 true JP2005516406A5 (https=) | 2005-12-22 |
Family
ID=27662938
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003564109A Pending JP2005516406A (ja) | 2001-11-07 | 2002-11-06 | 平坦化マイクロエレクトロニクス基板 |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US7771779B2 (https=) |
| EP (1) | EP1444284B1 (https=) |
| JP (1) | JP2005516406A (https=) |
| KR (1) | KR100876301B1 (https=) |
| CN (1) | CN1307233C (https=) |
| AT (1) | ATE342929T1 (https=) |
| AU (1) | AU2002365226A1 (https=) |
| DE (1) | DE60215533T2 (https=) |
| TW (1) | TWI267525B (https=) |
| WO (1) | WO2003064495A2 (https=) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000040637A1 (en) * | 1999-01-08 | 2000-07-13 | The Dow Chemical Company | Low dielectric constant polymers having good adhesion and toughness and articles made with such polymers |
| US7122079B2 (en) * | 2004-02-27 | 2006-10-17 | Molecular Imprints, Inc. | Composition for an etching mask comprising a silicon-containing material |
| US7157036B2 (en) | 2003-06-17 | 2007-01-02 | Molecular Imprints, Inc | Method to reduce adhesion between a conformable region and a pattern of a mold |
| US7307118B2 (en) | 2004-11-24 | 2007-12-11 | Molecular Imprints, Inc. | Composition to reduce adhesion between a conformable region and a mold |
| US8076386B2 (en) | 2004-02-23 | 2011-12-13 | Molecular Imprints, Inc. | Materials for imprint lithography |
| US7906180B2 (en) | 2004-02-27 | 2011-03-15 | Molecular Imprints, Inc. | Composition for an etching mask comprising a silicon-containing material |
| US20060062922A1 (en) | 2004-09-23 | 2006-03-23 | Molecular Imprints, Inc. | Polymerization technique to attenuate oxygen inhibition of solidification of liquids and composition therefor |
| DE102005047414B4 (de) | 2005-02-21 | 2012-01-05 | Infineon Technologies Ag | Magnetoresistives Sensormodul und Verfahren zum Herstellen desselben |
| KR101157953B1 (ko) * | 2005-06-30 | 2012-06-22 | 엘지디스플레이 주식회사 | 액정표시장치 및 그의 제조방법 |
| US8808808B2 (en) | 2005-07-22 | 2014-08-19 | Molecular Imprints, Inc. | Method for imprint lithography utilizing an adhesion primer layer |
| US8557351B2 (en) | 2005-07-22 | 2013-10-15 | Molecular Imprints, Inc. | Method for adhering materials together |
| US7759407B2 (en) | 2005-07-22 | 2010-07-20 | Molecular Imprints, Inc. | Composition for adhering materials together |
| KR100826104B1 (ko) * | 2006-12-29 | 2008-04-29 | 제일모직주식회사 | 고 내에칭성 반사방지 하드마스크 조성물 및 이를 이용한패턴화된 재료 형상의 제조방법 |
| KR101564676B1 (ko) * | 2008-02-01 | 2015-11-02 | 가부시키가이샤 후지미인코퍼레이티드 | 연마용 조성물 및 이를 이용한 연마 방법 |
| US8415010B2 (en) * | 2008-10-20 | 2013-04-09 | Molecular Imprints, Inc. | Nano-imprint lithography stack with enhanced adhesion between silicon-containing and non-silicon containing layers |
| US8822274B2 (en) * | 2012-10-04 | 2014-09-02 | Texas Instruments Incorporated | Packaged IC having printed dielectric adhesive on die pad |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5002808A (en) * | 1988-03-23 | 1991-03-26 | The Dow Chemical Company | Adhesion methods employing benzocyclobutene-based organosilane adhesion aids |
| US5312994A (en) | 1993-04-02 | 1994-05-17 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Phenylethynyl endcapping reagents and reactive diluents |
| US5965679A (en) * | 1996-09-10 | 1999-10-12 | The Dow Chemical Company | Polyphenylene oligomers and polymers |
| WO2000031183A1 (en) * | 1998-11-24 | 2000-06-02 | The Dow Chemical Company | A composition containing a cross-linkable matrix precursor and a poragen, and a porous matrix prepared therefrom |
| WO2000040637A1 (en) * | 1999-01-08 | 2000-07-13 | The Dow Chemical Company | Low dielectric constant polymers having good adhesion and toughness and articles made with such polymers |
| US6440642B1 (en) | 1999-09-15 | 2002-08-27 | Shipley Company, L.L.C. | Dielectric composition |
| US6359091B1 (en) * | 1999-11-22 | 2002-03-19 | The Dow Chemical Company | Polyarylene compositions with enhanced modulus profiles |
| US6696358B2 (en) * | 2001-01-23 | 2004-02-24 | Honeywell International Inc. | Viscous protective overlayers for planarization of integrated circuits |
-
2002
- 2002-11-06 WO PCT/US2002/035756 patent/WO2003064495A2/en not_active Ceased
- 2002-11-06 CN CNB028257340A patent/CN1307233C/zh not_active Expired - Lifetime
- 2002-11-06 DE DE60215533T patent/DE60215533T2/de not_active Expired - Lifetime
- 2002-11-06 JP JP2003564109A patent/JP2005516406A/ja active Pending
- 2002-11-06 AT AT02804825T patent/ATE342929T1/de not_active IP Right Cessation
- 2002-11-06 US US10/494,240 patent/US7771779B2/en active Active
- 2002-11-06 KR KR1020047007014A patent/KR100876301B1/ko not_active Expired - Lifetime
- 2002-11-06 EP EP02804825A patent/EP1444284B1/en not_active Expired - Lifetime
- 2002-11-06 AU AU2002365226A patent/AU2002365226A1/en not_active Abandoned
- 2002-11-07 TW TW091132806A patent/TWI267525B/zh not_active IP Right Cessation
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