JP2005510051A5 - - Google Patents

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Publication number
JP2005510051A5
JP2005510051A5 JP2003544774A JP2003544774A JP2005510051A5 JP 2005510051 A5 JP2005510051 A5 JP 2005510051A5 JP 2003544774 A JP2003544774 A JP 2003544774A JP 2003544774 A JP2003544774 A JP 2003544774A JP 2005510051 A5 JP2005510051 A5 JP 2005510051A5
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JP
Japan
Prior art keywords
oxide
temperature
film
ferrite
microelectronic substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2003544774A
Other languages
English (en)
Japanese (ja)
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JP2005510051A (ja
Filing date
Publication date
Priority claimed from DE10155594A external-priority patent/DE10155594A1/de
Application filed filed Critical
Publication of JP2005510051A publication Critical patent/JP2005510051A/ja
Publication of JP2005510051A5 publication Critical patent/JP2005510051A5/ja
Withdrawn legal-status Critical Current

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JP2003544774A 2001-11-13 2002-11-13 多層マイクロエレクトロニック基材の製造方法 Withdrawn JP2005510051A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10155594A DE10155594A1 (de) 2001-11-13 2001-11-13 Verfrahren zum Herstellen eines aus mehreren Schichten bestehenden mikroelektronischen Substrats
PCT/IB2002/004763 WO2003043035A1 (en) 2001-11-13 2002-11-13 Method of producing a multilayer microelectronic substrate

Publications (2)

Publication Number Publication Date
JP2005510051A JP2005510051A (ja) 2005-04-14
JP2005510051A5 true JP2005510051A5 (https=) 2006-01-05

Family

ID=7705522

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003544774A Withdrawn JP2005510051A (ja) 2001-11-13 2002-11-13 多層マイクロエレクトロニック基材の製造方法

Country Status (6)

Country Link
US (2) US7158365B2 (https=)
EP (1) EP1449224A1 (https=)
JP (1) JP2005510051A (https=)
CN (1) CN1585992A (https=)
DE (1) DE10155594A1 (https=)
WO (1) WO2003043035A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004031878B3 (de) * 2004-07-01 2005-10-06 Epcos Ag Elektrisches Mehrschichtbauelement mit zuverlässigem Lötkontakt
US20060279171A1 (en) * 2005-06-10 2006-12-14 Viehland Dwight D Broadband, Nonreciprocal Network Element
DE102007009740A1 (de) * 2007-02-28 2008-09-04 Siemens Ag Verfahren zum Herstellen eines magnetischen Keramikmaterials und Verwendung des Keramikmaterials
US20080220542A1 (en) * 2007-03-07 2008-09-11 Micheli Adolph L Low-fire ferroelectric material
DE102009014542B3 (de) * 2009-02-12 2010-12-02 Epcos Ag Mehrschichtbauelement und Verfahren zur Herstellung
JP6574574B6 (ja) * 2015-01-21 2020-01-15 Ｎｊコンポーネント株式会社 積層インダクタ

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE554942A (https=) * 1956-02-14
SU378969A1 (ru) 1967-02-06 1973-04-18 Ферритовый материал
SU661620A2 (ru) 1977-04-26 1979-05-05 Предприятие П/Я А-1216 Ферритовый материал
JPH0541315A (ja) 1991-08-02 1993-02-19 Tokin Corp 低損失酸化物磁性材料の製造方法
US5176771A (en) * 1991-12-23 1993-01-05 Hughes Aircraft Company Multilayer ceramic tape substrate having cavities formed in the upper layer thereof and method of fabricating the same by printing and delamination
JPH06237742A (ja) 1992-03-31 1994-08-30 Chiyoda Corp 果汁製品の製造方法
US5259110A (en) * 1992-04-03 1993-11-09 International Business Machines Corporation Method for forming a multilayer microelectronic wiring module
US5426075A (en) * 1994-06-15 1995-06-20 Ramtron International Corporation Method of manufacturing ferroelectric bismuth layered oxides
US5600533A (en) * 1994-06-23 1997-02-04 Murata Manufacturing Co., Ltd. Multilayer ceramic capacitor having an anti-reducing agent
US5648015A (en) * 1995-01-26 1997-07-15 Ferronics Incorporated Process for preparing a ferromagnetic material
JPH09306716A (ja) 1996-05-14 1997-11-28 Taiyo Yuden Co Ltd フェライト焼結体およびその製造方法
JP3631341B2 (ja) * 1996-10-18 2005-03-23 Ｔｄｋ株式会社 積層型複合機能素子およびその製造方法
US6080468A (en) * 1997-02-28 2000-06-27 Taiyo Yuden Co., Ltd. Laminated composite electronic device and a manufacturing method thereof
WO2000004577A1 (de) 1998-07-15 2000-01-27 Siemens Aktiengesellschaft Verfahren zur herstellung eines keramischen körpers mit einem integrierten passiven elektronischen bauelement, derartiger körper und verwendung des körpers
US6191934B1 (en) * 1998-10-02 2001-02-20 Sarnoff Corporation & Co., Ltd. High dielectric constant embedded capacitors
TW398060B (en) 1998-11-24 2000-07-11 Advanced Ceramic X Corp Fabrication method for ceramic chip of semiconductor diode
DE19924354A1 (de) 1999-05-27 2000-11-30 Philips Corp Intellectual Pty Bauelement mit magnetodielektrischem Material
JP3758464B2 (ja) * 2000-05-12 2006-03-22 株式会社村田製作所 積層電子部品

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