JP2005340543A - 発光装置および照明装置 - Google Patents
発光装置および照明装置 Download PDFInfo
- Publication number
- JP2005340543A JP2005340543A JP2004158457A JP2004158457A JP2005340543A JP 2005340543 A JP2005340543 A JP 2005340543A JP 2004158457 A JP2004158457 A JP 2004158457A JP 2004158457 A JP2004158457 A JP 2004158457A JP 2005340543 A JP2005340543 A JP 2005340543A
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- JP
- Japan
- Prior art keywords
- light emitting
- light
- emitting device
- emitting element
- annular member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15172—Fan-out arrangement of the internal vias
- H01L2924/15174—Fan-out arrangement of the internal vias in different layers of the multilayer substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Led Device Packages (AREA)
Abstract
【解決手段】 発光装置は、上側主面に発光素子4の載置部6が形成された基体1と、基体1の上側主面に載置部6を取り囲むように取着された環状部材2と、基体1の上側主面に取着され、内周面の下端が環状部材2の外周面に全周にわたって接しているとともに内周面が光反射面とされた枠状の反射部材3と、載置部6に載置された発光素子4と、環状部材2の内側に発光素子4を覆うように設けられた透光性部材5とを具備している。
【選択図】 図1
Description
2:環状部材
3:反射部材
4:発光素子
5:透光性部材
6:載置部
101:発光装置
102:発光装置駆動回路基板
103:反射治具
Claims (4)
- 上側主面に発光素子の載置部が形成された基体と、該基体の上側主面に前記載置部を取り囲むように取着された環状部材と、前記基体の上側主面に取着され、内周面の下端が前記環状部材の外周面に全周にわたって接しているとともに内周面が光反射面とされた枠状の反射部材と、前記載置部に載置された前記発光素子と、前記環状部材の内側に前記発光素子を覆うように設けられた透光性部材とを具備していることを特徴とする発光装置。
- 前記環状部材は、その熱膨張係数が前記反射部材よりも小さいとともに縦弾性係数が前記反射部材よりも大きいことを特徴とする請求項1記載の発光装置。
- 前記載置部は、高さが前記環状部材よりも高くなるように突出していることを特徴とする請求項1または請求項2記載の発光装置。
- 請求項1乃至請求項3記載のいずれかに記載の発光装置を所定の配置となるように設置したことを特徴とする照明装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004158457A JP4593974B2 (ja) | 2004-05-27 | 2004-05-27 | 発光装置および照明装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004158457A JP4593974B2 (ja) | 2004-05-27 | 2004-05-27 | 発光装置および照明装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005340543A true JP2005340543A (ja) | 2005-12-08 |
JP4593974B2 JP4593974B2 (ja) | 2010-12-08 |
Family
ID=35493755
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004158457A Expired - Fee Related JP4593974B2 (ja) | 2004-05-27 | 2004-05-27 | 発光装置および照明装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4593974B2 (ja) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007123891A (ja) * | 2005-10-27 | 2007-05-17 | Lg Innotek Co Ltd | 発光ダイオードパッケージ及びその製造方法 |
JP2007266357A (ja) * | 2006-03-29 | 2007-10-11 | Kyocera Corp | 発光装置および照明装置 |
JP2008034536A (ja) * | 2006-07-27 | 2008-02-14 | Nichia Chem Ind Ltd | 発光装置及び発光装置の製造方法 |
JP2010500739A (ja) * | 2006-08-09 | 2010-01-07 | パナソニック株式会社 | 発光装置 |
JP2012104546A (ja) * | 2010-11-08 | 2012-05-31 | Ushio Inc | Led素子 |
KR101193909B1 (ko) * | 2009-12-31 | 2012-10-29 | 장광균 | Led 조명용 리드 프레임 및 그 제조방법 |
WO2018030486A1 (ja) * | 2016-08-10 | 2018-02-15 | 京セラ株式会社 | 電気素子搭載用パッケージ、アレイ型パッケージおよび電気装置 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4814973U (ja) * | 1971-06-30 | 1973-02-20 | ||
JPH0428269A (ja) * | 1990-05-23 | 1992-01-30 | Fujikura Ltd | Ledベアチップの実装構造 |
JP2002314143A (ja) * | 2001-04-09 | 2002-10-25 | Toshiba Corp | 発光装置 |
JP2002324918A (ja) * | 2001-02-07 | 2002-11-08 | Patent Treuhand Ges Elektr Gluehlamp Mbh | リフレクタを備えた半導体モジュール |
-
2004
- 2004-05-27 JP JP2004158457A patent/JP4593974B2/ja not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4814973U (ja) * | 1971-06-30 | 1973-02-20 | ||
JPH0428269A (ja) * | 1990-05-23 | 1992-01-30 | Fujikura Ltd | Ledベアチップの実装構造 |
JP2002324918A (ja) * | 2001-02-07 | 2002-11-08 | Patent Treuhand Ges Elektr Gluehlamp Mbh | リフレクタを備えた半導体モジュール |
JP2002314143A (ja) * | 2001-04-09 | 2002-10-25 | Toshiba Corp | 発光装置 |
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9054283B2 (en) | 2005-10-27 | 2015-06-09 | Lg Innotek Co., Ltd. | Light emitting diode package and method of manufacturing the same |
JP2007123891A (ja) * | 2005-10-27 | 2007-05-17 | Lg Innotek Co Ltd | 発光ダイオードパッケージ及びその製造方法 |
US8963188B2 (en) | 2005-10-27 | 2015-02-24 | Lg Innotek Co., Ltd. | Light emitting diode package and method of manufacturing the same |
US9012947B2 (en) | 2005-10-27 | 2015-04-21 | Lg Innotek Co., Ltd. | Light emitting diode package and method of manufacturing the same |
JP2007266357A (ja) * | 2006-03-29 | 2007-10-11 | Kyocera Corp | 発光装置および照明装置 |
JP2008034536A (ja) * | 2006-07-27 | 2008-02-14 | Nichia Chem Ind Ltd | 発光装置及び発光装置の製造方法 |
JP2010500739A (ja) * | 2006-08-09 | 2010-01-07 | パナソニック株式会社 | 発光装置 |
KR101193909B1 (ko) * | 2009-12-31 | 2012-10-29 | 장광균 | Led 조명용 리드 프레임 및 그 제조방법 |
JP2012104546A (ja) * | 2010-11-08 | 2012-05-31 | Ushio Inc | Led素子 |
WO2018030486A1 (ja) * | 2016-08-10 | 2018-02-15 | 京セラ株式会社 | 電気素子搭載用パッケージ、アレイ型パッケージおよび電気装置 |
JP6305668B1 (ja) * | 2016-08-10 | 2018-04-04 | 京セラ株式会社 | 電気素子搭載用パッケージ、アレイ型パッケージおよび電気装置 |
CN109564900A (zh) * | 2016-08-10 | 2019-04-02 | 京瓷株式会社 | 电气元件搭载用封装体和阵列型封装体以及电气装置 |
KR20190034545A (ko) * | 2016-08-10 | 2019-04-02 | 쿄세라 코포레이션 | 전기 소자 탑재용 패키지, 어레이형 패키지, 및 전기 장치 |
JP2019195096A (ja) * | 2016-08-10 | 2019-11-07 | 京セラ株式会社 | 電気素子搭載用パッケージ、アレイ型パッケージおよび電気装置 |
KR102449952B1 (ko) * | 2016-08-10 | 2022-10-04 | 교세라 가부시키가이샤 | 전기 소자 탑재용 패키지, 어레이형 패키지, 및 전기 장치 |
US11784459B2 (en) | 2016-08-10 | 2023-10-10 | Kyocera Corporation | Electrical element mounting package, array package, and electrical device |
CN109564900B (zh) * | 2016-08-10 | 2024-03-08 | 京瓷株式会社 | 电气元件搭载用封装体和阵列型封装体以及电气装置 |
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