JP2005506910A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2005506910A5 JP2005506910A5 JP2003540075A JP2003540075A JP2005506910A5 JP 2005506910 A5 JP2005506910 A5 JP 2005506910A5 JP 2003540075 A JP2003540075 A JP 2003540075A JP 2003540075 A JP2003540075 A JP 2003540075A JP 2005506910 A5 JP2005506910 A5 JP 2005506910A5
- Authority
- JP
- Japan
- Prior art keywords
- region
- functional layer
- micromachining type
- substrate
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005459 micromachining Methods 0.000 claims 16
- 239000002346 layers by function Substances 0.000 claims 12
- 239000000463 material Substances 0.000 claims 11
- 239000000758 substrate Substances 0.000 claims 8
- 238000004519 manufacturing process Methods 0.000 claims 4
- 238000000034 method Methods 0.000 claims 4
- 239000010410 layer Substances 0.000 claims 3
- 239000011241 protective layer Substances 0.000 claims 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 2
- 239000000470 constituent Substances 0.000 claims 2
- 238000005530 etching Methods 0.000 claims 2
- 239000004020 conductor Substances 0.000 claims 1
- 238000000151 deposition Methods 0.000 claims 1
- 239000011810 insulating material Substances 0.000 claims 1
- 238000005304 joining Methods 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 238000005498 polishing Methods 0.000 claims 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims 1
- 235000012239 silicon dioxide Nutrition 0.000 claims 1
- 239000000377 silicon dioxide Substances 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10152254A DE10152254A1 (de) | 2001-10-20 | 2001-10-20 | Mikromechanisches Bauelement und entsprechendes Herstellungsverfahren |
| PCT/DE2002/003283 WO2003037782A2 (de) | 2001-10-20 | 2002-09-05 | Mikromechanisches bauelement und entsprechendes herstellungsverfahren |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005506910A JP2005506910A (ja) | 2005-03-10 |
| JP2005506910A5 true JP2005506910A5 (enExample) | 2006-01-05 |
| JP4638671B2 JP4638671B2 (ja) | 2011-02-23 |
Family
ID=7703424
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003540075A Expired - Fee Related JP4638671B2 (ja) | 2001-10-20 | 2002-09-05 | マイクロマシニング型の構成エレメントおよび相応の製作法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US7312553B2 (enExample) |
| EP (1) | EP1441976A2 (enExample) |
| JP (1) | JP4638671B2 (enExample) |
| DE (1) | DE10152254A1 (enExample) |
| WO (1) | WO2003037782A2 (enExample) |
Families Citing this family (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1687896B1 (en) * | 2003-11-14 | 2007-06-13 | Koninklijke Philips Electronics N.V. | Semiconductor device with a resonator |
| DE102004006201B4 (de) * | 2004-02-09 | 2011-12-08 | Robert Bosch Gmbh | Drucksensor mit Siliziumchip auf einer Stahlmembran |
| JP4422624B2 (ja) | 2004-03-03 | 2010-02-24 | 日本航空電子工業株式会社 | 微小可動デバイス及びその作製方法 |
| CN100444317C (zh) * | 2004-03-03 | 2008-12-17 | 日本航空电子工业株式会社 | 微型移动装置及其制作方法 |
| EP1727177B1 (en) * | 2004-03-12 | 2017-01-04 | Hamamatsu Photonics K.K. | Process for producing a photoelectric layered member and layered member |
| DE102005004877A1 (de) * | 2005-02-03 | 2006-08-10 | Robert Bosch Gmbh | Mikromechanisches Bauelement und entsprechendes Herstellungsverfahren |
| DE102005029803A1 (de) * | 2005-06-27 | 2007-01-04 | Robert Bosch Gmbh | Verfahren zur Herstellung eines mikromechanischen Bauelements sowie mikromechanisches Bauelement |
| EP1832841B1 (en) * | 2006-03-10 | 2015-12-30 | STMicroelectronics Srl | Microelectromechanical integrated sensor structure with rotary driving motion |
| US7409862B2 (en) * | 2006-10-18 | 2008-08-12 | Honeywell International Inc. | Systems and methods for isolation of torque and sense capacitors of an accelerometer |
| US7639104B1 (en) | 2007-03-09 | 2009-12-29 | Silicon Clocks, Inc. | Method for temperature compensation in MEMS resonators with isolated regions of distinct material |
| JP5432440B2 (ja) * | 2007-07-04 | 2014-03-05 | キヤノン株式会社 | 揺動体装置 |
| DE102008001071B4 (de) * | 2008-04-09 | 2017-05-24 | Robert Bosch Gmbh | Mikromechanische Aktuatorstruktur und entsprechendes Betätigungsverfahren |
| US7999201B2 (en) * | 2008-11-06 | 2011-08-16 | Shandong Gettop Acoustic Co. Ltd. | MEMS G-switch device |
| JP5329932B2 (ja) * | 2008-12-08 | 2013-10-30 | 佐藤 一雄 | シリコン微細構造体の製造方法及び微細流路デバイスの製造方法 |
| US8040207B2 (en) | 2009-01-15 | 2011-10-18 | Infineon Technologies Ag | MEMS resonator devices with a plurality of mass elements formed thereon |
| DE102009027873B4 (de) | 2009-07-21 | 2022-11-17 | Robert Bosch Gmbh | Mikromechanisches System und zugehöriges Herstellungsverfahren |
| WO2011083162A2 (de) * | 2010-01-11 | 2011-07-14 | Elmos Semiconductor Ag | Mikroelektromechanisches halbleiterbauelement |
| GB201020722D0 (en) * | 2010-12-07 | 2011-01-19 | Atlantic Inertial Systems Ltd | Accelerometer |
| EP2515436A1 (en) * | 2011-04-18 | 2012-10-24 | Nxp B.V. | MEMS resonator and method of controlling the same |
| CN103869099B (zh) * | 2012-12-10 | 2016-09-07 | 原相科技股份有限公司 | 具有低膨胀系数差异的微机电装置 |
| US8902010B2 (en) * | 2013-01-02 | 2014-12-02 | Motorola Mobility Llc | Microelectronic machine-based ariable |
| FR3071492B1 (fr) * | 2017-09-25 | 2021-07-09 | Commissariat Energie Atomique | Micro-dispositif comportant un element protege contre une gravure hf et forme d'un materiau comprenant un semi-conducteur et un metal |
| GB2570732B (en) * | 2018-02-06 | 2023-01-11 | Atlantic Inertial Systems Ltd | Angular rate sensors |
| DE102018213735B4 (de) * | 2018-08-15 | 2020-03-12 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Bauelement und Verfahren zum Herstellen eines Bauelements |
| DE102018222615B4 (de) * | 2018-12-20 | 2021-09-02 | Robert Bosch Gmbh | Bauelement mit einer optimierten mehrlagigen Torsionsfeder |
| DE102020210597A1 (de) | 2020-08-20 | 2022-02-24 | Robert Bosch Gesellschaft mit beschränkter Haftung | Verfahren zur Herstellung einer mikroelektromechanischen Struktur und mikroelektromechanische Struktur |
| DE102021200074A1 (de) | 2021-01-07 | 2022-07-07 | Robert Bosch Gesellschaft mit beschränkter Haftung | Mikromechanisches Bauteil für eine Sensorvorrichtung |
| CN116147600A (zh) * | 2021-10-27 | 2023-05-23 | 苏州明皜传感科技股份有限公司 | 微机电多轴角速度感测器 |
| DE102022114406A1 (de) | 2022-06-08 | 2023-12-14 | Northrop Grumman Litef Gmbh | Mikroelektromechanische Kopplungsvorrichtung |
| CN120076700B (zh) * | 2025-04-30 | 2025-07-15 | 成都纤声科技有限公司 | 一种半导体器件及其制备方法 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6472794B1 (en) * | 1992-07-10 | 2002-10-29 | Matsushita Electric Industrial Co., Ltd. | Microactuator |
| DE4241045C1 (de) | 1992-12-05 | 1994-05-26 | Bosch Gmbh Robert | Verfahren zum anisotropen Ätzen von Silicium |
| DE4317274A1 (de) | 1993-05-25 | 1994-12-01 | Bosch Gmbh Robert | Verfahren zur Herstellung oberflächen-mikromechanischer Strukturen |
| US5536988A (en) * | 1993-06-01 | 1996-07-16 | Cornell Research Foundation, Inc. | Compound stage MEM actuator suspended for multidimensional motion |
| DE4419844B4 (de) * | 1994-06-07 | 2009-11-19 | Robert Bosch Gmbh | Beschleunigungssensor |
| DE4420962C2 (de) | 1994-06-16 | 1998-09-17 | Bosch Gmbh Robert | Verfahren zur Bearbeitung von Silizium |
| DE19537814B4 (de) | 1995-10-11 | 2009-11-19 | Robert Bosch Gmbh | Sensor und Verfahren zur Herstellung eines Sensors |
| DE19704454C2 (de) | 1997-02-06 | 2000-03-02 | Bosch Gmbh Robert | Verfahren zur Herstellung oberflächenmikromechanischer Strukturen mittels Ätzung in der Dampfphase |
| US6121552A (en) * | 1997-06-13 | 2000-09-19 | The Regents Of The University Of Caliofornia | Microfabricated high aspect ratio device with an electrical isolation trench |
| US6079873A (en) | 1997-10-20 | 2000-06-27 | The United States Of America As Represented By The Secretary Of Commerce | Micron-scale differential scanning calorimeter on a chip |
| US6151964A (en) * | 1998-05-25 | 2000-11-28 | Citizen Watch Co., Ltd. | Angular velocity sensing device |
| US6291875B1 (en) * | 1998-06-24 | 2001-09-18 | Analog Devices Imi, Inc. | Microfabricated structures with electrical isolation and interconnections |
| JP2000065855A (ja) * | 1998-08-17 | 2000-03-03 | Mitsubishi Electric Corp | 半導体加速度スイッチ、半導体加速度スイッチの製造方法 |
| DE19847455A1 (de) | 1998-10-15 | 2000-04-27 | Bosch Gmbh Robert | Verfahren zur Bearbeitung von Silizium mittels Ätzprozessen |
| JP4238437B2 (ja) | 1999-01-25 | 2009-03-18 | 株式会社デンソー | 半導体力学量センサとその製造方法 |
-
2001
- 2001-10-20 DE DE10152254A patent/DE10152254A1/de not_active Ceased
-
2002
- 2002-09-05 WO PCT/DE2002/003283 patent/WO2003037782A2/de not_active Ceased
- 2002-09-05 JP JP2003540075A patent/JP4638671B2/ja not_active Expired - Fee Related
- 2002-09-05 EP EP02772043A patent/EP1441976A2/de not_active Ceased
- 2002-09-05 US US10/492,896 patent/US7312553B2/en not_active Expired - Lifetime
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2005506910A5 (enExample) | ||
| JP4880878B2 (ja) | マルチメタルレイヤmems構造及びこれを作製するプロセス | |
| JP5602761B2 (ja) | 分離した微細構造を有する微小電気機械システムデバイス及びその製造方法 | |
| TWI380456B (en) | Micro-electro-mechanical device and method for making same | |
| CN206635022U (zh) | 微机电器件 | |
| CN101780944B (zh) | 一种mems微桥结构的制备方法 | |
| JP2003039395A (ja) | 懸架微細構造を形成する方法 | |
| TW201811658A (zh) | 用於微機電系統(mems)裝置及互補金屬氧化物半導體(cmos)裝置之整合方案 | |
| JP2003517611A (ja) | 半導体素子、殊には加速度センサをマイクロメカニカル製造するための方法 | |
| CN111204703B (zh) | 微机电系统装置的制造方法 | |
| CN103985814A (zh) | 双层压电薄膜悬臂梁传感器结构及其制造方法 | |
| CN106957044B (zh) | 一种mems器件及其制造方法和电子装置 | |
| CN107304038B (zh) | 一种mems器件及其制备方法、电子装置 | |
| CN107852555A (zh) | Dsr扬声器元件及制造dsr扬声器元件的方法 | |
| TW201103858A (en) | Microelectronic device and method for fabricating MEMS resonator thereof | |
| US20210107785A1 (en) | Selective self-assembled monolayer patterning with sacrificial layer for devices | |
| US8710601B2 (en) | MEMS structure and method for making the same | |
| CN108609573A (zh) | 一种mems器件及其制备方法、电子装置 | |
| CN105197871B (zh) | Mems器件及其制造方法 | |
| JP4726927B2 (ja) | 集積化マイクロエレクトロメカニカルシステムおよびその製造方法 | |
| CN111182430B (zh) | 一种mems结构 | |
| US10290721B2 (en) | Method of fabricating an electromechanical structure including at least one mechanical reinforcing pillar | |
| JP2005516221A (ja) | 加速度計製造方法 | |
| CN106032267B (zh) | 一种mems器件及其制作方法和电子装置 | |
| TWI803632B (zh) | 製造蝕刻停止層之方法及包含蝕刻停止層之微機電系統感測器 |