JP2005505910A5 - - Google Patents

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Publication number
JP2005505910A5
JP2005505910A5 JP2002566550A JP2002566550A JP2005505910A5 JP 2005505910 A5 JP2005505910 A5 JP 2005505910A5 JP 2002566550 A JP2002566550 A JP 2002566550A JP 2002566550 A JP2002566550 A JP 2002566550A JP 2005505910 A5 JP2005505910 A5 JP 2005505910A5
Authority
JP
Japan
Prior art keywords
signal
riser
trace
vias
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002566550A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005505910A (ja
JP4156927B2 (ja
Filing date
Publication date
Priority claimed from US09/789,401 external-priority patent/US8125087B2/en
Application filed filed Critical
Publication of JP2005505910A publication Critical patent/JP2005505910A/ja
Publication of JP2005505910A5 publication Critical patent/JP2005505910A5/ja
Application granted granted Critical
Publication of JP4156927B2 publication Critical patent/JP4156927B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2002566550A 2001-02-20 2002-02-01 多層板装置 Expired - Fee Related JP4156927B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/789,401 US8125087B2 (en) 2001-02-20 2001-02-20 High-density flip-chip interconnect
PCT/US2002/002836 WO2002067325A2 (en) 2001-02-20 2002-02-01 High-density flip-chip interconnect

Publications (3)

Publication Number Publication Date
JP2005505910A JP2005505910A (ja) 2005-02-24
JP2005505910A5 true JP2005505910A5 (https=) 2005-12-22
JP4156927B2 JP4156927B2 (ja) 2008-09-24

Family

ID=25147535

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002566550A Expired - Fee Related JP4156927B2 (ja) 2001-02-20 2002-02-01 多層板装置

Country Status (7)

Country Link
US (1) US8125087B2 (https=)
EP (1) EP1364403A2 (https=)
JP (1) JP4156927B2 (https=)
KR (1) KR100732123B1 (https=)
CN (1) CN1331222C (https=)
AU (1) AU2002236936A1 (https=)
WO (1) WO2002067325A2 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100615606B1 (ko) * 2005-03-15 2006-08-25 삼성전자주식회사 메모리 모듈 및 이 모듈의 신호 라인 배치 방법
JP2009175198A (ja) 2008-01-21 2009-08-06 Sony Corp Ｅｌ表示パネル及び電子機器
US12033903B1 (en) * 2021-12-09 2024-07-09 Amazon Technologies, Inc. High-density microbump and probe pad arrangement for semiconductor components

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0563029A (ja) * 1991-09-02 1993-03-12 Fujitsu Ltd 半導体素子
JPH05129366A (ja) * 1991-11-08 1993-05-25 Fujitsu Ltd 集積回路用ｔａｂ実装構造
US5545923A (en) * 1993-10-22 1996-08-13 Lsi Logic Corporation Semiconductor device assembly with minimized bond finger connections
US5424492A (en) * 1994-01-06 1995-06-13 Dell Usa, L.P. Optimal PCB routing methodology for high I/O density interconnect devices
US5906042A (en) * 1995-10-04 1999-05-25 Prolinx Labs Corporation Method and structure to interconnect traces of two conductive layers in a printed circuit board
US5764489A (en) * 1996-07-18 1998-06-09 Compaq Computer Corporation Apparatus for controlling the impedance of high speed signals on a printed circuit board
US5812379A (en) * 1996-08-13 1998-09-22 Intel Corporation Small diameter ball grid array pad size for improved motherboard routing
JPH10303562A (ja) * 1997-04-30 1998-11-13 Toshiba Corp プリント配線板
JP3386977B2 (ja) * 1997-06-05 2003-03-17 新光電気工業株式会社 多層回路基板
JP3152180B2 (ja) * 1997-10-03 2001-04-03 日本電気株式会社 半導体装置及びその製造方法
US6011695A (en) * 1998-11-02 2000-01-04 Intel Corporation External bus interface printed circuit board routing for a ball grid array integrated circuit package
US6310398B1 (en) * 1998-12-03 2001-10-30 Walter M. Katz Routable high-density interfaces for integrated circuit devices
DE60039569D1 (de) 1999-11-02 2008-09-04 Canon Kk Gedruckte Leiterplatte

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