JP2005500677A5 - - Google Patents
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- Publication number
- JP2005500677A5 JP2005500677A5 JP2003521074A JP2003521074A JP2005500677A5 JP 2005500677 A5 JP2005500677 A5 JP 2005500677A5 JP 2003521074 A JP2003521074 A JP 2003521074A JP 2003521074 A JP2003521074 A JP 2003521074A JP 2005500677 A5 JP2005500677 A5 JP 2005500677A5
- Authority
- JP
- Japan
- Prior art keywords
- module
- power tool
- housing
- cover
- power
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 8
- 238000010292 electrical insulation Methods 0.000 claims 7
- 239000000463 material Substances 0.000 claims 7
- 238000004382 potting Methods 0.000 claims 7
- 239000011800 void material Substances 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US92741801A | 2001-08-10 | 2001-08-10 | |
| PCT/US2002/025547 WO2003017742A1 (en) | 2001-08-10 | 2002-08-09 | Electrically isolated module |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005500677A JP2005500677A (ja) | 2005-01-06 |
| JP2005500677A5 true JP2005500677A5 (enExample) | 2006-01-05 |
| JP4130628B2 JP4130628B2 (ja) | 2008-08-06 |
Family
ID=25454700
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003521074A Expired - Fee Related JP4130628B2 (ja) | 2001-08-10 | 2002-08-09 | 電気絶縁されたモジュール |
Country Status (11)
| Country | Link |
|---|---|
| EP (1) | EP1421837B1 (enExample) |
| JP (1) | JP4130628B2 (enExample) |
| CN (1) | CN1593075B (enExample) |
| AT (1) | ATE508621T1 (enExample) |
| AU (1) | AU2002343325B2 (enExample) |
| BR (1) | BR0211840A (enExample) |
| CA (1) | CA2457438A1 (enExample) |
| DE (1) | DE60239942D1 (enExample) |
| NZ (1) | NZ531008A (enExample) |
| TW (1) | TW579322B (enExample) |
| WO (1) | WO2003017742A1 (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102008041366A1 (de) * | 2008-08-20 | 2010-02-25 | Robert Bosch Gmbh | Elektronikmodul |
| JP5610284B2 (ja) * | 2010-09-28 | 2014-10-22 | 日本電産シンポ株式会社 | 発熱素子の放熱構造 |
| US20140138811A1 (en) * | 2012-11-21 | 2014-05-22 | Nvidia Corporation | A semiconductor device including a heat-spreading lid |
| CN105765716B (zh) * | 2014-05-15 | 2018-06-22 | 富士电机株式会社 | 功率半导体模块和复合模块 |
| US10882123B2 (en) | 2015-02-25 | 2021-01-05 | Milwaukee Electric Tool Corporation | Miter saw |
| CN107645874A (zh) * | 2016-07-20 | 2018-01-30 | 珠海市声驰电器有限公司 | 一种密封电路结构及其灌封方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| IT992650B (it) * | 1973-07-19 | 1975-09-30 | Ates Componenti Elettron | Elemento per accoppiare un radiatore di calore con la massa termica di un dispositivo integra to nel montaggio su circuito stam pato |
| GB2190795B (en) * | 1986-05-09 | 1990-01-10 | Hella Kg Hueck & Co | Circuit arrangement |
| IT1252624B (it) * | 1991-12-05 | 1995-06-19 | Cons Ric Microelettronica | Dispositivo semiconduttore incapsulato in resina e elettricamente isolato di migliorate caratteristiche di isolamento,e relativo processo di fabbricazione |
| US5321582A (en) * | 1993-04-26 | 1994-06-14 | Cummins Engine Company, Inc. | Electronic component heat sink attachment using a low force spring |
| US5558166A (en) * | 1995-04-28 | 1996-09-24 | Chen; Ching-Jen | Power tool |
| US5835350A (en) * | 1996-12-23 | 1998-11-10 | Lucent Technologies Inc. | Encapsulated, board-mountable power supply and method of manufacture therefor |
| US5909358A (en) * | 1997-11-26 | 1999-06-01 | Todd Engineering Sales, Inc. | Snap-lock heat sink clip |
| DE69905036T2 (de) * | 1999-09-01 | 2004-01-22 | Ramarathnam, Ramachandran | Elektrohandwerkzeug |
-
2002
- 2002-08-09 CA CA002457438A patent/CA2457438A1/en not_active Abandoned
- 2002-08-09 CN CN02820232.5A patent/CN1593075B/zh not_active Expired - Fee Related
- 2002-08-09 WO PCT/US2002/025547 patent/WO2003017742A1/en not_active Ceased
- 2002-08-09 NZ NZ531008A patent/NZ531008A/en not_active IP Right Cessation
- 2002-08-09 EP EP02780260A patent/EP1421837B1/en not_active Expired - Lifetime
- 2002-08-09 JP JP2003521074A patent/JP4130628B2/ja not_active Expired - Fee Related
- 2002-08-09 BR BR0211840-8A patent/BR0211840A/pt not_active IP Right Cessation
- 2002-08-09 TW TW091118014A patent/TW579322B/zh not_active IP Right Cessation
- 2002-08-09 AU AU2002343325A patent/AU2002343325B2/en not_active Ceased
- 2002-08-09 DE DE60239942T patent/DE60239942D1/de not_active Expired - Lifetime
- 2002-08-09 AT AT02780260T patent/ATE508621T1/de not_active IP Right Cessation
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