JP2005511426A5 - - Google Patents
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- Publication number
- JP2005511426A5 JP2005511426A5 JP2003550577A JP2003550577A JP2005511426A5 JP 2005511426 A5 JP2005511426 A5 JP 2005511426A5 JP 2003550577 A JP2003550577 A JP 2003550577A JP 2003550577 A JP2003550577 A JP 2003550577A JP 2005511426 A5 JP2005511426 A5 JP 2005511426A5
- Authority
- JP
- Japan
- Prior art keywords
- foil
- electronic component
- component packaging
- packaging method
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011888 foil Substances 0.000 claims 45
- 238000004806 packaging method and process Methods 0.000 claims 20
- 230000001154 acute Effects 0.000 claims 2
- 239000012528 membrane Substances 0.000 claims 2
- 230000000875 corresponding Effects 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP01204684 | 2001-12-05 | ||
PCT/IB2002/005190 WO2003049522A1 (en) | 2001-12-05 | 2002-11-25 | Method of and device for packaging electronic components thus packaged |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005511426A JP2005511426A (ja) | 2005-04-28 |
JP2005511426A5 true JP2005511426A5 (ko) | 2006-01-26 |
Family
ID=8181355
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003550577A Pending JP2005511426A (ja) | 2001-12-05 | 2002-11-25 | 電子部品包装方法及び装置、並びに同方法で包装した電子部品 |
Country Status (6)
Country | Link |
---|---|
US (2) | US7340872B2 (ko) |
EP (1) | EP1459614A1 (ko) |
JP (1) | JP2005511426A (ko) |
CN (1) | CN1299555C (ko) |
AU (1) | AU2002348875A1 (ko) |
WO (1) | WO2003049522A1 (ko) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10217792A1 (de) * | 2002-04-20 | 2003-11-13 | Infineon Technologies Ag | Verpackungsanlage mit einem Werkzeug zum Einschließen elektronischer Bauteile und Verfahren zum Bestücken eines Traggurtes |
JP4466756B2 (ja) * | 2008-04-02 | 2010-05-26 | 住友電気工業株式会社 | 化合物半導体基板の包装方法 |
JP6151925B2 (ja) * | 2013-02-06 | 2017-06-21 | ヤマハ発動機株式会社 | 基板固定装置、基板作業装置および基板固定方法 |
CN105513996B (zh) * | 2014-09-23 | 2017-12-19 | 软控股份有限公司 | 一种全自动轮胎用rfid电子标签封装设备 |
CN105438524B (zh) * | 2014-09-23 | 2017-11-07 | 软控股份有限公司 | 一种轮胎用rfid电子标签包装设备及包装方法 |
CN112607088B (zh) * | 2020-11-30 | 2023-03-21 | 东莞领杰金属精密制造科技有限公司 | 包装方法及包装装置 |
CN113501159B (zh) * | 2021-08-04 | 2022-07-29 | 深圳市辉悦科技有限公司 | 一种避免芯片损伤供料的芯片编带机 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4575995A (en) * | 1980-04-03 | 1986-03-18 | Murata Manufacturing Co., Ltd. | Automatic producing apparatus of chip-form electronic parts aggregate |
US4757895A (en) * | 1984-09-20 | 1988-07-19 | Gelzer John R | Article packaging system |
US4621486A (en) * | 1984-11-15 | 1986-11-11 | Molex Incorporated | Apparatus for making a tape carrier |
US4867308A (en) * | 1987-05-14 | 1989-09-19 | Crawford Richard J | Storage tape for electronic components |
US5150787A (en) * | 1991-02-21 | 1992-09-29 | Minnesota Mining And Manufacturing Company | Component carrier tape |
US5199564A (en) * | 1992-03-13 | 1993-04-06 | Minnesota Mining And Manufacturing Company | Carrier tape for electronic through-hole components |
US5203143A (en) | 1992-03-28 | 1993-04-20 | Tempo G | Multiple and split pressure sensitive adhesive stratums for carrier tape packaging system |
JPH0837395A (ja) | 1994-07-21 | 1996-02-06 | Matsushita Electric Ind Co Ltd | 半導体チップ供給装置および供給方法 |
US5524765A (en) | 1994-11-15 | 1996-06-11 | Tempo G | Carrier tape packaging system utilizing a layer of gel for retaining small components |
US5857572A (en) * | 1995-12-21 | 1999-01-12 | Bird; Gerald C. | Component carrier tape |
US5938038A (en) * | 1996-08-02 | 1999-08-17 | Dial Tool Industries, Inc. | Parts carrier strip and apparatus for assembling parts in such a strip |
US5966903A (en) * | 1998-05-27 | 1999-10-19 | Lucent Technologies Inc. | High speed flip-chip dispensing |
US6202292B1 (en) * | 1998-08-26 | 2001-03-20 | Micron Technology, Inc. | Apparatus for removing carrier film from a semiconductor die |
JP3838797B2 (ja) * | 1998-10-27 | 2006-10-25 | 松下電器産業株式会社 | 部品の貼り着け方法とその装置 |
JP4275258B2 (ja) * | 1999-07-23 | 2009-06-10 | 富士機械製造株式会社 | 物品供給装置 |
DE10032415A1 (de) * | 2000-07-04 | 2001-10-18 | Infineon Technologies Ag | Vorrichtung zum Verpacken und zum Transport von elektrischen Bauteilen und Herstellungsverfahren |
-
2002
- 2002-11-25 EP EP02781607A patent/EP1459614A1/en not_active Withdrawn
- 2002-11-25 CN CNB028242106A patent/CN1299555C/zh not_active Expired - Fee Related
- 2002-11-25 JP JP2003550577A patent/JP2005511426A/ja active Pending
- 2002-11-25 AU AU2002348875A patent/AU2002348875A1/en not_active Abandoned
- 2002-11-25 US US10/497,644 patent/US7340872B2/en not_active Expired - Fee Related
- 2002-11-25 WO PCT/IB2002/005190 patent/WO2003049522A1/en active Application Filing
-
2008
- 2008-01-22 US US12/018,089 patent/US7823369B2/en not_active Expired - Fee Related
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