JP2005515441A - 電気的測定用プローブとその製造方法 - Google Patents
電気的測定用プローブとその製造方法 Download PDFInfo
- Publication number
- JP2005515441A JP2005515441A JP2003560573A JP2003560573A JP2005515441A JP 2005515441 A JP2005515441 A JP 2005515441A JP 2003560573 A JP2003560573 A JP 2003560573A JP 2003560573 A JP2003560573 A JP 2003560573A JP 2005515441 A JP2005515441 A JP 2005515441A
- Authority
- JP
- Japan
- Prior art keywords
- probe
- probe according
- flexible
- substrate
- coil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000523 sample Substances 0.000 title claims abstract description 53
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 claims abstract description 16
- 238000005259 measurement Methods 0.000 claims abstract description 10
- 239000011888 foil Substances 0.000 claims description 14
- 229910000859 α-Fe Inorganic materials 0.000 claims description 12
- 238000005266 casting Methods 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
- 230000005294 ferromagnetic effect Effects 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 5
- 229920000642 polymer Polymers 0.000 claims description 5
- 239000004642 Polyimide Substances 0.000 claims description 4
- 229920001721 polyimide Polymers 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims 1
- 230000005284 excitation Effects 0.000 abstract description 8
- 230000007547 defect Effects 0.000 abstract description 5
- 230000005291 magnetic effect Effects 0.000 abstract description 3
- 230000003321 amplification Effects 0.000 description 4
- 238000003199 nucleic acid amplification method Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000001419 dependent effect Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/72—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables
- G01N27/82—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables for investigating the presence of flaws
- G01N27/90—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables for investigating the presence of flaws using eddy currents
- G01N27/9013—Arrangements for scanning
- G01N27/902—Arrangements for scanning by moving the sensors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Or Analyzing Materials By The Use Of Magnetic Means (AREA)
- Measuring Leads Or Probes (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP02001268A EP1329730A1 (de) | 2002-01-17 | 2002-01-17 | Wirbelstromsonde auf einem flexiblen Substrat |
| PCT/EP2002/014738 WO2003060530A1 (de) | 2002-01-17 | 2002-12-23 | Sonde für elektrische messverfahren und verwendung einer flexiblen sonde zur herstellung einer unflexiblen sonde |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005515441A true JP2005515441A (ja) | 2005-05-26 |
| JP2005515441A5 JP2005515441A5 (enExample) | 2005-12-22 |
Family
ID=8185297
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003560573A Pending JP2005515441A (ja) | 2002-01-17 | 2002-12-23 | 電気的測定用プローブとその製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US7688067B2 (enExample) |
| EP (2) | EP1329730A1 (enExample) |
| JP (1) | JP2005515441A (enExample) |
| DE (1) | DE50211376D1 (enExample) |
| WO (1) | WO2003060530A1 (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1496355A1 (de) * | 2003-07-09 | 2005-01-12 | Siemens Aktiengesellschaft | Sonde für elektrische Messverfahren, insbesondere für Wirbelstrommessungen |
| US7888932B2 (en) * | 2007-11-05 | 2011-02-15 | General Electric Company | Surface flaw detection system to facilitate nondestructive inspection of a component and methods of assembling the same |
| US7688089B2 (en) * | 2008-01-25 | 2010-03-30 | International Business Machines Corporation | Compliant membrane thin film interposer probe for intergrated circuit device testing |
| US8269489B2 (en) * | 2008-11-25 | 2012-09-18 | General Electric Company | System and method for eddy current inspection of parts with complex geometries |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58153157A (ja) | 1982-03-05 | 1983-09-12 | Shimadzu Corp | 磁気探傷装置の磁気検出器 |
| GB8513006D0 (en) * | 1985-05-22 | 1985-06-26 | Raychem Gmbh | Encapsulating electrical components |
| EP0228177A3 (en) * | 1985-11-19 | 1988-11-02 | Electric Power Research Institute, Inc | Flexible eddy-current coil and coil array for nondestructive testing |
| US5389876A (en) | 1991-05-06 | 1995-02-14 | General Electric Company | Flexible eddy current surface measurement array for detecting near surface flaws in a conductive part |
| JP3208158B2 (ja) | 1991-09-06 | 2001-09-10 | 株式会社東立エンジニアリング | 溶接棒位置決め装置 |
| DE4204643C1 (enExample) * | 1992-02-15 | 1993-05-19 | Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung Ev, 8000 Muenchen, De | |
| US5315234A (en) | 1992-04-03 | 1994-05-24 | General Electric Company | Eddy current device for inspecting a component having a flexible support with a plural sensor array |
| JPH0738956A (ja) | 1993-07-14 | 1995-02-07 | Toshiba Corp | 移動無線通信装置 |
| US5510709A (en) * | 1993-09-27 | 1996-04-23 | General Electric Company | Eddy current surface inspection probe for aircraft fastener inspection, and inspection method |
| US5467775A (en) | 1995-03-17 | 1995-11-21 | University Research Engineers & Associates | Modular auscultation sensor and telemetry system |
| JPH0983104A (ja) * | 1995-09-12 | 1997-03-28 | Murata Mfg Co Ltd | コイル内蔵回路基板 |
| US6002251A (en) | 1995-12-15 | 1999-12-14 | Sun; Yu-Shi | Electromagnetic-field-focusing remote-field eddy-current probe system and method for inspecting anomalies in conducting plates |
| JPH10197492A (ja) | 1997-01-08 | 1998-07-31 | Toshiba Corp | 電磁誘導薄膜プローブ |
| JP2001522046A (ja) * | 1997-11-04 | 2001-11-13 | シーメンス アクチエンゲゼルシヤフト | 渦電流検査ヘッド、渦電流検査ヘッドの製造方法および渦電流検査方法 |
| DE19748556A1 (de) | 1997-11-04 | 1999-05-20 | Siemens Ag | Magnetfluß-Meßsystem zur Wirbelstromprüfung und Verfahren zur Wirbelstromprüfung |
| US6198280B1 (en) * | 1998-04-27 | 2001-03-06 | Siemens Westinghouse Power Corporation | Eddy current flexible field probe deployed through a loading platform |
| US6838890B2 (en) * | 2000-02-25 | 2005-01-04 | Cascade Microtech, Inc. | Membrane probing system |
| EP1496355A1 (de) * | 2003-07-09 | 2005-01-12 | Siemens Aktiengesellschaft | Sonde für elektrische Messverfahren, insbesondere für Wirbelstrommessungen |
| JP3812559B2 (ja) * | 2003-09-18 | 2006-08-23 | Tdk株式会社 | 渦電流プローブ |
-
2002
- 2002-01-17 EP EP02001268A patent/EP1329730A1/de not_active Withdrawn
- 2002-12-23 US US10/501,724 patent/US7688067B2/en not_active Expired - Fee Related
- 2002-12-23 WO PCT/EP2002/014738 patent/WO2003060530A1/de not_active Ceased
- 2002-12-23 DE DE50211376T patent/DE50211376D1/de not_active Expired - Lifetime
- 2002-12-23 JP JP2003560573A patent/JP2005515441A/ja active Pending
- 2002-12-23 EP EP02801068A patent/EP1466181B1/de not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| US20050140366A1 (en) | 2005-06-30 |
| EP1466181B1 (de) | 2007-12-12 |
| US7688067B2 (en) | 2010-03-30 |
| EP1329730A1 (de) | 2003-07-23 |
| DE50211376D1 (de) | 2008-01-24 |
| WO2003060530A1 (de) | 2003-07-24 |
| EP1466181A1 (de) | 2004-10-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4464096B2 (ja) | 成形式渦電流アレイプローブ | |
| CN102549375B (zh) | 表面硬化深度的涡流检验 | |
| US9678175B2 (en) | Eddy current detection | |
| US6400146B1 (en) | Sensor head for ACFM based crack detection | |
| CN1225655C (zh) | 磁探伤装置的漏磁检测传感器及钢带的在线探伤方法 | |
| US6975108B2 (en) | Methods and devices for eddy current PCB inspection | |
| EP2812685B1 (en) | Apparatus and method for measuring properties of a ferromagnetic material | |
| JP4425610B2 (ja) | 特に薄層の厚さ測定装置用の測定プローブ | |
| CN105158330A (zh) | 一种用于曲面零件缺陷检测的柔性涡流传感器 | |
| JPS6355450A (ja) | 非破壊試験用のフレキシブルな渦電流コイルの配列体 | |
| JP2005515441A (ja) | 電気的測定用プローブとその製造方法 | |
| JP2008008806A (ja) | 渦電流探傷法による表面欠陥長さ評価方法及び装置 | |
| JPH01500460A (ja) | 混成分析検査機器用の改良プローブ | |
| JPH08101167A (ja) | 非破壊検査用センサ及びその製造方法 | |
| JPH04221757A (ja) | 欠陥検出装置及び方法 | |
| US7463039B2 (en) | Probe for electrical measurement methods, especially eddy current measurements | |
| Yamada et al. | Application of ECT technique for inspection of bare PCB | |
| JP2006038676A (ja) | 渦流探傷装置のマルチコイル式プローブ及びその製造方法 | |
| US7795863B2 (en) | Method and apparatus for forming coil for use in eddy current sensing probe | |
| JP4328066B2 (ja) | 膜厚検査装置および膜厚検査方法 | |
| KR100358227B1 (ko) | 봉강의 결함탐상용 센서 및 그 제조방법 | |
| Ravat et al. | Study for the design of Eddy Current microsensor arrays for non destructive testing applications | |
| CN105588878A (zh) | 一种涡流阵列检测金属缺陷装置 | |
| KR100954777B1 (ko) | 비파괴 박막센서가 내장된 결함 검출용 멀티프로브 | |
| JPH10197492A (ja) | 電磁誘導薄膜プローブ |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20070614 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20070913 |
|
| A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20070921 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20071011 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20071108 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20080207 |
|
| A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20080215 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20080306 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20080403 |