JP2005340264A - Substrate accommodation vessel and auxiliary tool therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an auxiliary tool for a substrate accommodation vessel which enables the flexible use of an accommodation vessel body and does not require a change in the design of a metal die even when the external size of the substrate as an accommodation object is changed, and to provide the substrate accommodation vessel. <P>SOLUTION: An adapter 30 is provided at the internal side of a carrier body 50 which can accommodate a plurality of 8-inch wafers in a state that these wafers are arranged at constant intervals. This adapter 30 also has a wafer supporting plate 10 or the like to arrange, within the carrier body 50, 6-inch wafers which are different in sizes at external shapes from the 8-inch wafers. Even if the diameter of the wafer as the accommodation object is changed and if the combination of wafers of different diameters is changed, the change in the design of the metal die is unnecessary and the flexible use of the carrier body 50 is possible. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an auxiliary tool for a substrate storage container and a substrate storage container, and more particularly to a wafer carrier used for storing a plurality of wafers in a manufacturing process of a semiconductor device.

2. Description of the Related Art Conventionally, a wafer carrier is known as a storage container in which a plurality of wafers are arranged at regular intervals and the wafers are supported and stored while maintaining the arrangement. In semiconductor device manufacturing processes and inspection processes, wafers are often handled in a state of being stored in a wafer carrier.
For example, when a plurality of wafers are processed in the semiconductor device manufacturing process, the plurality of wafers are stored in the wafer carrier, and the wafer carrier is set in a loader or the like of the manufacturing apparatus. In the case of single wafer processing, wafers are taken out one by one from a wafer carrier set in a loader and subjected to various processing processes.

  Further, in the semiconductor device inspection process, when electrical or visual inspection is performed on a plurality of wafers, the plurality of wafers are stored in a wafer carrier, as in the case of the above processing, This wafer carrier is set on a loader or the like of an inspection apparatus. Further, when a plurality of wafers are transported within the manufacturing process or between the manufacturing process and the inspection process, the plurality of wafers are transported in a state of being stored in a wafer carrier. Alternatively, when a plurality of wafers are temporarily stored in a clean room, the plurality of wafers are stored in a wafer carrier, and the wafer carrier storing the wafer is placed on a stocker or the like and stored.

  In Patent Documents 1, 2, and 3, among such wafer carriers, a plurality of types of wafers having different diameters (hereinafter referred to as “different diameter wafers”) or a plurality of types of wafers having different shapes (hereinafter referred to as “variant shapes”). A wafer carrier of a type capable of storing both wafers) is described. In such a special type of wafer carrier, a groove portion is provided on the inner side of the carrier main body so that different diameter wafers or irregularly shaped wafers can be arranged in a state of being spaced apart at equal intervals.

  The external dimensions of such a special type of wafer carrier are designed to be the same as those of a general-purpose (that is, only one type of wafer whose diameter and shape are determined as one) is accommodated. This is to eliminate the need for “various adjustment operations according to the outer dimensions of the wafer carrier” at the loader or handling portion of the manufacturing apparatus or inspection apparatus in which the wafer carrier is set.

The following (i) and (ii) are conceivable as methods for manufacturing such a special type of wafer carrier.
(I) A predetermined portion inside the carrier body having the same external dimensions as the general-purpose type is cut and cut to form the above-mentioned wafer having a different diameter and a groove corresponding to the wafer having a different shape, thereby manufacturing a wafer carrier.

(Ii) A die for forming a carrier main body having the same outer dimensions as the general-purpose type and having the above-mentioned different-diameter wafer and a groove corresponding to the irregular-shaped wafer inside is manufactured by casting. Then, the wafer carrier is integrally molded using the manufactured mold.
JP 11-59777 A JP 59-213142 A JP-A-57-167629

[1] First Problem However, in the above (i), it is impossible to purchase a commercially available general-purpose type wafer carrier and form the groove on the inside of the carrier body. This is because the general-purpose type wafer carrier already has a groove corresponding to the outer dimension of one kind of wafer. For example, in a general-purpose type wafer carrier corresponding to an 8-inch wafer, it is impossible to form a groove corresponding to a 6-inch wafer in a part inside thereof.

For this reason, in the above (i), first, a carrier body having a cutting allowance (that is, a portion where the groove portion is not formed) has to be manufactured. In order to manufacture a carrier body having this cutting allowance, it is necessary to specially manufacture a dedicated die. In addition, there is a problem that the cost for cutting the carrier main body manufactured by integral molding must be precisely cut one by one, resulting in high cost.
The above (ii) also has a problem of high cost because it is necessary to manufacture a dedicated mold in accordance with a different diameter wafer or a combination of irregular wafers.

[2] Second Problem The groove inside the carrier main body manufactured by the method (i) or (ii) is made by cutting or integral molding with a mold. Therefore, once the wafer carrier is manufactured, the size of the groove cannot be arbitrarily changed, and there is a problem that the usability is poor. For example, the outer diameter of the carrier body corresponds to (adapts to) an 8-inch wafer, and different diameters are provided with grooves corresponding to the storage of the 8-inch wafer and the storage of the 6-inch wafer, respectively. Assume a wafer storage carrier. This odd-shaped wafer storage carrier can store both 8-inch wafers and 6-inch wafers. In such a wafer carrier, when the wafer to be stored is changed to an 8-inch wafer or a 4-inch wafer, the groove corresponding to the storage of the 6-inch wafer must be changed to a size for a 4-inch wafer. Don't be.

This change in size is not possible with cutting. Therefore, in addition to the 8-inch wafer, it is necessary to manufacture a wafer carrier having a groove corresponding to the accommodation of the 4-inch wafer, and it becomes necessary to newly manufacture a dedicated mold. Therefore, if the minimum diameter of the wafer to be stored is different, the carrier cannot be reused.
The present invention has been made to solve the above first and second problems. Even when the external dimensions of the substrate to be stored are changed, the design change of the mold is unnecessary, and the storage is performed. It is an object of the present invention to provide an auxiliary tool for a substrate storage container and a substrate storage container in which the container body can be reused.

  In order to solve the above-described problems, the first substrate storage container auxiliary tool according to the present invention is attached to the inside of a substrate storage container that can store a plurality of first substrates arranged in a fixed interval. It is an auxiliary tool, and has an arrangement means for arranging a second substrate having an outer dimension different from that of the first substrate in the substrate storage container. Here, the auxiliary tool is detachably attached to the inside of the substrate storage container by spot welding, for example.

  According to the first substrate storage container auxiliary tool of the present invention, since the auxiliary tool is manufactured separately from the substrate storage container, only the substrate storage container (storage container main body) corresponding to the first substrate is molded. You can make with. Therefore, when the external dimensions of the second substrates arranged by the auxiliary tool are changed, the auxiliary tool is removed from the storage container body. And the new auxiliary tool corresponding to a new 2nd board | substrate can be reattached to the storage container main body which removed the auxiliary tool. Compared with the conventional method, even when the external dimensions of the second substrate are changed, it is not necessary to change the design of the mold, and the storage container body can be reused.

  The second substrate storage container auxiliary tool according to the present invention is the above-mentioned first substrate storage container auxiliary tool, wherein the array means is a U-shaped array plate as viewed from the array direction of the second substrate. The second substrate is a semiconductor wafer, and the inner diameter of the array plate is smaller than the outer diameter of the second substrate. Here, the U-shape is a shape in which three sides are closed and the other one is opened, and includes, for example, an angular U-shape like a Gothic body and a U-shape of Katakana. .

  Furthermore, the third substrate storage container assisting tool according to the present invention has positioning means for positioning the second substrate with respect to the array plate in the second substrate storage container assisting tool described above. It is a feature. According to the second and third substrate storage container assisting devices according to the present invention, the surface of the array plate can be brought into contact with the edge portion of the substrate and not in contact with the center portion of the substrate. Therefore, for example, contact of the array plate from the edge of the wafer surface to the inner circuit forming surface can be prevented.

According to the fourth substrate storage container auxiliary tool according to the present invention, in the second and third substrate storage container auxiliary tools described above, a plurality of the array plates, and a connecting means for connecting the array plates, And separating means for separating the arrayed plates connected by the connecting means at a constant interval.
Further, a fifth substrate storage container assisting tool according to the present invention is the above-described fourth substrate storage container assisting tool, wherein each of the plurality of array plates viewed from the array direction of the second substrate is used. The center line is characterized in that the plurality of the array plates are overlapped in a state of being connected by the connecting means. Here, the center line is a line representing a symmetry axis in a plan view seen from a predetermined direction. According to the fourth and fifth substrate storage container auxiliary tools according to the present invention, a plurality of second substrates having different external dimensions from the first substrate can be regularly arranged inside the storage container body.

A first substrate storage container according to the present invention can be stored in a state in which any one of the first to fifth substrate storage container auxiliary tools described above and a plurality of first substrates are arranged at regular intervals. A substrate container, and the substrate container auxiliary tool is mounted in the container body.
According to the first substrate storage container of the present invention, the substrate storage container auxiliary tool described above is attached to the storage container body. Therefore, when the external dimensions of the second substrates arranged by the auxiliary tool are changed, the auxiliary tool is removed from the storage container body. And the new auxiliary tool corresponding to a new 2nd board | substrate can be reattached to the storage container main body which removed the auxiliary tool. Compared with the conventional method, even when the external dimensions of the second substrate are changed, it is not necessary to change the design of the mold, and the storage container body can be reused.

In the second substrate storage container according to the present invention, in the first substrate storage container described above, one or more auxiliary tools for the substrate storage container are attached to the inside of the storage container body. It is characterized by.
In the third substrate storage container according to the present invention, in the first and second substrate storage containers described above, two or more auxiliary tools for the substrate storage container are attached to the inside of the storage container body. One of the substrate storage container auxiliary tools arranges the second substrate in the storage container main body, and the other substrate storage container auxiliary tool has an outer dimension smaller than that of the first substrate and the first substrate. A third substrate having an external dimension different from that of the two substrates is arranged in the storage container body. According to the second and third substrate storage containers of the present invention, for example, an 8 inch wafer, a 6 inch wafer, and a 4 inch wafer are regularly arranged inside a carrier body corresponding to the 8 inch wafer. Thus, it can be stored inside the storage container body.

  According to the present invention, even when the external dimensions of the substrate to be stored are changed, it is not necessary to change the design of the mold, and the storage container body can be reused.

Hereinafter, an auxiliary tool for a substrate storage container and a substrate storage container according to an embodiment of the present invention will be described with reference to the drawings.
FIG. 1 is a conceptual diagram showing a configuration example of a wafer carrier 100 according to an embodiment of the present invention. As shown in FIG. 1, the wafer carrier 100 includes a carrier body 50 and an adapter 30. The carrier body 50 is also an outer frame of the wafer carrier 100. The carrier body 50 is, for example, a commercially available general-purpose type, and a groove portion 55 capable of storing 25 wafers is provided on the inside thereof. Here, the wafer is a semiconductor wafer, a glass wafer for TFT, or the like.

  The adapter 30 is manufactured separately from the general-purpose type carrier main body 50, and is inserted and attached to the inside of the carrier main body 50 after the manufacture. As shown in FIG. 1, the adapter 30 includes, for example, a wafer support plate 10, X-direction positioning plates P1, P2, P3 and P4, Y-direction positioning plates Q1 and Q2, wafer positioning rods S1 and S2, and a distance between them. The holding plates R1, R2, R3, and R4 are configured. First, the carrier body 50 to which the adapter 30 of the present invention is attached will be described.

  2A and 2B are a plan view illustrating a configuration example of the carrier body 50 and a cross-sectional view taken along line AA ′. The carrier body 50 is the same as, for example, a commercially available general-purpose type wafer carrier. The outer dimension of the carrier body 50 (hereinafter referred to as “outer dimension”) and the size of the groove inside the carrier body 50 correspond (adapt) to, for example, an 8-inch wafer. As shown in FIG. 2A, the outer dimensions of the carrier body 50 are a1 as a horizontal dimension (dimension in the X direction), b1 as a vertical dimension (dimension in the Z direction), and as shown in FIG. 2B. Let c1 be the height dimension (dimension in the Y direction). In this embodiment, for example, a1 = 233.0 [mm], b1 = 202.7 [mm], and c1 = 218.7 [mm].

  By the way, as can be seen from FIG. 2B, inside the general-purpose type carrier main body 50 having the outer dimensions and inner dimensions corresponding to the 8-inch wafer (hereinafter referred to as “inner dimensions”), An 8-inch wafer and a 6-inch wafer are stored as they are. When the center lines of the 8-inch wafer and the 6-inch wafer are overlapped inside the carrier body 50, the peripheral portion of the 8-inch wafer is supported by being sandwiched between the grooves of the carrier body 50. The peripheral edge of the 6 inch wafer does not reach the groove. Here, the center line is a line representing an axis of symmetry viewed from the Z direction in FIG.

  For this reason, it is impossible to correctly support the 6-inch wafer by using only the carrier main body 50 having the outer and inner dimensions corresponding to the 8-inch wafer. In order to make this possible, in the present invention, an adapter capable of supporting, for example, a 6-inch wafer is manufactured separately from the carrier body 50, and the adapter is inserted and attached inside the carrier body 50 after the manufacture.

  FIGS. 3A and 3B are a plan view and a cross-sectional view taken along the line AA ′ showing a configuration example of the carrier body 50 with the adapter 30 attached, that is, the wafer carrier 100. As shown in FIGS. 3A and 3B, the external dimensions of the adapter 30 correspond to the internal dimensions of the carrier body 50, and the external dimensions of the adapter 30 are completely accommodated inside the carrier body 50. It is about the size.

  As shown in FIG. 3B, when a 6-inch wafer is stored in a wafer carrier having an adapter 30, the 6-inch wafer is positioned in the X direction by X-direction positioning plates P1, P2, P3, and P4, and The Y-direction positioning plates Q1 and Q2 are used for positioning in the Y direction. In this positioned state, the center line of the 6-inch wafer overlaps the center line of the 8-inch wafer that is supported by the grooves of the carrier body 50. Here, the center line is a line representing an axis of symmetry viewed from the Z direction in FIG. With such a configuration, the adapter 30 can regularly arrange 6-inch wafers.

  The positioning rod S1 is attached between the X-direction positioning plates P1 and P3. Since the mounting interval between the X direction positioning plates P1 and P3 is large and positioning in the X direction is impossible between them, the positioning rod S1 serves to assist in positioning the wafer in the X direction during this interval. Similarly, the positioning rod S2 is attached between the X direction positioning plates P2 and P4. Since the mounting interval between the X direction positioning plates P2 and P4 is large and positioning in the X direction is impossible between them, the positioning rod S2 serves to assist in positioning the wafer in the X direction during this interval.

  7A to 7C are plan views showing examples of the shapes of the members A, B, and C constituting the wafer support plate 10. As shown in FIG. 7A, the shape of the member A in a plan view as viewed from the Z direction is U-shaped, and openings 1 to 8 penetrating the member A are provided in a portion close to the inner peripheral side thereof. Is provided. A member B shown in FIG. 7B is attached to an edge portion on the outer peripheral side of the member A. The attachment position of the member C with respect to the member A will be described later. Each material of the member A, the member B, and the member C is, for example, heat resistant vinyl chloride. In the wafer support plate 10, the materials of the members A, B, and C are selected in consideration of the wafer surface residual heat after the wafer processing by the production apparatus.

  FIGS. 8A and 8B are a plan view showing a configuration example of the interval holding plate R1 and a cross-sectional view taken along the line CC ′. The spacing plate R1 has, for example, a comb shape, and the comb teeth (notches) are inserted into the gaps between adjacent wafer support plates 10. The outer dimensions of R1 and R2 (see FIG. 1) are the same. As shown in FIG. 1, the wafer support plates 10 are held at equal intervals by fitting the gap holding plates R1 to R4.

  In addition, the dimension width of the notch corresponding to the 25th groove part of the carrier main body of such interval holding plates R1 to R4 is a notch corresponding to the number of another groove part (hereinafter referred to as “groove number”). It is larger than the dimension width. This is because a wafer support plate bonded with the member A bonded to the upper surface of the member C is fitted. In FIG. 8A, the numbers 1 to 25 are the groove numbers of the carrier body, and the wafer support plate corresponding to the groove number is fitted into the notch shown immediately below the groove number.

  4A and 4B are partially enlarged cross-sectional views showing the difference between a case where an 8-inch wafer is supported by the groove 55 inside the carrier body 50 and a case where an 8-inch wafer is supported by the wafer support plate 10. It is. In this cross-sectional view, FIG. 4A corresponds to the DD ′ cross section of FIG. 2B, and FIG. 4B corresponds to the DD ′ cross section of FIG. 3B. As shown in FIG. 4A, the outer and inner dimensions of the carrier main body 50 correspond to an 8-inch wafer, and therefore the peripheral portion of the 8-inch wafer is inserted into the groove portion 55 of the carrier main body 50 and the carrier main body 50 is inserted. 50 can be stored.

  As shown in FIG. 4B, the wafer support plate 10 is composed of a member A and a member B. The member A is a portion that contacts the peripheral edge of the back surface of the wafer and supports the array of wafers. The member B is a portion that is inserted into the groove 55 of the carrier body 50. As shown in FIG. 4B, the back surface of the end portion of the member B exposed from the groove is joined to the peripheral portion of the surface of the member A (ie, the surface that supports the wafer). With such a configuration, the surface of the member A can be brought into contact with the back edge of the 6-inch wafer, and the wafer support plate 10 can be prevented from coming into contact with the center of the 6-inch wafer. Therefore, the contact of the wafer support plate 10 with the circuit forming surface on the surface of the 6-inch wafer can be prevented.

  5A and 5B are partially enlarged cross-sectional views showing the wafer position adjustment function by the wafer support plate 10. FIG. 5A corresponds to the DD ′ cross section of FIG. FIG. 5B corresponds to the DD ′ section in FIG. FIG. 5A shows a state in which an 8-inch wafer is inserted into the 20th groove portion 55 and the 19th groove portion 55 of the carrier body 50, for example. At this time, the distance from the back surface of the 8-inch wafer inserted into the 19th groove 55 to the bottom surface of the carrier body 50 is defined as d1.

  On the other hand, in FIG. 5B, the wafer support plate 10 is inserted into at least the 20th groove portion 55 and the 19th groove portion 55 of the carrier body 50, and the wafer support plate 10 supports the 6-inch wafer. Shows the state. At this time, the distance from the back surface of the 6-inch wafer supported by the wafer support plate 10 inserted into the 19th groove 55 to the bottom surface of the carrier body 50 is defined as d2.

  As shown in FIG. 5B, when the back surface of the 6-inch wafer is in contact with the surface of the member A, the back surface of the member B and the back surface of the 6-inch wafer are flush with each other. For this reason, if the thickness t of the member B is increased, and the member A is bonded and bonded to the member B, the separation distance d2 when the 6-inch wafer is supported by the member A is decreased. Conversely, if the thickness t of the member B is reduced, and the member A is bonded and bonded to the member B, the separation distance d2 when the 6-inch wafer is supported by the member A is increased. In the present invention, by adjusting the thickness t of the member B, the separation distance d2 from the bottom surface of the carrier body 50 to the back surface of the 6-inch wafer is adjusted to the separation distance d1 when the 8-inch wafer is arrayed and supported (d2). = D1) is possible.

6A and 6B are partially enlarged cross-sectional views showing the wafer array support function by the stopper. FIG. 6A corresponds to the DD ′ cross section of FIG. FIG. 6B corresponds to the DD ′ cross section of FIG.
As shown in FIG. 6A, when an 8-inch wafer is supported by the 25th groove 55 located at the top of the bottom surface of the carrier body 50, the groove crest on the front surface side of the wafer is It functions as an upward stopper for the wafer. On the other hand, the adapter 30 of the present invention is devised in the structure of the wafer support plate 10 positioned at the uppermost position with respect to the bottom surface of the carrier body 50 in order to obtain the above-described stopper function at the uppermost position. .

  That is, as shown in FIG. 6B, the wafer support plate 10 has the member C bonded and bonded to the upper surface of the end of the member B, and the member A bonded and bonded to the upper surface of the member C. According to such a structure, it is possible to give the member A an upward stopper function. As shown in FIG. 6B, in this example, the wafer support plate 10 having this stopper function is inserted into the 25th groove of the carrier body 50.

  As described above, according to the adapter 30 and the wafer carrier 100 according to the embodiment of the present invention, since the adapter 30 is manufactured separately from the carrier body 50, only the carrier body 50 corresponding to, for example, an 8-inch wafer is used as a mold. Just make it. The adapter 30 is fixed inside the carrier body 50 by spot welding. Therefore, when the external dimensions of the wafers arranged by the adapter 30 are changed from 6 inches to 4 inches, the adapter 30 is compared with the carrier body 50 by cutting the welded portion of the spot welded adapter 30. Can be easily removed. Then, the adapter 30 corresponding to the 4-inch wafer can be reattached to the carrier body 50 after the adapter 30 is removed. Compared to the conventional method, even when a different diameter wafer to be stored or a combination of deformed wafers is changed, it is not necessary to change the design of the mold, and the carrier body 50 can be reused.

  Next, a method for manufacturing the above-described adapter 30 and the wafer carrier 100 having the adapter 30 will be described. Here, for example, a case is assumed in which an adapter 30 capable of supporting the arrangement of 6-inch wafers at regular intervals in one carrier body 50 corresponding to 8-inch wafers is assumed. A general-purpose wafer carrier having an outer shape corresponding to an 8-inch wafer is prepared as the carrier body 50 of the present invention, and the adapter 30 is manufactured separately.

  First, for example, 25 wafer support plates 10 capable of supporting a 6-inch wafer are prepared, and these wafer support plates 10 are arranged in the Z direction. Then, as shown in FIG. 1, the X-direction positioning plate P1 is formed in the opening 1 of the arranged wafer support plates 10, the X-direction positioning plate P3 is formed in the opening 2, and the X-direction positioning plate P4 is formed in the opening 5. The X-direction positioning plate P2 is passed through the opening 6 respectively. Further, the wafer positioning bar S1 is passed through the opening 7 of the wafer support plate 10, and the wafer positioning bar S2 is passed through the opening 8. Further, the Y-direction positioning plate Q1 is passed through the opening 3 of the wafer support plate 10 and the Y-direction positioning plate Q2 is passed through the opening 4 respectively. In this way, the wafer support plate 10 is integrated.

  Here, the clearances between the X direction positioning plates P1 to P4 and the Y direction positioning plates Q1 and Q2 and the wafer positioning rods S1 and S2 and the openings provided in the member A are narrowed in advance. Thus, by keeping the clearance narrow, the member A does not move easily with respect to the X-direction positioning plates P1 to P4, the Y-direction positioning plates Q1 and Q2, and the wafer positioning rods S1 and S2. Can be prevented. Since misalignment can be prevented, it is only necessary to pass the X-direction positioning plates P1 to P4 and the Y-direction positioning plates Q1 and Q2 and the wafer positioning rods S1 and S2 through the member A, and these need to be welded to the member A. Absent. Next, the comb teeth of the spacing plates R <b> 1 to R <b> 4 are fitted between the wafer support plates 10. In this way, the adapter 30 is completed.

  Next, the completed adapter 30 is inserted inside the carrier body 50. When inserting, the first to 25th edge portions of the wafer support plate 10 are aligned with the first to 25th groove portions 55 of the carrier body 50, and the edge portions of the wafer support plate 10 are placed in the groove portions 55. insert. After the edge of the wafer support plate 10 is inserted into the groove 55 of the carrier body 50, the adapter 30 is fixed to the carrier body 50 by spot welding.

  FIGS. 9A and 9B are diagrams showing a welding location between the adapter 30 and the carrier body 50. Specifically, FIG. 9A is a plan view of the wafer carrier viewed from the Z direction, and FIG. 9B is a cross-sectional view taken along line AA ′ of FIG. 9A. 10 is a cross-sectional view taken along the line BB ′ of FIG. 9A, and FIG. 11 is a cross-sectional view taken along the line CC ′ of FIG. 9A. As shown in FIGS. 9A and 9B and FIG. 11, in the state where the adapter 30 is inserted and arranged at a predetermined position inside the carrier main body 50, the vicinity of both ends in the longitudinal direction of the spacing plate R2, and the carrier main body The parts 101 and 107 close to the opening side of 50 are welded. In addition, the spacing plate R3 and the portions 113 and 114 close to the legs inside the carrier body 50 are welded. Before and after this, as shown in FIGS. 9A and 9B and FIG. 10, the longitudinal direction of the spacing plate R1 with the adapter 30 inserted and arranged at a predetermined position inside the carrier body 50 is shown. The portions 104 and 110 near the both ends and the portions close to the opening side of the carrier body 50 are welded. In addition, the spacing plate R4 and the portions 115 and 116 close to the legs inside the carrier body 50 are welded.

  Next, as shown in FIGS. 9A and 11, the vicinity of both ends in the longitudinal direction of the X-direction positioning plate P2 and the inner portions 102 and 108 facing the XY plane of the carrier body 50 are welded. Further, the vicinity of both ends in the longitudinal direction of the X-direction positioning plate P4 and the inner portions 119 and 120 facing the XY plane of the carrier body 50 are welded. Further, as shown in FIGS. 9A and 10, the vicinity of both ends in the longitudinal direction of the X-direction positioning plate P1 and the inner portions 105 and 111 facing the XY plane of the carrier body 50 are welded. The vicinity of both ends in the longitudinal direction of the X-direction positioning plate P3 and the inner portions 117 and 118 facing the XY plane of the carrier body 50 are welded.

  Next, as shown in FIGS. 9A and 11, the vicinity of both ends in the longitudinal direction of the Y-direction positioning plate Q2 and the inner portions 103 and 109 facing the XY plane of the carrier body 50 are welded. Next, as shown in FIGS. 9A and 10, the Y-direction positioning plate Q <b> 1 and the inner portions 106 and 112 facing the XY plane of the carrier body 50 are welded. In this way, the wafer carrier 100 according to the embodiment of the present invention is completed.

  In addition, when the carrier main body 50 and the welding site | part of the adapter 30 are different materials, there exists a possibility that these cannot be welded. Therefore, it is preferable that the carrier main body 50, the spacing plates R1, R2, R3, and R4, the X direction positioning plates P1, P2, P3, and P4, and the Y direction positioning plates Q1 and Q2 are made of the same material. For example, when the material of the carrier body 50 is PP (polypropylene), the spacing plates R1, R2, R3 and R4, the X direction positioning plates P1, P2, P3 and P4, and the Y direction positioning plates Q1 and Q2 The material is also PP.

  In this embodiment, an 8-inch wafer corresponds to the first substrate of the present invention, and a 6-inch wafer corresponds to the second substrate of the present invention. The carrier body 50 corresponds to the substrate storage container of the present invention, and the adapter 30 corresponds to the auxiliary tool of the present invention. Further, the wafer support plate 10 corresponds to the arrangement means (array plate) of the present invention, and the X direction positioning plates P1, P2, P3 and P4, the Y direction positioning plates Q1 and Q2, and the wafer positioning rods S1 and S2 are provided. This corresponds to the connecting means of the present invention. Further, the spacing plates R1, R2, R3 and R4 correspond to the separation means of the present invention, and the X direction positioning plates P1, P2, P3 and P4, the Y direction positioning plates Q1 and Q2, and the wafer positioning rods S1 and S2 Corresponds to the positioning means of the present invention.

  In this embodiment, the adapter 30 capable of storing 25 6-inch wafers (that is, the number of wafer support plates 10 is 25) has been described. However, the adapter 30 according to the present invention can store 25 adapters. There is no limit. For example, even if an adapter 30 (that is, the number of wafer support plates 10 is 12) that can store 12 6-inch wafers is inserted into the carrier body 50 that can store 25-inch 8-inch wafers. good. In this case, 12 6-inch wafers and 13 8-inch wafers can be stored in one wafer carrier.

  The wafer size that can be accommodated in the adapter 30 according to the present invention is not limited to 6 inches, and may be, for example, 4 inches. Further, two or more adapters 30 may be inserted and arranged in one carrier body 50. For example, an adapter that can store 12 6-inch wafers (i.e., 12 6-inch wafer support plates 10) and a 4-inch wafer for a carrier body 50 that can store 25-inch 8-inch wafers. 6 adapters (that is, six wafer support plates for 4 inches) may be inserted into one carrier body 50. In this case, 12 6-inch wafers, 6 4-inch wafers, and 7 8-inch wafers can be stored in a regular array in one wafer carrier. In this case, a 4-inch wafer corresponds to the third substrate of the present invention.

  The present invention is not limited to a semiconductor wafer, and can also be used for a storage container that can support a plate-shaped object other than a wafer arranged at equal intervals.

The conceptual diagram which shows the structural example of the wafer carrier 100 which concerns on embodiment. The top view which shows the structural example of the carrier main body 50, and AA 'arrow sectional drawing. The top view which shows the structural example of the wafer carrier 100, and AA 'arrow sectional drawing. FIG. 6 is a partial enlarged cross-sectional view showing a difference between a case where an 8-inch wafer is supported by a groove 55 inside the carrier body 50 and a case where an 8-inch wafer is supported by a wafer support plate 10. FIG. 4 is a partial enlarged cross-sectional view showing a wafer position adjustment function by member B. The partial expanded sectional view which shows the arrangement | sequence support function of the wafer by a stopper (member A). The top view which shows an example of the shape of the member A, the member B, and the member C which comprise the wafer support plate 10. FIG. The top view which shows the structural example of the space | interval holding | maintenance board R1, and CC 'arrow sectional drawing. The figure which shows the welding location of the adapter 30 and the carrier main body 50. FIG. BB 'arrow sectional drawing of FIG. 9 (A). CC 'arrow sectional drawing of FIG. 9 (A).

Explanation of symbols

1 to 7 Opening portion 10 Wafer support plate 30 Adapter 50 Carrier body 55 Groove portion 100 Wafer carrier 101 to 120 Welded parts P1 to P4 of carrier body 50 X direction positioning plate Q1, Q2 Y direction positioning plate S1, S2 Wafer positioning rod R1 R4 spacing plate

Claims (8)

An auxiliary tool attached to the inside of a substrate storage container that can be stored in a state in which a plurality of first substrates are arranged at regular intervals,
An auxiliary tool for a substrate storage container, comprising: an arrangement means for arranging a second substrate having a different external dimension from the first substrate in the substrate storage container. The arrangement means is a U-shaped arrangement plate as viewed from the arrangement direction of the second substrate,
The second substrate is a semiconductor wafer;
The auxiliary tool for a substrate storage container according to claim 1, wherein a dimension of an inner diameter of the array plate is smaller than an outer diameter dimension of the second substrate.   The auxiliary tool for a substrate storage container according to claim 2, further comprising positioning means for positioning the second substrate with respect to the array plate. A plurality of the array plates;
Connecting means for connecting the array plates;
4. The substrate storage container auxiliary tool according to claim 2, further comprising a separation unit configured to separate the arrayed plates connected by the connection unit at a predetermined interval. 5. The center line of each of the plurality of the array plates viewed from the array direction of the second substrate is:
The auxiliary tool for a substrate storage container according to claim 4, wherein the plurality of the array plates are overlapped in a state of being connected by the connecting means. An auxiliary tool for a substrate storage container according to any one of claims 1 to 5,
A storage container body capable of storing a plurality of first substrates arranged in a fixed interval;
The substrate storage container is characterized in that the substrate storage container auxiliary tool is mounted in the storage container main body.   The substrate storage container according to claim 6, wherein one or more auxiliary tools for the substrate storage container are attached to the inside of the storage container main body. Two or more auxiliary tools for the substrate storage container are attached to the inside of the storage container body,
One of the substrate storage container auxiliary tools arranges the second substrate in the storage container body,
The other substrate storage container auxiliary tool has a third substrate having an outer dimension smaller than that of the first substrate and having a different outer dimension from the second substrate, and is arranged in the main body of the storage container. The substrate storage container according to claim 6 or 7.

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