JP2005347303A - 熱圧着装置 - Google Patents

熱圧着装置 Download PDF

Info

Publication number
JP2005347303A
JP2005347303A JP2004161570A JP2004161570A JP2005347303A JP 2005347303 A JP2005347303 A JP 2005347303A JP 2004161570 A JP2004161570 A JP 2004161570A JP 2004161570 A JP2004161570 A JP 2004161570A JP 2005347303 A JP2005347303 A JP 2005347303A
Authority
JP
Japan
Prior art keywords
thermocompression bonding
bonding apparatus
heat insulating
fluid passage
heating member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004161570A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005347303A5 (enrdf_load_stackoverflow
Inventor
Takashi Yamashita
敬 山下
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2004161570A priority Critical patent/JP2005347303A/ja
Publication of JP2005347303A publication Critical patent/JP2005347303A/ja
Publication of JP2005347303A5 publication Critical patent/JP2005347303A5/ja
Pending legal-status Critical Current

Links

Images

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2004161570A 2004-05-31 2004-05-31 熱圧着装置 Pending JP2005347303A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004161570A JP2005347303A (ja) 2004-05-31 2004-05-31 熱圧着装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004161570A JP2005347303A (ja) 2004-05-31 2004-05-31 熱圧着装置

Publications (2)

Publication Number Publication Date
JP2005347303A true JP2005347303A (ja) 2005-12-15
JP2005347303A5 JP2005347303A5 (enrdf_load_stackoverflow) 2007-07-12

Family

ID=35499434

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004161570A Pending JP2005347303A (ja) 2004-05-31 2004-05-31 熱圧着装置

Country Status (1)

Country Link
JP (1) JP2005347303A (enrdf_load_stackoverflow)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012204604A (ja) * 2011-03-25 2012-10-22 Fujikoshi Mach Corp ワーク貼着方法およびワーク貼着装置
JP2014140032A (ja) * 2013-01-21 2014-07-31 Vesi Switzerland Ag 加熱及び冷却可能な吸引部材を有するボンディングヘッド
CN104282586A (zh) * 2013-07-02 2015-01-14 库利克和索夫工业公司 用于热压接合器的接合头、热压接合器及其操作方法
JP2015233138A (ja) * 2014-06-10 2015-12-24 セメス株式会社Ｓｅｍｅｓ Ｃｏ．， Ｌｔｄ． ボンディングヘッド及びこれを含むダイボンディング装置
CN111390465A (zh) * 2020-01-20 2020-07-10 武汉高芯科技有限公司 一种用于倒装焊的液压装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1041355A (ja) * 1996-07-24 1998-02-13 Toray Eng Co Ltd 熱圧着ツール
JP2001060757A (ja) * 1999-06-14 2001-03-06 Sharp Corp 外部回路実装方法および熱圧着装置
JP2004031885A (ja) * 2002-04-30 2004-01-29 Toray Eng Co Ltd ボンディング方法およびその装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1041355A (ja) * 1996-07-24 1998-02-13 Toray Eng Co Ltd 熱圧着ツール
JP2001060757A (ja) * 1999-06-14 2001-03-06 Sharp Corp 外部回路実装方法および熱圧着装置
JP2004031885A (ja) * 2002-04-30 2004-01-29 Toray Eng Co Ltd ボンディング方法およびその装置

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012204604A (ja) * 2011-03-25 2012-10-22 Fujikoshi Mach Corp ワーク貼着方法およびワーク貼着装置
JP2014140032A (ja) * 2013-01-21 2014-07-31 Vesi Switzerland Ag 加熱及び冷却可能な吸引部材を有するボンディングヘッド
CN104282586A (zh) * 2013-07-02 2015-01-14 库利克和索夫工业公司 用于热压接合器的接合头、热压接合器及其操作方法
JP2015233138A (ja) * 2014-06-10 2015-12-24 セメス株式会社Ｓｅｍｅｓ Ｃｏ．， Ｌｔｄ． ボンディングヘッド及びこれを含むダイボンディング装置
CN111390465A (zh) * 2020-01-20 2020-07-10 武汉高芯科技有限公司 一种用于倒装焊的液压装置
CN111390465B (zh) * 2020-01-20 2022-03-22 武汉高芯科技有限公司 一种用于倒装焊的液压装置

Similar Documents

Publication Publication Date Title
JP4941305B2 (ja) 接合装置
US7667474B2 (en) Probe device
CN111344855B (zh) 卡盘板、具有所述卡盘板的卡盘结构物及具有卡盘结构物的焊接装置
US7425838B2 (en) Body for keeping a wafer and wafer prober using the same
US8925170B2 (en) Method for removing an electronic component from a substrate
CN107210239B (zh) 安装装置和安装方法
RU2333622C1 (ru) Способы и система теплового подсоединения и отсоединения компонентов для поверхностного монтажа
JP3895703B2 (ja) プリント配線基板の接続装置
KR102811712B1 (ko) 기판 상의 전자부품들을 신터링하기 위한 신터링 프레스
US20080156789A1 (en) Platen for use with a thermal attach and detach system which holds components by vacuum suction
WO2007077688A1 (ja) 半田付け方法及び半導体モジュールの製造方法
JP2005347303A (ja) 熱圧着装置
JP4631796B2 (ja) 電子部品の熱圧着装置
KR20070028920A (ko) 열압착 공구 및 이를 포함한 열압착 장치
JP3539826B2 (ja) 熱圧着ツール
JPH04364090A (ja) ハンダ付け用治具
CN115119471A (zh) 用于将发热构件与冷却装置连接的方法
JP4323419B2 (ja) 熱圧着ツール及び熱圧着装置
KR101887151B1 (ko) 확산 접합 장치
KR102272891B1 (ko) 마이크로 소자 전사 장치
US20230321925A1 (en) Method for connecting a film to a substrate
CN221363072U (zh) 一种用于打印头和电路板的热压焊接机
CN221231778U (zh) 一种rosa热压焊装置
JP2812304B2 (ja) フリップチップ型半導体装置のリペア方法
CN221248604U (zh) 针刺散热底板装配设备

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070525

A621 Written request for application examination

Effective date: 20070525

Free format text: JAPANESE INTERMEDIATE CODE: A621

RD03 Notification of appointment of power of attorney

Effective date: 20070525

Free format text: JAPANESE INTERMEDIATE CODE: A7423

A977 Report on retrieval

Effective date: 20090511

Free format text: JAPANESE INTERMEDIATE CODE: A971007

A131 Notification of reasons for refusal

Effective date: 20090522

Free format text: JAPANESE INTERMEDIATE CODE: A131

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090716

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20090807

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20091005

A02 Decision of refusal

Effective date: 20100427

Free format text: JAPANESE INTERMEDIATE CODE: A02