KR100876301B1 - 평탄화된 마이크로전자 기판 - Google Patents

평탄화된 마이크로전자 기판 Download PDF

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Publication number
KR100876301B1
KR100876301B1 KR1020047007014A KR20047007014A KR100876301B1 KR 100876301 B1 KR100876301 B1 KR 100876301B1 KR 1020047007014 A KR1020047007014 A KR 1020047007014A KR 20047007014 A KR20047007014 A KR 20047007014A KR 100876301 B1 KR100876301 B1 KR 100876301B1
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South Korea
Prior art keywords
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glass transition
polymer
composition
uncured
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Expired - Lifetime
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KR1020047007014A
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English (en)
Korean (ko)
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KR20040053289A (ko
Inventor
포스터케니쓰엘
래들러마이클제이
Original Assignee
다우 글로벌 테크놀로지스 인크.
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Publication of KR20040053289A publication Critical patent/KR20040053289A/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
    • H01B3/306—Polyimides or polyesterimides
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/02—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
    • C08G61/10—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aromatic carbon atoms, e.g. polyphenylenes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H01B3/441—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from alkenes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H05K3/4676—Single layer compositions

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Formation Of Insulating Films (AREA)
  • Liquid Crystal (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Inorganic Insulating Materials (AREA)
  • Paints Or Removers (AREA)
KR1020047007014A 2001-11-07 2002-11-06 평탄화된 마이크로전자 기판 Expired - Lifetime KR100876301B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US33805401P 2001-11-07 2001-11-07
US60/338,054 2001-11-07
PCT/US2002/035756 WO2003064495A2 (en) 2001-11-07 2002-11-06 Planarized microelectronic substrates

Publications (2)

Publication Number Publication Date
KR20040053289A KR20040053289A (ko) 2004-06-23
KR100876301B1 true KR100876301B1 (ko) 2008-12-31

Family

ID=27662938

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020047007014A Expired - Lifetime KR100876301B1 (ko) 2001-11-07 2002-11-06 평탄화된 마이크로전자 기판

Country Status (10)

Country Link
US (1) US7771779B2 (https=)
EP (1) EP1444284B1 (https=)
JP (1) JP2005516406A (https=)
KR (1) KR100876301B1 (https=)
CN (1) CN1307233C (https=)
AT (1) ATE342929T1 (https=)
AU (1) AU2002365226A1 (https=)
DE (1) DE60215533T2 (https=)
TW (1) TWI267525B (https=)
WO (1) WO2003064495A2 (https=)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000040637A1 (en) * 1999-01-08 2000-07-13 The Dow Chemical Company Low dielectric constant polymers having good adhesion and toughness and articles made with such polymers
US7122079B2 (en) * 2004-02-27 2006-10-17 Molecular Imprints, Inc. Composition for an etching mask comprising a silicon-containing material
US7157036B2 (en) 2003-06-17 2007-01-02 Molecular Imprints, Inc Method to reduce adhesion between a conformable region and a pattern of a mold
US7307118B2 (en) 2004-11-24 2007-12-11 Molecular Imprints, Inc. Composition to reduce adhesion between a conformable region and a mold
US8076386B2 (en) 2004-02-23 2011-12-13 Molecular Imprints, Inc. Materials for imprint lithography
US7906180B2 (en) 2004-02-27 2011-03-15 Molecular Imprints, Inc. Composition for an etching mask comprising a silicon-containing material
US20060062922A1 (en) 2004-09-23 2006-03-23 Molecular Imprints, Inc. Polymerization technique to attenuate oxygen inhibition of solidification of liquids and composition therefor
DE102005047414B4 (de) 2005-02-21 2012-01-05 Infineon Technologies Ag Magnetoresistives Sensormodul und Verfahren zum Herstellen desselben
KR101157953B1 (ko) * 2005-06-30 2012-06-22 엘지디스플레이 주식회사 액정표시장치 및 그의 제조방법
US8808808B2 (en) 2005-07-22 2014-08-19 Molecular Imprints, Inc. Method for imprint lithography utilizing an adhesion primer layer
US8557351B2 (en) 2005-07-22 2013-10-15 Molecular Imprints, Inc. Method for adhering materials together
US7759407B2 (en) 2005-07-22 2010-07-20 Molecular Imprints, Inc. Composition for adhering materials together
KR100826104B1 (ko) * 2006-12-29 2008-04-29 제일모직주식회사 고 내에칭성 반사방지 하드마스크 조성물　및　이를 이용한패턴화된 재료 형상의　제조방법
KR101564676B1 (ko) * 2008-02-01 2015-11-02 가부시키가이샤 후지미인코퍼레이티드 연마용 조성물 및 이를 이용한 연마 방법
US8415010B2 (en) * 2008-10-20 2013-04-09 Molecular Imprints, Inc. Nano-imprint lithography stack with enhanced adhesion between silicon-containing and non-silicon containing layers
US8822274B2 (en) * 2012-10-04 2014-09-02 Texas Instruments Incorporated Packaged IC having printed dielectric adhesive on die pad

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5965679A (en) 1996-09-10 1999-10-12 The Dow Chemical Company Polyphenylene oligomers and polymers

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5002808A (en) * 1988-03-23 1991-03-26 The Dow Chemical Company Adhesion methods employing benzocyclobutene-based organosilane adhesion aids
US5312994A (en) 1993-04-02 1994-05-17 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Phenylethynyl endcapping reagents and reactive diluents
WO2000031183A1 (en) * 1998-11-24 2000-06-02 The Dow Chemical Company A composition containing a cross-linkable matrix precursor and a poragen, and a porous matrix prepared therefrom
WO2000040637A1 (en) * 1999-01-08 2000-07-13 The Dow Chemical Company Low dielectric constant polymers having good adhesion and toughness and articles made with such polymers
US6440642B1 (en) 1999-09-15 2002-08-27 Shipley Company, L.L.C. Dielectric composition
US6359091B1 (en) * 1999-11-22 2002-03-19 The Dow Chemical Company Polyarylene compositions with enhanced modulus profiles
US6696358B2 (en) * 2001-01-23 2004-02-24 Honeywell International Inc. Viscous protective overlayers for planarization of integrated circuits

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5965679A (en) 1996-09-10 1999-10-12 The Dow Chemical Company Polyphenylene oligomers and polymers

Also Published As

Publication number Publication date
TW200300146A (en) 2003-05-16
KR20040053289A (ko) 2004-06-23
CN1307233C (zh) 2007-03-28
WO2003064495A2 (en) 2003-08-07
TWI267525B (en) 2006-12-01
JP2005516406A (ja) 2005-06-02
WO2003064495A3 (en) 2003-12-04
EP1444284A2 (en) 2004-08-11
ATE342929T1 (de) 2006-11-15
DE60215533D1 (de) 2006-11-30
US7771779B2 (en) 2010-08-10
AU2002365226A1 (en) 2003-09-02
EP1444284B1 (en) 2006-10-18
US20040241338A1 (en) 2004-12-02
DE60215533T2 (de) 2007-04-05
CN1606582A (zh) 2005-04-13

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