DE10156395A1 - Verfahren und Vorrichtung zum Durchkontaktieren von Substraten und Leiterplatten - Google Patents

Verfahren und Vorrichtung zum Durchkontaktieren von Substraten und Leiterplatten

Info

Publication number
DE10156395A1
DE10156395A1 DE10156395A DE10156395A DE10156395A1 DE 10156395 A1 DE10156395 A1 DE 10156395A1 DE 10156395 A DE10156395 A DE 10156395A DE 10156395 A DE10156395 A DE 10156395A DE 10156395 A1 DE10156395 A1 DE 10156395A1
Authority
DE
Germany
Prior art keywords
substrate
cut
cutting tool
adjacent
past
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE10156395A
Other languages
German (de)
English (en)
Inventor
Juergen Usner
Ando Welling
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Giesecke and Devrient GmbH
Original Assignee
Giesecke and Devrient GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Giesecke and Devrient GmbH filed Critical Giesecke and Devrient GmbH
Priority to DE10156395A priority Critical patent/DE10156395A1/de
Priority to EP20020791679 priority patent/EP1449415B1/de
Priority to DE50202510T priority patent/DE50202510D1/de
Priority to JP2003545087A priority patent/JP3981080B2/ja
Priority to RU2004118246A priority patent/RU2292680C2/ru
Priority to AT02791679T priority patent/ATE291343T1/de
Priority to CN028259181A priority patent/CN100407882C/zh
Priority to PCT/EP2002/012774 priority patent/WO2003043394A1/de
Priority to US10/495,564 priority patent/US7207107B2/en
Priority to ES02791679T priority patent/ES2235102T3/es
Priority to PT02791679T priority patent/PT1449415E/pt
Publication of DE10156395A1 publication Critical patent/DE10156395A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/27—Means for performing other operations combined with cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/18—Perforating by slitting, i.e. forming cuts closed at their ends without removal of material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/18—Perforating by slitting, i.e. forming cuts closed at their ends without removal of material
    • B26F1/22—Perforating by slitting, i.e. forming cuts closed at their ends without removal of material to form non-rectilinear cuts, e.g. for tabs
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09081—Tongue or tail integrated in planar structure, e.g. obtained by cutting from the planar structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09836—Oblique hole, via or bump
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/081—Blowing of gas, e.g. for cooling or for providing heat during solder reflowing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/082—Suction, e.g. for holding solder balls or components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y10T29/49135—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting and shaping, e.g., cutting or bending, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/51—Plural diverse manufacturing apparatus including means for metal shaping or assembling
    • Y10T29/5136—Separate tool stations for selective or successive operation on work
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/51—Plural diverse manufacturing apparatus including means for metal shaping or assembling
    • Y10T29/5147—Plural diverse manufacturing apparatus including means for metal shaping or assembling including composite tool
    • Y10T29/5148—Plural diverse manufacturing apparatus including means for metal shaping or assembling including composite tool including severing means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/02—Other than completely through work thickness
    • Y10T83/0207—Other than completely through work thickness or through work presented

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Forests & Forestry (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Container Filling Or Packaging Operations (AREA)
  • Nonmetal Cutting Devices (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Monitoring And Testing Of Exchanges (AREA)
  • Combinations Of Printed Boards (AREA)
DE10156395A 2001-11-16 2001-11-16 Verfahren und Vorrichtung zum Durchkontaktieren von Substraten und Leiterplatten Withdrawn DE10156395A1 (de)

Priority Applications (11)

Application Number Priority Date Filing Date Title
DE10156395A DE10156395A1 (de) 2001-11-16 2001-11-16 Verfahren und Vorrichtung zum Durchkontaktieren von Substraten und Leiterplatten
EP20020791679 EP1449415B1 (de) 2001-11-16 2002-11-14 Verfahren und vorrichtung zum durchkontaktieren von substraten und leiterplatten
DE50202510T DE50202510D1 (de) 2001-11-16 2002-11-14 Verfahren und vorrichtung zum durchkontaktieren von substraten und leiterplatten
JP2003545087A JP3981080B2 (ja) 2001-11-16 2002-11-14 基体および回路基板にスルーコンタクトを形成する方法および装置
RU2004118246A RU2292680C2 (ru) 2001-11-16 2002-11-14 Способ и устройство для выполнения сквозных соединений в подложках и печатных платах
AT02791679T ATE291343T1 (de) 2001-11-16 2002-11-14 Verfahren und vorrichtung zum durchkontaktieren von substraten und leiterplatten
CN028259181A CN100407882C (zh) 2001-11-16 2002-11-14 用于基板和印刷电路板的贯通接触的方法和设备
PCT/EP2002/012774 WO2003043394A1 (de) 2001-11-16 2002-11-14 Verfahren und vorrichtung zum durchkontaktieren von substraten und leiterplatten
US10/495,564 US7207107B2 (en) 2001-11-16 2002-11-14 Method and device for through-hole plating of substrates and printed circuit boards
ES02791679T ES2235102T3 (es) 2001-11-16 2002-11-14 Metodo y aparato para realizar contactos pasantes en sustratos y tarjetas de circuitos.
PT02791679T PT1449415E (pt) 2001-11-16 2002-11-14 Metodo e aparelho proprios para estabelecer contactos atravessantes em substratos e placas de circuitos impressos

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10156395A DE10156395A1 (de) 2001-11-16 2001-11-16 Verfahren und Vorrichtung zum Durchkontaktieren von Substraten und Leiterplatten

Publications (1)

Publication Number Publication Date
DE10156395A1 true DE10156395A1 (de) 2003-05-28

Family

ID=7706026

Family Applications (2)

Application Number Title Priority Date Filing Date
DE10156395A Withdrawn DE10156395A1 (de) 2001-11-16 2001-11-16 Verfahren und Vorrichtung zum Durchkontaktieren von Substraten und Leiterplatten
DE50202510T Expired - Lifetime DE50202510D1 (de) 2001-11-16 2002-11-14 Verfahren und vorrichtung zum durchkontaktieren von substraten und leiterplatten

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE50202510T Expired - Lifetime DE50202510D1 (de) 2001-11-16 2002-11-14 Verfahren und vorrichtung zum durchkontaktieren von substraten und leiterplatten

Country Status (10)

Country Link
US (1) US7207107B2 (enExample)
EP (1) EP1449415B1 (enExample)
JP (1) JP3981080B2 (enExample)
CN (1) CN100407882C (enExample)
AT (1) ATE291343T1 (enExample)
DE (2) DE10156395A1 (enExample)
ES (1) ES2235102T3 (enExample)
PT (1) PT1449415E (enExample)
RU (1) RU2292680C2 (enExample)
WO (1) WO2003043394A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7207107B2 (en) 2001-11-16 2007-04-24 Giesecke & Devrient Gmbh Method and device for through-hole plating of substrates and printed circuit boards

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL1030664C2 (nl) * 2005-12-13 2007-06-14 Meco Equip Eng Werkwijze voor het verbinden van sporen aan tegenover elkaar gelegen zijden van een drager.
DE102011014820A1 (de) 2011-03-23 2012-09-27 Giesecke & Devrient Gmbh Substrat mit durchkontaktierten leitfähigen Strukturen und Verfahren zu dessen Herstellung
DE102011016512A1 (de) 2011-04-08 2012-10-11 Giesecke & Devrient Gmbh Verfahren zur Durchkontaktierung elektrisch leitfähiger Strukturen an entgegengesetzten Oberflächen eines Substrats
RU2544709C1 (ru) * 2013-11-26 2015-03-20 Государственное бюджетное образовательное учреждение высшего профессионального образования "Кировская государственная медицинская академия" Министерства здравоохранения Российской Федерации (ГБОУ ВПО Кировская ГМА Минздрава России) Способ в.г. вохмянина получения в детали длинномерных отверстий
US10817768B1 (en) 2019-12-20 2020-10-27 Capital One Services, Llc Systems and methods for preventing chip fraud by inserts in chip pocket
US11049822B1 (en) 2019-12-20 2021-06-29 Capital One Services, Llc Systems and methods for the use of fraud prevention fluid to prevent chip fraud
US10810475B1 (en) 2019-12-20 2020-10-20 Capital One Services, Llc Systems and methods for overmolding a card to prevent chip fraud
US10888940B1 (en) 2019-12-20 2021-01-12 Capital One Services, Llc Systems and methods for saw tooth milling to prevent chip fraud
US10977539B1 (en) 2019-12-20 2021-04-13 Capital One Services, Llc Systems and methods for use of capacitive member to prevent chip fraud
US11715103B2 (en) 2020-08-12 2023-08-01 Capital One Services, Llc Systems and methods for chip-based identity verification and transaction authentication

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DE2524581A1 (de) * 1975-06-03 1976-12-23 Siemens Ag Flexible gedruckte schaltung

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US2426670A (en) * 1945-12-19 1947-09-02 David N Cooley Apparatus for connecting metallic strips
DE2107591A1 (de) * 1971-02-17 1972-08-31 Siemens Ag Verfahren zur Durchkontaktierung von beidseitig mit Leiterbahnen beschichteten Folien
US3977074A (en) * 1975-02-06 1976-08-31 General Motors Corporation Double sided printed circuit board and method for making same
DE3017320C2 (de) * 1980-05-06 1982-05-27 Siemens AG, 1000 Berlin und 8000 München Verfahren zur Herstellung einer Durchkontaktierung zwischen Metallschichten
JPH01125892A (ja) * 1987-11-10 1989-05-18 Mari Yamazaki 両面形プリント配線板の導通方法
JPH0871981A (ja) * 1994-08-30 1996-03-19 Bridgestone Corp 帯状部材の切断方法および装置
US5718142A (en) * 1995-07-20 1998-02-17 Ferraro; Ronald M. Metal stitcher
DE10122414A1 (de) 2001-05-09 2002-11-14 Giesecke & Devrient Gmbh Durchkontaktierung von flexiblen Leiterplatten
US6705147B2 (en) * 2001-06-21 2004-03-16 Black & Decker Inc. Method and apparatus for fastening steel framing by crimping
DE10156395A1 (de) 2001-11-16 2003-05-28 Giesecke & Devrient Gmbh Verfahren und Vorrichtung zum Durchkontaktieren von Substraten und Leiterplatten

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2524581A1 (de) * 1975-06-03 1976-12-23 Siemens Ag Flexible gedruckte schaltung

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP 01125892 A.,In: Patent Abstracts of Japan *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7207107B2 (en) 2001-11-16 2007-04-24 Giesecke & Devrient Gmbh Method and device for through-hole plating of substrates and printed circuit boards

Also Published As

Publication number Publication date
CN1608398A (zh) 2005-04-20
JP3981080B2 (ja) 2007-09-26
EP1449415A1 (de) 2004-08-25
PT1449415E (pt) 2005-07-29
US20050125997A1 (en) 2005-06-16
CN100407882C (zh) 2008-07-30
RU2004118246A (ru) 2006-01-10
JP2005510068A (ja) 2005-04-14
WO2003043394A1 (de) 2003-05-22
ES2235102T3 (es) 2005-07-01
RU2292680C2 (ru) 2007-01-27
DE50202510D1 (de) 2005-04-21
EP1449415B1 (de) 2005-03-16
US7207107B2 (en) 2007-04-24
ATE291343T1 (de) 2005-04-15

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