JP2005510068A5 - - Google Patents

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Publication number
JP2005510068A5
JP2005510068A5 JP2003545087A JP2003545087A JP2005510068A5 JP 2005510068 A5 JP2005510068 A5 JP 2005510068A5 JP 2003545087 A JP2003545087 A JP 2003545087A JP 2003545087 A JP2003545087 A JP 2003545087A JP 2005510068 A5 JP2005510068 A5 JP 2005510068A5
Authority
JP
Japan
Prior art keywords
substrate
adjacent
cutting tool
substrate regions
fixing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2003545087A
Other languages
English (en)
Japanese (ja)
Other versions
JP3981080B2 (ja
JP2005510068A (ja
Filing date
Publication date
Priority claimed from DE10156395A external-priority patent/DE10156395A1/de
Application filed filed Critical
Publication of JP2005510068A publication Critical patent/JP2005510068A/ja
Publication of JP2005510068A5 publication Critical patent/JP2005510068A5/ja
Application granted granted Critical
Publication of JP3981080B2 publication Critical patent/JP3981080B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2003545087A 2001-11-16 2002-11-14 基体および回路基板にスルーコンタクトを形成する方法および装置 Expired - Fee Related JP3981080B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10156395A DE10156395A1 (de) 2001-11-16 2001-11-16 Verfahren und Vorrichtung zum Durchkontaktieren von Substraten und Leiterplatten
PCT/EP2002/012774 WO2003043394A1 (de) 2001-11-16 2002-11-14 Verfahren und vorrichtung zum durchkontaktieren von substraten und leiterplatten

Publications (3)

Publication Number Publication Date
JP2005510068A JP2005510068A (ja) 2005-04-14
JP2005510068A5 true JP2005510068A5 (enExample) 2006-01-12
JP3981080B2 JP3981080B2 (ja) 2007-09-26

Family

ID=7706026

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003545087A Expired - Fee Related JP3981080B2 (ja) 2001-11-16 2002-11-14 基体および回路基板にスルーコンタクトを形成する方法および装置

Country Status (10)

Country Link
US (1) US7207107B2 (enExample)
EP (1) EP1449415B1 (enExample)
JP (1) JP3981080B2 (enExample)
CN (1) CN100407882C (enExample)
AT (1) ATE291343T1 (enExample)
DE (2) DE10156395A1 (enExample)
ES (1) ES2235102T3 (enExample)
PT (1) PT1449415E (enExample)
RU (1) RU2292680C2 (enExample)
WO (1) WO2003043394A1 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10156395A1 (de) 2001-11-16 2003-05-28 Giesecke & Devrient Gmbh Verfahren und Vorrichtung zum Durchkontaktieren von Substraten und Leiterplatten
NL1030664C2 (nl) * 2005-12-13 2007-06-14 Meco Equip Eng Werkwijze voor het verbinden van sporen aan tegenover elkaar gelegen zijden van een drager.
DE102011014820A1 (de) 2011-03-23 2012-09-27 Giesecke & Devrient Gmbh Substrat mit durchkontaktierten leitfähigen Strukturen und Verfahren zu dessen Herstellung
DE102011016512A1 (de) 2011-04-08 2012-10-11 Giesecke & Devrient Gmbh Verfahren zur Durchkontaktierung elektrisch leitfähiger Strukturen an entgegengesetzten Oberflächen eines Substrats
RU2544709C1 (ru) * 2013-11-26 2015-03-20 Государственное бюджетное образовательное учреждение высшего профессионального образования "Кировская государственная медицинская академия" Министерства здравоохранения Российской Федерации (ГБОУ ВПО Кировская ГМА Минздрава России) Способ в.г. вохмянина получения в детали длинномерных отверстий
US10817768B1 (en) 2019-12-20 2020-10-27 Capital One Services, Llc Systems and methods for preventing chip fraud by inserts in chip pocket
US11049822B1 (en) 2019-12-20 2021-06-29 Capital One Services, Llc Systems and methods for the use of fraud prevention fluid to prevent chip fraud
US10810475B1 (en) 2019-12-20 2020-10-20 Capital One Services, Llc Systems and methods for overmolding a card to prevent chip fraud
US10888940B1 (en) 2019-12-20 2021-01-12 Capital One Services, Llc Systems and methods for saw tooth milling to prevent chip fraud
US10977539B1 (en) 2019-12-20 2021-04-13 Capital One Services, Llc Systems and methods for use of capacitive member to prevent chip fraud
US11715103B2 (en) 2020-08-12 2023-08-01 Capital One Services, Llc Systems and methods for chip-based identity verification and transaction authentication

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2426670A (en) * 1945-12-19 1947-09-02 David N Cooley Apparatus for connecting metallic strips
DE2107591A1 (de) * 1971-02-17 1972-08-31 Siemens Ag Verfahren zur Durchkontaktierung von beidseitig mit Leiterbahnen beschichteten Folien
US3977074A (en) * 1975-02-06 1976-08-31 General Motors Corporation Double sided printed circuit board and method for making same
DE2524581A1 (de) * 1975-06-03 1976-12-23 Siemens Ag Flexible gedruckte schaltung
DE3017320C2 (de) * 1980-05-06 1982-05-27 Siemens AG, 1000 Berlin und 8000 München Verfahren zur Herstellung einer Durchkontaktierung zwischen Metallschichten
JPH01125892A (ja) * 1987-11-10 1989-05-18 Mari Yamazaki 両面形プリント配線板の導通方法
JPH0871981A (ja) * 1994-08-30 1996-03-19 Bridgestone Corp 帯状部材の切断方法および装置
US5718142A (en) * 1995-07-20 1998-02-17 Ferraro; Ronald M. Metal stitcher
DE10122414A1 (de) 2001-05-09 2002-11-14 Giesecke & Devrient Gmbh Durchkontaktierung von flexiblen Leiterplatten
US6705147B2 (en) * 2001-06-21 2004-03-16 Black & Decker Inc. Method and apparatus for fastening steel framing by crimping
DE10156395A1 (de) 2001-11-16 2003-05-28 Giesecke & Devrient Gmbh Verfahren und Vorrichtung zum Durchkontaktieren von Substraten und Leiterplatten

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