NZ531008A - Electrically isolated module - Google Patents

Electrically isolated module

Info

Publication number
NZ531008A
NZ531008A NZ531008A NZ53100802A NZ531008A NZ 531008 A NZ531008 A NZ 531008A NZ 531008 A NZ531008 A NZ 531008A NZ 53100802 A NZ53100802 A NZ 53100802A NZ 531008 A NZ531008 A NZ 531008A
Authority
NZ
New Zealand
Prior art keywords
housing
module
power device
power
control module
Prior art date
Application number
NZ531008A
Other languages
English (en)
Inventor
Zolie W Privett
Brian R Crowell
Original Assignee
Black & Decker Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Black & Decker Inc filed Critical Black & Decker Inc
Publication of NZ531008A publication Critical patent/NZ531008A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H9/00—Details of switching devices, not covered by groups H01H1/00 - H01H7/00
    • H01H9/52—Cooling of switch parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Registering, Tensioning, Guiding Webs, And Rollers Therefor (AREA)
  • Conductive Materials (AREA)
  • Control And Other Processes For Unpacking Of Materials (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Control Of Electric Motors In General (AREA)
NZ531008A 2001-08-10 2002-08-09 Electrically isolated module NZ531008A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US92741801A 2001-08-10 2001-08-10
PCT/US2002/025547 WO2003017742A1 (en) 2001-08-10 2002-08-09 Electrically isolated module

Publications (1)

Publication Number Publication Date
NZ531008A true NZ531008A (en) 2006-08-31

Family

ID=25454700

Family Applications (1)

Application Number Title Priority Date Filing Date
NZ531008A NZ531008A (en) 2001-08-10 2002-08-09 Electrically isolated module

Country Status (11)

Country Link
EP (1) EP1421837B1 (enExample)
JP (1) JP4130628B2 (enExample)
CN (1) CN1593075B (enExample)
AT (1) ATE508621T1 (enExample)
AU (1) AU2002343325B2 (enExample)
BR (1) BR0211840A (enExample)
CA (1) CA2457438A1 (enExample)
DE (1) DE60239942D1 (enExample)
NZ (1) NZ531008A (enExample)
TW (1) TW579322B (enExample)
WO (1) WO2003017742A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008041366A1 (de) * 2008-08-20 2010-02-25 Robert Bosch Gmbh Elektronikmodul
JP5610284B2 (ja) * 2010-09-28 2014-10-22 日本電産シンポ株式会社 発熱素子の放熱構造
US20140138811A1 (en) * 2012-11-21 2014-05-22 Nvidia Corporation A semiconductor device including a heat-spreading lid
CN105765716B (zh) * 2014-05-15 2018-06-22 富士电机株式会社 功率半导体模块和复合模块
US10882123B2 (en) 2015-02-25 2021-01-05 Milwaukee Electric Tool Corporation Miter saw
CN107645874A (zh) * 2016-07-20 2018-01-30 珠海市声驰电器有限公司 一种密封电路结构及其灌封方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT992650B (it) * 1973-07-19 1975-09-30 Ates Componenti Elettron Elemento per accoppiare un radiatore di calore con la massa termica di un dispositivo integra to nel montaggio su circuito stam pato
GB2190795B (en) * 1986-05-09 1990-01-10 Hella Kg Hueck & Co Circuit arrangement
IT1252624B (it) * 1991-12-05 1995-06-19 Cons Ric Microelettronica Dispositivo semiconduttore incapsulato in resina e elettricamente isolato di migliorate caratteristiche di isolamento,e relativo processo di fabbricazione
US5321582A (en) * 1993-04-26 1994-06-14 Cummins Engine Company, Inc. Electronic component heat sink attachment using a low force spring
US5558166A (en) * 1995-04-28 1996-09-24 Chen; Ching-Jen Power tool
US5835350A (en) * 1996-12-23 1998-11-10 Lucent Technologies Inc. Encapsulated, board-mountable power supply and method of manufacture therefor
US5909358A (en) * 1997-11-26 1999-06-01 Todd Engineering Sales, Inc. Snap-lock heat sink clip
ES2192022T3 (es) * 1999-09-01 2003-09-16 Ramachandran Ramarathnam Util electrico portatil.

Also Published As

Publication number Publication date
BR0211840A (pt) 2004-09-08
JP4130628B2 (ja) 2008-08-06
EP1421837A4 (en) 2008-04-23
EP1421837B1 (en) 2011-05-04
EP1421837A1 (en) 2004-05-26
AU2002343325B2 (en) 2006-08-03
DE60239942D1 (de) 2011-06-16
TW579322B (en) 2004-03-11
ATE508621T1 (de) 2011-05-15
CN1593075A (zh) 2005-03-09
JP2005500677A (ja) 2005-01-06
CA2457438A1 (en) 2003-02-27
CN1593075B (zh) 2011-07-13
WO2003017742A1 (en) 2003-02-27

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Legal Events

Date Code Title Description
PSEA Patent sealed
RENW Renewal (renewal fees accepted)
RENW Renewal (renewal fees accepted)
RENW Renewal (renewal fees accepted)
RENW Renewal (renewal fees accepted)

Free format text: PATENT RENEWED FOR 1 YEAR UNTIL 09 AUG 2016 BY COMPUTER PACKAGES INC

Effective date: 20150718

RENW Renewal (renewal fees accepted)

Free format text: PATENT RENEWED FOR 1 YEAR UNTIL 09 AUG 2017 BY CPA GLOBAL

Effective date: 20160624

LAPS Patent lapsed