JP2005335086A - Circuit board, resin molded product, electronic part and resin molded product or electronic part manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve the problem wherein resin flash is formed on the non-mounting surface of a substrate when the chip mounted on the mounting surface of the substrate is sealed with a resin. <P>SOLUTION: A circuit board 1a to be used has a die pad part 24 having the mounting surface 28 on which the chips 3 must be fixed and the non-mounting surface 21 being the surface opposite to the mounting surface 28, electrode parts 23 having to function as external electrodes 33 on the side of the non-mounting surface 21 in electronic parts being complete products and a thin plate part 27 provided on the side of the non-mounting surface 21 so as to close at least the gaps between the mutual electrode parts 23 on the side of the non-mounting surface 21 and is provided only with a plurality of the regions 2 respectively corresponding to the electronic parts. The chips 3 are respectively fixed to the respective regions 2 of the circuit board 1a and a plurality of the chips 3 are collectively sealed with the resin to form a resin molded product 16a while the thin plate part 27 is removed to complete a resin molded product 16b and this resin molded product 16b is separated at every region 2 to complete individual electronic parts. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a case where an electronic component is manufactured by resin-sealing a chip-like element (hereinafter appropriately referred to as “chip”) mounted on a circuit board such as a lead frame (hereinafter appropriately referred to as “substrate”). The present invention relates to a circuit board, a resin molded body, an electronic component, and a method for manufacturing the resin molded body or the electronic component.

  The conventional chip, which is mounted on each of the grid-like areas provided on the substrate, is collectively sealed with resin, and the resulting resin molded body is cut to form individual pieces corresponding to the respective areas. The case where an electronic component is manufactured will be described with reference to FIGS. FIG. 4 (1) is a plan view showing the positional relationship between the chip mounted on the substrate and the mold, and FIG. 4 (2) shows a state where the mold is clamped when a conventional substrate is used. It is sectional drawing shown along the BB line of (1), and FIG. 4 (3) is a top view which shows the resin molding which the chip | tip with which the board | substrate was mounted | worn was resin-sealed and completed. FIG. 5 (1) is a cross-sectional view taken along the line CC of FIG. 4 (1), showing a state where the peripheral edge of the substrate is clamped and the mold is clamped in conventional resin sealing. 2) is a front view showing a resin molded body taken out from the mold after resin sealing is completed, and FIG. 5 (3) is a front view showing a process of cutting the resin molded body in FIG. 5 (2). is there. FIG. 6A is a plan view showing one region of a conventional substrate, and FIG. 6B is a cross-sectional view of the substrate of FIG. 6A along the line CC. It should be noted that any figure used in the following description is exaggerated and schematically illustrated for easy understanding. In the following description, a metal lead frame made of Cu or the like will be described as an example of the substrate.

  As shown in FIG. 4, the conventional substrate 1p made of the lead frame used in this case is provided with regions 2 corresponding to the finished electronic components in a grid pattern. That is, the substrate 1p is a so-called matrix type substrate, and a chip 3 made of an LSI or the like is mounted in each region 2. In addition, a mold 6 including a lower mold 4 and an upper mold 5 facing each other is used as a mold for resin sealing.

  Conventional resin sealing using the matrix type substrate 1p is performed as follows. First, the chip 3 is die-bonded to each region 2 of the conventional substrate 1p. Next, the electrodes (both not shown) of the chip 3 and the substrate 1p are electrically connected by wire bonding. Next, as shown in FIGS. 4 (2) and 5 (1), the entire region 2 of the substrate 1p is covered with the cavity 7 provided in the upper die 5, so that the substrate 1p becomes lower. 4 is placed on top. Next, after the mold 6 is clamped, the resin tablet (not shown) disposed in the pot 8 provided in the lower mold 4 is pressed by the plunger 9 to pressurize and heat the resin tablet. Is melted to produce a molten resin 10 having fluidity. Next, the molten resin 10 is pressurized and injected into the cavity 7 all at once through the runner 12 and the gate 13 in order from the cal 11 provided on the upper mold 5. Next, after the molten resin 10 is cured to form a cured resin, the mold 6 is opened, and unnecessary portions of the cured resin that are cured in the resin flow path 14 including the cal 11, the runner 12, and the gate 13, that is, Perform a gate break to separate unnecessary resin. Thereby, as shown in FIGS. 4 (3) and 5 (2), a plurality of chips 3 mounted on the substrate 1p are collectively resin-sealed with a sealing resin 15 made of a cured resin. The body 16p is completed by so-called transfer molding. Here, the sealing resin 15 is formed so as to block the through-hole 17 also in the through-hole 17 provided in the substrate 1p. Next, as shown in FIG. 5 (3), the resin molded body 16 p fixed by the suction table 20 using the rotary blade 19 in the dicing line 18 virtually provided at the boundary of each region 2. 4. Cut in the X direction and Y direction in FIG. Through the steps so far, the resin molded body 16p is divided for each region 2, and an electronic component composed of individual pieces corresponding to each region 2 is completed (for example, see Patent Document 1).

  However, according to the above-described conventional technique, the molten resin 10 that is collectively injected into the cavity 7 is a surface where the chip 3 is not mounted via the through hole 17 in the substrate 1p, that is, the non-mounting surface 21. (The lower surface in FIG. 5) may leak out. As a result, the leaked molten resin 10 is cured on the non-mounting surface 21 of the substrate 1p and a resin flash (flash) 22 is formed. Then, on the non-mounting surface 21, the leads 23 arranged along the periphery of the chip 3, the island to which the chip 3 is fixed, that is, the die pad 24, and the suspension lead 25 that supports the die pad 24, shown in FIG. 6. The resin beam 22 formed in the above causes the following problems.

  First, the resin beam 22 causes a poor appearance. Therefore, the electronic component in which the resin beam 22 is generated may be a defective product. Second, the resin beam 22 is interposed between the terminal (external electrode) of the electronic component and the terminal of the printed circuit board when the completed electronic component is mounted on the printed circuit board. Cause. Therefore, the electronic component in which the resin beam 22 is generated may be defective due to this. In particular, the presence of the resin beam 22 between the leads 23 tends to cause a connection failure. Thirdly, the resin beam 22 makes the fixing of the resin molded body 16p by the suction table 20 unstable. Therefore, chatter is generated when the resin molded body 16p is cut, and there is a possibility that a defect may occur with respect to the dimensional accuracy, appearance quality, and the like of the finished electronic component. From these facts, the generation of the resin beam 22 has a problem that the yield of electronic parts is lowered. In particular, in the substrate 1p made of the lead frame shown in FIG. 6, since the area occupied by the through holes 17 in each region 2 is large, the resin flash 22 is likely to occur. In recent years, as the demand for thinning electronic components is high, the fluidity of the molten resin 10 tends to increase, so that the resin flash 22 is more likely to occur.

  Further, as shown in FIG. 5A, the matrix type substrate 1p of FIG. 4 is sandwiched between the lower mold 4 and the upper mold 5 at the peripheral edge portion 26, but is sandwiched at the center portion. It has not been. Therefore, in the state where the mold 6 is clamped, deformation such as minute warping and undulation is likely to occur in the substrate 1p. Furthermore, since the substrate 1p tends to increase in size in response to a request for cost reduction in recent years, deformations such as minute warping and undulation in the substrate 1p are likely to occur. From these things, since the resin flash 22 is easy to generate | occur | produce, the problem which generate | occur | produces due to the resin flash 22 is getting more serious. The first and second problems described above may occur even when the matrix type substrate 1p is not used. That is, those problems are that one resin component is sealed by injecting a molten resin into one cavity covering one or more chips mounted on the substrate and curing it, and one electronic component corresponding to the cavity. Even in the case of forming, there is a risk of occurrence. In addition, these problems may occur in the same manner even when a plurality of cavities that respectively cover a plurality of chips are used.

  Incidentally, in order to prevent the occurrence of the resin beam 22 shown in FIG. 5, a film is stretched between the mold surface of the mold 6 (the lower mold 4 in FIGS. 4 and 5) and the conventional substrate 1p. In this state, a method of performing resin sealing has been proposed. Since this film is compressed and deformed by being pressed between the substrate 1p and the mold surface of the lower mold 4 when the lower mold 4 and the upper mold 5 are clamped, the through hole 17 is blocked. Thereby, it is suppressed that the molten resin 10 leaks to the non-mounting surface 21 of the board | substrate 1p via the through-hole 17. FIG. Therefore, generation | occurrence | production of the resin beam 22 is prevented (for example, refer patent document 2).

However, in this case, there are the following problems. First, since such a method using a film is a so-called disposable method, the load on the environment increases. Secondly, the running cost increases due to the disposable method. Third, since a film supply and winding mechanism is required, the apparatus is complicated, and the cost of the apparatus increases.
Japanese Unexamined Patent Publication No. 2000-12578 (pages 4-5, FIG. 1, FIG. 3, FIG. 5, FIG. 6) JP-A-8-156014 (pages 4-5, FIG. 1)

  The problem to be solved by the present invention is that when a chip mounted on a mounting surface of a substrate is resin-sealed, a resin flash occurs on the non-mounting surface of the substrate.

  In order to solve the above-described problems, a circuit board according to the present invention has one surface (28) to which the chip-like element (3) is to be fixed and the other surface that is the opposite surface of the one surface (28). And a die pad portion (24) having (21), and an electrode portion (23) to function as an external electrode (33) on the other surface (21) side in the electronic component as a finished product, and fluidity Used when producing a resin molded body (16b) including at least an electronic component by resin-sealing the chip-like element (3) using a cured resin (15) formed by curing the resin (10). The circuit board (1a) is provided with at least a thin plate portion (27) provided so as to block between the electrode portions (23), and is completed as a resin molded body (16b) or an electronic component. In the thin plate (27 There wherein the should have been removed.

  The circuit board according to the present invention is characterized in that the circuit board (1a) is provided with a plurality of regions (2) each corresponding to an electronic component.

  Moreover, the resin molding which concerns on this invention has one surface (28) to which a chip-shaped element (3) should be fixed, and the other surface (21) which is an opposite surface of this one surface (28). It has a die pad part (24) and an electrode part (23) that should function as an external electrode (33) on the other surface (21) side of the electronic component as a finished product, and the fluid resin (10) is cured. A resin molded body (16b) produced by resin-sealing the chip-like element (3) using the cured resin (15) formed in this manner, and including at least an electronic component, at least an electrode portion (23) It has the thin plate part (27) which exists so that it may block between, and in the state completed as a resin molding (16b), the thin plate part (27) should be removed, It is characterized by the above-mentioned.

  Further, the resin molded body according to the present invention is characterized in that in the above-mentioned resin molded body (16b), a plurality of regions (2) each corresponding to an electronic component are provided.

  The electronic component according to the present invention includes a die pad portion (24) having one surface (28) and the other surface (21) opposite to the one surface (28), and the other in the completed state. Using the circuit board (1a) having the electrode part (23) to function as the external electrode (33) on the surface (21) side, the chip-like element (3) fixed to one surface (28) ) With a cured resin (15), and the circuit board (1a) is a thin plate portion (27) that exists so as to close at least between the electrode portions (23). And the thin plate portion (27) is removed in a completed state.

  The electronic component according to the present invention is the above-described electronic component, wherein the circuit board (1a) is provided with a plurality of regions (2) each corresponding to the electronic component, and the chip-like element (3) is provided. It is manufactured by separating the resin molded body (16b) in which the circuit board (1a) and the cured resin (15) are integrated after the resin sealing, for each region (2).

  The electronic component manufacturing method according to the present invention includes one surface (28) to which the chip-like element (3) is to be fixed and the other surface (21) opposite to the one surface (28). A die pad part (24) having an electrode, an electrode part (23) to function as an external electrode (33) on the other surface (21) side in the electronic component as a finished product, and at least between the electrode parts (23) A resin molded body (16b) including at least an electronic component using a circuit board (1a) having a thin plate portion (27) provided so as to close the substrate, or a manufacturing method of the electronic component, 24) fixing the chip-like element (3), electrically connecting the electrode of the chip-like element (3) and the electrode part (23), and the fluid resin (10) being cured. Chip-shaped element using cured resin (15) 3) Resin-sealing and filling the cured resin (15) into the recess (30) between at least the electrode portions (23) and the thin plate portion (27) and unnecessary among the cured resin (15) And a step of forming a resin molded body (16b) or an electronic component by removing the thin plate portion (27) and separating at least the electrode portions (23) from each other. .

  The electronic component manufacturing method according to the present invention is the above-described electronic component manufacturing method, wherein the circuit board (1a) is provided with a plurality of regions (2) each corresponding to the electronic component, and a resin. The method includes a step of completing each electronic component by separating the molded body (16b) for each region (2).

  According to the present invention, one surface (28) on which the chip-like element (3) is to be fixed to the circuit board (1a) and the other surface (21) which is the opposite surface of the one surface (28), And an electrode part (23) to function as an external electrode (33) on the other surface (21) side of the electronic component as a finished product. Further, the circuit board (1a) is provided with a thin plate portion (27) so as to close at least the space between the electrode portions (23). By using this circuit board (1a), when the chip-like element (3) mounted on one surface (28) is resin-sealed, at least between the electrode parts (23), the other Leakage of the flowable resin (10) with respect to the side (21) of the plate is prevented. Therefore, in the resin molded body (16b) or the other surface (21) of the electronic component produced by resin-sealing the chip-like element (3) fixed to the one surface (28) of the circuit board (1a). In addition, the generation of the resin flash (22) between at least the electrode portions (23) is prevented.

  Further, according to the present invention, the resin molded body (16b) and the electronic component manufactured by sealing the chip-like element (3) fixed to the one surface (28) of the circuit board (1a) described above with resin. In this case, on the other surface (21) side opposite to the one surface (28), at least the resin flash (22) between the electrode portions (23) is prevented.

  Moreover, according to this invention, while sealing the chip-shaped element (3) fixed to one surface (28) of the circuit board (1a) mentioned above, at least electrode part (23) and thin-plate part (27). The resin molded body (16b) is formed by filling the concave portion (30) with the cured resin (15), and then the thin plate portion (27) is removed. Thereby, at least the electrode parts (23) are separated from each other, and an electronic component is manufactured. Therefore, on the other side (21), that is, the side where the electrode part (23) functions as the external electrode (33), at least the occurrence of the resin flash (22) between the electrode parts (23) is prevented. be able to. This makes it possible to manufacture an electronic component having no resin flash (22) at least between the electrode portions (23).

  According to the present invention, the circuit board (1a) described above is provided with a plurality of regions (2) each corresponding to an electronic component. Then, the chip-like element (3) fixed in each region (2) is resin-sealed to form a resin molded body (16b), and provided at least between the electrode portions (23). The thin plate portion (27) is removed, and then the resin molded body (16b) is separated for each region (2). Thereby, resin sealing is performed once for one circuit board (1a) to form a resin molded body (16b), and the resin molded body (16b) is separated for each region (2). A plurality of electronic components can be manufactured. Therefore, a large number of electronic components having no resin flash (22) at least between the electrode portions (23) can be efficiently manufactured.

  A die pad portion (24) having one surface (28) to which the chip-like element (3) is to be fixed and the other surface (21) opposite to the one surface (28), and a finished product. In the electronic component, the electrode part (23) which should function as the external electrode (33) on the other surface (21) side and the thin plate part (27) provided so as to close at least the space between the electrode parts (23). An electronic component is manufactured using a circuit board (1a) having the following. The manufacturing method at that time includes a step of fixing the chip-like element (3) to the die pad portion (24), a step of electrically connecting the electrode of the chip-like element (3) and the electrode portion (23), a flow The chip-shaped element (3) is resin-sealed using a cured resin (15) formed by curing the conductive resin (10), and at least between the electrode portions (23) and the thin plate portion (27). A step of forming a resin molded body (16a) by filling the concave portion (30) with a cured resin (15), and a step of separating at least the electrode portions (23) by removing the thin plate portion (27). Is provided. The circuit board (1a) described above is provided with a plurality of regions (2) each corresponding to an electronic component. Then, the chip-like elements (3) are respectively fixed to the respective regions (2) of the circuit board (1a), and the plurality of chip-like elements (3) are collectively sealed with resin to form a resin molded body (16a). And the thin plate portion (27) is removed to complete the resin molded body (16b), and the resin molded body (16b) is separated for each region (2) to complete each individual electronic component.

  Embodiment 1 of a circuit board, a resin molded body, an electronic component, and a method for manufacturing the resin molded body or the electronic component according to the present invention will be described with reference to FIGS. In the following description, a metal lead frame made of Cu or the like will be described as an example of a circuit board (substrate). FIG. 1A is a plan view showing one region of the substrate according to this embodiment, and FIG. 1B is a cross-sectional view showing the substrate of FIG. 1A along the line AA. It is. FIG. 2A shows a state where the peripheral edge of the substrate is clamped and the mold is clamped in this embodiment, part of the line AA in FIG. 1A and part of the line AA in FIG. 2 (2) shows the state where the curing of the molten resin has been completed in the portion shown in FIG. 2 (1), and FIG. 2 (3) is taken out of the state of FIG. 2 (2). The process of removing the thin plate portion of the resin molded body is shown, and FIG. 2 (4) is a partial sectional view showing the resin molded body completed by removing the thin plate portion. In any of the drawings used in the following description, the same components as those in FIGS. 4 to 6 are denoted by the same reference numerals, and the description thereof is omitted.

  As shown in FIG. 1, the substrate 1a is a substrate according to the present embodiment, and has a matrix type structure like the conventional substrate 1p shown in FIG. The substrate 1a is provided with a thin plate portion 27 having a small plate thickness, instead of the through hole (through hole 17 in FIG. 6) in the conventional substrate. More specifically, each region 2 of the substrate 1a includes a die pad 24 having a mounting surface 28 to which a chip (not shown) is to be fixed, and external electrodes on the non-mounting surface 21 side in the finished electronic component. And a reinforcing portion 29 for preventing a decrease in the strength of the substrate 1a around each apex of each region 2 is provided. In the portion of the through hole 17 provided between the lead 23, the die pad 24, and the suspension lead 25 shown in FIG. 6, the side of the non-mounting surface 21 as shown in FIG. A thin plate portion 27 is provided. In other words, in the substrate 1 a, the lead 23, the die pad 24, and the reinforcing portion 29 are connected by the thin plate portion 27 on the non-mounting surface 21 side. Therefore, in the substrate 1a, unlike the conventional substrate 1p shown in FIG. 6, the mounting surface 28 is provided with a recess 30 having an opening, and there is no through hole. In addition, the board | substrate 1a which consists of such a lead frame is manufactured by half-etching the metal plate which is material. The thin plate portion 27 is removed in a step after resin sealing, as will be described later. Therefore, in consideration of ease of removal, it is preferable that the thin plate portion 27 has a minimum plate thickness such that the molten resin 10 does not leak out during resin sealing.

  The resin molded body and electronic component according to the present embodiment and the method for manufacturing the resin molded body or electronic component will be described with reference to FIGS. First, the chip 3 is die-bonded to the mounting surface 28 of the die pad 24 on the substrate 1a. In this case, the chip 3 is die-bonded for each region 2 on the mounting surface 28. Thereafter, the electrodes (not shown) of the chip 3 and the leads 23 of the substrate 1a are electrically connected by wire bonding using wires (not shown).

  Next, as shown in FIG. 2 (1), the substrate 1a is placed on the lower mold 4, the mold 6 is clamped, and the substrate 1a is sandwiched at the peripheral edge 26 of the substrate 1a, thereby improving fluidity. The molten resin 10 is poured into the cavity 7 at a time. Here, a thin plate portion 27 is provided on the non-mounting surface 21 side so as to close the space between the lead 23, the die pad 24, and the reinforcing portion 29. Therefore, in this step, the molten resin 10 does not leak to the non-mounting surface 21 side.

  Next, as shown in FIG. 2 (2), the molten resin 10 poured into the cavity 7 is cured to form a sealing resin 15 made of a cured resin, the mold 6 is opened, and the cured resin is formed. Among these, unnecessary portions, that is, unnecessary resins are separated and removed. As a result, a resin molded body 16a is formed in which the plurality of chips 3 mounted on the substrate 1a are collectively sealed with the sealing resin 15. In the resin molded body 16a, as can be seen from FIGS. 2A and 2B, the leads 23, the die pad 24, and the reinforcing portion 29 are connected by the thin plate portion 27. Thereby, since each lead 23 is electrically short-circuited, each of the electronic components contained in the resin molded body 16a cannot operate. Therefore, the resin molded body 16a is in an unfinished state as a semi-finished product of electronic parts.

  Next, after the mold 6 is opened, the resin molded body 16a is taken out. As shown in FIG. 2 (3), the resin molded body 16a is removed by a known method such as suction or adhesive tape (not shown). Fix on stage 31. Then, by irradiating the portion between the leads 23 in the thin plate portion 27 of the substrate 16a with the laser beam 32, the thin plate portion 27 in that portion is melted and removed. Further, the portion of the thin plate portion 27 between each of the lead 23, the die pad 24, and the reinforcing portion 29 is irradiated with the laser light 32, and the thin plate portion 27 of the portion is melted and removed. Thus, the leads 23 connected by the thin plate portion 27 are separated from each other, and each lead 23 is also separated from the die pad 24 and the reinforcing portion 29. Here, it is possible to remove the thin plate portion 27 in a short time by minimizing the thickness of the thin plate portion 27 to such an extent that the molten resin 10 does not leak out during resin sealing.

  By the way, as shown in FIG. 2 (4), at this stage, in each region 2, the thin plate portion 27 around each lead 23 is removed, and the upper portion of the side wall made of the lead 23 is exposed by the standoff d. An external electrode 33 is formed. And while having the external electrode 33 mutually independent in each area | region 2, the resin molding 16b which consists of those each area | region 2 is completed. In each region 2 of the resin molded body 16b, the external electrodes 33 are independent of each other. As a result, each region 2 operates normally when a predetermined power supply voltage and signal are supplied to each region 2 as long as no defect occurs in each region 2 corresponding to each electronic component as a finished product. . In other words, the resin molded body 16b is completed as a semi-finished product of electronic parts.

  Next, from the state shown in FIG. 2 (4), the resin molded body 16 b is irradiated with the laser beam 32 at the position of the dicing line 18. As the laser beam 32 used in the present embodiment, it is preferable to use, for example, a YAG laser beam, a short wavelength excimer laser beam, or the like. By this irradiation, in each dicing line 18, the substrate 1a and the sealing resin 15 are sequentially melted and removed, and the resin molded body 16b is cut. At this time, the leads 23 connected to each other in the adjacent regions 2 are separated from each other at the position of the dicing line 18, thereby completing the external electrodes 33 that are completely independent in each region 2. Through the steps up to here, the resin molded body 16b can be separated to complete individual electronic components including portions corresponding to the respective regions 2 of the substrate 1a. And the manufacturer of an electronic component can select non-defective products from the separated electronic components and ship them to consumers of the electronic components.

  According to the present invention, the thin plate portion 27 is provided on the non-mounting surface 21 side so as to close the space between the lead 23, the die pad 24, and the reinforcing portion 29 in the substrate 1a. This prevents the molten resin 10 from leaking to the non-mounting surface 21 side in the step of injecting the molten resin 10 into the cavity 7. Therefore, when manufacturing the resin molding 16b and an electronic component, the board | substrate 1a which can prevent generation | occurrence | production of a resin flash without using a film is provided.

  Further, resin sealing is performed using the substrate 1 a without using a film, and thereafter, the thin plate portion 27 is removed around each lead 23. As a result, it is possible to manufacture an electronic component having the external electrode 33 made of the lead 23 and having no resin burrs. Further, the side wall of each external electrode 33 is exposed from the sealing resin 15 by the standoff d. Thereby, when an electronic component is mounted on a printed circuit board or the like, a conductive material such as solder adheres to the side wall of the external electrode 33. Therefore, an electronic component in which the external electrode 33 and a terminal such as a printed board are reliably connected is realized.

  The substrate 1a is provided with a plurality of regions 2 each corresponding to one electronic component. Then, the chips 3 fixed in each region 2 are collectively resin-sealed to form a resin molded body 16a, and at least the thin plate portion 27 provided so as to close between the leads 23 is removed. The resin molded body 16b is formed, and the resin molded body 16b is separated for each region 2. Thereby, resin sealing is performed once for one substrate 1a to form the resin molded body 16a, and the thin plate portion 27 is removed to complete the resin molded body 16b. A plurality of electronic components can be manufactured by separating each unit. Therefore, without using a film, it is possible to manufacture a resin molded body 16b without a resin flash, and it is possible to efficiently manufacture a large number of electronic components without a resin flash.

  In the description so far, the thin plate portion 27 around each lead 23 in the resin molded body 16 a is melted and removed by irradiating the laser beam 32. Not only this but the thin-plate part 27 around each lead | read | reed 23 can be cut and removed by making a rotary blade, a wire saw, etc. contact the part. Moreover, you may use combining the laser beam 32, a rotary blade, a wire saw, etc. FIG.

  Further, at the position of the dicing line 18, the resin molded body 16b from which the thin plate portion 27 has been removed is irradiated with a laser beam 32, whereby the substrate 1a and the sealing resin 15 are sequentially melted and removed, and the resin molded body is removed. 16b was cut. Not limited to this, the resin molded body 16b may be cut at the position of the dicing line 18 using a rotary blade, a wire saw, or the like. Further, at the position of the dicing line 18, the resin molded body 16b is removed to the middle in the thickness direction by the above-mentioned means to form a groove or a continuous blind hole (scribing), and then suitable for the resin molded body 16b. This may be divided by applying an external force. Also by these methods, the part corresponding to each region 2 in the substrate 1a in the resin molded body 16b can be separated from each other to complete individual electronic components.

  Embodiment 2 of the resin molded body, the electronic component, and the method of manufacturing the resin molded body or the electronic component according to the present invention will be described with reference to FIG. 3 (1) shows the step of exposing the photoresist applied to the substrate in this embodiment, and FIG. 3 (2) shows the resin-sealed state on the substrate on which the resist pattern is formed. ) Is a partial cross-sectional view showing a state in which the substrate on which the resist pattern is formed is etched, and FIG. 3 (4) is a partial cross-sectional view showing a state in which the resist pattern is removed.

  According to this embodiment, first, a resist film 34 is formed by applying a positive photoresist to the non-mounting surface 21 of the substrate 1a using a roll coater or a spin coater. In this step, a dry coater (laminator) may be used to attach a photoresist (dry film resist) formed in a film shape to the non-mounting surface 21 of the substrate 1a.

  Next, as shown in FIG. 3A, a photomask 35 is positioned and arranged on the non-mounting surface 21 of the substrate 1a. Then, the resist film 34 formed on the non-mounting surface 21 is irradiated through the photomask 35 with the light beam 36 for exposure. In this embodiment, since a positive type photoresist is used, the photomask 35 is irradiated with a portion of the substrate 1a to be removed, that is, the resist film 34 covering the thin plate portion 27 so as to block light. Pattern is formed. Then, a decomposition reaction is caused to occur in the resist film 34 in the portion irradiated with the exposure light beam 36, that is, in the exposure portion 37, so that the resist film 34 is soluble in a predetermined developer. Here, as the light beam 36 for exposure, for example, ultraviolet rays can be used.

  Next, following the state shown in FIG. 3A, the exposed substrate 1a is taken out from under the photomask 35, and the exposed resist film 34 is developed using a predetermined developer. Thus, a resist pattern 40 is formed on the non-mounting surface 21 of the substrate 1a. The resist pattern 40 includes an opening 38 formed by dissolving the exposed portion 37 and a remaining portion 39 where the photoresist remains (FIG. 3B). reference).

  Next, as shown in FIG. 3B, after the chip (not shown) is mounted on the substrate 1a, the chip is resin-sealed. That is, the chip is die-bonded to the mounting surface 28 of the substrate 1a shown in FIG. 3A, and the electrodes (not shown) of the chip 3 and the leads 23 of the substrate 1a are wire-bonded. Thereafter, the chip is sealed with a sealing resin 15 made of a cured resin. Thereby, the resin molded body 16a having the resist pattern 40 is formed. Similar to the first embodiment, the resin molded body 16a is in an unfinished state as a semi-finished product of an electronic component.

  Next, as shown in FIGS. 3 (2) and 3 (3), the etching solution is applied to the non-mounting surface 21 side of the substrate 1a of the resin molded body 16a, that is, the side on which the resist pattern 40 is formed. Use and etch. 3 (2), the portion covered with the remaining portion 39 of the substrate 1a remains without being dissolved, while the thin plate portion 27 exposed at the opening 38 is dissolved and removed. Therefore, as apparent from a comparison between FIG. 3 (2) and FIG. 3 (3), an independent external electrode 33 is provided on the non-mounting surface 21 side of the substrate 1a and immediately below the remaining portion 39. Each of the removed thin plate portions 27 protrudes from the sealing resin 15 by the thickness dimension. This thickness dimension is the dimension at which the upper part of the side wall of the external electrode 33 protrudes from the sealing resin 15, that is, the standoff d. By the steps so far, the external electrodes 33 that are independent from each other in each region 2 are formed, and the resin molded body 16b that includes these regions 2 is formed.

  Next, as shown in FIG. 3D, the remaining portion 39 made of photoresist is removed using a scrubber or the like. As a result, the resin molded body 16b in which the independent external electrode 33 protruding from the sealing resin 15 by the standoff d is formed on the non-mounting surface 21 side of the substrate 1a is completed. In addition, the resin molded body 16b includes a plurality of electronic components composed of the regions 2 surrounded by the dicing lines 18 in a state where they are not separated. Therefore, the resin molded body 16b is a semi-finished product for an electronic component that is a finished product. That is, as in Example 1, the resin molded body 16b is completed as a semi-finished product of electronic parts.

  Next, using a prober, a predetermined power supply voltage / signal is supplied to each electronic component of the resin molded body 16b shown in FIG. 3 (4) to perform an electrical operation test. When a malfunction is found, a fail mark is attached to the sealing resin 15 in the region 2 to clearly indicate that the electronic component corresponding to the region 2 is a defective product.

  Next, as in Example 1, the resin molded body 16b is cut at the position of the dicing line 18. Thereby, the resin molded body 16b can be separated into portions corresponding to the respective regions 2 in the substrate 1a to complete individual electronic components. And the manufacturer of an electronic component can sort out the non-defective products from the separated electronic components and ship them to consumers of the electronic components.

  According to the present invention, as in the first embodiment, the resin molded body 16b and the electronic component without resin flash are manufactured without using a film. In addition, due to the presence of the standoff d in the external electrode 33, an electronic component in which the external electrode 33 and a terminal such as a printed board are reliably connected is manufactured. In addition, the resin molded body 16b having no resin burrs can be produced without using a film, and a large number of electronic components without resin burrs can be efficiently produced. Further, unlike the first embodiment, the thin plate portion 27 of the substrate 1a is collectively removed by etching. Therefore, the efficiency at the time of forming the external electrode 33 by removing the thin plate portion 27 is improved.

  In this example, after forming the resist pattern 40 on the non-mounting surface 21 of the substrate 1a, the chip was sealed with the sealing resin 15. However, the resist pattern 40 may be formed on the non-mounting surface 21 of the substrate 1a after the chip is resin-sealed.

  Further, after the resist pattern 40 was formed on the non-mounting surface 21 of the substrate 1a, the non-mounting surface 21 side was etched using an etching solution. Not only such wet etching, but also dry etching can be used. Furthermore, you may spray a fine abrasive grain with a high pressure fluid on the non-mounting surface 21 in which the resist pattern 40 was formed using a blasting method. By any of these methods, the thin plate portion 27 of the substrate 1a can be removed at a time.

  In this example, a positive type photoresist was used. The present invention is not limited to this, and a negative photoresist and a photomask having a pattern obtained by inverting the photomask 35 can be used in combination.

  In addition, according to each Example mentioned above, the non-mounting surface 21 of the die pad 24 was exposed in the resin molded body 16b which is a finished product or a semi-finished product (FIG. 2 (4), (See FIG. 3 (4)). Here, the types of electronic components include a die pad non-exposed type in which the non-mounting surface 21 of the die pad 24 is not exposed, in addition to such a die pad exposed type. In this die pad non-exposed electronic component, the non-mounting surface 21 of the die pad 24 is covered with the sealing resin 15. Referring to FIG. 1, in the case of the die pad non-exposed type, the substrate 1 a made of a lead frame is processed so that the die pad 24 is positioned above the leads 23. For example, a thin plate portion 27 is provided so as to extend from at least some of the leads 23, and the respective lead 23 and the die pad 24 are partially connected by the thin plate portion 27. Further, between the leads 23, through holes are provided in the vicinity of the die pad 24, and a thin plate portion 27 is provided in a part other than the through holes. With this structure, the fluid resin wraps around the non-mounting surface 21 side of the die pad 24 through the through holes around the die pad 24. Also in this case, in order to prevent the resin flash in the portion between the leads 23, the thin plate portion 27 is provided at least in this portion. Then, after resin sealing, the thin plate portion 27 provided so as to close at least a portion between the leads 23 on the non-mounting surface 21 side is removed.

  Moreover, according to each Example mentioned above, the thin-plate part 27 was provided in the non-mounting surface 21 side of the board | substrate 1a. Not only this but the thin-plate part 27 should just be provided in any one part between the non-mounting surface 21 and the mounting surface 28 of the board | substrate 1a. In this case, the thin plate portion 27 is removed by the laser 32 of the first embodiment or by etching using the dry resist of the second embodiment. And such a board | substrate 1a is manufactured by giving processes, such as a half etching, from both surfaces with respect to the metal plate which is material.

  Moreover, in each Example mentioned above, the operation | movement test is performed with respect to the resin molding 16b, and the manufacturer which manufactured the resin molding 16b in the subsequent step has specified the area | region 2 where malfunctioning generate | occur | produced. You may ship the resin molding 16b to the consumer of an electronic component. In this case, the resin molded body 16b is completed as a semi-finished product of electronic parts, and the customer performs the process of separating the resin molded body 16b into individual pieces of electronic parts. Further, instead of or in addition to adding a fail mark to the area 2 in which the malfunction has occurred, a flexible disk on which information (mapping information) indicating in which area 2 the malfunction has occurred is recorded. Such a recording medium may be shipped to the consumer. Further, the mapping information may be transmitted to the consumer via a telecommunication line or wirelessly.

  In the above description, as the substrate 1a, a metal lead frame having the thin plate portion 27 instead of the conventional through hole has been described as an example. Not limited to this, as the substrate 1a, a printed board based on glass epoxy or the like having a thin plate portion 27 instead of a through hole, a flexible substrate based on polyimide or the like, a TAB film, or the like is used. Thus, the present invention can be applied to these substrates. In this case, a thin plate portion (corresponding to the thin plate portion 27 in FIG. 1) made of copper foil is provided so as to cover the through holes (corresponding to the through holes 17 in FIG. 6) provided in the base material of these substrates. Provided.

  The case where the present invention is applied to the matrix type substrate 1a has been described so far. However, the resin sealing is performed by injecting a molten resin into one cavity 7 covering one or a plurality of chips mounted on the substrate 1a and curing the resin. The present invention can also be applied to the case where individual electronic components are formed. In these cases, the resin molded body itself or the remaining portion from which unnecessary portions are removed from the resin molded body constitutes an electronic component.

  The present invention can also be applied to the case where resin sealing is performed by injecting molten resin into the cavities 7 that individually cover the plurality of chips mounted on the substrate 1a and curing them. In this case, after the resin sealing is performed to form the resin molded body, the resin molded body is separated by a method such as punching or cutting to complete each electronic component having a chip.

  Further, the substrate 1 a is disposed on the lower mold 4, and the cavity 7 is formed on the upper mold 5. Not only this configuration but also the substrate 1 a may be disposed on either the lower mold 4 or the upper mold 5, and the cavity 7 may be formed in the lower mold 4. Including this case, resin sealing can be performed by applying not only transfer molding but also injection molding.

  In addition, the substrate 1a is disposed in the upper mold 5 and the cavity 7 is formed in the lower mold 4, so that at least a part of the cavity 7 is filled with the fluid resin before the mold clamping is completed. It is good to do. In this configuration, by using supply means such as a dispenser, at least a part of the cavity 7 can be filled in advance with a fluid resin that is liquid at room temperature before heating. Further, a solid resin material such as powder, granule, or sheet is supplied to the cavity 7, and the resin material is heated and melted by using a heating means such as a heater block or a halogen lamp. A part can be made into the state filled with fluid resin. In these cases, instead of the plunger serving as the filling means, the supply means or the heating means functions as a filling means for filling at least a part of the cavity 7 with the fluid resin.

  Moreover, the lower mold | type 4 and the upper mold | type 5 which oppose each other were used. In the present invention, it is possible to use a plurality of resin-sealed molds that face each other without being limited to the vertical direction.

  Further, the electrode of the chip (not shown) and the lead 23 of the substrate 1a were electrically connected by wire bonding. However, the present invention is not limited to this, and a method other than wire bonding, for example, flip chip bonding may be used to electrically connect the electrode of the chip and the lead 23 of the substrate 1a.

  In addition to the above-described embodiments, the entire surface of the non-mounting surface 21 of the substrate 1a may be etched, polished, or ground until the thin plate portion 27 is completely removed after the chip is sealed with the resin. Good. According to this, as in each of the embodiments, it is possible to manufacture the resin molded body 16b without a resin flash, and it is possible to efficiently manufacture a large number of electronic components without a resin flash. In this case, the standoff d in the external electrode 33 cannot be formed. Therefore, this method may be applied when there is no particular problem even if there is no standoff d. For example, this method is used when the number of external electrodes 33 is small and the plane area is large, that is, when the external electrodes 33 and the terminals of the printed circuit board are securely connected without the standoff d. It is preferable to apply.

  In addition, the present invention is not limited to the above-described embodiments, and may be arbitrarily combined, changed, or selected as necessary without departing from the spirit of the present invention. It can be done.

FIG. 1 (1) is a plan view showing one area of the substrate according to the first embodiment of the present invention, and FIG. 1 (2) shows the substrate of FIG. 1 (1) along the line AA. It is sectional drawing shown. FIG. 2 (1) shows the state where the peripheral edge of the substrate is clamped and the mold is clamped in Example 1 of the present invention, along the line AA in FIG. 1 (1) and the line AA in FIG. 4 (1). 2 (2) shows a state in which the cured resin is completely cured in the portion shown in FIG. 2 (1), and FIG. 2 (3) shows the state from FIG. 2 (2). FIG. 2 (4) is a partial cross-sectional view showing the completed resin molded body from which the thin plate portion has been removed, showing the process of removing the thin plate portion of the resin molded body taken out. FIG. 3 (1) shows the step of exposing the photoresist applied to the substrate in Example 2 of the present invention, and FIG. 3 (2) shows the state of resin sealing on the substrate on which the resist pattern is formed. 3 (3) is a partial cross-sectional view showing a state where the substrate on which the resist pattern is formed is etched, and FIG. 3 (4) is a partial cross-sectional view showing a state where the resist pattern is removed. FIG. 4 (1) is a plan view showing the positional relationship between the chip mounted on the substrate and the mold, and FIG. 4 (2) shows a state where the mold is clamped when a conventional substrate is used. It is sectional drawing shown along the BB line of (1), and FIG. 4 (3) is a top view which shows the resin molding which the chip | tip with which the board | substrate was mounted | worn was resin-sealed and completed. FIG. 5 (1) is a cross-sectional view taken along the line CC of FIG. 4 (1), showing a state where the peripheral edge of the substrate is clamped and the mold is clamped in conventional resin sealing. 2) is a front view showing a resin molded body taken out from the mold after resin sealing is completed, and FIG. 5 (3) is a front view showing a process of cutting the resin molded body in FIG. 5 (2). is there. FIG. 6A is a plan view showing one region of a conventional substrate, and FIG. 6B is a cross-sectional view of the substrate of FIG. 6A along the line CC.

Explanation of symbols

1a Board (circuit board)
2 areas 3 chips (chip-shaped elements)
4 Lower mold 5 Upper mold 6 Mold 7 Cavity 8 Pot 9 Plunger 10 Molten resin (flowable resin)
DESCRIPTION OF SYMBOLS 11 Cal 12 Runner 13 Gate 14 Resin flow path 15 Sealing resin 16a, 16b Resin molding 17 Through-hole 18 Dicing line 19 Rotary blade 20 Suction table 21 Non-mounting surface (the other surface)
22 Resin beam 23 Lead (electrode part)
24 Die pad (die pad part)
25 Suspended lead 26 Peripheral portion 27 Thin plate portion 28 Mounting surface (one surface)
DESCRIPTION OF SYMBOLS 29 Reinforcement part 30 Concave part 31 Stage 32 Laser beam 33 External electrode 34 Resist film 35 Photomask 36 Light beam 37 Exposure part 38 Opening part 39 Remaining part 40 Resist pattern d Standoff

Claims (8)

A die pad portion having one surface to which the chip-like element is to be fixed and the other surface opposite to the one surface, and functions as an external electrode on the side of the other surface in the finished electronic component. Used when producing a resin molded body including at least the electronic component by resin-sealing the chip-like element using a cured resin formed by curing a fluid resin. A circuit board,
With a thin plate portion provided so as to block at least between the electrode portions,
The circuit board, wherein the thin plate portion should be removed in a state where the resin molded body or the electronic component is completed. The circuit board according to claim 1,
A circuit board comprising a plurality of regions each corresponding to the electronic component. A die pad portion having one surface to which the chip-like element is to be fixed and the other surface opposite to the one surface, and functions as an external electrode on the side of the other surface in the finished electronic component. A resin molded body comprising at least the electronic component manufactured by resin-sealing the chip-like element using a cured resin formed by curing a fluid resin with a power electrode portion,
With a thin plate portion that exists so as to block at least between the electrode portions,
In the state completed as the said resin molding, the said thin plate part should be removed, The resin molding characterized by the above-mentioned. In the resin molded product according to claim 3,
A resin molded body comprising a plurality of regions each corresponding to the electronic component. A circuit board having a die pad portion having one surface and the other surface opposite to the one surface and an electrode portion to function as an external electrode on the other surface side in a completed state is used. An electronic component manufactured by resin-sealing a chip-like element fixed on the one surface with a cured resin,
The circuit board includes at least a thin plate portion that exists so as to block between the electrode portions,
An electronic component, wherein the thin plate portion is removed in a completed state. The electronic component according to claim 5, wherein
The circuit board has a plurality of regions each corresponding to the electronic component, and
An electronic component manufactured by separating a resin molded body in which the circuit board and the cured resin are integrated into each region after the chip-shaped element is resin-sealed. A die pad portion having one surface to which the chip-like element is to be fixed and the other surface opposite to the one surface, and functions as an external electrode on the side of the other surface in the finished electronic component A method of manufacturing a resin molded body or electronic component including at least an electronic component using a circuit board having a power electrode portion and a thin plate portion provided so as to block at least between the electrode portions,
Fixing the chip-shaped element to the die pad portion;
Electrically connecting the electrode of the chip-like element and the electrode portion;
A step of resin-sealing the chip-like element using a cured resin formed by curing a flowable resin, and filling the cured resin in a recess at least between the electrode portions and the thin plate portion; ,
Removing unnecessary portions of the cured resin;
And a step of forming the resin molded body or the electronic component by removing the thin plate portion and separating at least the electrode portions from each other. In the manufacturing method of the electronic component of Claim 7,
The circuit board has a plurality of regions each corresponding to the electronic component, and
A method of manufacturing an electronic component comprising the step of completing each of the electronic components by separating the resin molded body into the regions.

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