CN110838460B - Wafer rotating temporary placing table - Google Patents
Wafer rotating temporary placing table Download PDFInfo
- Publication number
- CN110838460B CN110838460B CN201810926977.4A CN201810926977A CN110838460B CN 110838460 B CN110838460 B CN 110838460B CN 201810926977 A CN201810926977 A CN 201810926977A CN 110838460 B CN110838460 B CN 110838460B
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- Prior art keywords
- wafer
- groove
- upper cover
- cover plate
- rotating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention relates to a wafer rotating temporary placing table, which mainly comprises an upper cover plate, a rotating plate, a positioning piece and a lower base table; the upper cover plate is provided with a through long groove and is assembled on the lower base station; the rotating plate is provided with a radial displacement groove which is positioned between the lower base and the upper cover plate, the rotating plate is pivoted with the lower base, and the positioning piece passes through the radial displacement groove and the through long groove. When the rotating plate rotates, the radial displacement groove drives the positioning piece to radially move under the guidance of the through long groove so as to form the wafer accommodating groove. Therefore, the invention can lead the radial displacement groove to drive the positioning piece to generate radial displacement by rotating the rotating plate under the guidance of the through long groove so as to form the wafer accommodating groove which accords with various wafer sizes to be detected, thereby being convenient for fixing and positioning the wafer to be detected.
Description
Technical Field
The present invention relates to a wafer rotating temporary table, and more particularly, to a wafer rotating temporary table suitable for a wafer inspection apparatus or a manufacturing apparatus.
Background
In the wafer manufacturing or testing process, there is an inevitable need for positioning or rotating the wafer by a specific angle, for example, after the wafer to be tested is sucked from a tray (tray), because the wafer is picked up in a direction different from the wafer placement direction in the test seat, usually because the contact position on the wafer is different from the probe orientation on the test seat, the wafer to be tested is placed on the rotating table before being placed in the test seat, and after the rotating table rotates by a specific angle, the wafer to be tested is placed in the test seat.
Referring to fig. 1 together, fig. 1 is a schematic perspective view of a conventional turntable. As shown in the figure, a wafer accommodating groove 11 is disposed in the center of the conventional turntable 1, and four corners of the wafer accommodating groove 11 are respectively connected with a groove 12, and the ends of the grooves 12 are respectively assembled with a laser alignment device 13, wherein the laser alignment device 13 is used for detecting whether the wafer to be tested is in the wafer accommodating groove 11 or not, and is also used for detecting whether the orientation of the wafer to be tested is correct or not.
However, the wafer accommodation groove 11 of the known turntable 1 is fixed in size; in other words, when the wafers to be tested are to be replaced, the whole fixture must be replaced because the same wafer accommodating groove 11 cannot be used for wafers to be tested with different sizes, which is quite disadvantageous to the process or the conversion of different wafers to be tested.
Therefore, the wafer rotating temporary table which is applicable to various wafers to be tested with different specifications and sizes has the advantages of simple structure and low cost, and does not need other alignment devices is an urgent need in the industry.
Disclosure of Invention
The invention mainly aims to provide a wafer rotating temporary setting table, so that the size of a clamp for accommodating a wafer to be tested can be adjusted randomly along with the specification and the size of the wafer to be tested, and the wafer rotating temporary setting table is simple in structure and convenient to operate.
In order to achieve the above objective, the wafer rotating temporary setting table of the present invention mainly comprises an upper cover plate, a rotating plate, at least one positioning piece and a lower base; the upper cover plate is provided with at least one through long groove and is assembled on the lower base station; the rotating plate is provided with at least one radial displacement groove which is positioned between the lower base table and the upper cover plate, and the rotating plate is pivoted with at least one of the lower base table and the upper cover plate; and at least one positioning piece penetrates through at least one radial displacement groove of the rotating plate and at least one through long groove of the upper cover plate. When the rotating plate rotates, the at least one radial displacement groove drives the at least one positioning piece to be guided by the at least one through long groove, so that the wafer accommodating groove is formed to fix the wafer.
Therefore, the temporary wafer rotating table can enable the radial displacement groove to drive the positioning piece to generate radial displacement by rotating the rotating plate under the guidance of the through long groove so as to form wafer accommodating grooves which are in line with various wafer sizes to be detected, thereby being convenient for fixing and positioning the wafer to be detected. In other words, in order to respond to different wafer sizes to be tested, the wafer clamp can be easily adjusted to wafer clamps with different sizes by rotating the rotating plate, and is applicable to various wafers to be tested with different specifications and sizes.
More preferably, the upper cover plate of the temporary wafer rotating platform can be circular, and at least one through long groove is radially arranged by taking the center of the upper cover plate as the center; similarly, the rotating plate of the present invention may be circular, and the at least one radial displacement groove is disposed in a swirl shape centering around the center of the rotating plate.
Furthermore, the temporary wafer rotating table of the invention can also comprise a locking piece; the upper cover plate can comprise a through hole, the rotating plate can further comprise an outer ring groove, and the lower base platform can comprise a locking hole; the locking piece can pass through the through hole and the outer ring groove and is locked and attached to the locking hole. Therefore, after the wafer container for accommodating the wafer to be tested is adjusted, the rotary plate can be fixed through the locking piece so as to prevent the rotary plate from rotating, thereby fixing the size of the wafer container.
In addition, each positioning piece of the temporary wafer rotating platform can comprise a wafer fixing part, a rectangular long block part and a cylindrical part, wherein the wafer fixing part can be protruded out of the upper surface of the upper cover plate, the rectangular long block part can be accommodated in at least one through long groove of the upper cover plate, and the cylindrical part can be accommodated in at least one radial displacement groove of the rotating plate. In other words, the wafer fixing portion is used for forming a wafer accommodating groove to fix the wafer to be tested, the rectangular long block portion can slide freely in the through long groove, and the cylindrical portion can slide freely in the radial displacement groove.
The temporary wafer rotation table of the present invention may further comprise a driving member which is assembled to the lower base, and the driving member is connected to the rotating plate and drives the rotating plate to rotate. Accordingly, the present invention can rotate the rotating plate by the driving member, and the driving member may be a driving device such as a motor or a manual device. Further, the drive member may comprise a drive wheel and the lower base may comprise a circumferential wall comprising an axial groove and the upper cover plate comprising a radial groove; the driving wheel is pivoted in the axial groove and the radial groove, and the outer circumference of the driving wheel contacts the side wall of the rotating plate.
In addition, the temporary wafer rotating table of the invention can also comprise a steering seat, and the lower base table can be assembled on the steering seat. Accordingly, the present invention may rotate the angle of the wafer in the wafer container through the turn table, and the turn table may include a motor to drive the rotation.
On the other hand, the upper surface of the upper cover plate of the wafer rotating temporary placing table can be provided with a fixing piece; when the rotating plate rotates, the at least one radial displacement groove drives the at least one positioning piece to approach or separate from the fixing piece under the guidance of the at least one through long groove. In other words, the wafer pocket can be formed by the fixing member and the freely movable positioning member provided on the upper surface of the upper cover plate.
More preferably, the wafer rotation temporary table of the present invention may include four positioning members; the upper cover plate can be provided with four through long grooves which are in cross-shaped configuration; the rotating plate can be provided with four radial displacement grooves which are equidistantly arranged; the four positioning pieces can respectively penetrate through the four radial displacement grooves of the rotating plate and the four through long grooves of the upper cover plate. In other words, the invention can enable the four positioning pieces to approach to or separate from each other to adjust the size of the wafer container through the cross configuration mode.
Drawings
Fig. 1 is a schematic perspective view of a conventional turntable.
Fig. 2 is a perspective view of a first embodiment of the present invention.
Fig. 3 is an exploded view of a first embodiment of the present invention.
Fig. 4 is a cross-sectional view of a first embodiment of the present invention.
Fig. 5 is a perspective view of a positioning member according to a first embodiment of the present invention.
Fig. 6 is a schematic diagram illustrating rotation of a rotating plate according to a first embodiment of the present invention.
Fig. 7A is a schematic diagram of a second embodiment of the present invention.
Fig. 7B is a schematic diagram of a third embodiment of the present invention.
Fig. 7C is a schematic diagram of a fourth embodiment of the present invention.
Detailed Description
Before the wafer rotating temporary table of the present invention is described in detail in this embodiment, it should be noted that in the following description, like components will be denoted by the same reference numerals. Furthermore, the figures of the present invention are merely schematic illustrations that are not necessarily to scale, and all details are not necessarily presented in the figures.
Referring to fig. 2, 3 and 4, fig. 2 is a perspective view, fig. 3 is an exploded view, and fig. 4 is a cross-sectional view of a first embodiment of the present invention. As shown in the figure, the wafer rotation temporary table of the present embodiment mainly includes an upper cover plate 2, a rotating plate 3, four positioning pieces 4, a lower base 5, a turn seat 6, and an outer case 7.
The upper cover 2 of the present embodiment is circular, and the upper cover 2 is provided with four through long slots 21, which are radially and equiangularly disposed about the center of the upper cover 2, i.e., are disposed in a cross shape. In addition, the rotating plate 3 of the present embodiment is also circular, and is provided with four radial displacement grooves 31 disposed equidistantly, which are disposed in a swirl shape with the center of the rotating plate 3 as the center.
Referring to fig. 5, fig. 5 is a perspective view of a positioning member according to a first embodiment of the present invention. Each positioning member 4 of the present embodiment includes a wafer fixing portion 41, a rectangular long block portion 42 and a cylindrical portion 43, wherein the wafer fixing portion 41 is provided with a right-angle groove 411 corresponding to a tip corner of a wafer C to be tested (see fig. 2). In other words, the right-angle grooves 411 of the four positioning members 4 correspond to the four corners of the tip of the wafer C to be tested to form the wafer accommodation groove Sc, so as to accommodate the wafer C to be tested.
In addition, as shown in fig. 4, the four positioning members 4 are respectively inserted into the four radial displacement grooves 31 of the rotating plate 3 and the four through long grooves 21 of the upper cover plate 2, that is, the rectangular long block portions 42 of the positioning members 4 are accommodated in the through long grooves 21 of the upper cover plate 2 so as to be freely slidable, the cylindrical portions 43 are accommodated in the radial displacement grooves 31 of the rotating plate 3 so as to be freely slidable, and the wafer fixing portions 41 protrude from the upper surface of the upper cover plate 2.
On the other hand, referring to fig. 3 and 4, the upper cover 2 is assembled on the lower base 5, the rotating plate 3 is located between the lower base 5 and the upper cover 2, and the rotating plate 3 is pivotally connected to the central protruding shaft 53 of the lower base 5, so that the rotating plate 3 can freely rotate relative to the upper cover 2 and the lower base 5. In addition, the lower base 5 comprises a circumferential wall 52 provided with an axial groove 521, while the outer circumference of the upper cover plate 2 is provided with a radial groove 22. Furthermore, in the present embodiment, a driving member 51 is pivoted in the axial groove 521 of the lower base 5 and correspondingly received in the radial groove 22, and the outer ring Zhou Ji of the driving wheel 510 contacts the sidewall of the rotating plate 3.
Furthermore, the present embodiment further includes a locking member 61, the upper cover plate 2 is provided with a through hole 20, the rotating plate 3 further includes an outer ring groove 32, and the lower base 5 is provided with a locking hole 50. Wherein the locking piece 61 passes through the through hole 20 and the outer ring groove 32 and is locked to the locking hole 50.
The practical operation principle of the present embodiment for adjusting the size of the wafer container Sc is described below. Referring to fig. 6 together, fig. 6 is a schematic diagram illustrating rotation of a rotating plate according to a first embodiment of the present invention. When the process is changed, i.e. the size of the wafer container Sc is to be adjusted according to the wafers C to be tested with different specifications, the driving wheel 510 is manually rotated to drive the rotation plate 3 to rotate by the driving wheel 510. Of course, in other embodiments of the present invention, the driving wheel 510 may be rotated by an electric motor.
At this time, the four radial displacement grooves 31 in the shape of a vortex drive the four positioning members 4 to move radially, but are restrained and guided by the through long groove 21, so that the four positioning members 4 move toward or away from each other in a straight line synchronously. However, after the adjustment is completed, the locking member 61 may be manually screwed to fasten the rotating plate 3, so as to fix the size of the wafer container Sc, so as to avoid the unintended displacement of the rotating plate 3 or the positioning member 4.
Referring to fig. 3 and fig. 4, the present embodiment further includes a steering seat 6 pivotally connected to the outer housing 7, and the lower base 5 is assembled on the steering seat 6. Furthermore, the steering seat 6 is further connected with a rotation driving module 8, which may be constituted by an electric motor and a reduction mechanism. In other words, the rotation driving module 8 can drive the rotation seat 6 to rotate, so as to drive the wafer container Sc formed by the whole upper cover plate 2, the rotation plate 3 and the four positioning members 4 and the lower base 5 to rotate, i.e. the whole wafer container Sc and the wafer C to be tested accommodated therein are driven to rotate by a specific angle, such as 90 ° or 180 °.
Please refer to fig. 7A, which is a diagram illustrating a second embodiment of the present invention. As shown in fig. 7A, the second embodiment of the present invention employs a single positioning member 4 moving manner. Wherein, the upper surface of the upper cover plate 2 is provided with a fixing piece 23 and is provided with a through long groove 21 only, and the rotating plate 3 is provided with a radial displacement groove 31 only (not shown in the figure); when the rotating plate 3 rotates, the radial displacement groove 31 drives the positioning member 4 to approach or separate from the fixing member 23 guided by the through long groove 21, thereby adjusting the size of the wafer accommodating groove.
Please refer to fig. 7B, which is a diagram illustrating a third embodiment of the present invention. As shown in fig. 7B, the third embodiment of the present invention adopts a manner that two positioning members 4 move in opposite directions. Wherein the upper cover plate 2 is provided with two through long grooves 21, and the rotating plate 3 is provided with two radial displacement grooves 31 (not shown in the figure); when the rotating plate 3 rotates, the two radial displacement grooves 31 drive the two positioning members 4 to approach or separate from each other guided by the two through long grooves 21, thereby adjusting the size of the wafer accommodating groove.
Please refer to fig. 7C, which is a diagram illustrating a fourth embodiment of the present invention. As shown in fig. 7C, the fourth embodiment of the present invention employs a manner in which three positioning members 4 are moved. Wherein the upper cover plate 2 is provided with three through long grooves 21, and the rotating plate 3 is provided with three radial displacement grooves 31 (not shown in the figure); when the rotating plate 3 rotates, the three radial displacement grooves 31 drive the three positioning members 4 to approach or separate from each other guided by the three through long grooves 21, thereby adjusting the size of the wafer accommodating groove.
In summary, the wafer container of the present invention can be configured with the number and shape of the positioning members 4 according to the wafers to be tested with different sizes or shapes, such as square ICs, round ICs or rectangular ICs. In addition, the temporary wafer rotating table of the invention can be further matched with an automatic optical detection device (Automated Optical Inspection, AOI), a laser alignment calibration device and the like to align and calibrate the wafer C to be tested.
The above embodiments are merely illustrative, and the claimed protection scope of the present invention shall be defined by the claims rather than be limited to the above embodiments.
Symbol description
1. Rotary table
2. Upper cover plate
3. Rotary plate
4. Positioning piece
5. Lower base station
6. Steering seat
7. Outer casing
8. Rotary driving module
11. Wafer accommodation groove
12. Groove
13. Laser alignment device
20. Through hole
21. Through long groove
22. Radial groove
23. Fixing piece
31. Radial displacement groove
32. Outer ring groove
41. Wafer fixing part
42. Rectangular long block part
43. Cylindrical portion
50. Lock attachment hole
51. Driving piece
52. Peripheral wall
53. Center convex shaft
61. Locking piece
411. Right-angle groove
510. Driving wheel
521. Axial groove
C chip to be tested
Sc wafer pockets.
Claims (9)
1. A wafer rotating temporary table comprising:
a lower base station;
the upper cover plate is provided with at least one through long groove and is assembled on the lower base station;
the rotating plate is provided with at least one radial displacement groove, is positioned between the lower base table and the upper cover plate and is pivoted with at least one of the lower base table and the upper cover plate; the rotary plate is circular, and the at least one radial displacement groove is arranged in a vortex shape by taking the center of the rotary plate as the center; and
at least one positioning member passing through the at least one radial displacement slot of the rotating plate and the at least one through elongated slot of the upper cover plate;
when the rotating plate rotates, the at least one radial displacement groove drives the at least one positioning piece to radially move under the guidance of the at least one through long groove so as to form a wafer accommodating groove.
2. The temporary wafer spin stand of claim 1, wherein the upper cover plate has a circular shape, and the at least one through slot is radially disposed about a center of the upper cover plate.
3. The wafer rotation temporary station of claim 1, further comprising a lock; the upper cover plate comprises a through hole, the rotating plate further comprises an outer ring groove, and the lower base station comprises a locking hole; the locking piece passes through the through hole and the outer ring groove and is locked and attached to the locking hole.
4. The wafer rotating temporary table according to claim 1, wherein each of the positioning members comprises a wafer fixing portion protruding from an upper surface of the upper cover plate, a rectangular long block portion accommodated in the at least one through long groove of the upper cover plate, and a cylindrical portion accommodated in the at least one radial displacement groove of the rotating plate.
5. The temporary wafer rotation table of claim 1, further comprising a driving member assembled to the lower base, the driving member being coupled to the rotating plate and driving the rotating plate to rotate.
6. The wafer rotation temporary station according to claim 5, wherein the drive member comprises a drive wheel, the lower base station comprises a peripheral wall comprising an axial groove, and the upper cover plate comprises a radial groove; the driving wheel is pivoted in the axial groove and the radial groove, and the outer circumference of the driving wheel contacts the side wall of the rotating plate.
7. The wafer rotating temporary table of claim 1, further comprising a steering seat on which the lower base is assembled.
8. The wafer rotating temporary table according to claim 1, wherein an upper surface of the upper cover plate is provided with a fixing member; when the rotating plate rotates, the at least one radial displacement groove drives the at least one positioning piece to approach or separate from the fixing piece under the guidance of the at least one through long groove.
9. The wafer rotating temporary table according to claim 1, comprising four positioning members; the upper cover plate is provided with four through long grooves which are arranged in a cross shape; the rotating plate is provided with four radial displacement grooves which are equidistantly arranged; the four positioning pieces respectively penetrate through the four radial displacement grooves of the rotating plate and the four through long grooves of the upper cover plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810926977.4A CN110838460B (en) | 2018-08-15 | 2018-08-15 | Wafer rotating temporary placing table |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810926977.4A CN110838460B (en) | 2018-08-15 | 2018-08-15 | Wafer rotating temporary placing table |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110838460A CN110838460A (en) | 2020-02-25 |
| CN110838460B true CN110838460B (en) | 2023-08-22 |
Family
ID=69572915
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810926977.4A Active CN110838460B (en) | 2018-08-15 | 2018-08-15 | Wafer rotating temporary placing table |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110838460B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01287939A (en) * | 1988-05-13 | 1989-11-20 | Fujitsu Ltd | Wafer positioning mechanism |
| JPH028039U (en) * | 1988-06-24 | 1990-01-18 | ||
| JPH0697266A (en) * | 1992-09-11 | 1994-04-08 | Fujitsu Ltd | Wafer chuck |
| JP2005340264A (en) * | 2004-05-24 | 2005-12-08 | Asahi Kasei Microsystems Kk | Substrate accommodation vessel and auxiliary tool therefor |
| CN201017857Y (en) * | 2006-12-27 | 2008-02-06 | 中芯国际集成电路制造(上海)有限公司 | Crystal boat box capable of changing dimension |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5316689B1 (en) * | 2012-10-31 | 2013-10-16 | 千住金属工業株式会社 | Positioning jig and position adjusting method |
-
2018
- 2018-08-15 CN CN201810926977.4A patent/CN110838460B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01287939A (en) * | 1988-05-13 | 1989-11-20 | Fujitsu Ltd | Wafer positioning mechanism |
| JPH028039U (en) * | 1988-06-24 | 1990-01-18 | ||
| JPH0697266A (en) * | 1992-09-11 | 1994-04-08 | Fujitsu Ltd | Wafer chuck |
| JP2005340264A (en) * | 2004-05-24 | 2005-12-08 | Asahi Kasei Microsystems Kk | Substrate accommodation vessel and auxiliary tool therefor |
| CN201017857Y (en) * | 2006-12-27 | 2008-02-06 | 中芯国际集成电路制造(上海)有限公司 | Crystal boat box capable of changing dimension |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110838460A (en) | 2020-02-25 |
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