JP2005327509A - 導電性微粒子及び異方性導電材料 - Google Patents

導電性微粒子及び異方性導電材料 Download PDF

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JP2005327509A
JP2005327509A JP2004142851A JP2004142851A JP2005327509A JP 2005327509 A JP2005327509 A JP 2005327509A JP 2004142851 A JP2004142851 A JP 2004142851A JP 2004142851 A JP2004142851 A JP 2004142851A JP 2005327509 A JP2005327509 A JP 2005327509A
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fine particles
conductive fine
load value
conductive
particles
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JP2004142851A
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Japanese (ja)
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JP2005327509A5 (https=
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Shinya Uenoyama
伸也 上野山
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Sekisui Chemical Co Ltd
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Sekisui Chemical Co Ltd
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Priority to JP2004142851A priority Critical patent/JP2005327509A/ja
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JP2004142851A 2004-05-12 2004-05-12 導電性微粒子及び異方性導電材料 Pending JP2005327509A (ja)

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JP2004142851A JP2005327509A (ja) 2004-05-12 2004-05-12 導電性微粒子及び異方性導電材料

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JP2005327509A true JP2005327509A (ja) 2005-11-24
JP2005327509A5 JP2005327509A5 (https=) 2007-03-08

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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009017200A1 (ja) * 2007-08-02 2009-02-05 Hitachi Chemical Company, Ltd. 回路接続材料、それを用いた回路部材の接続構造及び回路部材の接続方法
JP2014080484A (ja) * 2012-10-15 2014-05-08 Hitachi Chemical Co Ltd 架橋ポリマー粒子、導電性粒子、異方性導電材料及び回路部材の接続構造体
JP2014080485A (ja) * 2012-10-15 2014-05-08 Hitachi Chemical Co Ltd 架橋ポリマー粒子、導電性粒子、異方性導電材料及び回路部材の接続構造体
JPWO2013085039A1 (ja) * 2011-12-08 2015-04-27 株式会社日本触媒 導電性微粒子及びそれを含む異方性導電材料
KR20180127439A (ko) 2016-03-23 2018-11-28 히타치가세이가부시끼가이샤 반응 장치, 그리고 수지 입자, 도전성 입자, 이방 도전 재료 및 접속 구조체의 제조 방법
US10546831B2 (en) 2015-05-27 2020-01-28 Dexerials Corporation Anisotropic electrically conductive film and connection structure
WO2020071271A1 (ja) * 2018-10-03 2020-04-09 デクセリアルズ株式会社 異方性導電フィルム、接続構造体、接続構造体の製造方法
JP2020095941A (ja) * 2018-10-03 2020-06-18 デクセリアルズ株式会社 異方性導電フィルム、接続構造体、接続構造体の製造方法

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009017200A1 (ja) * 2007-08-02 2009-02-05 Hitachi Chemical Company, Ltd. 回路接続材料、それを用いた回路部材の接続構造及び回路部材の接続方法
JPWO2009017200A1 (ja) * 2007-08-02 2010-10-21 日立化成工業株式会社 回路接続材料、それを用いた回路部材の接続構造及び回路部材の接続方法
TWI396205B (zh) * 2007-08-02 2013-05-11 日立化成工業股份有限公司 A circuit connecting material, a connecting structure using the circuit member, and a connection method of the circuit member
KR101302778B1 (ko) * 2007-08-02 2013-09-02 히타치가세이가부시끼가이샤 회로 접속 재료, 그것을 이용한 회로 부재의 접속 구조체 및 회로 부재의 접속 방법
CN101689410B (zh) * 2007-08-02 2013-10-16 日立化成株式会社 电路连接材料、使用它的电路构件的连接结构及电路构件的连接方法
JPWO2013085039A1 (ja) * 2011-12-08 2015-04-27 株式会社日本触媒 導電性微粒子及びそれを含む異方性導電材料
JP2014080485A (ja) * 2012-10-15 2014-05-08 Hitachi Chemical Co Ltd 架橋ポリマー粒子、導電性粒子、異方性導電材料及び回路部材の接続構造体
JP2014080484A (ja) * 2012-10-15 2014-05-08 Hitachi Chemical Co Ltd 架橋ポリマー粒子、導電性粒子、異方性導電材料及び回路部材の接続構造体
US10546831B2 (en) 2015-05-27 2020-01-28 Dexerials Corporation Anisotropic electrically conductive film and connection structure
US10892243B2 (en) 2015-05-27 2021-01-12 Dexerials Corporation Anisotropic electrically conductive film and connection structure
KR20180127439A (ko) 2016-03-23 2018-11-28 히타치가세이가부시끼가이샤 반응 장치, 그리고 수지 입자, 도전성 입자, 이방 도전 재료 및 접속 구조체의 제조 방법
WO2020071271A1 (ja) * 2018-10-03 2020-04-09 デクセリアルズ株式会社 異方性導電フィルム、接続構造体、接続構造体の製造方法
JP2020095941A (ja) * 2018-10-03 2020-06-18 デクセリアルズ株式会社 異方性導電フィルム、接続構造体、接続構造体の製造方法

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