JP2005317313A - Short circuit inspection method in wiring structure - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a short circuit inspection method for easily inspecting a short circuit between a first wiring and a second wiring in a short time even if a number of wirings are increased. <P>SOLUTION: This short circuit inspection method for inspecting a short circuit between a plurality of first wirings and second wirings repeats a first short circuit inspection process for dividing a first wiring start group into a plurality of first wiring groups to execute short circuit tests among all the respective first wiring groups and all the second wirings and for selecting short-circuited first wiring groups as the next first wiring start group until the number of the short-circuited first wirings reaches one, thereafter executes an additional first short circuit inspection process, then repeats a second short circuit inspection process for dividing a second wiring start group into a plurality of second wiring groups to execute short circuit tests among the respective second wiring groups and the short-circuited first wirings, and for selecting the short-circuited second wiring groups as the next second wiring start group until the number of the short-circuited second wirings reaches one, and thereafter executes an additional second short circuit inspection process. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a short circuit inspection method in a wiring structure.

  As an image display device that can replace the mainstream cathode ray tube (CRT), various types of flat display devices have been studied. Examples of such a flat display device include a liquid crystal display device (LCD), an electroluminescence display device (ELD), and a plasma display device (PDP). In addition, a cold cathode field emission display device, so-called field emission display (FED), which can emit electrons from a solid into a vacuum without using thermal excitation has been proposed. It has attracted attention from the viewpoint of color display and low power consumption.

  A cold cathode field emission display device (hereinafter sometimes abbreviated as a display device) is generally used for a cold cathode field emission display device having electron emission regions corresponding to pixels arranged in a two-dimensional matrix. A cathode panel (hereinafter may be abbreviated as a cathode panel) and an anode panel having a phosphor region that emits light when excited by collision with electrons emitted from an electron emission region are arranged to face each other through a vacuum layer. It has the structure made. The electron emission region EA is usually provided with a plurality of cold cathode field electron emission elements (hereinafter sometimes abbreviated as field emission elements). Examples of the field emission device include a Spindt type, an edge type, a flat type, and a flat type.

  As an example, FIG. 26 shows a conceptual partial end view of a conventional display device to which a Spindt type field emission device is applied, and shows a part of the cathode panel CP and the anode panel AP when the cathode panel CP and the anode panel AP are disassembled. FIG. 27 shows a schematic exploded perspective view of the above. A Spindt-type field emission device constituting such a display device includes a cathode electrode 11 formed on a support 10, an insulating layer 12, a gate electrode 13 formed on the insulating layer 12, and an opening 14 (gate electrode 13). A first opening 14A provided in the insulating layer 12, a second opening 14B provided in the insulating layer 12, and a conical electron emission portion 15 formed on the cathode electrode 11 located at the bottom of the opening 14. It is configured. The cathode electrode 11 has a stripe shape extending in the first direction, and the gate electrode 13 has a stripe shape extending in a second direction different from the first direction (see FIG. 27). An overlapping region where the striped cathode electrode 11 and the striped gate electrode 13 overlap corresponds to the electron emission region EA.

  On the other hand, the anode panel AP has phosphor regions 22 having a predetermined pattern on the substrate 20 (specifically, a red light-emitting phosphor region 22R, a green light-emitting phosphor region 22G, and a blue light-emitting phosphor region 22B). The phosphor region 22 is formed and covered with the anode electrode 24. In addition, a space between these phosphor regions 22 is embedded with a light absorbing layer (black matrix) 23 made of a light absorbing material such as carbon to prevent the occurrence of color turbidity and optical crosstalk in the display image. ing. In FIG. 26, reference numeral 21 represents a partition, reference numeral 25 represents a spacer, reference numeral 26 represents a spacer holding portion, and reference numeral 27 represents a frame.

  When a voltage is applied between the cathode electrode 11 and the gate electrode 13, electrons are emitted from the tip portion of the electron emission portion 15 based on the quantum tunnel effect due to the electric field generated as a result. Then, the electrons are attracted to the anode electrode 24 provided on the anode panel AP, and collide with the phosphor region 22 formed between the anode electrode 24 and the substrate 20. As a result, the phosphor region 22 is excited to emit light, and a desired image can be obtained. The operation of the field emission device is basically controlled by the voltage applied to the gate electrode 13 and the cathode electrode 11.

  For example, a short circuit may occur between the gate electrode 13 and the electron emission portion 15 or between the gate electrode 13 and the cathode electrode 11 due to, for example, a manufacturing process. In the cathode panel CP, normally, a plurality of electron emission region rows in which a plurality of electron emission regions are arranged one-dimensionally (in a strip shape) are juxtaposed. Therefore, when such a short circuit occurs, there may be a case where a complete display of the entire line of the band-shaped electron emission region including the short circuit part cannot be performed.

  A method for inspecting a short circuit between an electron emission portion and a gate electrode in a cathode panel is well known from, for example, Japanese Patent Application Laid-Open No. 2001-23505 and Special Table 2001-512239. In the inspection method for a cathode panel disclosed in Japanese Patent Laid-Open No. 2001-23505, an electron emission portion or a cathode electrode is obtained by applying a voltage between the cathode electrode and the gate electrode of the cathode panel in which a plurality of field emission elements are formed. Check the short circuit condition between the gate electrode and the gate electrode. In the cathode panel inspection method disclosed in JP-T-2001-512239, a magnetic head is used to detect a short-circuit location from a change in magnetic flux induced by a current flowing through the cathode electrode and the gate electrode.

JP2001-23505 Special table 2001-512239

  However, in the inspection method disclosed in Japanese Patent Application Laid-Open No. 2001-23505, a voltage is applied to one of the A cathode electrodes and one of the B gate electrodes to inspect for the presence of a short circuit. Therefore, it is necessary to perform A × B inspections substantially. However, as the display device becomes larger and has higher definition, the number of cathode electrodes and gate electrodes increases rapidly. Therefore, the time required for the short circuit inspection becomes very long and becomes impractical. Moreover, in the inspection method of the cathode panel disclosed in JP-T-2001-512239, a short-circuited portion having a high electric resistance value cannot be detected, and the detected short-circuited portion is a cathode electrode and a gate electrode. Because it is determined by the image whether it is located in the overlapping area of the image, there is a problem that the inspector needs technology and ability to identify the presence or absence of a short circuit, and a problem that a short circuit inspection takes a long time .

  Accordingly, an object of the present invention is to provide a first wiring and a second wiring (for example, a cathode electrode) in an overlapping region between a first wiring and a second wiring (for example, a cathode electrode and a gate electrode) formed through an insulating layer. Provided is a short-circuit inspection method for easily inspecting a short circuit between a gate electrode or an electron emission portion and a gate electrode in a short time even when the number of first wirings and second wirings increases. There is.

The short circuit inspection method in the wiring structure of the present invention for achieving the above object (hereinafter may be abbreviated as the short circuit inspection method of the present invention)
(1) A ₁ (A ₁ ≧ 2) first wiring extending in the first direction, and
(2) B ₁ (provided that B ₁ ≧ 2) second wirings formed through an insulating layer and extending in a second direction different from the first direction;
In the wiring structure consisting of: a short circuit inspection method for inspecting a short circuit between the first wiring and the second wiring in the overlapping region of the first wiring and the second wiring,
(A-1) A _i first wirings are defined as a first wiring starting group, and the first wiring starting group is divided into a _i first wiring groups;
(A-2) A short-circuit test between all of the first wirings belonging to one first wiring group and all of the second wirings is performed in all of the a _i first wiring groups,
(A-3) If there is one short-circuit first wiring group in which a short circuit exists, select the short-circuit first wiring group as the next first wiring starting group,
(A-4) If there are two or more short-circuit first wiring groups in which a short circuit exists, record that there are two or more short-circuit first wiring groups, and that there are two or more short-circuit first wiring groups. Selecting one of the short-circuited first wiring groups in the next as the first wiring starting group,
After repeating the first short-circuit inspection step including each step from i = 1 until the number of first wires belonging to the short-circuit first wire group becomes one, the first wire in which the short-circuit has occurred is designated as i ′ ′. Recorded as the first short-circuited first wiring A _{i ′} (where i ′ = 1),
Then
(A-5) When two or more short-circuit first wiring groups exist, one short-circuit first wiring group other than the selected one short-circuit first wiring group is selected as the next first wiring start group. Based on the first wiring starting group, the first short-circuit inspection step is repeated until the number of first wirings belonging to the short-circuiting first wiring group becomes one, and the first wiring that has short-circuited is replaced with the i'th-th wiring. The first short-circuit wiring A _{i ′} (where i ′ = 2, 3,..., I ′) is recorded (secondary first short-circuit inspection step) as a recorded first short-circuit wiring group. Until there is no more
after that,
(B-1) a second wire B _j present a second wire starting group, divided second interconnection starting group b _j-number of the second wire group,
(B-2) A short-circuit test between all of the second wirings belonging to one second wiring group and the i'th short-circuiting first wiring is performed in all of the b _j second wiring groups,
(B-3) If there is one short-circuited second wiring group in which a short circuit exists, select the short-circuited second wiring group as the next second wiring starting group,
(B-4) If there are two or more short-circuit second wiring groups in which a short circuit exists, record that there are two or more short-circuit second wiring groups, and that there are two or more short-circuit second wiring groups. Selecting one of the short-circuited second wiring groups in the second second wiring starting group,
After repeating the second short-circuit inspection step consisting of each step from j = 1 until the number of second wires belonging to the short-circuit second wire group becomes one, the second wire in which the short-circuit has occurred is designated as j ′ ′. The second short-circuited second wiring B _{j ′} (where j ′ = 1),
Then
(B-5) If there are two or more short-circuit second wiring groups, one short-circuit second wiring group other than the selected one short-circuit second wiring group is selected as the next second wiring start group. Based on the second wiring starting group, the second short-circuit inspection step is repeated until the number of second wirings belonging to the short-circuiting second wiring group becomes one, and the second wiring that has short-circuited is replaced with the j'th The step of recording as a short-circuit second wiring B _{j ′} (where j ′ = 2, 3,... J ′) (secondary second short-circuit inspection step) Until it disappears, repeat sequentially,
(B-6) Further, steps (B-1) to (B-5) are repeated from i ′ = 1 to i ′ = I ′.
It is characterized by that.

  In the short circuit inspection method of the present invention, as a short circuit test between the first wiring and the second wiring, the presence or absence of a short circuit is inspected by measuring the electrical resistance value and abnormal heat generation between the first wiring and the second wiring. A method of measuring a current flowing by applying a voltage to the first wiring and the second wiring, and measuring a voltage between the first wiring and the second wiring by flowing a current through the first wiring and the second wiring. The method can be exemplified, and these tests can be performed in the atmosphere (such as indoors). Note that the short circuit test between the first wiring and the second wiring may be performed in a vacuum.

  In the short-circuit inspection method of the present invention, the first direction in which the first wiring extends and the second direction in which the second wiring extend are preferably orthogonal from the viewpoint of simplification of the wiring structure, but is limited to such a configuration. Not what you want.

In the short-circuit inspection method of the present invention, after the step (B-6) is completed, the short-circuit location between the first wiring and the second wiring in the overlapping region of the first wiring and the second wiring (A _{i ′} , B _{j ′} ), for example, can be displayed on the display means provided in the short-circuit test apparatus.

In the short-circuit inspection method of the present invention including the above-described preferred embodiment, the value of a _{i and} the value of b _j may be 2 or more. The value of a _i may be changed for each value of i is changed, it may be a constant value. Further, the value of b _j may be changed every time the value of j changes, or may be a constant value. The value of a _{i and} the value of b _j may be the same value or different values. Further, although not limited, it is preferable that a _{i has} a value of 2 and b _{j has} a value of 2. In this case, the A _i first wiring start groups are divided into two. When divided into the first wiring groups, the number A _i-1 of the first wirings included in one first wiring group and the number A _i-2 of the first wirings included in the other first wiring group are: Respectively,
A _i-1 = INT (A _i / 2) + mod (A _i , 2)
A _i−2 = A _i −A _i−1
And
When the B _j second wiring start groups are divided into two second wiring groups, the number of second wirings B _j−1 included in one second wiring group and the other second wiring group The number B _j-2 of the second wirings included is respectively
B _j-1 = INT (B _j / 2) + mod (B _j , 2)
B _j-2 = B _j -B _j-1
It can be set as the structure which is. However, INT (X / Y) is a function for obtaining the integer part of the quotient when the integer X is divided by the integer Y, and mod (X, Y) is the remainder when the integer X is divided by the integer Y. This is the function to find.

  After the completion of the short-circuit inspection method of the present invention, preferably in the overlapping region of the first wiring and the second wiring, and in the overlapping region where the short-circuit has occurred, preferably the portion of the shorted first wiring or second wiring (for convenience, (Referred to as a short-circuit wiring portion) is preferably separated from other first wiring or second wiring portions. That is, based on the short-circuit inspection method of the present invention, a short-circuit portion between the first wire and the second wire in the overlapping region between the first wire and the second wire is detected and the short-circuit portion is identified by observing with a microscope, etc. From the cathode panel obtained by separating the shorted first wiring or second wiring portion from the other first wiring or second wiring portion, and the phosphor region and the anode electrode formed on the substrate A cold cathode field emission display device can be manufactured based on a manufacturing method of a cold cathode field emission display device in which the anode panels are joined at their peripheral portions. Examples of the separation method include a method of removing all or a part of the short-circuit wiring portion based on an external physical or chemical action. As a more specific method, all or a part of the short-circuit wiring portion is Examples thereof include a method of fusing and melting using a laser, and a method of cutting and removing based on a lithography technique and an etching technique. Alternatively, for example, when forming the stripe-shaped first wiring or the second wiring extending in parallel with the first direction or the second direction, one or a plurality of grooves (notches) extending in parallel with the first direction or the second direction. ) Is formed together with the portion of the first wiring or the second wiring in the overlapping region, and the region located at the end of the groove portion is melted, melted, cut, and removed in the short-circuiting wire portion, thereby It can be separated from other portions of the first wiring or the second wiring. Alternatively, the shorted wiring portion may be separated from other first wiring or second wiring portions by scanning with a laser beam, and in some cases, the shorted wiring portion may be eliminated.

  The short-circuit inspection method of the present invention including the various preferred embodiments described above can be applied to a short-circuit inspection in a cathode panel for a cold cathode field emission display. In this case, a short circuit between the cathode electrode and the gate electrode in the overlapping region between the cathode electrode and the gate electrode provided on the cathode panel is inspected, or the cathode electrode and the gate provided on the cathode panel are also inspected. A short circuit between the electron emission portion and the gate electrode and a short circuit between the cathode electrode and the gate electrode in the overlapping region with the electrode are inspected. The cold cathode field emission display includes a cathode panel provided with a plurality of cold cathode field emission devices, and an anode panel (details will be described later) comprising a phosphor region and an anode electrode formed on the substrate. , And joined at their peripheral parts.

That is, in the short circuit inspection method of the present invention including the various preferred embodiments described above,
(A) a cathode electrode formed on a support;
(B) an insulating layer formed on the support and the cathode electrode;
(C) a gate electrode formed on the insulating layer;
(D) an opening provided in the gate electrode and the insulating layer in the overlapping region of the cathode electrode and the gate electrode, and
(E) an electron emission portion exposed at the bottom of the opening,
A cathode electrode in a cathode panel for a cold cathode field emission display device comprising a plurality of cold cathode field emission devices comprising: a cathode electrode corresponding to a first wiring and a gate electrode corresponding to a second wiring; or a cathode electrode Can correspond to the second wiring, and the gate electrode can correspond to the first wiring.

  The overlap region between the cathode electrode and the gate electrode corresponds to an electron emission region, and the overlap region between the cathode electrode and the gate electrode includes one or a plurality of cold cathode field emission devices (hereinafter abbreviated as field emission devices). ) Is provided.

The field emission device is usually manufactured by the following method.
(1) forming a cathode electrode on a support;
(2) forming an insulating layer on the entire surface (on the support and the cathode electrode);
(3) forming a gate electrode on the insulating layer;
(4) forming an opening in the gate electrode and the insulating layer in the overlapping region of the cathode electrode and the gate electrode, and exposing the cathode electrode to the bottom of the opening;
(5) A step of forming an electron emission portion on the cathode electrode located at the bottom of the opening.

  When the short-circuit inspection method of the present invention is applied to a short-circuit inspection in a cathode panel for a cold cathode field emission display, the short-circuit inspection method of the present invention may be implemented after the step (3), The short circuit inspection method of the present invention may be performed after 4), or the short circuit inspection method of the present invention may be performed after the step (5).

Alternatively, the field emission device can be manufactured by the following method.
(1) forming a cathode electrode on a support;
(2) A step of forming an electron emission portion on the cathode electrode.
(3) forming an insulating layer on the entire surface (on the support and the electron emission portion or on the support, the cathode electrode and the electron emission portion);
(4) forming a gate electrode on the insulating layer;
(5) A step of forming an opening in the gate electrode and the insulating layer in the overlapping region of the cathode electrode and the gate electrode and exposing the electron emission portion at the bottom of the opening.

  In this case, the short circuit inspection method of the present invention may be performed after the step (4), or the short circuit inspection method of the present invention may be performed after the step (5).

  When the short-circuit inspection method of the present invention is applied to a short-circuit inspection in a cathode panel for a cold cathode field emission display device, after completion of the short-circuit inspection method of the present invention, the short-circuit inspection method is an overlapping region between the cathode electrode and the gate electrode. In the overlapping region where the occurrence of the problem occurs, it is preferable that the part of the shorted gate electrode is separated from the other part of the gate electrode. As a method of separating, the above-described method of separating the short-circuit wiring portion from the other first wiring or second wiring portion may be employed.

  The type of the field emission device is not particularly limited, and may be any of a Spindt type field emission device, an edge type field emission device, a planar type field emission device, a flat type field emission device, or a crown type field emission device. The cathode electrode and the gate electrode have a stripe shape, and it is preferable from the viewpoint of simplification of the structure of the cold cathode field emission display that the projection image of the cathode electrode and the projection image of the gate electrode are orthogonal to each other.

  The field emission device may be provided with a focusing electrode. That is, a field emission element in which an interlayer insulating layer is further provided on the gate electrode and the insulating layer, and a focusing electrode is provided on the interlayer insulating layer, or an electric field in which the focusing electrode is provided above the gate electrode. It can also be an emitting element. Here, the focusing electrode is an electrode for converging the trajectory of emitted electrons that are emitted from the opening and directed toward the anode electrode, thereby improving the luminance and preventing optical crosstalk between adjacent pixels. It is. In a so-called high-voltage type cold cathode field emission display device in which the potential difference between the anode electrode and the cathode electrode is on the order of several kilovolts and the distance between the anode electrode and the cathode electrode is relatively long, the focusing electrode Is particularly effective. A relative negative voltage is applied to the focusing electrode from the focusing electrode control circuit. The focusing electrode is not necessarily provided for each field emission element. For example, by extending the field emission elements along a predetermined arrangement direction of the field emission elements, a convergence effect common to a plurality of field emission elements is exerted. You can also

As constituent materials of the first wiring, the second wiring, the cathode electrode, the gate electrode, and the focusing electrode, aluminum (Al), tungsten (W), niobium (Nb), tantalum (Ta), molybdenum (Mo), chromium (Cr) , Copper (Cu), gold (Au), silver (Ag), titanium (Ti), nickel (Ni), cobalt (Co), zirconium (Zr), iron (Fe), platinum (Pt), zinc (Zn) Metals, etc .; alloys or compounds containing these metal elements (for example, nitrides such as TiN and silicides such as WSi ₂ , MoSi ₂ , TiSi ₂ , TaSi ₂ ); semiconductors such as silicon (Si); carbons such as diamond Thin film: Examples thereof include conductive metal oxides such as ITO (indium oxide-tin), indium oxide, and zinc oxide. In addition, as a method of forming these wirings and electrodes, for example, a vapor deposition method such as an electron beam vapor deposition method or a hot filament vapor deposition method, a sputtering method, a combination of a CVD method, an ion plating method and an etching method; a screen printing method; a plating method (Electroplating method or electroless plating method); lift-off method; laser ablation method; sol-gel method. According to the screen printing method or the plating method, it is possible to directly form these wirings and electrodes in a stripe shape, for example.

As a material for constituting the insulating layer and the interlayer insulating _{layer, SiO 2, BPSG, PSG,} BSG, AsSG, PbSG, SiON, SOG ( spin on glass), low-melting glass, SiO ₂ based materials such glass paste; SiN-based materials; polyimide These insulating resins can be used alone or in appropriate combination. For forming the insulating layer or the interlayer insulating layer, a known process such as a CVD method, a coating method, a sputtering method, or a screen printing method can be used.

  The planar shape of the opening provided in the gate electrode or insulating layer (the shape when the opening is cut in a virtual plane parallel to the support surface) is circular, elliptical, rectangular, polygonal, rounded rectangular Any shape such as a rounded polygon can be used. The opening can be formed by, for example, isotropic etching, a combination of anisotropic etching and isotropic etching, or, depending on the method of forming the gate electrode, the opening is formed directly on the gate electrode. It can also be formed. The openings in the insulating layer and the interlayer insulating layer can also be formed by, for example, isotropic etching or a combination of anisotropic etching and isotropic etching.

As a support or as a substrate constituting an anode panel, a glass substrate, a glass substrate with an insulating film formed on the surface, a quartz substrate, a quartz substrate with an insulating film formed on the surface, and an insulating film formed on the surface From the viewpoint of reducing the manufacturing cost, it is preferable to use a glass substrate or a glass substrate having an insulating film formed on the surface. As a glass substrate, high strain point glass, soda glass (Na ₂ O · CaO · SiO ₂ ), borosilicate glass (Na ₂ O · B ₂ O ₃ · SiO ₂ ), forsterite (2MgO · SiO ₂ ), lead glass (Na ₂ O · PbO · SiO ₂ ) can be exemplified.

  In the cold cathode field emission display, a strong electric field generated by a voltage applied to the cathode electrode and the gate electrode is applied to the electron emission portion, and as a result, electrons are emitted from the electron emission portion by the quantum tunnel effect. The electrons are attracted to the anode panel by the anode electrode provided on the anode panel, and collide with the phosphor region. As a result of the collision of electrons with the phosphor region, the phosphor region emits light and can be recognized as an image.

In the cold cathode field emission display, the cathode electrode is connected to the cathode electrode control circuit, the gate electrode is connected to the gate electrode control circuit, and the anode electrode is connected to the anode electrode control circuit. Note that these control circuits can be constituted by known circuits. The output voltage V _A of the anode electrode control circuit is normally constant and can be set to, for example, 5 kilovolts to 10 kilovolts. Alternatively, when the distance between the anode panel and the cathode panel is d (where 0.5 mm ≦ d ≦ 10 mm), the value of V _A / d (unit: kilovolt / mm) is 0.5 or more and 20 Hereinafter, it is desirable to satisfy 1 or more and 10 or less, and more preferably 5 or more and 10 or less.

In the actual operation of the cold cathode field emission display device, regarding the voltage V _C applied to the cathode electrode and the voltage V _G applied to the gate electrode, when the voltage modulation method is adopted as the gradation control method,
(1) A method of changing the voltage V _G applied to the gate electrode while keeping the voltage V _C applied to the cathode electrode constant (2) A voltage V _G applied to the gate electrode by changing the voltage V _C applied to the cathode electrode (3) There is a method in which the voltage V _C applied to the cathode electrode is changed and the voltage V _G applied to the gate electrode is also changed.

In the short-circuit inspection method of the present invention, the first wiring starting group composed of A _i first wirings is divided into a _i first wiring groups, and all the first wirings belonging to one first wiring group are divided. When the short-circuit test between the all the second wiring is performed in the first wire group all a _i number. Further, divide the second wiring starting group made up of the second wiring B _j present in b _j-number of the second wire group, one second every second wiring belonging to the wiring group of the one first wire The short circuit test is performed on all the b _j second wiring groups. That is, the short circuit inspection method is completed in a short time because voltage is not applied to _one of the first wiring of A ₁ and the second wiring of B ₁ to inspect for the presence or absence of a short circuit. It becomes possible to make it. In addition, as a short circuit test, a method of inspecting the presence or absence of a short circuit by measuring an electrical resistance value or abnormal heat generation between the first wiring and the second wiring, a current flowing by applying a voltage to the first wiring and the second wiring And a method in which a current is passed through the first wiring and the second wiring to measure the voltage between the first wiring and the second wiring, and these tests are performed in the atmosphere (such as indoors). ), The inspector is not required to have the skill and ability to identify the presence or absence of a short circuit, and the short circuit inspection method can be completed in a short time. Further, if the voltage applied to the first wiring and the second wiring and the value of the current passed through the first wiring and the second wiring are set to appropriate values, the first wiring, the second wiring, and the field emission element are damaged. This can be avoided reliably.

  By implementing the short circuit inspection method of the present invention, it becomes possible to provide a highly reliable wiring structure or cold cathode field emission display, and before the wiring structure is made into a final product, or In addition, since the short-circuit inspection method can be performed on the wiring structure or the cathode panel before assembling the cold cathode field emission display device, the entire device incorporating the wiring structure or the manufacture of the cold cathode field emission display device as a whole Yield can be improved.

  Hereinafter, the present invention will be described based on examples with reference to the drawings.

Example 1 relates to a short circuit inspection method of the present invention. The short circuit inspection method of Example 1 is
(1) A ₁ (A ₁ ≧ 2) first wiring extending in the first direction, and
(2) B ₁ (provided that B ₁ ≧ 2) second wirings formed through an insulating layer and extending in a second direction different from the first direction;
A short circuit inspection method for inspecting a short circuit between the first wiring and the second wiring in the overlapping region of the first wiring and the second wiring.

  In Example 1, a cathode panel for a cold cathode field emission display device (hereinafter simply referred to as a display device) provided with a plurality of cold cathode field electron emission devices (hereinafter simply referred to as field emission devices). (Hereinafter abbreviated as a cathode panel CP) is an object of the implementation of the short-circuit inspection method. A flowchart for explaining the short-circuit inspection method of the present invention is shown in FIG. 1 as a whole, and in more detail in FIGS. FIG. 26 shows a schematic partial end view of the display device according to the first embodiment, and a schematic exploded perspective view of a part of the cathode panel CP and the anode panel AP when the cathode panel CP and the anode panel AP are disassembled. Is shown in FIG. Furthermore, arrangement | sequences, such as a fluorescent substance area | region, are illustrated to FIGS. 28-33 as typical partial top view. The arrangement of the phosphor regions and the like in the schematic partial end view of the anode panel AP shown in FIG. 26 has the configuration shown in FIG. 29 or FIG. 28 to 33, the anode electrode is not shown.

  In the display device according to the first embodiment, the cathode panel CP and the anode panel AP are joined at their peripheral portions, and the space between the cathode panel CP and the anode panel AP is in a vacuum state. The cathode panel CP includes a support 10 and electron emission regions EA arranged and arranged in a two-dimensional matrix on the support 10. On the other hand, the anode panel AP includes the substrate 20 and the phosphor region 22 formed on the substrate 20 (in the case of color display, a red light-emitting phosphor region 22R, a green light-emitting phosphor region 22G, and a blue light-emitting phosphor region 22B). ) And an anode electrode 24 covering the phosphor region 22.

The field emission device in Example 1 is a Spindt-type field emission device, and as shown in FIGS. 26 and 27,
(A) a cathode electrode 11 formed on the support 10;
(B) an insulating layer 12 formed on the support 10 and the cathode electrode 11;
(C) a gate electrode 13 formed on the insulating layer 12;
(D) The opening 14 provided in the gate electrode 13 and the insulating layer 12 in the overlapping region of the cathode electrode 11 and the gate electrode 13 (the first opening 14A provided in the gate electrode 13 and the insulating layer 12 Second opening 14B), and
(E) a conical electron emission portion 15 exposed at the bottom of the opening 14;
Consists of.

  An overlapping region between the cathode electrode 11 and the gate electrode 13 corresponds to the electron emission region EA, and a plurality of field emission elements are provided in the electron emission region EA. One subpixel is composed of one electron emission area EA on the cathode panel side and a phosphor area 22 on the anode panel side facing the electron emission area EA. In the effective area, such subpixels are arranged in a two-dimensional matrix, for example, on the order of hundreds of thousands to millions.

In the first embodiment, the stripe-shaped cathode electrode corresponds to the first wiring and the stripe-shaped gate electrode corresponds to the second wiring. However, the stripe-shaped cathode electrode corresponds to the second wiring, and the stripe-shaped cathode electrode corresponds to the second wiring. Alternatively, the gate electrode having a shape corresponds to the first wiring. Here, the cathode electrode 11 corresponding to the first wiring of A ₁ present (where A ₁ ≧ 2) extend in a first direction (toward a direction parallel to FIG. 26), _one B (however, The gate electrode 13 corresponding to the second wiring of B ₁ ≧ 2 extends in the second direction (a direction perpendicular to the paper surface of FIG. 26). That is, the projected image of the cathode electrode 11 and the projected image of the gate electrode 13 are orthogonal to each other. In other words, the first direction and the second direction are orthogonal.

  More specifically, the anode panel AP is formed on the substrate 20 and the substrate 20 between the barrier ribs 21 formed on the substrate 20 and the barrier ribs 21, and a phosphor region 22 (red color) made of a large number of phosphor particles. A light emitting phosphor region 22R, a green light emitting phosphor region 22G, a blue light emitting phosphor region 22B), and an anode electrode 24 formed on the phosphor region 22. The anode electrode 24 is in the form of a thin sheet that covers the effective area, and is connected to the anode electrode control circuit 32. The anode electrode 24 is made of aluminum having a thickness of about 70 nm, and is provided so as to cover the partition wall 21 and the phosphor region 22. Between the phosphor region 22 and the phosphor region 22, and between the partition wall 21 and the substrate 20, a light absorption layer (black) is used to prevent the occurrence of color turbidity and optical crosstalk in the display image. Matrix) 23 is formed.

  An example of the arrangement state of the partition wall 21, the spacer 25, and the phosphor region 22 is schematically shown in FIGS. The planar shape of the partition wall 21 is a lattice shape (cross-beam shape), that is, a shape corresponding to one subpixel, for example, a shape surrounding the four sides of the phosphor region 22 having a substantially rectangular shape (FIGS. 28, 29, 30, 31), or a strip shape (stripe shape) extending in parallel with two opposing sides of the substantially rectangular (or striped) phosphor region 22 (see FIGS. 32 and 33). In the phosphor region 22 shown in FIG. 32, the phosphor regions 22R, 22G, and 22B may be formed in a stripe shape extending in the vertical direction in FIG. A part of the partition wall 21 also functions as a spacer holding portion 26 for holding the spacer 25.

  In the display device according to the first embodiment, as shown in FIG. 26, the cathode electrode 11 is connected to the cathode electrode control circuit 30, the gate electrode 13 is connected to the gate electrode control circuit 31, and the anode electrode 24 is connected to the anode electrode control circuit 32. It is connected to the. These control circuits can be constituted by known circuits.

  A relatively negative voltage is applied to the cathode electrode 11 from the cathode electrode control circuit 30, a relatively positive voltage is applied to the gate electrode 13 from the gate electrode control circuit 31, and the anode electrode 24 is applied to the anode electrode 24 more than the gate electrode 13. Further, a higher positive voltage is applied from the anode electrode control circuit 32. When performing display in such a display device, for example, a scanning signal is input to the cathode electrode 11 from the cathode electrode control circuit 30, and a video signal is input to the gate electrode 13 from the gate electrode control circuit 31. Note that a video signal may be input to the cathode electrode 11 from the cathode electrode control circuit 30, and a scanning signal may be input to the gate electrode 13 from the gate electrode control circuit 31. Electrons are emitted from the electron emitter 15 based on the quantum tunnel effect due to an electric field generated when a voltage is applied between the cathode electrode 11 and the gate electrode 13, and the electrons are attracted to the anode electrode 24. It passes through and collides with the phosphor region 22. As a result, the phosphor region 22 is excited to emit light, and a desired image can be obtained. That is, the operation of this display device is basically controlled by the voltage applied to the gate electrode 13 and the voltage applied to the electron emission unit 15 through the cathode electrode 11.

Hereinafter, the short-circuit inspection method according to the first embodiment when the short-circuit inspection method according to the first embodiment is applied to the cathode panel CP before the cathode panel CP and the anode panel AP are assembled. Description will be made with reference to FIGS. 6 to 25 are diagrams schematically showing the first wiring (shown by a solid line) and the second wiring (shown by a dotted line). The voltage applied to the first wiring is applied to V ₁ and the second wiring. The applied voltage is represented by V ₂ , and the short-circuited portion is surrounded by a circle. Furthermore, a short-circuit portion to be found (targeted) in the short-circuit test is surrounded by a black circle. The value of | V ₁ −V ₂ | may be several volts. In the following description, the value of A ₁ is 14 (that is, the number of cathode electrodes 11 corresponding to the first wiring is 14), and the value of B ₁ is 9 (that is, the second wiring). (The number of gate electrodes 13 corresponding to is 9), but these values are merely illustrative values. For example, in an actual display device of 1024 × 768 pixels, the number of pixels can be displayed. The number of cathode electrodes and gate electrodes may be used.

Also _{assume that} the value of a _{i and} the value of b _j are 2. Further, when the A _i first wiring start groups are divided into two first wiring groups, the number of first wirings A _i−1 included in one first wiring group and the other first wiring group. The number of first wirings A _i−2 included in the wiring group,
A _i-1 = INT (A _i / 2) + mod (A _i , 2)
A _i−2 = A _i −A _i−1
When the B _j second wiring start group is divided into two second wiring groups, the number of second wirings B _j−1 included in one second wiring group and the other second wiring The number B _j-2 of the second wires included in the group,
B _j-1 = INT (B _j / 2) + mod (B _j , 2)
B _j-2 = B _j -B _j-1
And However, INT (X / Y) is a function for obtaining the integer part of the quotient when the integer X is divided by the integer Y, and mod (X, Y) is the remainder when the integer X is divided by the integer Y. This is the function to find.

Furthermore, in the first embodiment, it is assumed that a short circuit occurs in the overlapping region between the fifth cathode electrode 11 and the seventh gate electrode 13. Such a state is referred to as occurrence of a short circuit in << 5, 7 >>. Further, referred to as a first-th first wiring the P-th first wiring in the first wiring starting group, which is composed of a first wire A _i present, the first A _i-th first wiring the Q th referred to as a first wiring, a first-th second wiring in the second wiring starting group made up of the second wiring B _j present is referred to as a first S-th second wiring, the first B _j-th second wiring This is called a Tth second wiring.

First,
(A-1) A _i first wirings are defined as a first wiring starting group, and the first wiring starting group is divided into a _i first wiring groups;
(A-2) A short-circuit test between all of the first wirings belonging to one first wiring group and all of the second wirings is performed in all of the a _i first wiring groups,
(A-3) If there is one short-circuit first wiring group in which a short circuit exists, select the short-circuit first wiring group as the next first wiring starting group,
(A-4) If there are two or more short-circuit first wiring groups in which a short circuit exists, record that there are two or more short-circuit first wiring groups, and that there are two or more short-circuit first wiring groups. Selecting one of the short-circuited first wiring groups in the next as the first wiring starting group,
After repeating the first short-circuit inspection step including each step from i = 1 until the number of first wires belonging to the short-circuit first wire group becomes one, the first wire in which the short-circuit has occurred is designated as i ′ ′. Recorded as the first short-circuited first wiring A _{i ′} (where i ′ = 1),
Then
(A-5) When two or more short-circuit first wiring groups exist, one short-circuit first wiring group other than the selected one short-circuit first wiring group is selected as the next first wiring start group. Based on the first wiring starting group, the first short-circuit inspection step is repeated until the number of first wirings belonging to the short-circuiting first wiring group becomes one, and the first wiring that has short-circuited is replaced with the i'th-th wiring. The first short-circuit wiring A _{i ′} (where i ′ = 2, 3,..., I ′) is recorded (secondary first short-circuit inspection step) as a recorded first short-circuit wiring group. Repeat until there is no more.

  More specifically, first, the following steps are executed.

[First First Short-Circuit Inspection Process]
Specifically, first, since i = 1, A ₁ (= 14) first wirings are set as a first wiring starting group. Here, the value of [P, Q] is [1, 14].

The first wiring start group is divided into a ₁ (= 2) first wiring groups. That is, the Qth first wiring is divided into two from the Pth first wiring. The first first wiring group includes first to seventh first wirings, and the second first wiring group includes eighth to fourteenth first wirings. That is, A _1-1 = 7 and A _1-2 = 7.

Next, all of the first wirings belonging to the first first wiring group (referred to as “first group” in FIGS. 2 and 3) (first to seventh short-circuited first wirings). ) And all of the second wirings (the first to ninth second wirings that are short-circuited, the same applies in the following description), and further, All of the first wirings belonging to the second first wiring group (referred to as “second group” in FIG. 2 and FIG. 3) Perform a short-circuit test between all two wires. That is, the first first short circuit inspection step is executed (see FIG. 6A). Specifically, the voltage V ₁ is applied from the first wiring power source to the first wiring group via the switch circuit and the probe, and all the short circuits are established from the second wiring power source through the switch circuit and the probe. A voltage V ₂ is applied to the second wiring, and an electrical resistance value between each first wiring group and all of the second wirings is measured, thereby performing a short circuit test for inspecting the presence or absence of a short circuit. This short circuit test can be performed in the atmosphere (such as indoors). Moreover, the short circuit test similar to this short circuit test is also performed in the short circuit test described below. Furthermore, the short-circuit inspection process described above may be referred to as “first first short-circuit inspection process” in the following description.

  In the first embodiment, since it is assumed that a short circuit has occurred in the fifth cathode electrode 11, a short circuit exists in the first first wiring group, and a short circuit exists in the second first wiring group. do not do. That is, since there is only one shorted first wiring group in which a short circuit exists, the shorted first wiring group (first first wiring group) is selected as the next first wiring starting group. Since there are no two or more short-circuit first wiring groups in which a short circuit exists, it is unnecessary to record that there are two or more short-circuit first wiring groups. It is also unnecessary to select one short-circuit first wiring group as the next first wiring starting group.

Then, “Process-02” shown in FIG. 2 is executed. That is, while the value of P is set to “1” as it is, the value of Q is changed based on the following equation.
Q = Q-INT ((Q-P + 1) / 2)
= 14-INT ((14-1 + 1) / 2)
= 7

  Next, it is determined whether the value of P is equal to the value of Q. In the first first short circuit inspection step, since the value of P is not equal to the value of Q, the second first short circuit inspection step is executed.

[Second first short circuit inspection step]
That is, assuming that i = 2, the second first short circuit inspection step is executed. Specifically, the first to seventh A ₂ (= 7) first wirings are set as the first wiring starting group in the second first short-circuit inspection step. Here, the value of [P, Q] is [1, 7].

The first wiring start group is divided into a ₂ (= 2) first wiring groups. That is, the Qth first wiring is divided into two from the Pth first wiring. The first first wiring group includes first to fourth first wirings, and the second first wiring group includes fifth to seventh first wirings. That is, A _2-1 = 4 and A _2-2 = 3.

  Next, a short circuit test is performed between all of the first wirings belonging to the first first wiring group (first to fourth first wirings in a short circuit state) and all of the second wirings, Further, a short circuit test is performed between all of the first wirings belonging to the second first wiring group (the fifth to seventh first wirings in a short circuit state) and all of the second wirings. . That is, the second first short circuit inspection step is executed (see FIG. 6B).

  In the first embodiment, since it is assumed that a short circuit has occurred in the fifth cathode electrode 11, there is no short circuit in the first first wiring group, and there is a short circuit in the second first wiring group. Exists. That is, since there is only one short-circuited first wiring group in which a short circuit exists, the short-circuited first wiring group (second first wiring group) is selected as the next first wiring starting group. Since there are no two or more short-circuit first wiring groups in which a short circuit exists, it is unnecessary to record that there are two or more short-circuit first wiring groups. It is also unnecessary to select one short-circuit first wiring group as the next first wiring starting group.

Then, “Process-01” shown in FIG. 2 is executed. That is, while the original value of Q is set to “7”, the value of P is changed based on the following equation.
P = P + INT ((Q−P + 1) / 2) + mod ((Q−P + 1), 2)
= 1 + INT ((7-1 + 1) / 2) + mod ((7-1 + 1), 2)
= 5

  Next, it is determined whether the value of P is equal to the value of Q. Also in the second first short circuit inspection step, since the value of P is not equal to the value of Q, the third first short circuit inspection step is executed.

[Third first short circuit inspection process]
That is, assuming that i = 3, the third first short circuit inspection step is executed. Specifically, the fifth to seventh A ₃ (= 3) first wirings are set as the first wiring starting group in the third first short-circuit inspection step. Here, the value of [P, Q] is [5, 7].

The first wiring start group is divided into a ₃ (= 2) first wiring groups. That is, the Qth first wiring is divided into two from the Pth first wiring. The first first wiring group includes the fifth to sixth first wirings, and the second first wiring group includes the seventh first wiring. That is, A _3-1 = 2 and A _3-2 = 1.

  Next, a short circuit test is performed between all of the first wirings belonging to the first first wiring group (the fifth to sixth first wirings in a short circuit state) and all of the second wirings, Furthermore, a short circuit test is performed between all of the first wirings (seventh first wiring) belonging to the second first wiring group and all of the second wirings. That is, the third first short circuit inspection step is executed (see FIG. 7A).

  In the first embodiment, since it is assumed that a short circuit has occurred in the fifth cathode electrode 11, a short circuit exists in the first first wiring group, and a short circuit exists in the second first wiring group. Not done. That is, since there is only one shorted first wiring group in which a short circuit exists, the shorted first wiring group (first first wiring group) is selected as the next first wiring starting group. Since there are no two or more short-circuit first wiring groups in which a short circuit exists, it is unnecessary to record that there are two or more short-circuit first wiring groups. It is also unnecessary to select one short-circuit first wiring group as the next first wiring starting group.

Then, “Process-02” shown in FIG. 2 is executed. That is, while the original value of P is set to “5”, the value of Q is changed based on the following equation.
Q = Q-INT ((Q-P + 1) / 2)
= 7-INT ((7-5 + 1) / 2)
= 6

  Next, it is determined whether the value of P is equal to the value of Q. Also in the third first short circuit inspection step, since the value of P is not equal to the value of Q, the fourth first short circuit inspection step is executed (see FIG. 7B).

[Fourth first short circuit inspection step]
That is, assuming that i = 4, the fourth first short circuit inspection step is executed. Specifically, A ₄ (= 2) first wirings are set as the first wiring starting group in the fourth first short circuit inspection step. Here, the value of [P, Q] is [5, 6].

The first wiring start group is divided into a ₄ (= 2) first wiring groups. That is, the Qth first wiring is divided into two from the Pth first wiring. The first first wiring group includes the fifth first wiring, and the second first wiring group includes the sixth first wiring. That is, A _4-1 = 1 and A _4-2 = 1.

  Next, a short-circuit test is performed between all of the first wirings belonging to the first first wiring group (fifth first wiring) and all of the second wirings, and further, the second first wiring A short circuit test is performed between all of the first wirings belonging to the group (sixth first wiring) and all of the second wirings. That is, the fourth first short circuit inspection step is executed.

  In the first embodiment, since it is assumed that a short circuit has occurred in the fifth cathode electrode 11, a short circuit exists in the first first wiring group, and a short circuit exists in the second first wiring group. Not done. That is, since there is only one shorted first wiring group in which a short circuit exists, the shorted first wiring group (first first wiring group) is selected as the next first wiring starting group. In addition, since there are not two or more short-circuited second wiring groups in which a short circuit exists, it is unnecessary to record that there are two or more short-circuited first wiring groups. It is also unnecessary to select one short-circuit first wiring group as the next first wiring starting group.

Then, “Process-02” shown in FIG. 2 is executed. That is, while the original value of P is set to “5”, the value of Q is changed based on the following equation.
Q = Q-INT ((Q-P + 1) / 2)
= 6-INT ((6-5 + 1) / 2)
= 5

  Next, it is determined whether the value of P is equal to the value of Q. In the fourth first short-circuit inspection step, the value of P is equal to the value of Q. That is, the number of first wirings belonging to the short-circuited first wiring group is one.

Accordingly, the repetition of the first short circuit inspection process is completed as described above, and the first wiring (fifth first wiring) in which the short circuit has occurred is replaced with the i′th first wiring A _{i ′} (where i ′ = Record as 1). Specifically, as shown in “Processing 04” in FIG. 3, the value of “P” is recorded and stored as P _{i ′} .

Then, it is determined whether or not the value of i ′ exceeds the specified number of short-circuited locations (Def ₁ ), and if it exceeds, the display means provided in the short-circuit test apparatus indicates that the cathode panel should be discarded. Display and end the implementation of the short-circuit inspection method.

  If not, it is determined whether it is recorded that there are two or more short-circuited first wiring groups. In Example 1, since there are no two or more short-circuited first wiring groups, the process proceeds to the next step.

  Table 1 below summarizes the values of [P, Q] and the like from the first first short-circuit inspection step to the fourth first short-circuit inspection step.

Next, (B-1) B _j second wirings are defined as second wiring starting groups, and this second wiring starting group is divided into b _j second wiring groups,
(B-2) A short-circuit test between all of the second wirings belonging to one second wiring group and the i'th short-circuiting first wiring is performed in all of the b _j second wiring groups,
(B-3) If there is one short-circuited second wiring group in which a short circuit exists, select the short-circuited second wiring group as the next second wiring starting group,
(B-4) If there are two or more short-circuit second wiring groups in which a short circuit exists, record that there are two or more short-circuit second wiring groups, and that there are two or more short-circuit second wiring groups. Selecting one of the short-circuited second wiring groups in the second second wiring starting group,
After repeating the second short-circuit inspection step consisting of each step from j = 1 until the number of second wires belonging to the short-circuit second wire group becomes one, the second wire in which the short-circuit has occurred is designated as j ′ ′. The second short-circuited second wiring B _{j ′} (where j ′ = 1),
Then
(B-5) If there are two or more short-circuit second wiring groups, one short-circuit second wiring group other than the selected one short-circuit second wiring group is selected as the next second wiring start group. Based on the second wiring starting group, the second short-circuit inspection step is repeated until the number of second wirings belonging to the short-circuiting second wiring group becomes one, and the second wiring that has short-circuited is replaced with the j'th The step of recording as a short-circuit second wiring B _{j ′} (where j ′ = 2, 3,... J ′) (secondary second short-circuit inspection step) Until it disappears, repeat sequentially,
(B-6) Further, the steps (B-1) to (B-5) are repeated from i ′ = 1 to i ′ = I ′.

  More specifically, the following steps are performed.

[First second short-circuit inspection step]
Specifically, first, since j = 1, B ₁ (= 9) second wirings are set as a second wiring starting group. Here, the value of [S, T] is [1, 9].

The second wiring starting group is divided into b ₁ (= 2) second wiring groups. That is, the Tth second wiring is divided into two from the Sth second wiring. The first second wiring group includes first to fifth second wirings, and the second second wiring group includes sixth to ninth second wirings. That is, B _1-1 = 5 and B _1-2 = 4.

Next, all of the second wirings belonging to the first second wiring group (referred to as “first group” in FIGS. 4 and 5) (the first to fifth second wirings in a short circuit state). ) And the i'th (i '= 1) short-circuited first wiring (specifically, the fifth first wiring; the same applies to the following description of the first embodiment). A short circuit test is performed, and all of the second wirings belonging to the second second wiring group (referred to as “second group” in FIGS. 4 and 5) (sixth to second short circuit states) A short-circuit test is performed between the 9th second wiring) and the i'th short-circuiting first wiring. That is, the first second short-circuit inspection step is executed (see FIG. 8A). Specifically, the voltage V ₁ is applied to the i'th short-circuited first wiring from the first wiring power source through the switch circuit and the probe, and the short-circuited state from the second wiring power source through the switch circuit and the probe. A voltage V ₂ is applied to the second wiring group, and the electrical resistance value between the first wiring and each second wiring group is measured, thereby performing a short circuit test for inspecting the presence or absence of a short circuit. This short circuit test can be performed in the atmosphere (such as indoors). Moreover, the short circuit test similar to this short circuit test is also performed in the short circuit test described below. Furthermore, the short-circuit inspection process described above may be referred to as “first second short-circuit inspection process” in the following description.

  In the first embodiment, since it is assumed that a short circuit has occurred in the seventh gate electrode 13, there is no short circuit in the first second wiring group, and there is a short circuit in the second second wiring group. Exists. That is, since there is only one short-circuited second wiring group in which a short circuit exists, the short-circuited second wiring group (second second wiring group) is selected as the next second wiring starting group. In addition, since there are not two or more short-circuited second wiring groups in which a short circuit exists, it is not necessary to record that there are two or more short-circuited second wiring groups. It is not necessary to select one short-circuit second wiring group as the next second wiring starting group.

Then, “Process 11” shown in FIG. 4 is executed. That is, while the original value of T is “9”, the value of S is changed based on the following equation.
S = S + INT ((T−S + 1) / 2) + mod ((T−S + 1), 2)
= 1 + INT ((9-1 + 1) / 2) + mod ((9-1 + 1), 2)
= 6

  Next, it is determined whether the value of S is equal to the value of T. In the first second short-circuit inspection step, the value of S and T are not equal, so the second second short-circuit inspection step is executed.

[Second Second Short-circuit Inspection Process]
That is, assuming that j = 2, the second second short-circuit inspection process is executed. Specifically, the sixth to ninth B ₂ (= 4) second wirings are set as the second wiring starting group in the second second short-circuit inspection step. Here, the value of [S, T] is [6, 9].

The second wiring start group is divided into b ₂ (= 2) second wiring groups. That is, the Tth second wiring is divided into two from the Sth second wiring. The first second wiring group includes sixth to seventh second wirings, and the second second wiring group includes eighth to ninth second wirings. That is, B _2-1 = 2 and B _2-2 = 2.

  Next, a short circuit between all the second wirings belonging to the first second wiring group (the sixth to seventh second wirings in a short circuit state) and the i'th shorting first wiring. A test is performed, and all the second wirings belonging to the second second wiring group (the eighth to ninth second wirings in a short-circuited state) and the i'th short-circuiting first wiring Perform a short-circuit test between. That is, the second second short-circuit inspection process is executed (see FIG. 8B).

  In the first embodiment, since it is assumed that a short circuit has occurred in the seventh gate electrode 13, a short circuit exists in the first second wiring group, and a short circuit exists in the second second wiring group. do not do. That is, since there is only one short-circuited second wiring group in which a short circuit exists, the short-circuited second wiring group (first second wiring group) is selected as the next second wiring starting group. In addition, since there are not two or more short-circuited second wiring groups in which a short circuit exists, it is not necessary to record that there are two or more short-circuited second wiring groups. It is not necessary to select one short-circuit second wiring group as the next second wiring starting group.

Then, the “process-12” shown in FIG. 4 is executed. That is, the value of S is set to “6” as it is, while the value of T is changed based on the following equation.
T = T-INT ((T-S + 1) / 2)
= 9-INT ((9-6 + 1) / 2)
= 7

  Next, it is determined whether the value of S is equal to the value of T. In the second second short circuit inspection step, the value of S and T are not equal, so the third second short circuit inspection step is executed.

[Third second short-circuit inspection step]
That is, assuming that j = 3, the third second short circuit inspection step is executed. Specifically, the sixth to seventh B ₃ (= 2) second wirings are set as the second wiring starting group in the third second short-circuit inspection step. Here, the value of [S, T] is [6, 7].

Then, this second wiring starting group is divided into b ₃ (= 2) second wiring groups. That is, the Tth second wiring is divided into two from the Sth second wiring. The first second wiring group includes the sixth second wiring, and the second second wiring group includes the seventh first wiring. That is, B _3-1 = 1 and B _3-2 = 1.

  Next, a short-circuit test is performed between all of the second wirings (sixth second wiring) belonging to the first second wiring group and the i'th short-circuiting first wiring. A short circuit test is performed between all of the second wirings (seventh second wiring) belonging to the second wiring group and the i'th shorting first wiring. That is, the third second short circuit inspection step is executed (see FIG. 9).

  In the first embodiment, since it is assumed that a short circuit has occurred in the seventh gate electrode 13, there is no short circuit in the first second wiring group, and there is a short circuit in the second second wiring group. Exists. That is, since there is only one short-circuited second wiring group in which a short circuit exists, the short-circuited second wiring group (second second wiring group) is selected as the next second wiring starting group. In addition, since there are not two or more short-circuited second wiring groups in which a short circuit exists, it is not necessary to record that there are two or more short-circuited second wiring groups. It is not necessary to select one short-circuit second wiring group as the next second wiring starting group.

Then, “Process 11” shown in FIG. 4 is executed. That is, while the value of T is set to “7” as it is, the value of S is changed based on the following equation.
S = S + INT ((T−S + 1) / 2) + mod ((T−S + 1), 2)
= 6 + INT ((7-6 + 1) / 2) + mod ((7-6 + 1), 2)
= 7

  Next, it is determined whether the value of S is equal to the value of T. In the third second short-circuit inspection step, the value of S is equal to the value of T. That is, the number of second wires belonging to the short-circuited second wire group is one.

Therefore, the second short-circuit inspection process is repeated until the second wiring (seventh second wiring) in which the short circuit has occurred is replaced with the j′-th second wiring B _{j ′} (where j ′ = Record as 1). Specifically, as shown in “Processing -14” in FIG. 5, the value of “S” is recorded and stored as S _{j ′} (or as _<< P _{i ′} , S _{j ′} >>).

Then, it is determined whether or not the value of j ′ exceeds the specified number of short-circuited points (Def ₂ ). If it exceeds, the display means provided in the short-circuit test apparatus indicates that the cathode panel should be discarded. Display and end the implementation of the short-circuit inspection method.

If not, it is determined whether it is recorded that there are two or more short-circuited second wiring groups. In the first embodiment, since there are no two or more short-circuited second wiring groups and i ′ = 1, the first wiring and the second wiring in the overlapping region of the first wiring and the second wiring are used. (A _{i ′} , B _{j ′} ) = << 5, 7 >> (that is, a short circuit occurs in the overlapping region of the fifth first wiring and the seventh second wiring) For example, it displays on the display means with which the short circuit test apparatus was equipped, and a short circuit inspection method is completed.

  Table 2 below summarizes the values of [S, T] from the first second short-circuit inspection process to the third second short-circuit inspection process.

In the second embodiment, the overlapping region between the fourth cathode electrode 11 and the seventh gate electrode 13 and the overlapping region between the eleventh cathode electrode 11 and the third gate electrode 13 are provided. It is assumed that a short circuit has occurred in FIG. That is,
<< 4,7 >>
<< 11,3 >>
It is assumed that a short circuit has occurred in FIG. Except for this point, Example 2 is the same as Example 1.

  Hereinafter, the short-circuit inspection method of Example 2 will be described more specifically with reference to FIGS.

[1-1st first short circuit inspection step]
Specifically, first, since i = 1, A ₁ (= 14) first wirings are set as a first wiring starting group. Here, the value of [P, Q] is [1, 14]. And the 1st-1st 1st short circuit inspection process is performed (refer to (A) of Drawing 10). That is, the “first first short circuit inspection process” is executed.

In the second embodiment, since it is assumed that the fourth and eleventh cathode electrodes 11 are short-circuited, there are two or more short-circuit first wiring groups in which a short-circuit exists. Therefore, as shown in “Processing 03” in FIG. 2, it is recorded that there are two or more short-circuit first wiring groups. Specifically, [1,14] is recorded and stored as the value of [P, Q]. Then, one of the two or more short-circuited first wiring groups is selected as the next first wiring starting group. Specifically, “Process-02” shown in FIG. 2 is executed. That is, while the value of P is set to “1” as it is, the value of Q is changed based on the following equation.
Q = Q-INT ((Q-P + 1) / 2)
= 14-INT ((14-1 + 1) / 2)
= 7

  Note that the value of [P, Q] recorded and stored in “Process-03” is not limited to [1, 14]. For example, “Process-01” may be executed, and the value of [P, Q] obtained thereby may be recorded and stored in “Process-03”. In short, the short-circuit first wiring group in which a short circuit exists Is recorded, stored, and / or the short-circuited first wiring group that is not selected among the two or more short-circuited first wiring groups may be specified by some means. The same applies to the following description.

  Next, it is determined whether the value of P is equal to the value of Q. In the first-first first short-circuit inspection step, the value of P is not equal to the value of Q, so the first-second first short-circuit inspection step is executed.

[1-2th first short circuit inspection step]
Specifically, the first to seventh A ₂ (= 7) first wirings are set as the first wiring starting group in the first-second first short circuit inspection step. Here, the value of [P, Q] is [1, 7].

The first wiring start group is divided into a ₂ (= 2) first wiring groups. That is, the Qth first wiring is divided into two from the Pth first wiring. The first first wiring group includes first to fourth first wirings, and the second first wiring group includes fifth to seventh first wirings. That is, A _2-1 = 4 and A _2-2 = 3.

  Next, a short circuit test is performed between all of the first wirings belonging to the first first wiring group (first to fourth first wirings in a short circuit state) and all of the second wirings, Further, a short circuit test is performed between all of the first wirings belonging to the second first wiring group (the fifth to seventh first wirings in a short circuit state) and all of the second wirings. . That is, the 1st-2nd 1st short circuit inspection process is performed (refer to (B) of Drawing 10).

  Here, since it is assumed that a short circuit has occurred in the fourth cathode electrode 11, a short circuit exists in the first first wiring group, and no short circuit exists in the second first wiring group. That is, since there is only one shorted first wiring group in which a short circuit exists, the shorted first wiring group (first first wiring group) is selected as the next first wiring starting group. Since there are no two or more short-circuit first wiring groups in which a short circuit exists, it is unnecessary to record that there are two or more short-circuit first wiring groups. It is also unnecessary to select one short-circuit first wiring group as the next first wiring starting group.

Then, “Process-02” shown in FIG. 2 is executed. That is, while the value of P is set to “1” as it is, the value of Q is changed based on the following equation.
Q = Q-INT ((Q-P + 1) / 2)
= 7-INT ((7-1 + 1) / 2)
= 4

  Next, it is determined whether the value of P is equal to the value of Q. Also in the 1st-2nd first short circuit inspection process, since the value of P is not equal to the value of Q, the 1st-3rd first short circuit inspection process is executed.

[1st-3rd first short circuit inspection step]
Specifically, the first to fourth A ₃ (= 4) first wirings are set as the first wiring starting group in the first to third third short-circuit inspection process. Here, the value of [P, Q] is [1, 4].

The first wiring start group is divided into a ₃ (= 2) first wiring groups. That is, the Qth first wiring is divided into two from the Pth first wiring. The first first wiring group includes first to second first wirings, and the second first wiring group includes third to fourth first wirings. That is, A _3-1 = 2 and A _3-2 = 2.

  Next, a short circuit test is performed between all of the first wirings belonging to the first first wiring group (first to second first wirings in a short circuit state) and all of the second wirings, Furthermore, a short circuit test is performed between all of the first wirings belonging to the second first wiring group (the third to fourth first wirings in a short circuit state) and all of the second wirings. . That is, the 1st-3rd 1st short circuit inspection process is performed (refer to (A) of Drawing 11).

  Here, since it is assumed that a short circuit has occurred in the fourth cathode electrode 11, there is no short circuit in the first first wiring group, and there is a short circuit in the second first wiring group. That is, since there is only one short-circuited first wiring group in which a short circuit exists, the short-circuited first wiring group (second first wiring group) is selected as the next first wiring starting group. Since there are no two or more short-circuit first wiring groups in which a short circuit exists, it is unnecessary to record that there are two or more short-circuit first wiring groups. It is also unnecessary to select one short-circuit first wiring group as the next first wiring starting group.

Then, “Process-01” shown in FIG. 2 is executed. That is, while the original value of Q is “4”, the value of P is changed based on the following equation.
P = P + INT ((Q−P + 1) / 2) + mod ((Q−P + 1), 2)
= 1 + INT ((4-1 + 1) / 2) + mod ((4-1 + 1), 2)
= 3

  Next, it is determined whether the value of P is equal to the value of Q. Also in the 1st-3rd first short circuit inspection process, the value of P is not equal to the value of Q, so the 1st-4th first short circuit inspection process is executed.

[1st-4th first short circuit inspection step]
Specifically, A ₄ (= 2) first wirings are set as the first wiring starting group in the first to fourth times of the first short circuit inspection step. Here, the value of [P, Q] is [3,4].

The first wiring start group is divided into a ₄ (= 2) first wiring groups. That is, the Qth first wiring is divided into two from the Pth first wiring. The first first wiring group includes the third first wiring, and the second first wiring group includes the fourth first wiring. That is, A _4-1 = 1 and A _4-2 = 1.

  Next, a short circuit test is performed between all of the first wirings (third third wiring) belonging to the first first wiring group and all of the second wirings, and further, the second first wiring A short circuit test is performed between all of the first wirings belonging to the group (fourth first wiring) and all of the second wirings. That is, the 1st-4th 1st short circuit inspection process is performed (refer to (B) of Drawing 11).

  Here, since it is assumed that a short circuit has occurred in the fourth cathode electrode 11, there is no short circuit in the first first wiring group, and there is a short circuit in the second first wiring group. That is, since there is only one short-circuited first wiring group in which a short circuit exists, the short-circuited first wiring group (second first wiring group) is selected as the next first wiring starting group. In addition, since there are not two or more short-circuited second wiring groups in which a short circuit exists, it is unnecessary to record that there are two or more short-circuited first wiring groups. It is also unnecessary to select one short-circuit first wiring group as the next first wiring starting group.

Then, “Process-01” shown in FIG. 2 is executed. That is, while the original value of Q is “4”, the value of P is changed based on the following equation.
P = P + INT ((Q−P + 1) / 2) + mod ((Q−P + 1), 2)
= 3 + INT ((4-3 + 1) / 2) + mod ((4-3 + 1), 2)
= 4

  Next, it is determined whether the value of P is equal to the value of Q. In the first to fourth times of the first short circuit inspection process, the value of P is equal to the value of Q. That is, the number of first wirings belonging to the short-circuited first wiring group is one.

Therefore, the repetition of the first short circuit inspection process is completed as described above, and the first wiring (fourth first wiring) in which the short circuit has occurred is replaced with the i′th first wiring A _{i ′} (where i ′ = Record as 1). Specifically, as shown in “Processing 04” in FIG. 3, the value of “P” is recorded and stored as P _{i ′} .

Then, it is determined whether or not the value of i ′ exceeds the specified number of short-circuited locations (Def ₁ ), and if it exceeds, the display means provided in the short-circuit test apparatus indicates that the cathode panel should be discarded. Display and end the implementation of the short-circuit inspection method.

If not, it is determined whether it is recorded that there are two or more short-circuited first wiring groups. In the second embodiment, since there are two or more short-circuit first wiring groups, one short-circuit first wiring group other than the one short-circuit first wiring group selected previously is selected as the next first wiring start group. Based on the first wiring starting group, the first short-circuit inspection step is repeated until the number of first wirings belonging to the short-circuiting first wiring group becomes one, and the first wiring that has short-circuited is replaced with the i'th-th wiring. The first short-circuit wiring A _{i ′} (where i ′ = 2, 3,..., I ′) is recorded (secondary first short-circuit inspection step) as a recorded first short-circuit wiring group. Repeat until there is no more.

  That is, first, “Process-05” is executed. Specifically, the latest [P, Q] value is selected from the [P, Q] values recorded and stored in “Process-03”. In Example 2, since the value of [P, Q] recorded and stored in “Process-03” is only one of [1, 14], [P, Q] = [1, 14]. Select. Then, one short-circuit first wiring group other than the one short-circuit first wiring group selected is selected as the next first wiring start group.

  Specifically, in “Process-03”, since the first to seventh first wirings are selected as the next first wiring starting group, that is, [P, Q] = [1, 7] is selected, the short-circuit first wiring group composed of the eighth to fourteenth first wirings is selected as the next first wiring starting group. That is, [P, Q] = [8, 14] is selected as the next first wiring start group. More specifically, “Process-01” is executed. Furthermore, [P, Q] selected in “Process-05” is deleted from [P, Q] recorded and stored in “Process-03”. In the second embodiment, since only one set of [P, Q] is recorded and stored in “Process-03”, when [P, Q] selected in “Process-05” is deleted, “Process- [P, Q] recorded and stored at “03” no longer exists.

Next, it is determined whether the value of P is equal to the value of Q. Since the value of P is not equal to the value of Q, the first short circuit inspection process is repeated until the number of first wirings belonging to the short circuit first wiring group becomes one on the basis of the first wiring starting group. A step of recording the generated first wiring as the i'th short-circuiting first wiring A _{i ′} (where i ′ = 2, 3,..., I ′) (secondary first short-circuit inspection step) ) Are repeated in sequence until there is no recorded short circuit first wiring group.

  Specifically, the following steps are executed.

[2-1st first short circuit inspection step]
Specifically, first, A _i (= 7) first wirings are set as a first wiring starting group. Here, the value of [P, Q] is [8, 14].

The first wiring start group is divided into a ₁ (= 2) first wiring groups. That is, the Qth first wiring is divided into two from the Pth first wiring. The first first wiring group includes the eighth to eleventh first wirings, and the second first wiring group includes the twelfth to fourteenth first wirings. That is, A _1-1 = 4 and A _1-2 = 3.

  Next, a short circuit test is performed between all of the first wirings belonging to the first first wiring group (the eighth to eleventh first wirings in a short circuit state) and all of the second wirings, Further, a short circuit test is performed between all of the first wirings belonging to the second first wiring group (the 12th to 14th first wirings in a short circuit state) and all of the second wirings. . That is, the 2-1st first short circuit inspection step is executed (see FIG. 12A).

  Here, since it is assumed that a short circuit has occurred in the eleventh cathode electrode 11, a short circuit exists in the first first wiring group, and a short circuit does not exist in the second first wiring group. That is, since there is only one shorted first wiring group in which a short circuit exists, the shorted first wiring group (first first wiring group) is selected as the next first wiring starting group. Since there are no two or more short-circuit first wiring groups in which a short circuit exists, it is unnecessary to record that there are two or more short-circuit first wiring groups. It is also unnecessary to select one short-circuit first wiring group as the next first wiring starting group.

Then, “Process-02” shown in FIG. 2 is executed. That is, the value of P is set to “8” as it is, while the value of Q is changed based on the following equation.
Q = Q-INT ((Q-P + 1) / 2)
= 14-INT ((14-8 + 1) / 2)
= 11

  Next, it is determined whether the value of P is equal to the value of Q. In the 2-1st first short circuit inspection step, since the value of P is not equal to the value of Q, the 2-2nd first short circuit inspection step is executed.

[Second-second first short circuit inspection step]
Specifically, the 8th to 11th A ₂ (= 4) first wirings are set as the first wiring starting group in the second-second first short circuit inspection step. Here, the value of [P, Q] is [8, 11].

The first wiring start group is divided into a ₂ (= 2) first wiring groups. That is, the Qth first wiring is divided into two from the Pth first wiring. The first first wiring group includes the eighth to ninth first wirings, and the second first wiring group includes the tenth to eleventh first wirings. That is, A _2-1 = 2 and A _2-2 = 2.

  Next, a short circuit test is performed between all the first wirings belonging to the first first wiring group (the eighth to ninth first wirings in a short circuit state) and all the second wirings, Furthermore, a short circuit test is performed between all of the first wirings belonging to the second first wiring group (the tenth to eleventh first wirings in a short circuit state) and all of the second wirings. . That is, the 2nd-2 1st short circuit inspection process is performed (refer to (B) of Drawing 12).

  Here, since it is assumed that a short circuit has occurred in the eleventh cathode electrode 11, a short circuit does not exist in the first first wiring group, and a short circuit exists in the second first wiring group. That is, since there is only one short-circuited first wiring group in which a short circuit exists, the short-circuited first wiring group (second first wiring group) is selected as the next first wiring starting group. Since there are no two or more short-circuit first wiring groups in which a short circuit exists, it is unnecessary to record that there are two or more short-circuit first wiring groups. It is also unnecessary to select one short-circuit first wiring group as the next first wiring starting group.

Then, “Process-01” shown in FIG. 2 is executed. That is, while the value of Q is set to “11” as it is, the value of P is changed based on the following equation.
P = P + INT ((Q−P + 1) / 2) + mod ((Q−P + 1), 2)
= 8 + INT ((11-8 + 1) / 2) + mod ((11-8 + 1), 2)
= 10

  Next, it is determined whether the value of P is equal to the value of Q. Also in the 2-2nd first short circuit inspection step, since the value of P and the value of Q are not equal, the 2nd-3rd first short circuit inspection step is executed.

[The 2nd-3rd 1st short circuit inspection process]
Specifically, the tenth to eleventh A ₃ (= 2) first wirings are set as the first wiring starting group in the second-third first short-circuit inspection step. Here, the value of [P, Q] is [10, 11].

The first wiring start group is divided into a ₃ (= 2) first wiring groups. That is, the Qth first wiring is divided into two from the Pth first wiring. The first first wiring group includes the tenth first wiring, and the second first wiring group includes the eleventh first wiring. That is, A _3-1 = 1 and A _3-2 = 1.

  Next, a short circuit test is performed between all of the first wirings belonging to the first first wiring group (the tenth first wiring) and all of the second wirings, and further, the second first wiring A short circuit test is performed between all of the first wirings belonging to the group (the eleventh first wiring) and all of the second wirings. That is, the 2nd-3rd 1st short circuit inspection process is performed (refer to (A) of Drawing 13).

  Here, since it is assumed that a short circuit has occurred in the eleventh cathode electrode 11, a short circuit does not exist in the first first wiring group, and a short circuit exists in the second first wiring group. That is, since there is only one short-circuited first wiring group in which a short circuit exists, the short-circuited first wiring group (second first wiring group) is selected as the next first wiring starting group. Since there are no two or more short-circuit first wiring groups in which a short circuit exists, it is unnecessary to record that there are two or more short-circuit first wiring groups. It is also unnecessary to select one short-circuit first wiring group as the next first wiring starting group.

Then, “Process-01” shown in FIG. 2 is executed. That is, while the value of Q is set to “11” as it is, the value of P is changed based on the following equation.
P = P + INT ((Q−P + 1) / 2) + mod ((Q−P + 1), 2)
= 10 + INT ((11-10 + 1) / 2) + mod ((11-10 + 1), 2)
= 11

  Next, it is determined whether the value of P is equal to the value of Q. In the second-third first short circuit inspection step, the value of P is equal to the value of Q. That is, the number of first wirings belonging to the short-circuited first wiring group is one.

Therefore, the repetition of the secondary first short-circuit inspection process is completed as described above, and the first wiring (the eleventh first wiring) in which the short circuit has occurred is replaced with the i'th first wiring A _{i '} (however, , I ′ = 2). Specifically, as shown in “Processing 04” in FIG. 3, the value of “P” is recorded and stored as P _{i ′} .

Then, it is determined whether or not the value of i ′ exceeds the specified number of short-circuited points (Def ₁ ). If it exceeds, the display means provided in the short-circuit test apparatus indicates that the cathode panel should be discarded. Display and end the implementation of the short-circuit inspection method.

  If not, it is determined whether it is recorded that there are two or more short-circuited first wiring groups. In the second embodiment, when [P, Q] selected in “Processing-05” is deleted, [P, Q] recorded and stored in “Processing-03” no longer exists. Since the recorded short-circuit first wiring group is lost, the process proceeds to the next step.

  Table 3 below summarizes the values of [P, Q] from the above-mentioned first-first first short-circuit inspection step to the first-fourth first short-circuit inspection step. Table 4 below summarizes the values of [P, Q] from the 2-1st first short circuit inspection step to the 2-3rd first short circuit inspection step.

[1-1st Second Short-Circuit Inspection Process]
First, the fourth first wiring is selected as the i′th (i ′ = 1) short-circuit first wiring. Since j = 1, B ₁ (= 9) second wirings are set as the second wiring starting group. Here, the value of [S, T] is [1, 9]. And the 2nd short circuit inspection process of the 1-1st time is performed (refer to (B) of Drawing 13). That is, the “first second short circuit inspection process” is executed.

  Here, since it is assumed that a short circuit has occurred in the seventh gate electrode 13, no short circuit exists in the first second wiring group, and a short circuit exists in the second second wiring group. That is, since there is only one short-circuited second wiring group in which a short circuit exists, the short-circuited second wiring group (second second wiring group) is selected as the next second wiring starting group. In addition, since there are not two or more short-circuited second wiring groups in which a short circuit exists, it is not necessary to record that there are two or more short-circuited second wiring groups. It is not necessary to select one short-circuit second wiring group as the next second wiring starting group.

Then, “Process 11” shown in FIG. 4 is executed. That is, while the original value of T is “9”, the value of S is changed based on the following equation.
S = S + INT ((T−S + 1) / 2) + mod ((T−S + 1), 2)
= 1 + INT ((9-1 + 1) / 2) + mod ((9-1 + 1), 2)
= 6

  Next, it is determined whether the value of S is equal to the value of T. In the first-first second short-circuit inspection step, since the value of S and the value of T are not equal, the first-second second short-circuit inspection step is executed.

[1-2th Second Short-Circuit Inspection Process]
Specifically, the sixth to ninth B ₂ (= 4) second wirings are set as the second wiring starting group in the first-second second short-circuit inspection step. Here, the value of [S, T] is [6, 9].

The second wiring start group is divided into b ₂ (= 2) second wiring groups. That is, the Tth second wiring is divided into two from the Sth second wiring. The first second wiring group includes sixth to seventh second wirings, and the second second wiring group includes eighth to ninth second wirings. That is, B _2-1 = 2 and B _2-2 = 2.

  Next, a short circuit between all the second wirings belonging to the first second wiring group (the sixth to seventh second wirings in a short circuit state) and the i'th shorting first wiring. A test is performed, and all the second wirings belonging to the second second wiring group (the eighth to ninth second wirings in a short-circuited state) and the i'th short-circuiting first wiring Perform a short-circuit test between. That is, the 1st-2nd 2nd short circuit inspection process is performed (refer to (A) of Drawing 14).

  Here, since it is assumed that a short circuit has occurred in the seventh gate electrode 13, a short circuit exists in the first second wiring group, and no short circuit exists in the second second wiring group. That is, since there is only one short-circuited second wiring group in which a short circuit exists, the short-circuited second wiring group (first second wiring group) is selected as the next second wiring starting group. In addition, since there are not two or more short-circuited second wiring groups in which a short circuit exists, it is not necessary to record that there are two or more short-circuited second wiring groups. It is not necessary to select one short-circuit second wiring group as the next second wiring starting group.

Then, the “process-12” shown in FIG. 4 is executed. That is, the value of S is set to “6” as it is, while the value of T is changed based on the following equation.
T = T-INT ((T-S + 1) / 2)
= 9-INT ((9-6 + 1) / 2)
= 7

  Next, it is determined whether the value of S is equal to the value of T. In the first-second second short-circuit inspection step, the value of S is not equal to the value of T, so the first-third second short-circuit inspection step is executed.

[1st-3rd second short circuit inspection step]
Specifically, the sixth to seventh B ₃ (= 2) second wirings are set as the second wiring starting group in the first to third second short-circuit inspection process. Here, the value of [S, T] is [6, 7].

Then, this second wiring starting group is divided into b ₃ (= 2) second wiring groups. That is, the Tth second wiring is divided into two from the Sth second wiring. The first second wiring group includes the sixth second wiring, and the second second wiring group includes the seventh first wiring. That is, B _3-1 = 1 and B _3-2 = 1.

  Next, a short-circuit test is performed between all of the second wirings (sixth second wiring) belonging to the first second wiring group and the i'th short-circuiting first wiring. A short circuit test is performed between all of the second wirings (seventh second wiring) belonging to the second wiring group and the i'th shorting first wiring. That is, the 1st-3rd 2nd short circuit inspection process is performed (refer to (B) of Drawing 14).

  Here, since it is assumed that a short circuit has occurred in the seventh gate electrode 13, no short circuit exists in the first second wiring group, and a short circuit exists in the second second wiring group. That is, since there is only one short-circuited second wiring group in which a short circuit exists, the short-circuited second wiring group (second second wiring group) is selected as the next second wiring starting group. In addition, since there are not two or more short-circuited second wiring groups in which a short circuit exists, it is not necessary to record that there are two or more short-circuited second wiring groups. It is not necessary to select one short-circuit second wiring group as the next second wiring starting group.

Then, “Process 11” shown in FIG. 4 is executed. That is, while the value of T is set to “7” as it is, the value of S is changed based on the following equation.
S = S + INT ((T−S + 1) / 2) + mod ((T−S + 1), 2)
= 6 + INT ((7-6 + 1) / 2) + mod ((7-6 + 1), 2)
= 7

  Next, it is determined whether the value of S is equal to the value of T. In the first to third second short circuit inspection steps, the value of S and the value of T are equal. That is, the number of second wires belonging to the short-circuited second wire group is one.

Therefore, the second short-circuit inspection process is repeated until the second wiring (seventh second wiring) in which the short circuit has occurred is replaced with the j′-th second wiring B _{j ′} (where j ′ = Record as 1). Specifically, as shown in “Processing -14” in FIG. 5, the value of “S” is recorded and stored as S _{j ′} (or as _<< P _{i ′} , S _{j ′} >>).

Then, it is determined whether or not the value of j ′ exceeds the specified number of short-circuited points (Def ₂ ). If it exceeds, the display means provided in the short-circuit test apparatus indicates that the cathode panel should be discarded. Display and end the implementation of the short-circuit inspection method.

  If not, it is determined whether it is recorded that there are two or more short-circuited second wiring groups. In the second embodiment, there are no two or more short-circuited second wiring groups (that is, there is no stored [S, T]), but the value of i ′ is 1 and 2, Furthermore, i '= 2 and the process proceeds to the next step.

[2-1st Second Short-Circuit Inspection Process]
The eleventh first wiring is selected as the i'th (i '= 2) short-circuiting first wiring. Then, B ₁ (= 9) second wirings are set as a second wiring starting group. Here, the value of [S, T] is [1, 9]. And the 2nd-1st 2nd short circuit inspection process is performed (refer to (A) of Drawing 15). That is, the “first second short circuit inspection process” is executed.

  Here, since it is assumed that a short circuit has occurred in the third gate electrode 13, a short circuit exists in the first second wiring group, and no short circuit exists in the second second wiring group. That is, since there is only one short-circuited second wiring group in which a short circuit exists, the short-circuited second wiring group (first second wiring group) is selected as the next second wiring starting group. In addition, since there are not two or more short-circuited second wiring groups in which a short circuit exists, it is not necessary to record that there are two or more short-circuited second wiring groups. It is not necessary to select one short-circuit second wiring group as the next second wiring starting group.

Then, the “process-12” shown in FIG. 4 is executed. That is, the value of S is set to “1” as it is, while the value of T is changed based on the following equation.
T = T-INT ((T-S + 1) / 2)
= 9-INT ((9-1 + 1) / 2)
= 5

  Next, it is determined whether the value of S is equal to the value of T. In the 2-1st second short circuit inspection process, the value of S and the value of T are not equal, so the 2-2nd second short circuit inspection process is executed.

[Second-second second short-circuit inspection step]
Specifically, the first to fifth B ₂ (= 5) second wirings are set as the second wiring starting group in the second-second second short circuit inspection step. Here, the value of [S, T] is [1, 5].

The second wiring start group is divided into b ₂ (= 2) second wiring groups. That is, the Tth second wiring is divided into two from the Sth second wiring. The first second wiring group includes first to third second wirings, and the second second wiring group includes fourth to fifth second wirings. That is, B _2-1 = 3 and B _2-2 = 2.

  Next, a short circuit between all of the second wirings belonging to the first second wiring group (the first to third second wirings in the short circuit state) and the i'th shorting first wiring. A test is performed, and all of the second wirings belonging to the second second wiring group (the fourth to fifth second wirings in a short circuit state) and the i'th shorting first wiring Perform a short-circuit test between. That is, the second-second second short circuit inspection step is executed (see FIG. 15B).

  Here, since it is assumed that a short circuit has occurred in the third gate electrode 13, a short circuit exists in the first second wiring group, and no short circuit exists in the second second wiring group. That is, since there is only one short-circuited second wiring group in which a short circuit exists, the short-circuited second wiring group (first second wiring group) is selected as the next second wiring starting group. In addition, since there are no two or more short-circuit second wiring groups in which a short circuit exists, it is not necessary to record that there are two or more short-circuit second wiring groups. It is not necessary to select one short-circuit second wiring group as the next second wiring starting group.

Then, “Process 11” shown in FIG. 4 is executed. That is, the value of S is set to “1” as it is, while the value of T is changed based on the following equation.
T = T-INT ((T-S + 1) / 2)
= 5-INT ((5-1 + 1) / 2)
= 3

  Next, it is determined whether the value of S is equal to the value of T. In the second-second second short-circuit inspection process, the value of S and the value of T are not equal, so the second-third second short-circuit inspection process is executed.

[2nd-3rd second short circuit inspection step]
Specifically, the first to third B ₃ (= 3) second wirings are set as the second wiring starting group in the second-third second short-circuit inspection step. Here, the value of [S, T] is [1, 3].

Then, this second wiring starting group is divided into b ₃ (= 2) second wiring groups. That is, the Tth second wiring is divided into two from the Sth second wiring. The first second wiring group includes the first to second second wirings, and the second second wiring group includes the third first wiring. That is, B _3-1 = 2 and B _3-2 = 1.

  Next, a short-circuit test is performed between all the second wirings (first to second second wirings) belonging to the first second wiring group and the i'th short-circuiting first wiring. Performs a short circuit test between all the second wirings (third second wiring) belonging to the second second wiring group and the i'th shorting first wiring. That is, the 2nd-3rd 2nd short circuit inspection process is performed (refer to Drawing 16).

  Here, since it is assumed that a short circuit has occurred in the third gate electrode 13, there is no short circuit in the first second wiring group, and there is a short circuit in the second second wiring group. That is, since there is only one shorted second wiring group in which a short circuit exists, the shorted second wiring group (second second wiring group) is selected as the next second wiring starting group. In addition, since there are not two or more short-circuited second wiring groups in which a short circuit exists, it is not necessary to record that there are two or more short-circuited second wiring groups. It is not necessary to select one short-circuit second wiring group as the next second wiring starting group.

Then, “Process 11” shown in FIG. 4 is executed. That is, while the original value of T is “3”, the value of S is changed based on the following equation.
S = S + INT ((T−S + 1) / 2) + mod ((T−S + 1), 2)
= 1 + INT ((3-1 + 1) / 2) + mod ((3-1 + 1), 2)
= 3

  Next, it is determined whether the value of S is equal to the value of T. In the second-third second short circuit inspection step, the value of S is equal to the value of T. That is, the number of second wires belonging to the short-circuited second wire group is one.

Therefore, the second short circuit inspection process is repeated until the second wiring (third second wiring) in which the short circuit has occurred is replaced with the j′th second wiring B _{j ′} (where j ′ = Record as 2). Specifically, as shown in “Processing -14” in FIG. 5, the value of “S” is recorded and stored as S _{j ′} (or as _<< P _{i ′} , S _{j ′} >>).

Then, it is determined whether or not the value of j ′ exceeds the specified number of short-circuited points (Def ₂ ). If it exceeds, the display means provided in the short-circuit test apparatus indicates that the cathode panel should be discarded. Display and end the implementation of the short-circuit inspection method.

If not, it is determined whether it is recorded that there are two or more short-circuited second wiring groups. In the second embodiment, there are no two or more short-circuited second wiring groups, and the second short-circuit inspection process in which i ′ = 1, 2 is completed, so that the first wiring and the second wiring overlap. (A _{i ′} , B _{j ′} ) = << 4, 7 >> (that is, the fourth first wiring and the seventh second wiring in the region are short-circuited between the first wiring and the second wiring. And a short circuit occurs in the overlapping region of the eleventh first wiring and the third second wiring (A _{i ′} , B _{j ′} ) = << 11, 3 >> ), For example, on the display means provided in the short-circuit test apparatus, and the short-circuit inspection method is completed.

  Table 5 below summarizes the values of [S, T] from the above-mentioned first-first second short-circuit inspection step to the first-third second short-circuit inspection step. Table 6 below summarizes the values of [S, T] from the second-first second short-circuit inspection process to the second-third second short-circuit inspection process.

In Example 3, the overlapping region of the third cathode electrode 11 and the seventh gate electrode 13, the overlapping region of the fourth cathode electrode 11 and the sixth gate electrode 13, the ninth Assume that short-circuits occur in four places, the overlapping region between the cathode electrode 11 and the second gate electrode 13 and the overlapping region between the ninth cathode electrode 11 and the fifth gate electrode 13. . That is,
<< 3,7 >>
<< 4,6 >>
<< 9,2 >>
<< 9,5 >>
It is assumed that a short circuit has occurred in FIG. Except for this point, Example 3 is the same as Example 1.

  Hereinafter, the short circuit inspection method of Example 3 will be described more specifically with reference to FIGS. 17 to 25.

[1-1st first short circuit inspection step]
Specifically, first, since i = 1, A ₁ (= 14) first wirings are set as a first wiring starting group. Here, the value of [P, Q] is [1, 14]. And the 1st-1st 1st short circuit inspection process is performed (refer to (A) of Drawing 17). That is, the “first first short circuit inspection process” is executed.

In the third embodiment, since it is assumed that the third, fourth, and ninth cathode electrodes 11 are short-circuited, there are two or more short-circuit first wiring groups in which a short-circuit exists. Therefore, as shown in “Processing 03” in FIG. 2, it is recorded that there are two or more short-circuit first wiring groups. Specifically, [1,14] is recorded and stored as the value of [P, Q]. Then, one of the two or more short-circuited first wiring groups is selected as the next first wiring starting group. Specifically, “Process-02” shown in FIG. 2 is executed. That is, while the value of P is set to “1” as it is, the value of Q is changed based on the following equation.
Q = Q-INT ((Q-P + 1) / 2)
= 14-INT ((14-1 + 1) / 2)
= 7

  Next, it is determined whether the value of P is equal to the value of Q. In the first-first first short-circuit inspection step, the value of P is not equal to the value of Q, so the first-second first short-circuit inspection step is executed.

[1-2th first short circuit inspection step]
Specifically, the first to seventh A ₂ (= 7) first wirings are set as the first wiring starting group in the first-second first short circuit inspection step. Here, the value of [P, Q] is [1, 7].

The first wiring start group is divided into a ₂ (= 2) first wiring groups. That is, the Qth first wiring is divided into two from the Pth first wiring. The first first wiring group includes first to fourth first wirings, and the second first wiring group includes fifth to seventh first wirings. That is, A _2-1 = 4 and A _2-2 = 3.

  Next, a short circuit test is performed between all of the first wirings belonging to the first first wiring group (first to fourth first wirings in a short circuit state) and all of the second wirings, Further, a short circuit test is performed between all of the first wirings belonging to the second first wiring group (the fifth to seventh first wirings in a short circuit state) and all of the second wirings. . That is, the 1st-2nd 1st short circuit inspection process is performed (refer to (B) of Drawing 17).

  Here, since it is assumed that a short circuit has occurred in the third and fourth cathode electrodes 11, a short circuit exists in the first first wiring group, and a short circuit exists in the second first wiring group. not exist. That is, since there is only one shorted first wiring group in which a short circuit exists, the shorted first wiring group (first first wiring group) is selected as the next first wiring starting group. Since there are no two or more short-circuit first wiring groups in which a short circuit exists, it is unnecessary to record that there are two or more short-circuit first wiring groups. It is also unnecessary to select one short-circuit first wiring group as the next first wiring starting group.

Then, “Process-02” shown in FIG. 2 is executed. That is, while the original value of P is set to “1”, the value of Q is changed based on the following equation.
Q = Q-INT ((Q-P + 1) / 2)
= 7-INT ((7-1 + 1) / 2)
= 4

  Next, it is determined whether the value of P is equal to the value of Q. Also in the 1st-2nd first short circuit inspection process, since the value of P is not equal to the value of Q, the 1st-3rd first short circuit inspection process is executed.

[1st-3rd first short circuit inspection step]
Specifically, the first to fourth A ₃ (= 4) first wirings are set as the first wiring starting group in the first to third third short-circuit inspection process. Here, the value of [P, Q] is [1, 4].

The first wiring start group is divided into a ₃ (= 2) first wiring groups. That is, the Qth first wiring is divided into two from the Pth first wiring. The first first wiring group includes first to second first wirings, and the second first wiring group includes third to fourth first wirings. That is, A _3-1 = 2 and A _3-2 = 2.

  Next, a short circuit test is performed between all of the first wirings belonging to the first first wiring group (first to second first wirings in a short circuit state) and all of the second wirings, Furthermore, a short circuit test is performed between all of the first wirings belonging to the second first wiring group (the third to fourth first wirings in a short circuit state) and all of the second wirings. . That is, the 1st-3rd 1st short circuit inspection process is performed (refer to (A) of Drawing 18).

  Here, since it is assumed that a short circuit has occurred in the third and fourth cathode electrodes 11, no short circuit exists in the first first wiring group, and a short circuit occurs in the second first wiring group. Exists. That is, since there is only one short-circuited first wiring group in which a short circuit exists, the short-circuited first wiring group (second first wiring group) is selected as the next first wiring starting group. Since there are no two or more short-circuit first wiring groups in which a short circuit exists, it is unnecessary to record that there are two or more short-circuit first wiring groups. It is also unnecessary to select one short-circuit first wiring group as the next first wiring starting group.

Then, “Process-01” shown in FIG. 2 is executed. That is, while the original value of Q is “4”, the value of P is changed based on the following equation.
P = P + INT ((Q−P + 1) / 2) + mod ((Q−P + 1), 2)
= 1 + INT ((4-1 + 1) / 2) + mod ((4-1 + 1), 2)
= 3

  Next, it is determined whether the value of P is equal to the value of Q. Also in the 1st-3rd first short circuit inspection process, the value of P is not equal to the value of Q, so the 1st-4th first short circuit inspection process is executed.

[1st-4th first short circuit inspection step]
Specifically, A ₄ (= 2) first wirings are set as the first wiring starting group in the first to fourth times of the first short circuit inspection step. Here, the value of [P, Q] is [3,4].

The first wiring start group is divided into a ₄ (= 2) first wiring groups. That is, the Qth first wiring is divided into two from the Pth first wiring. The first first wiring group includes the third first wiring, and the second first wiring group includes the fourth first wiring. That is, A _4-1 = 1 and A _4-2 = 1.

  Next, a short circuit test is performed between all of the first wirings (third third wiring) belonging to the first first wiring group and all of the second wirings, and further, the second first wiring A short circuit test is performed between all of the first wirings belonging to the group (fourth first wiring) and all of the second wirings. That is, the 1st-4th 1st short circuit inspection process is performed (refer to (B) of Drawing 18).

Here, since it is assumed that a short circuit has occurred in the third and fourth cathode electrodes 11, there are two or more short circuit first wiring groups in which a short circuit exists. Therefore, as shown in “Processing 03” in FIG. 2, it is recorded that there are two or more short-circuit first wiring groups. Specifically, [3,4] is recorded and stored as the value of [P, Q]. Then, one of the two or more short-circuited first wiring groups is selected as the next first wiring starting group. Specifically, “Process-02” shown in FIG. 2 is executed. That is, while the original value of P is set to “3”, the value of Q is changed based on the following equation.
Q = Q-INT ((Q-P + 1) / 2)
= 4-INT ((4-3 + 1) / 2)
= 3

  Next, it is determined whether the value of P is equal to the value of Q. In the first to fourth times of the first short circuit inspection process, the value of P is equal to the value of Q. That is, the number of first wirings belonging to the short-circuited first wiring group is one.

Accordingly, the repetition of the first short circuit inspection process is completed as described above, and the first wiring (third first wiring) in which the short circuit has occurred is replaced with the i′th first wiring A _{i ′} (where i ′ = Record as 1). Specifically, as shown in “Processing 04” in FIG. 3, the value of “P” is recorded and stored as P _{i ′} .

Then, it is determined whether or not the value of i ′ exceeds the specified number of short-circuited points (Def ₁ ). If it exceeds, the display means provided in the short-circuit test apparatus indicates that the cathode panel should be discarded. Display and end the implementation of the short-circuit inspection method.

If not, it is determined whether it is recorded that there are two or more short-circuited first wiring groups. In the third embodiment, since there are two or more short-circuit first wiring groups, one short-circuit first wiring group other than the one short-circuit first wiring group selected previously is selected as the next first wiring start group. Based on the first wiring starting group, the first short-circuit inspection step is repeated until the number of first wirings belonging to the short-circuiting first wiring group becomes one, and the first wiring that has short-circuited is replaced with the i'th th The first short-circuit wiring A _{i ′} (where i ′ = 2, 3,..., I ′) is recorded (secondary first short-circuit inspection step) as a recorded first short-circuit wiring group. Repeat until there is no more.

  That is, first, “Process-05” is executed. Specifically, the latest [P, Q] value is selected from the [P, Q] values recorded and stored in “Process-03”. In the third embodiment, [P, Q] recorded and stored in “Process-03” is recorded and stored in the order of [1, 14] and [3, 4], and the latest [P, Q] is stored. ] Is [3,4]. Accordingly, [P, Q] = [3,4] is selected. Then, one short-circuit first wiring group other than the one short-circuit first wiring group selected is selected as the next first wiring start group. That is, “Process-01” is executed.

  Specifically, in “Process-03”, the third to fourth first wirings are selected as the next first wiring starting group, that is, [P, Q] = [3, 4] is selected, here, the short-circuited first wiring group composed of the fourth first wiring is selected as the next first wiring starting group. That is, [P, Q] = [4, 4] is selected as the next first wiring start group. Furthermore, [P, Q] selected in “Process-05” is deleted from [P, Q] recorded and stored in “Process-03”. Here, [P, Q] = [3,4] is deleted and [P, Q] = [1, 14] is left.

By the way, since the short-circuited first wiring group composed of the fourth first wiring is selected as the next first wiring starting group, [P, Q] = [4, 4], and P = Q. . Therefore, the first wiring (fourth first wiring) in which the short circuit has occurred is recorded as the i'th first wiring A _{i ′} (where i ′ = 2). Specifically, as shown in “Processing 04” in FIG. 3, the value of “P” is recorded and stored as P _{i ′} .

Then, it is determined whether or not the value of i ′ exceeds the specified number of short-circuited locations (Def ₁ ), and if it exceeds, the display means provided in the short-circuit test apparatus indicates that the cathode panel should be discarded. Display and end the implementation of the short-circuit inspection method.

  If not, it is determined whether it is recorded that there are two or more short-circuited first wiring groups. In this case, since [P, Q] = [1, 14] remains, “Process-05” is executed again. Specifically, the latest [P, Q] value is selected from the [P, Q] values recorded and stored in “Process-03”. [P, Q] recorded and stored in “Process-03” is only [1, 14] at this time, and the latest value of [P, Q] is [1, 14]. Accordingly, [P, Q] = [1, 14] is selected. Then, one short-circuit first wiring group other than the one short-circuit first wiring group selected is selected as the next first wiring start group. That is, “Process-01” is executed.

  Specifically, in “Process-03”, the first to seventh first wirings are selected as the next first wiring starting group, that is, [P, Q] = [1, 7] is selected, the short-circuit first wiring group composed of the eighth to fourteenth first wirings is selected as the next first wiring starting group. That is, [P, Q] = [8, 14] is selected as the next first wiring start group. Furthermore, [P, Q] selected in “Process-05” is deleted from [P, Q] recorded and stored in “Process-03”. Here, [P, Q] = [1, 14] is deleted, and [P, Q] recorded and stored in “Process-03” no longer exists.

Then, based on the first wiring starting group, the first short-circuit inspection step is repeated until the number of the first wirings belonging to the short-circuiting first wiring group becomes one, and the first wiring in which the short-circuit has occurred is i '. Record as the first short-circuited first wiring A _{i ′} (where i ′ = 2, 3,..., I ′).

  Specifically, the following steps are executed.

[2-1st first short circuit inspection step]
Specifically, first, A _i (= 7) first wirings are set as a first wiring starting group. Here, the value of [P, Q] is [8, 14].

The first wiring start group is divided into a ₁ (= 2) first wiring groups. That is, the Qth first wiring is divided into two from the Pth first wiring. The first first wiring group includes the eighth to eleventh first wirings, and the second first wiring group includes the twelfth to fourteenth first wirings. That is, A _1-1 = 4 and A _1-2 = 3.

  Next, a short circuit test is performed between all of the first wirings belonging to the first first wiring group (the eighth to eleventh first wirings in a short circuit state) and all of the second wirings, Further, a short circuit test is performed between all of the first wirings belonging to the second first wiring group (the 12th to 14th first wirings in a short circuit state) and all of the second wirings. . That is, the 2-1st first short circuit inspection step is executed (see FIG. 19A).

  Here, since it is assumed that a short circuit has occurred in the ninth cathode electrode 11, a short circuit exists in the first first wiring group, and no short circuit exists in the second first wiring group. That is, since there is only one shorted first wiring group in which a short circuit exists, the shorted first wiring group (first first wiring group) is selected as the next first wiring starting group. Since there are no two or more short-circuit first wiring groups in which a short circuit exists, it is unnecessary to record that there are two or more short-circuit first wiring groups. It is also unnecessary to select one short-circuit first wiring group as the next first wiring starting group.

Then, “Process-02” shown in FIG. 2 is executed. That is, the value of P is set to “8” as it is, while the value of Q is changed based on the following equation.
Q = Q-INT ((Q-P + 1) / 2)
= 14-INT ((14-8 + 1) / 2)
= 11

  Next, it is determined whether the value of P is equal to the value of Q. In the 2-1st first short circuit inspection step, since the value of P is not equal to the value of Q, the 2-2nd first short circuit inspection step is executed.

[Second-second first short circuit inspection step]
Specifically, the 8th to 11th A ₂ (= 4) first wirings are set as the first wiring starting group in the second-second first short circuit inspection step. Here, the value of [P, Q] is [8, 11].

The first wiring start group is divided into a ₂ (= 2) first wiring groups. That is, the Qth first wiring is divided into two from the Pth first wiring. The first first wiring group includes the eighth to ninth first wirings, and the second first wiring group includes the tenth to eleventh first wirings. That is, A _2-1 = 2 and A _2-2 = 2.

  Next, a short circuit test is performed between all the first wirings belonging to the first first wiring group (the eighth to ninth first wirings in a short circuit state) and all the second wirings, Furthermore, a short circuit test is performed between all of the first wirings belonging to the second first wiring group (the tenth to eleventh first wirings in a short circuit state) and all of the second wirings. . That is, the 2-2nd first short circuit inspection step is executed (see FIG. 19B).

  Here, since it is assumed that a short circuit has occurred in the ninth cathode electrode 11, there is a short circuit in the first first wiring group, and there is no short circuit in the second first wiring group. That is, since there is only one short-circuited first wiring group in which a short circuit exists, the short-circuited first wiring group (first first wiring group) is selected as the next first wiring starting group. Since there are no two or more short-circuit first wiring groups in which a short circuit exists, it is not necessary to record that there are two or more short-circuit first wiring groups. It is not necessary to select one short-circuit first wiring group as the next first wiring starting group.

Then, “Process-02” shown in FIG. 2 is executed. That is, the value of P is set to “8” as it is, while the value of Q is changed based on the following equation.
Q = Q-INT ((Q-P + 1) / 2)
= 11-INT ((11-8 + 1) / 2)
= 9

  Next, it is determined whether the value of P is equal to the value of Q. Also in the 2-2nd first short circuit inspection step, since the value of P and the value of Q are not equal, the 2nd-3rd first short circuit inspection step is executed.

[The 2nd-3rd 1st short circuit inspection process]
Specifically, the tenth to eleventh A ₃ (= 2) first wirings are set as the first wiring starting group in the second-third first short-circuit inspection step. Here, the value of [P, Q] is [8, 9].

The first wiring start group is divided into a ₃ (= 2) first wiring groups. That is, the Qth first wiring is divided into two from the Pth first wiring. The first first wiring group includes the eighth first wiring, and the second first wiring group includes the ninth first wiring. That is, A _3-1 = 1 and A _3-2 = 1.

  Next, a short circuit test is performed between all of the first wirings belonging to the first first wiring group (the eighth first wiring) and all of the second wirings, and further, the second first wiring A short circuit test is performed between all of the first wirings belonging to the group (the ninth first wiring) and all of the second wirings. That is, the 2nd-3rd 1st short circuit inspection process is performed.

  Here, since it is assumed that a short circuit has occurred in the ninth cathode electrode 11, no short circuit exists in the first first wiring group, and a short circuit exists in the second first wiring group. That is, since there is only one short-circuited first wiring group in which a short circuit exists, the short-circuited first wiring group (second first wiring group) is selected as the next first wiring starting group. Since there are no two or more short-circuit first wiring groups in which a short circuit exists, it is unnecessary to record that there are two or more short-circuit first wiring groups. It is also unnecessary to select one short-circuit first wiring group as the next first wiring starting group.

Then, “Process-01” shown in FIG. 2 is executed. That is, while the value of Q is set to “9” as it is, the value of P is changed based on the following equation.
P = P + INT ((Q−P + 1) / 2) + mod ((Q−P + 1), 2)
= 8 + INT ((9-8 + 1) / 2) + mod ((9-8 + 1), 2)
= 9

  Next, it is determined whether the value of P is equal to the value of Q. In the second-third first short circuit inspection step, the value of P is equal to the value of Q. That is, the number of first wirings belonging to the short-circuited first wiring group is one.

Accordingly, the repetition of the secondary first short circuit inspection process is completed. And the 1st wiring (11th 1st wiring) in which the short circuit has arisen is recorded as i'th 1st wiring _{Ai '} (however, i' = 3). Specifically, as shown in “Processing 04” in FIG. 3, the value of “P” is recorded and stored as P _{i ′} .

Then, it is determined whether or not the value of i ′ exceeds the specified number of short-circuited points (Def ₁ ). If it exceeds, the display means provided in the short-circuit test apparatus indicates that the cathode panel should be discarded. Display and end the implementation of the short-circuit inspection method.

  If not, it is determined whether it is recorded that there are two or more short-circuited first wiring groups. In the third embodiment, when [P, Q] selected in “Process-05” is deleted, [P, Q] recorded and stored in “Process-03” no longer exists. Since the recorded short-circuit first wiring group is lost, the process proceeds to the next step.

  Table 7 below summarizes the values of [P, Q] from the above-mentioned first-first first short-circuit inspection step to the first-fourth first short-circuit inspection step. Table 8 below summarizes the values of [P, Q] from the 2-1st first short circuit inspection process to the 2-3rd first short circuit inspection process.

[1-1st Second Short-Circuit Inspection Process]
First, the third first wiring is selected as the i′th (i ′ = 1) short-circuit first wiring. Since j = 1, B ₁ (= 9) second wirings are set as the second wiring starting group. Here, the value of [S, T] is [1, 9]. And the 2nd short circuit inspection process of the 1st-1st time is performed (refer to (B) of Drawing 20). That is, the “first second short circuit inspection process” is executed.

  Here, since it is assumed that a short circuit has occurred in the seventh gate electrode 13, no short circuit exists in the first second wiring group, and a short circuit exists in the second second wiring group. That is, since there is only one short-circuited second wiring group in which a short circuit exists, the short-circuited second wiring group (second second wiring group) is selected as the next second wiring starting group. In addition, since there are no two or more short-circuit second wiring groups in which a short circuit exists, it is not necessary to record that there are two or more short-circuit second wiring groups. It is not necessary to select one short-circuit second wiring group as the next second wiring starting group.

Then, “Process 11” shown in FIG. 4 is executed. That is, while the original value of T is “9”, the value of S is changed based on the following equation.
S = S + INT ((T−S + 1) / 2) + mod ((T−S + 1), 2)
= 1 + INT ((9-1 + 1) / 2) + mod ((9-1 + 1), 2)
= 6

  Next, it is determined whether the value of S is equal to the value of T. In the first-first second short-circuit inspection step, since the value of S and the value of T are not equal, the first-second second short-circuit inspection step is executed.

[1-2th Second Short-Circuit Inspection Process]
Specifically, the sixth to ninth B ₂ (= 4) second wirings are set as the second wiring starting group in the first-second second short-circuit inspection step. Here, the value of [S, T] is [6, 9].

The second wiring start group is divided into b ₂ (= 2) second wiring groups. That is, the Tth second wiring is divided into two from the Sth second wiring. The first second wiring group includes sixth to seventh second wirings, and the second second wiring group includes eighth to ninth second wirings. That is, B _2-1 = 2 and B _2-2 = 2.

  Next, a short circuit between all the second wirings belonging to the first second wiring group (the sixth to seventh second wirings in a short circuit state) and the i'th shorting first wiring. A test is performed, and all the second wirings belonging to the second second wiring group (the eighth to ninth second wirings in a short-circuited state) and the i'th short-circuiting first wiring Perform a short-circuit test between. That is, the 1st-2nd 2nd short circuit inspection process is performed (refer to (A) of Drawing 21).

  Here, since it is assumed that a short circuit has occurred in the seventh gate electrode 13, a short circuit exists in the first second wiring group, and no short circuit exists in the second second wiring group. That is, since there is only one short-circuited second wiring group in which a short circuit exists, the short-circuited second wiring group (first second wiring group) is selected as the next second wiring starting group. In addition, since there are no two or more short-circuit second wiring groups in which a short circuit exists, it is not necessary to record that there are two or more short-circuit second wiring groups. It is not necessary to select one short-circuit second wiring group as the next second wiring starting group.

Then, the “process-12” shown in FIG. 4 is executed. That is, the value of S is set to “6” as it is, while the value of T is changed based on the following equation.
T = T-INT ((T-S + 1) / 2)
= 9-INT ((9-6 + 1) / 2)
= 7

  Next, it is determined whether the value of S is equal to the value of T. In the first-second second short-circuit inspection step, the value of S is not equal to the value of T, so the first-third second short-circuit inspection step is executed.

[1st-3rd second short circuit inspection step]
Specifically, the sixth to seventh B ₃ (= 2) second wirings are set as the second wiring starting group in the first to third second short-circuit inspection process. Here, the value of [S, T] is [6, 7].

Then, this second wiring starting group is divided into b ₃ (= 2) second wiring groups. That is, the Tth second wiring is divided into two from the Sth second wiring. The first second wiring group includes the sixth second wiring, and the second second wiring group includes the seventh first wiring. That is, B _3-1 = 1 and B _3-2 = 1.

  Next, a short-circuit test is performed between all of the second wirings (sixth second wiring) belonging to the first second wiring group and the i'th short-circuiting first wiring. A short circuit test is performed between all of the second wirings (seventh second wiring) belonging to the second wiring group and the i'th shorting first wiring. That is, the 1st-3rd 2nd short circuit inspection process is performed (refer to (B) of Drawing 21).

  Here, since it is assumed that a short circuit has occurred in the seventh gate electrode 13, no short circuit exists in the first second wiring group, and a short circuit exists in the second second wiring group. That is, since there is only one short-circuited second wiring group in which a short circuit exists, the short-circuited second wiring group (second second wiring group) is selected as the next second wiring starting group. In addition, since there are no two or more short-circuit second wiring groups in which a short circuit exists, it is not necessary to record that there are two or more short-circuit second wiring groups. It is not necessary to select one short-circuit second wiring group as the next second wiring starting group.

Then, “Process 11” shown in FIG. 4 is executed. That is, while the value of T is set to “7” as it is, the value of S is changed based on the following equation.
S = S + INT ((T−S + 1) / 2) + mod ((T−S + 1), 2)
= 6 + INT ((7-6 + 1) / 2) + mod ((7-6 + 1), 2)
= 7

  Next, it is determined whether the value of S is equal to the value of T. In the first to third second short circuit inspection steps, the value of S and the value of T are equal. That is, the number of second wires belonging to the short-circuited second wire group is one.

Therefore, the second short-circuit inspection process is repeated until the second wiring (seventh second wiring) in which the short circuit has occurred is replaced with the j′-th second wiring B _{j ′} (where j ′ = Record as 1). Specifically, as shown in “Processing -14” in FIG. 5, the value of “S” is recorded and stored as S _{j ′} (or as _<< P _{i ′} , S _{j ′} >>).

Then, it is determined whether or not the value of j ′ exceeds the specified number of short-circuited points (Def ₂ ). If it exceeds, the display means provided in the short-circuit test apparatus indicates that the cathode panel should be discarded. Display and end the implementation of the short-circuit inspection method.

  If not, it is determined whether it is recorded that there are two or more short-circuited second wiring groups. In this case, there are no two or more short-circuited second wiring groups, but since the second short-circuit inspection step with i ′ = 2, 3 remains, the process further proceeds to the next step.

[2-1st Second Short-Circuit Inspection Process]
The fourth first wiring is selected as the i′th (i ′ = 2) short-circuit first wiring. Then, B ₁ (= 9) second wirings are set as a second wiring starting group. Here, the value of [S, T] is [1, 9]. Then, the second-first second short circuit inspection step is executed (see FIG. 22A). That is, the “first second short circuit inspection process” is executed.

  Here, since it is assumed that a short circuit has occurred in the sixth gate electrode 13, no short circuit exists in the first second wiring group, and a short circuit exists in the second second wiring group. That is, since there is only one short-circuited second wiring group in which a short circuit exists, the short-circuited second wiring group (second second wiring group) is selected as the next second wiring starting group. In addition, since there are not two or more short-circuited second wiring groups in which a short circuit exists, it is not necessary to record that there are two or more short-circuited second wiring groups. It is not necessary to select one short-circuit second wiring group as the next second wiring starting group.

Then, “Process 11” shown in FIG. 4 is executed. That is, while the original value of T is “9”, the value of S is changed based on the following equation.
S = S + INT ((T−S + 1) / 2) + mod ((T−S + 1), 2)
= 1 + INT ((9-1 + 1) / 2) + mod ((9-1 + 1), 2)
= 6

  Next, it is determined whether the value of S is equal to the value of T. In the 2-1st second short circuit inspection process, the value of S and the value of T are not equal, so the 2-2nd second short circuit inspection process is executed.

[Second-second second short-circuit inspection step]
Specifically, the sixth to ninth B ₂ (= 4) second wirings are set as the second wiring starting group in the second-second second short-circuit inspection step. Here, the value of [S, T] is [6, 9].

The second wiring start group is divided into b ₂ (= 2) second wiring groups. That is, the Tth second wiring is divided into two from the Sth second wiring. The first second wiring group includes sixth to seventh second wirings, and the second second wiring group includes eighth to ninth second wirings. That is, B _2-1 = 2 and B _2-2 = 2.

  Next, a short circuit between all the second wirings belonging to the first second wiring group (the sixth to seventh second wirings in a short circuit state) and the i'th shorting first wiring. A test is performed, and all the second wirings belonging to the second second wiring group (the eighth to ninth second wirings in a short-circuited state) and the i'th short-circuiting first wiring Perform a short-circuit test between. That is, the 2-2nd second short circuit inspection step is executed (see FIG. 22B).

  Here, since it is assumed that a short circuit has occurred in the sixth gate electrode 13, a short circuit exists in the first second wiring group, and no short circuit exists in the second second wiring group. That is, since there is only one short-circuited second wiring group in which a short circuit exists, the short-circuited second wiring group (first second wiring group) is selected as the next second wiring starting group. In addition, since there are not two or more short-circuited second wiring groups in which a short circuit exists, it is not necessary to record that there are two or more short-circuited second wiring groups. It is not necessary to select one short-circuit second wiring group as the next second wiring starting group.

Then, the “process-12” shown in FIG. 4 is executed. That is, the value of S is set to “6” as it is, while the value of T is changed based on the following equation.
T = T-INT ((T-S + 1) / 2)
= 9-INT ((9-6 + 1) / 2)
= 7

  Next, it is determined whether the value of S is equal to the value of T. In the second-second second short-circuit inspection process, the value of S and the value of T are not equal, so the second-third second short-circuit inspection process is executed.

[2nd-3rd second short circuit inspection step]
Specifically, the sixth to seventh B ₃ (= 2) second wirings are set as the second wiring starting group in the second-third second short-circuit inspection step. Here, the value of [S, T] is [6, 7].

Then, this second wiring starting group is divided into b ₃ (= 2) second wiring groups. That is, the Tth second wiring is divided into two from the Sth second wiring. The first second wiring group includes the sixth second wiring, and the second second wiring group includes the seventh first wiring. That is, B _3-1 = 1 and B _3-2 = 1.

  Next, a short-circuit test is performed between all of the second wirings (sixth second wiring) belonging to the first second wiring group and the i'th short-circuiting first wiring. A short circuit test is performed between all of the second wirings (seventh second wiring) belonging to the second wiring group and the i'th shorting first wiring. That is, the 2nd-3rd 2nd short circuit inspection process is performed (refer to (A) of Drawing 23).

  Here, since it is assumed that a short circuit has occurred in the sixth gate electrode 13, a short circuit exists in the first second wiring group, and no short circuit exists in the second second wiring group. That is, since there is only one short-circuited second wiring group in which a short circuit exists, the short-circuited second wiring group (first second wiring group) is selected as the next second wiring starting group. In addition, since there are no two or more short-circuit second wiring groups in which a short circuit exists, it is not necessary to record that there are two or more short-circuit second wiring groups. It is not necessary to select one short-circuit second wiring group as the next second wiring starting group.

Then, the “process-12” shown in FIG. 4 is executed. That is, the value of S is set to “6” as it is, while the value of T is changed based on the following equation.
T = T-INT ((T-S + 1) / 2)
= 7-INT ((7-6 + 1) / 2)
= 6

  Next, it is determined whether the value of S is equal to the value of T. In the second-third second short circuit inspection step, the value of S is equal to the value of T. That is, the number of second wires belonging to the short-circuited second wire group is one.

Accordingly, the second short-circuit inspection process is repeated until the second wiring (sixth second wiring) in which the short-circuit has occurred is replaced with the j′-th second wiring B _{j ′} (where j ′ = Record as 2). Specifically, as shown in “Processing -14” in FIG. 5, the value of “S” is recorded and stored as S _{j ′} (or as _<< P _{i ′} , S _{j ′} >>).

Then, it is determined whether or not the value of j ′ exceeds the specified number of short-circuited points (Def ₂ ). If it exceeds, the display means provided in the short-circuit test apparatus indicates that the cathode panel should be discarded. Display and end the implementation of the short-circuit inspection method.

  If not, it is determined whether it is recorded that there are two or more short-circuited second wiring groups. In this case, there are no two or more short-circuited second wiring groups, but since the second short-circuit inspection step with i '= 3 remains, the process further proceeds to the next step.

[The 3-1st 2nd short circuit inspection process]
The ninth first wiring is selected as the i'th (i '= 3) short-circuit first wiring. Then, B ₁ (= 9) second wirings are set as a second wiring starting group. Here, the value of [S, T] is [1, 9]. Then, the third-first second short circuit inspection step is performed (see FIG. 23B). That is, the “first second short circuit inspection process” is executed.

  Here, since it is assumed that a short circuit has occurred in the second and fifth gate electrodes 13, a short circuit exists in the first second wiring group, and a short circuit exists in the second second wiring group. not exist. That is, since there is only one short-circuited second wiring group in which a short circuit exists, the short-circuited second wiring group (first second wiring group) is selected as the next second wiring starting group. In addition, since there are no two or more short-circuit second wiring groups in which a short circuit exists, it is not necessary to record that there are two or more short-circuit second wiring groups. It is not necessary to select one short-circuit second wiring group as the next second wiring starting group.

Then, the “process-12” shown in FIG. 4 is executed. That is, the value of S is set to “1” as it is, while the value of T is changed based on the following equation.
T = T-INT ((T-S + 1) / 2)
= 9-INT ((9-1 + 1) / 2)
= 5

  Next, it is determined whether the value of S is equal to the value of T. In the 3-1st second short circuit inspection step, the value of S and the value of T are not equal, so the 3rd-2nd second short circuit inspection step is executed.

[3-2 second short circuit inspection step]
Specifically, the first to fifth B ₂ (= 5) second wirings are set as the second wiring starting group in the third-second second short-circuit inspection step. Here, the value of [S, T] is [1, 5].

The second wiring start group is divided into b ₂ (= 2) second wiring groups. That is, the Tth second wiring is divided into two from the Sth second wiring. The first second wiring group includes first to third second wirings, and the second second wiring group includes fourth to fifth second wirings. That is, B _2-1 = 3 and B _2-2 = 2.

  Next, a short circuit between all of the second wirings belonging to the first second wiring group (the first to third second wirings in the short circuit state) and the i'th shorting first wiring. A test is performed, and all of the second wirings belonging to the second second wiring group (the fourth to fifth second wirings in a short circuit state) and the i'th shorting first wiring Perform a short-circuit test between. That is, the 3rd-2nd 2nd short circuit inspection process is performed (refer to (A) of Drawing 24).

Here, since it is assumed that a short circuit has occurred in the second and fifth gate electrodes 13, there are two or more short circuit second wiring groups in which a short circuit exists. Therefore, as shown in “Processing -13” in FIG. 4, it is recorded that there are two or more short-circuited second wiring groups. Specifically, [1, 5] is recorded and stored as the value of [S, T]. Then, one shorted second wiring group among the two or more shorted second wiring groups is selected as the next second wiring starting group. Specifically, the “process-12” shown in FIG. 4 is executed. That is, the value of S is set to “1” as it is, while the value of T is changed based on the following equation.
T = T-INT ((T-S + 1) / 2)
= 5-INT ((5-1 + 1) / 2)
= 3

  Note that the value of [S, T] recorded and stored in “Process-13” is not limited to [1, 5]. For example, “Process 11” may be executed, and the value of [S, T] obtained thereby may be recorded and stored in “Process 13”. In short, the short-circuit second wiring group in which a short circuit exists It may be recorded and stored that two or more exist, and / or a short-circuit second wiring group that has not been selected among two or more short-circuit second wiring groups may be specified by some means.

  Next, it is determined whether the value of S is equal to the value of T. In the 3rd-2nd second short circuit inspection process, the value of S and the value of T are not equal, so the 3rd-3rd second short circuit inspection process is executed.

[Second and third short circuit inspection step]
Specifically, the first to third B ₃ (= 3) second wirings are set as the second wiring starting group in the second and third second short circuit inspection process. Here, the value of [S, T] is [1, 3].

Then, this second wiring starting group is divided into b ₃ (= 2) second wiring groups. That is, the Tth second wiring is divided into two from the Sth second wiring. The first second wiring group includes the first to second second wirings, and the second second wiring group includes the third first wiring. That is, B _3-1 = 2 and B _3-2 = 1.

  Next, a short circuit between all of the second wirings belonging to the first second wiring group (first to second second wirings in a short circuit state) and the i'th shorting first wiring. A test is performed, and further, a short-circuit test is performed between all the second wirings (third second wiring) belonging to the second second wiring group and the i'th short-circuiting first wiring. In other words, the second and third second short-circuit inspection process is executed (see FIG. 24B).

  Here, since it is assumed that a short circuit has occurred in the second gate electrode 13, there is a short circuit in the first second wiring group, and there is no short circuit in the second second wiring group. That is, since there is only one short-circuited second wiring group in which a short circuit exists, the short-circuited second wiring group (first second wiring group) is selected as the next second wiring starting group. In addition, since there are no two or more short-circuit second wiring groups in which a short circuit exists, it is not necessary to record that there are two or more short-circuit second wiring groups. It is not necessary to select one short-circuit second wiring group as the next second wiring starting group.

Then, the “process-12” shown in FIG. 4 is executed. That is, the value of S is set to “1” as it is, while the value of T is changed based on the following equation.
T = T-INT ((T-S + 1) / 2)
= 3-INT ((3-1 + 1) / 2)
= 2

  Next, it is determined whether the value of S is equal to the value of T. In the 3rd to 2nd second short circuit inspection process, since the value of S and the value of T are not equal, the 3rd and 4th second short circuit inspection process is executed.

[3-4th Second Short-Circuit Inspection Process]
Specifically, the first to second B ₄ (= 2) second wirings are set as the second wiring starting group in the third to fourth second short-circuit inspection process. Here, the value of [S, T] is [1, 2].

Then, this second wiring starting group is divided into b ₄ (= 2) second wiring groups. That is, the Tth second wiring is divided into two from the Sth second wiring. The first second wiring group includes a first second wiring, and the second second wiring group includes a second first wiring. That is, B _4-1 = 1 and B _4-2 = 1.

  Next, a short-circuit test is performed between all the second wirings (first second wiring) belonging to the first second wiring group and the i'th short-circuiting first wiring. A short-circuit test is performed between all the second wirings (second second wiring) belonging to the second wiring group and the i'th short-circuiting first wiring. That is, the 3rd-4th 2nd short circuit inspection process is performed (refer to (A) of Drawing 25).

  Here, since it is assumed that a short circuit has occurred in the second gate electrode 13, no short circuit exists in the first second wiring group, and a short circuit exists in the second second wiring group. That is, since there is only one short-circuited second wiring group in which a short circuit exists, the short-circuited second wiring group (second second wiring group) is selected as the next second wiring starting group. In addition, since there are no two or more short-circuit second wiring groups in which a short circuit exists, it is not necessary to record that there are two or more short-circuit second wiring groups. It is not necessary to select one short-circuit second wiring group as the next second wiring starting group.

Then, “Process 11” shown in FIG. 4 is executed. That is, while the original value of T is “2”, the value of S is changed based on the following equation.
S = S + INT ((T−S + 1) / 2) + mod ((T−S + 1), 2)
= 1 + INT ((2-1 + 1) / 2) + mod ((2-1 + 1), 2)
= 2

  Next, it is determined whether the value of S is equal to the value of T. In the 3rd to 4th second short-circuit inspection step, the value of S is equal to the value of T. That is, the number of second wires belonging to the short-circuited second wire group is one.

Accordingly, the second short-circuit inspection process is repeated until the second wiring (second second wiring) in which the short-circuit has occurred is replaced with the j′-th second wiring B _{j ′} (where j ′ = Record as 3). Specifically, as shown in “Processing -14” in FIG. 5, the value of “S” is recorded and stored as S _{j ′} (or as _<< P _{i ′} , S _{j ′} >>).

Then, it is determined whether or not the value of j ′ exceeds the specified number of short-circuited points (Def ₂ ). If it exceeds, the display means provided in the short-circuit test apparatus indicates that the cathode panel should be discarded. Display and end the implementation of the short-circuit inspection method.

  If not, it is determined whether it is recorded that there are two or more short-circuited second wiring groups. In this case, since there are two or more short-circuited second wiring groups, the process further proceeds to the next step.

  That is, “Processing-15” is executed. Specifically, the latest [S, T] value is selected from the [S, T] values recorded and stored in "Process-13". In the third embodiment, the value of [S, T] recorded and stored in “Processing -13” is only one of [1, 5], so (S, TQ) = [1, 5]. Select. Then, one short second wiring group other than the one short second wiring group selected is selected as the next second wiring starting group. That is, “Process 11” is executed.

  Specifically, in “Process-13”, the first to third second wirings are selected as the next second wiring starting group, that is, [S, T] = [1, 3] is selected, here, the short-circuited second wiring group constituted by the fourth to fifth second wirings is selected as the next second wiring starting group. That is, [S, T] = [4, 5] is selected as the next second wiring starting group. Furthermore, [S, T] selected in “Process-15” is deleted from [S, T] recorded and stored in “Process-13”. In the third embodiment, since only one set of [S, T] is recorded and stored in “Process-13”, when [S, T] selected in “Process-15” is deleted, “Process- [S, T] recorded and stored at 13 ”no longer exists.

Then, based on the second wiring starting group, the second short-circuit inspection step is repeated until the number of second wirings belonging to the short-circuiting second wiring group becomes one, and the second wiring in which the short-circuit has occurred is replaced with the j'th The step of recording as the second short-circuit second wiring B _{j ′} (where j ′ = 2, 3,..., J ′) (secondary second short-circuit inspection step) is recorded. Repeat sequentially until there are no more groups.

  Specifically, the following steps are executed.

[4-1th Second Short-Circuit Inspection Process]
The ninth first wiring is selected as the i'th (i '= 3) short-circuit first wiring. Then, the _Bi (= 2) second wirings are set as the second wiring starting group. Here, the value of [S, T] is [4, 5].

The second wiring starting group is divided into b ₁ (= 2) second wiring groups. That is, the Tth second wiring is divided into two from the Sth second wiring. The first second wiring group includes a fourth second wiring, and the second second wiring group includes a fifth second wiring. That is, B _1-1 = 1 and B _1-2 = 1.

  Next, all the second wirings (fourth second wiring) belonging to the first second wiring group and the i'th short-circuiting first wiring (specifically, i '= 3, Short-circuit test is performed between the second wiring group and all the second wirings (fifth second wiring) belonging to the second second wiring group and the i'th short-circuiting Perform a short-circuit test with one wiring. That is, the 4th-1st 2nd short circuit inspection process is performed (refer to (B) of Drawing 25).

  Here, since it is assumed that a short circuit has occurred in the fifth gate electrode 13, there is no short circuit in the first second wiring group, and there is a short circuit in the second second wiring group. That is, since there is only one short-circuited second wiring group in which a short circuit exists, the short-circuited second wiring group (second second wiring group) is selected as the next second wiring starting group. In addition, since there are no two or more short-circuit second wiring groups in which a short circuit exists, it is not necessary to record that there are two or more short-circuit second wiring groups. It is not necessary to select one short-circuit second wiring group as the next second wiring starting group.

Then, “Process 11” shown in FIG. 4 is executed. That is, while the original value of T is set to “5”, the value of S is changed based on the following equation.
S = S + INT ((T−S + 1) / 2) + mod ((T−S + 1), 2)
= 4 + INT ((5-4 + 1) / 2) + mod ((5-4 + 1), 2)
= 5

  Next, it is determined whether the value of S is equal to the value of T. In the fourth-first second short-circuit inspection step, the value of S is equal to the value of T. That is, the number of second wires belonging to the short-circuited second wire group is one.

Therefore, the second short circuit inspection process is repeated until the second wiring (fifth second wiring) in which the short circuit has occurred is replaced with the j′th second wiring B _{j ′} (where j ′ = Record as 4). Specifically, as shown in “Processing -14” in FIG. 5, the value of “S” is recorded and stored as S _{j ′} (or as _<< P _{i ′} , S _{j ′} >>).

Then, it is determined whether or not the value of j ′ exceeds the specified number of short-circuited points (Def ₂ ). If it exceeds, the display means provided in the short-circuit test apparatus indicates that the cathode panel should be discarded. Display and end the implementation of the short-circuit inspection method.

If not, it is determined whether it is recorded that there are two or more short-circuited second wiring groups. At this time, since there are no two or more short-circuited second wiring groups and the second short-circuit inspection process with i ′ = 1, 2, 3 is completed, the first wiring and the second wiring (A _{i ′} , B _{j ′} ) = << 3, 7 >> (that is, the third first wiring and the seventh second wiring) between the first wiring and the second wiring in the overlapping region (A _{i ′} , B _{j ′} ) = << 4, 6 >> (ie, a short circuit occurs in the overlapping region of the fourth first wiring and the sixth second wiring) , (A _{i ′} , B _{j ′} ) = << 9, 2 >> (that is, a short circuit occurs in the overlapping region of the ninth first wiring and the second second wiring), and (A _{i ′} , B _{j ′} ) = << 9,5 >> (that is, a short circuit occurs in the overlapping region of the ninth first wiring and the fifth second wiring), for example, on the display means provided in the short-circuit test apparatus Display and short circuit Complete the 査方 method.

  Table 9 below summarizes the values of [S, T] from the above-mentioned first-first second short-circuit inspection step to the first-third second short-circuit inspection step. Table 10 below summarizes the values of [S, T] from the above-described second-first second short-circuit inspection step to the second-third second short-circuit inspection step. Further, the values of [S, T] from the 3-1st second short circuit inspection process to the 3-4th second short circuit inspection process are summarized in Table 11 below. The values of [S, T] and the like in the 4-1 second short-circuit inspection process are summarized in Table 12 below.

[Method of manufacturing Spindt-type field emission device and method of manufacturing display device]
34A and 35B, which are schematic partial end views of the support 10 and the like constituting the cathode panel, show the Spindt field emission device manufacturing method and the display device manufacturing method. This will be described with reference to (A) and (B).

  This Spindt-type field emission device can be basically obtained by a method of forming the conical electron emission portion 15 by vertical vapor deposition of a metal material. That is, the vapor deposition particles are perpendicularly incident on the first opening 14A provided in the gate electrode 13, but use the shielding effect by the overhanging deposit formed near the opening end of the first opening 14A. Thus, the amount of vapor deposition particles reaching the bottom of the second opening 14B is gradually reduced, and the electron emission portion 15 that is a conical deposit is formed in a self-aligning manner. Here, a method for forming the separation layer 16 in advance on the gate electrode 13 and the insulating layer 12 in order to facilitate removal of unnecessary overhanging deposits will be described. In the drawing for explaining the method of manufacturing the field emission device, only one electron emission portion is shown.

[Step-A0]
First, a cathode electrode conductive material layer made of, for example, polysilicon is formed on the support 10 made of, for example, a glass substrate by a plasma CVD method, and then the cathode electrode conductive material layer is formed based on a lithography technique and a dry etching technique. Are patterned to form a striped cathode electrode 11. Thereafter, an insulating layer 12 made of SiO _{2 is} formed on the entire surface by a CVD method.

[Step-A1]
Next, a gate electrode conductive material layer (for example, an Al layer) is formed on the insulating layer 12 by a sputtering method, and then the gate electrode conductive material layer is patterned by a lithography technique and a dry etching technique. Thus, a stripe-shaped gate electrode 13 can be obtained. When the gate electrode 13 is formed, a single groove (notch) 13A (not shown in FIGS. 34 to 35) extending in parallel with the second direction is combined with the gate electrode 13 in the overlapping region. It is preferable to form it. The striped cathode electrode 11 extends in the horizontal direction of the drawing, and the striped gate electrode 13 extends in the vertical direction of the drawing.

  The gate electrode 13 is formed by a well-known thin film formation method such as a PVD method such as a vacuum deposition method, a CVD method, a plating method such as an electroplating method or an electroless plating method, a screen printing method, a laser ablation method, a sol-gel method, a lift-off method. If necessary, it may be formed by a combination with an etching technique. According to the screen printing method or the plating method, for example, a striped gate electrode can be directly formed.

[Step-A2]
Thereafter, a resist layer is formed again, the first opening 14A is formed in the gate electrode 13 by etching, the second opening 14B is formed in the insulating layer, and the cathode electrode 11 is formed at the bottom of the second opening 14B. After the exposure, the resist layer is removed. In this way, the structure shown in FIG. 34A can be obtained.

[Step-A3]
Next, the peeling layer 16 is formed by obliquely vacuum-depositing nickel (Ni) on the insulating layer 12 including the gate electrode 13 while rotating the support 10 (see FIG. 34B). At this time, by selecting a sufficiently large incident angle of the vapor deposition particles with respect to the normal of the support 10 (for example, an incident angle of 65 to 85 degrees), nickel is hardly deposited on the bottom of the second opening 14B. A release layer 16 can be formed on the gate electrode 13 and the insulating layer 12. The release layer 16 protrudes in a bowl shape from the opening end of the first opening 14A, whereby the diameter of the first opening 14A is substantially reduced.

[Step-A4]
Next, for example, molybdenum (Mo) is vertically deposited as an electrically conductive material on the entire surface (incident angle: 3 to 10 degrees). At this time, as shown in FIG. 35A, as the conductive material layer 17 having an overhang shape grows on the release layer 16, the substantial diameter of the first opening 14A is gradually reduced. The vapor deposition particles that contribute to the deposition at the bottom of the second opening 14B are gradually limited to those that pass near the center of the first opening 14A. As a result, a conical deposit is formed at the bottom of the second opening 14 </ b> B, and this conical deposit becomes the electron emission portion 15.

[Step-A5]
Thereafter, as shown in FIG. 35B, the peeling layer 16 is peeled off from the surfaces of the gate electrode 13 and the insulating layer 12 by a lift-off method, and the conductive material layer 17 above the gate electrode 13 and the insulating layer 12 is selected. To remove. Next, it is preferable to recede the side wall surface of the second opening 14B provided in the insulating layer 12 by isotropic etching from the viewpoint of exposing the opening end of the gate electrode 13. The isotropic etching can be performed by dry etching using radicals as a main etching species, such as chemical dry etching, or wet etching using an etchant. As the etchant, for example, a 1: 100 (volume ratio) mixed solution of 49% hydrofluoric acid aqueous solution and pure water can be used. Thus, a cathode panel in which a plurality of Spindt type field emission devices are formed can be obtained.

  As described above, when the short-circuit inspection method of the present invention is applied to the short-circuit inspection in the cathode panel, the short-circuit inspection method may be performed after [Step-A1] or short-circuited after [Step-A2]. An inspection method may be implemented, and a short circuit inspection method may be implemented after [Step-A5].

[Step-A6]
On the other hand, an anode panel AP in which the phosphor region 22, the anode electrode 24, etc. are formed is prepared. Then, the display device is assembled. Specifically, for example, the spacer 25 is attached to the spacer holding portion 26 provided in the effective region of the anode panel AP, and the anode panel AP and the cathode panel CP are arranged so that the phosphor region 22 and the electron emission region EA face each other. And the anode panel AP and the cathode panel CP (more specifically, the substrate 20 and the support 10) are joined to each other at the peripheral portion via a frame body 27 made of ceramics or glass. At the time of joining, frit glass is applied to the joining part between the frame body 27 and the anode panel AP and the joining part between the frame body 27 and the cathode panel CP, and the anode panel AP, the cathode panel CP, and the frame body 27 are pasted. In addition, the frit glass is dried by preliminary baking, and then main baking is performed at about 450 ° C. for 10 to 30 minutes. Thereafter, the space surrounded by the anode panel AP, the cathode panel CP, the frame 27, and the frit glass (not shown) is exhausted through a through hole (not shown) and a tip tube (not shown), and the pressure of the space When the ^pressure reaches about 10 ⁻⁴ Pa, the tip tube is sealed by heating and melting. In this way, the space surrounded by the anode panel AP, the cathode panel CP, and the frame 27 can be evacuated. Alternatively, for example, the frame 27, the anode panel AP, and the cathode panel CP may be bonded together in a high vacuum atmosphere. Alternatively, depending on the structure of the display device, the anode panel AP and the cathode panel CP may be bonded together by using only an adhesive layer without a frame. Thereafter, wiring connection with necessary external circuits is performed, and the display device is completed.

  As mentioned above, although this invention was demonstrated based on the preferable Example, this invention is not limited to these Examples. The wiring structure, cathode panel, anode panel, cold cathode field emission display device, and cold cathode field emission device described in the embodiments are merely examples and can be changed as appropriate. A method for manufacturing a panel, a cold cathode field emission display or a cold cathode field emission device is also an example, and can be appropriately changed. Furthermore, the various materials used in the manufacture of the anode panel and the cathode panel are also examples, and can be changed as appropriate. The display device has been described by taking color display exclusively as an example, but it may also be a single color display.

  In the field emission device, the configuration in which one electron emission portion corresponds to only one opening has been described. However, depending on the structure of the field emission device, the configuration in which a plurality of electron emission portions correspond to one opening. Alternatively, one electron emission portion may correspond to a plurality of openings. Alternatively, a plurality of first openings are provided in the gate electrode, a plurality of second openings connected to the plurality of first openings in the insulating layer are provided, and one or a plurality of electron emission portions are provided. You can also.

  In the field emission device, an interlayer insulating layer 42 may be further provided on the gate electrode 13 and the insulating layer 12, and a focusing electrode 43 may be provided on the interlayer insulating layer 42. FIG. 36 shows a schematic partial end view of a field emission device having such a structure. The interlayer insulating layer 42 is provided with a third opening 44 that communicates with the first opening 14A. The convergence electrode 43 is formed, for example, by forming the stripe-shaped gate electrode 13 on the insulating layer 12 in [Step-A2], then forming the interlayer insulating layer 42, and then patterning on the interlayer insulating layer 42. After forming the focusing electrode 43, the third opening 44 may be provided in the focusing electrode 43 and the interlayer insulating layer 42, and the first opening 14A may be provided in the gate electrode 13. Depending on the patterning of the focusing electrode, it may be a focusing electrode of a type in which one or a plurality of electron emission portions or a focusing electrode unit corresponding to one or a plurality of pixels is assembled, or an effective area. Can be a converging electrode of the type covered with a sheet of conductive material. In FIG. 36, the Spindt-type field emission device is illustrated, but it goes without saying that other field emission devices can be used.

In the cold cathode field emission display according to the present invention, the field emission device may be any type of field emission device. For example, as described in the embodiment,
(1) In addition to the Spindt-type field emission device in which the conical electron emission portion is provided on the cathode electrode positioned at the bottom of the opening, the field emission device is
(2) A flat field emission device in which a substantially planar electron emission portion is provided on the cathode electrode located at the bottom of the opening. (3) On the cathode electrode where the crown-shaped electron emission portion is located at the bottom of the opening. A crown-type field emission device that emits electrons from the crown-shaped portion of the electron-emitting portion, and a flat-type field emission device that emits electrons from the surface of the flat cathode electrode. Crater-type field emission device that emits electrons from a large number of convex portions on the surface of the electrode (6) An edge-type field emission device that emits electrons from the edge portion of the cathode electrode can also be used.

  In the Spindt-type field emission device, as a material constituting the electron emission portion, in addition to molybdenum described in the embodiment, tungsten, tungsten alloy, molybdenum alloy, titanium, titanium alloy, niobium, niobium alloy, tantalum, Mention may be made of at least one material selected from the group consisting of tantalum alloys, chromium, chromium alloys, and silicon containing impurities (polysilicon or amorphous silicon). The electron emission portion of the Spindt-type field emission device can be formed by, for example, a sputtering method or a CVD method in addition to the vacuum evaporation method.

In the flat field emission device, it is preferable that the material constituting the electron emission portion is composed of a material having a work function Φ smaller than that of the material constituting the cathode electrode. What is necessary is just to determine based on the work function of the material which comprises a cathode electrode, the potential difference between a gate electrode and a cathode electrode, the magnitude | size of the emission electron current density requested | required, etc. As typical materials constituting the cathode electrode in the field emission device, tungsten (Φ = 4.55 eV), niobium (Φ = 4.02 to 4.87 eV), molybdenum (Φ = 4.53 to 4.95 eV), Examples include aluminum (Φ = 4.28 eV), copper (Φ = 4.6 eV), tantalum (Φ = 4.3 eV), chromium (Φ = 4.5 eV), and silicon (Φ = 4.9 eV). . The electron emission portion preferably has a work function Φ smaller than these materials, and the value is preferably approximately 3 eV or less. Such materials include carbon (Φ <1 eV), cesium (Φ = 2.14 eV), LaB ₆ (Φ = 2.66 to 2.76 eV), BaO (Φ = 1.6 to 2.7 eV), SrO (Φ = 1.25 to 1.6 eV), Y ₂ O ₃ (Φ = 2.0 eV), CaO (Φ = 1.6 to 1.86 eV), BaS (Φ = 2.05 eV), TiN (Φ = 2. 92 eV) and ZrN (Φ = 2.92 eV). More preferably, the electron emission portion is made of a material having a work function Φ of 2 eV or less. In addition, the material which comprises an electron emission part does not necessarily need to be provided with electroconductivity.

Alternatively, in the flat type field emission device, as a material constituting the electron emission portion, a material in which the secondary electron gain δ of the material is larger than the secondary electron gain δ of the conductive material constituting the cathode electrode is used. You may select suitably. That is, silver (Ag), aluminum (Al), gold (Au), cobalt (Co), copper (Cu), molybdenum (Mo), niobium (Nb), nickel (Ni), platinum (Pt), tantalum (Ta) ), Tungsten (W), zirconium (Zr) and other metals; silicon (Si), germanium (Ge) and other semiconductors; carbon and diamond, etc .; and aluminum oxide (Al ₂ O ₃ ), barium oxide (BaO) ), Beryllium oxide (BeO), calcium oxide (CaO), magnesium oxide (MgO), tin oxide (SnO ₂ ), barium fluoride (BaF ₂ ), calcium fluoride (CaF ₂ ), etc. You can choose. In addition, the material which comprises an electron emission part does not necessarily need to be provided with electroconductivity.

In the flat type field emission device, carbon, more specifically, amorphous diamond or graphite, carbon nanotube structure, ZnO whisker, MgO whisker, SnO ₂ whisker, MnO whisker is particularly preferable as a constituent material of the electron emission part. Y ₂ O ₃ whisker, NiO whisker, ITO whisker, In ₂ O ₃ whisker, and Al ₂ O ₃ whisker. When the electron emission portion is composed of these, the emission electron current density required for the cold cathode field emission display device can be obtained with an electric field intensity of 5 × 10 ⁷ V / m or less. In addition, since amorphous diamond is an electrical resistor, it is possible to make the emission electron current obtained from each electron emission portion uniform, and thus suppress variation in luminance when incorporated in a cold cathode field emission display. It becomes possible. Furthermore, since these materials have extremely high resistance to the sputtering effect by ions of residual gas in the cold cathode field emission display, the lifetime of the field emission device can be extended.

  Specific examples of the carbon nanotube structure include carbon nanotubes and / or graphite nanofibers. More specifically, the electron emission part may be composed of carbon nanotubes, the electron emission part may be composed of graphite nanofibers, or the electron emission is performed from a mixture of carbon nanotubes and graphite nanofibers. You may comprise a part. Macroscopically, carbon nanotubes and graphite nanofibers may be in the form of powder or thin film. In some cases, the carbon nanotube structure has a conical shape. It may be. Carbon nanotubes and graphite nanofibers are produced by various CVD methods such as the well-known arc discharge method and laser ablation method, such as PVD method, plasma CVD method, laser CVD method, thermal CVD method, vapor phase synthesis method, and vapor phase growth method. Can be manufactured and formed.

  A flat field emission device in which a carbon / nanotube structure and the above-mentioned various whiskers (hereinafter collectively referred to as a carbon / nanotube structure) are dispersed in a binder material is a desired region of the cathode electrode. For example, a method of firing or curing a binder material after coating (specifically, an organic binder material such as an epoxy resin or an acrylic resin, or an inorganic binder material such as water glass, a carbon nanotube structure Etc. can also be produced by, for example, applying to a desired region of the cathode electrode and then removing the solvent and baking / curing the binder material. Such a method is referred to as a first method for forming a carbon nanotube structure or the like. An example of the application method is a screen printing method.

Alternatively, the flat field emission device can be manufactured by a method in which a metal compound solution in which a carbon / nanotube structure or the like is dispersed is applied on the cathode electrode, and then the metal compound is baked. A carbon / nanotube structure or the like is fixed to the surface of the cathode electrode by a matrix containing metal atoms constituting the metal. Such a method is referred to as a second method for forming a carbon nanotube structure or the like. The matrix is preferably made of a conductive metal oxide, and more specifically, made of tin oxide, indium oxide, indium oxide-tin, zinc oxide, antimony oxide, or antimony oxide-tin. preferable. After firing, a state in which a part of each carbon / nanotube structure or the like is embedded in the matrix can be obtained, or a state in which each carbon / nanotube structure or the like is entirely embedded in the matrix can be obtained. The volume resistivity of the matrix is preferably 1 × 10 ⁻⁹ Ω · m to 5 × 10 ⁻⁶ Ω · m.

  As a metal compound which comprises a metal compound solution, an organic metal compound, an organic acid metal compound, or a metal salt (for example, chloride, nitrate, acetate) can be mentioned, for example. Specifically, as a metal compound solution composed of an organic acid metal compound, an organic tin compound, an organic indium compound, an organic zinc compound, or an organic antimony compound is dissolved in an acid (for example, hydrochloric acid, nitric acid, or sulfuric acid). Can be mentioned which are diluted with an organic solvent (for example, toluene, butyl acetate, isopropyl alcohol). In addition, as a metal compound solution composed of an organometallic compound, specifically, an organic tin compound, an organic indium compound, an organic zinc compound, and an organic antimony compound are dissolved in an organic solvent (for example, toluene, butyl acetate, isopropyl alcohol). Can be illustrated. When the metal compound solution is 100 parts by weight, it is preferable to have a composition containing 0.001 to 20 parts by weight of the carbon / nanotube structure and 0.1 to 10 parts by weight of the metal compound. The metal compound solution may contain a dispersant or a surfactant. Further, from the viewpoint of increasing the thickness of the matrix, an additive such as carbon black may be added to the metal compound solution. Moreover, depending on the case, water can also be used as a solvent instead of an organic solvent.

  Examples of a method for applying a metal compound solution in which a carbon nanotube structure or the like is dispersed on the cathode electrode include a spray method, a spin coating method, a dipping method, a diquarter method, and a screen printing method. It is preferable to adopt the method from the viewpoint of easy application.

  After applying a metal compound solution in which carbon / nanotube structures are dispersed on the cathode electrode, the metal compound solution is dried to form a metal compound layer, and then unnecessary portions of the metal compound layer on the cathode electrode are removed. Thereafter, the metal compound may be fired, or after firing the metal compound, unnecessary portions on the cathode electrode may be removed, or the metal compound solution may be applied only on a desired region of the cathode electrode. Also good.

  The firing temperature of the metal compound is, for example, a temperature at which the metal salt is oxidized to form a conductive metal oxide, or an organic metal compound or an organic acid metal compound is decomposed to form an organic metal compound or an organic acid. Any temperature that can form a matrix (for example, a conductive metal oxide) containing metal atoms constituting the metal compound may be used. For example, the temperature is preferably 300 ° C. or higher. The upper limit of the firing temperature may be a temperature at which thermal damage or the like does not occur in the constituent elements of the field emission device or the cathode panel.

  In the first formation method or the second formation method of the carbon nanotube structure or the like, after the formation of the electron emission portion, a kind of activation treatment (cleaning treatment) of the surface of the electron emission portion is performed. This is preferable from the viewpoint of further improving the efficiency of electron emission from the electron emission portion. Examples of such treatment include plasma treatment in a gas atmosphere such as hydrogen gas, ammonia gas, helium gas, argon gas, neon gas, methane gas, ethylene gas, acetylene gas, and nitrogen gas.

  In the first formation method or the second formation method of the carbon nanotube structure or the like, the electron emission portion may be formed on the surface of the cathode electrode portion located at the bottom of the opening portion. It may be formed so as to extend from the portion of the cathode electrode located at the bottom of the portion to the surface of the portion of the cathode electrode other than the bottom of the opening. Further, the electron emission portion may be formed on the entire surface of the portion of the cathode electrode located at the bottom of the opening or may be formed partially.

A high resistance film may be provided between the cathode electrode and the electron emission portion. By providing the high resistance film, it is possible to stabilize the operation of the field emission device and make the electron emission characteristics uniform. As the material constituting the high resistance film, a carbon-based material such as silicon carbide (SiC) and SiCN; SiN-based materials; semiconductor materials such as amorphous silicon; ruthenium oxide (RuO _2), tantalum oxide, a refractory metal oxide of tantalum nitride Things can be exemplified. Examples of the method for forming the high resistance film include a sputtering method, a CVD method, and a screen printing method. The electric resistance value per one electron emitting portion is approximately 1 × 10 ⁶ to 1 × 10 ¹¹ Ω, preferably several tens of gigaΩ.

The anode electrode provided in the anode panel constituting the cold cathode field emission display device may be composed of one anode electrode as a whole or a plurality of anode electrode units. In the latter case, the anode electrode unit and the anode electrode unit need to be electrically connected by a resistor layer. As the material constituting the resistor layer, carbon-based materials such as silicon carbide (SiC) and SiCN; SiN-based materials; refractory metal oxides such as ruthenium oxide (RuO ₂ ), tantalum oxide, tantalum nitride, chromium oxide, and titanium oxide A semiconductor material such as amorphous silicon. Examples of the sheet resistance value of the resistor layer include 1 × 10 ⁻¹ Ω / □ to 1 × 10 ¹⁰ Ω / □, preferably 1 × 10 ³ Ω / □ to 1 × 10 ⁸ Ω / □. The number (N) of anode electrode units may be two or more. For example, when the total number of phosphor regions arranged in a straight line is n, N = n or n = α · N (Α is an integer of 2 or more, preferably 10 ≦ α ≦ 100, more preferably 20 ≦ α ≦ 50), or 1 for the number of spacers (described later) arranged at a constant interval. It can be an added number, or it can be a number that matches the number of pixels or subpixels, or an integer fraction of the number of pixels or subpixels. The size of each anode electrode unit may be the same regardless of the position of the anode electrode unit, or may vary depending on the position of the anode electrode unit.

  When the cold cathode field emission display is in color display, one row of the phosphor regions arranged in a straight line is a row occupied by the red light emitting phosphor region and a row occupied by the green light emitting phosphor region. And a row occupied by the blue light-emitting phosphor region, or a row in which the red light-emitting phosphor region, the green light-emitting phosphor region, and the blue light-emitting phosphor region are sequentially arranged. It may be. Here, the phosphor region is defined as a phosphor region that generates one bright spot on the anode panel. One pixel (one pixel) is composed of a set of one red light emitting phosphor region, one green light emitting phosphor region, and one blue light emitting phosphor region, and one subpixel is one phosphor. The region is composed of one red light emitting phosphor region, one green light emitting phosphor region, or one blue light emitting phosphor region. Furthermore, the size corresponding to one subpixel in the anode electrode unit means the size of the anode electrode unit surrounding one phosphor region.

The anode electrode (including the anode electrode unit) may be formed using a conductive material layer. As a method for forming the conductive material layer, for example, various PVD methods such as an evaporation method such as an electron beam evaporation method and a hot filament evaporation method, a sputtering method, an ion plating method, and a laser ablation method; various CVD methods; a screen printing method; Method; sol-gel method and the like. That is, it is possible to form an anode electrode by forming a conductive material layer made of a conductive material and patterning the conductive material layer based on a lithography technique and an etching technique. Alternatively, the anode electrode can be obtained by forming a conductive material based on a PVD method or a screen printing method through a mask or screen having an anode electrode pattern. The resistor layer can also be formed by a similar method. That is, a resistor layer may be formed from a resistor material, and the resistor layer may be patterned based on a lithography technique and an etching technique, or the resistor material may be provided via a mask or screen having a resistor layer pattern. The resistor layer can be obtained by formation based on the PVD method or the screen printing method. 3 × 10 ⁻⁸ m (30 nm) to 1 as the average thickness of the anode electrode on the substrate (or above the substrate) (when the partition is provided as described later, the average thickness of the anode electrode on the top surface of the partition) And 5 × 10 ⁻⁷ m (150 nm), preferably 5 × 10 ⁻⁸ m (50 nm) to 1 × 10 ⁻⁷ m (100 nm).

The constituent material of the anode electrode may be appropriately selected according to the configuration of the cold cathode field emission display. That is, when the cold cathode field emission display is a transmission type (the anode panel corresponds to the display surface), and the anode electrode and the phosphor region are laminated in this order on the substrate, the substrate is Originally, the anode electrode itself needs to be transparent, and a transparent conductive material such as ITO (indium tin oxide) is used. On the other hand, when the cold cathode field emission display device is of a reflective type (the cathode panel corresponds to the display surface), and even if it is a transmissive type, the phosphor region and the anode electrode are laminated in this order on the substrate. In the case of molybdenum (Mo), aluminum (Al), chromium (Cr), tungsten (W), niobium (Nb), tantalum (Ta), gold (Au), silver (Ag), titanium (Ti), Metals such as cobalt (Co), zirconium (Zr), iron (Fe), platinum (Pt), zinc (Zn); alloys or compounds containing these metal elements (for example, nitrides such as TiN, WSi ₂ , MoSi _2, TiSi _2, silicides such as TaSi _2); thin carbon film such as diamond; silicon (semiconductor Si) such as ITO (indium - tin), indium oxide, conductive zinc oxide, etc. It can be exemplified genus oxide. When the resistor layer is formed, the anode electrode is preferably made of a conductive material that does not change the electric resistance value of the resistor layer. For example, when the resistor layer is made of silicon carbide (SiC), the anode electrode Is preferably made of molybdenum (Mo).

  As an example of the configuration of the anode electrode and the phosphor region, (1) a configuration in which the anode electrode is formed on the substrate and the phosphor region is formed on the anode electrode, and (2) a phosphor region is formed on the substrate. The structure which forms an anode electrode on a fluorescent substance area can be mentioned. In the configuration (1), a so-called metal back film that is electrically connected to the anode electrode may be formed on the phosphor region. In the configuration (2), a metal back film may be formed on the anode electrode.

  In the anode panel, electrons that have recoiled from the phosphor region or secondary electrons emitted from the phosphor region enter the other phosphor region, and so-called optical crosstalk (color turbidity) occurs. A configuration in which a plurality of partition walls for prevention is provided may be employed.

  Examples of the planar shape of the partition walls include a lattice shape (cross-beam shape), that is, a shape corresponding to one subpixel, for example, a shape surrounding the four sides of a phosphor region having a substantially rectangular shape (dot shape). Examples thereof include a strip shape or a stripe shape extending in parallel with two opposite sides of the rectangular or stripe phosphor region. In the case where the partition walls have a lattice shape, a shape that continuously surrounds four sides of one phosphor region may be used, or a shape that discontinuously surrounds them. When the partition wall has a strip shape or a stripe shape, it may have a continuous shape or a discontinuous shape. After the partition wall is formed, the partition wall may be polished to flatten the top surface of the partition wall.

  Examples of the partition wall forming method include a screen printing method, a dry film method, a photosensitive method, and a sandblast forming method. Here, in the screen printing method, an opening is formed in a portion of the screen corresponding to a portion where a partition is to be formed, and the partition forming material on the screen is passed through the opening using a squeegee, and the partition is formed on the substrate. In this method, after the formation material layer is formed, the partition wall formation material layer is fired. The dry film method is a method of laminating a photosensitive film on a substrate, removing the photosensitive film at the part where the partition wall is to be formed by exposure and development, embedding a material for forming the partition wall in the opening formed by the removal, and baking. is there. The photosensitive film is burned and removed by baking, and the partition wall-forming material embedded in the openings remains to form partition walls. The photosensitive method is a method in which a barrier rib-forming material layer having photosensitivity is formed on a substrate, the barrier rib-forming material layer is patterned by exposure and development, and then fired. The sand blast forming method is, for example, for forming partition walls on which a partition wall forming material layer is formed on a substrate by using screen printing, a roll coater, a doctor blade, a nozzle discharge type coater or the like and dried. In this method, the material layer portion is covered with a mask layer, and then the exposed partition wall forming material layer portion is removed by sandblasting.

  The phosphor region may be composed of monochromatic phosphor particles or may be composed of three primary color phosphor particles. In addition, the phosphor region may be arranged in a dot shape or a stripe shape. In the dot-like or stripe-like arrangement pattern, a gap between adjacent phosphor regions may be embedded with a light absorption layer (black matrix) for the purpose of improving contrast.

  For the phosphor region, a luminescent crystal particle composition prepared from luminescent crystal particles (for example, phosphor particles having a particle size of about 5 to 10 nm) is used. For example, a red photosensitive luminescent crystal particle composition is used. (Red phosphor slurry) is applied to the entire surface, exposed and developed to form a red light emitting phosphor region, and then a green photosensitive luminescent crystal particle composition (green phosphor slurry) is applied to the entire surface. Then, it is exposed to light and developed to form a green light emitting phosphor region. Further, a blue photosensitive luminescent crystal particle composition (blue phosphor slurry) is coated on the entire surface, exposed to light and developed to emit blue light. It can be formed by a method of forming a phosphor region. Although the average thickness of the phosphor region on the substrate is not limited, it is desirably 3 μm to 20 μm, preferably 5 μm to 10 μm.

The phosphor material constituting the luminescent crystal particles can be appropriately selected from conventionally known phosphor materials. In the case of color display, a phosphor material whose color purity is close to the three primary colors specified by NTSC, white balance is achieved when the three primary colors are mixed, the afterglow time is short, and the afterglow time of the three primary colors is almost equal. It is preferable to combine them. As phosphor materials constituting the red light emitting phosphor region, (Y ₂ O ₃ : Eu), (Y ₂ O ₂ S: Eu), (Y ₃ Al ₅ O ₁₂ : Eu), (Y ₂ SiO ₅ : Eu) ) And (Zn ₃ (PO ₄ ) ₂ : Mn) can be exemplified, among which (Y ₂ O ₃ : Eu) and (Y ₂ O ₂ S: Eu) are preferably used. Further, as phosphor materials constituting the green light emitting phosphor region, (ZnSiO ₂ : Mn), (Sr ₄ Si ₃ O ₈ Cl ₄ : Eu), (ZnS: Cu, Al), (ZnS: Cu, Au, Al), [(Zn, Cd) S: Cu, Al], (Y ₃ Al ₅ O ₁₂ : Tb), (Y ₂ SiO ₅ : Tb), [Y ₃ (Al, Ga) ₅ O ₁₂ : Tb] , (ZnBaO ₄ : Mn), (GbBO ₃ : Tb), (Sr ₆ SiO ₃ Cl ₃ : Eu), (BaMgAl ₁₄ O ₂₃ : Mn), (ScBO ₃ : Tb), (Zn ₂ SiO ₄ : Mn) , (ZnO: Zn), (Gd ₂ O ₂ S: Tb), and (ZnGa ₂ O ₄ : Mn), (ZnS: Cu, Al), (ZnS: Cu, Au, Al), [(Zn, Cd ) S: Cu, Al], (Y 3 Al 5 O 12: Tb), [Y 3 ( _{l, Ga) 5 O 12:} Tb], (Y 2 SiO 5: it is preferable to use a Tb). Further, as phosphor materials constituting the blue light emitting phosphor region, (Y ₂ SiO ₅ : Ce), (CaWO ₄ : Pb), CaWO ₄ , YP _0.85 V _0.15 O ₄ , (BaMgAl ₁₄ O ₂₃ : Eu) , (Sr ₂ P ₂ O ₇ : Eu), (Sr ₂ P ₂ O ₇ : Sn), (ZnS: Ag, Al), (ZnS: Ag), ZnMgO, and ZnGaO _4. , (ZnS: Ag), (ZnS: Ag, Al) are preferably used.

  A light absorption layer that absorbs light from the phosphor region is preferably formed between the partition wall and the substrate from the viewpoint of improving the contrast of the display image. Here, the light absorption layer functions as a so-called black matrix. As a material constituting the light absorption layer, it is preferable to select a material that absorbs 99% or more of light from the phosphor region. Such materials include carbon, metal thin films (eg, chromium, nickel, aluminum, molybdenum, etc., or alloys thereof), metal oxides (eg, chromium oxide), metal nitrides (eg, chromium nitride), heat resistance Materials such as photosensitive organic resins, glass pastes, glass pastes containing conductive particles such as black pigments and silver, and specifically, photosensitive polyimide resins, chromium oxides, and chromium oxide / chromium laminated films Can be illustrated. In the chromium oxide / chromium laminated film, the chromium film is in contact with the substrate. For example, the light absorption layer is a combination of a vacuum vapor deposition method, a sputtering method and an etching method, a vacuum vapor deposition method, a sputtering method, a combination of a spin coating method and a lift-off method, a screen printing method, a lithography technique, etc. It can be formed by a method appropriately selected depending on the method.

  In the cold cathode field emission display device, since the space between the anode panel and the cathode panel is in a vacuum state, it is necessary to arrange a spacer between the anode panel and the cathode panel. The cold cathode field emission display may be damaged by atmospheric pressure. The spacer can be made of ceramics, for example. When the spacer is made of ceramics, the ceramics include mullite, alumina, barium titanate, lead zirconate titanate, zirconia, cordiolite, borosilicate barium, iron silicate, glass ceramic materials, titanium oxide and chromium oxide. Examples thereof include iron oxide, vanadium oxide, and nickel oxide added. In this case, a spacer can be manufactured by forming a so-called green sheet, firing the green sheet, and cutting the fired green sheet. Further, a conductive material layer made of metal or alloy may be formed on the surface of the spacer, or a high resistance layer may be formed, or a thin layer made of a material having a low secondary electron emission coefficient may be formed. . For example, the spacer may be fixed by being sandwiched between the partition walls, or alternatively, for example, by forming a spacer holding portion on the anode panel and sandwiching and fixing between the spacer holding portion and the spacer holding portion. Good.

The cathode panel and the anode panel are joined at the peripheral edge, but the joining may be performed using an adhesive layer, or a frame made of an insulating rigid material such as glass or ceramics and an adhesive layer are used in combination. May be. When using a frame and an adhesive layer together, the opposing distance between the cathode panel and the anode panel is set longer than when only the adhesive layer is used by appropriately selecting the height of the frame. Is possible. As a constituent material of the adhesive layer, frit glass is generally used, but a so-called low melting point metal material having a melting point of about 120 to 400 ° C. may be used. Such low melting point metal materials include In (indium: melting point 157 ° C.); indium-gold based low melting point alloy; Sn ₈₀ Ag ₂₀ (melting point 220-370 ° C.), Sn ₉₅ Cu ₅ (melting point 227-370 °). C) tin (Sn) -based high-temperature solder; Pb _97.5 Ag _2.5 (melting point 304 ° C.), Pb _94.5 Ag _5.5 (melting point 304 to 365 ° C.), Pb _97.5 Ag _1.5 Sn _1.0 (melting point 309 ° C.), etc. Lead (Pb) -based high-temperature solder; zinc (Zn) -based high-temperature solder such as Zn ₉₅ Al ₅ (melting point 380 ° C.); Sn ₅ Pb ₉₅ (melting point 300-314 ° C.), Sn ₂ Pb ₉₈ (melting point 316-322) Tin-lead standard solder such as ° C); brazing material such as Au ₈₈ Ga ₁₂ (melting point 381 ° C) (the above subscripts all represent atomic%).

  When joining the three of the substrate, the support and the frame, the three-party simultaneous joining may be performed, or in the first stage, either the substrate or the support and the frame are joined first, In the second stage, the other of the substrate or the support and the frame may be joined. If the three-party simultaneous bonding or the second stage bonding is performed in a high vacuum atmosphere, the space surrounded by the substrate, the support, the frame, and the adhesive layer becomes a vacuum simultaneously with the bonding. Alternatively, after the three members are joined, the space surrounded by the substrate, the support, the frame, and the adhesive layer can be evacuated to create a vacuum. When exhausting after joining, the pressure of the atmosphere at the time of joining may be normal pressure / depressurized, and the gas constituting the atmosphere may be air, or nitrogen gas or group 0 of the periodic table An inert gas containing a gas belonging to (for example, Ar gas) may be used.

  When exhausting after joining, the exhausting can be performed through a tip tube connected in advance to the substrate and / or the support. The tip tube is typically composed of a glass tube, and a frit is formed around a through hole provided in an ineffective area (that is, an area other than the effective area functioning as a display portion) of the substrate and / or the support. It joins using glass or the above-mentioned low melting metal material, and after the space reaches a predetermined degree of vacuum, it is sealed off by heat fusion. In addition, if the entire cold cathode field emission display is once heated and then cooled before sealing, the residual gas can be released into the space, and the residual gas can be removed out of the space by exhaust. This is preferable.

FIG. 1 is a flowchart for explaining the outline of the short-circuit inspection method of the present invention. FIG. 2 is a flowchart for explaining the short circuit inspection method of the present invention. FIG. 3 is a flowchart for explaining the short circuit inspection method of the present invention, following FIG. FIG. 4 is a flowchart for explaining the short circuit inspection method of the present invention, following FIG. FIG. 5 is a flowchart for explaining the short circuit inspection method of the present invention, following FIG. 6A and 6B are diagrams schematically illustrating a voltage application state to the first wiring and the second wiring when the short circuit inspection method according to the first embodiment is performed. 7A and 7B schematically show voltage application states to the first wiring and the second wiring when the short-circuit inspection method according to the first embodiment is performed, following FIG. 6B. FIG. 8A and 8B schematically show the voltage application state to the first wiring and the second wiring when the short-circuit inspection method of the first embodiment is performed, following FIG. 7B. FIG. FIG. 9 is a diagram schematically illustrating a voltage application state to the first wiring and the second wiring when the short circuit inspection method according to the first embodiment is performed following FIG. FIGS. 10A and 10B are diagrams schematically illustrating a voltage application state to the first wiring and the second wiring when the short circuit inspection method according to the second embodiment is performed. 11A and 11B schematically show voltage application states to the first wiring and the second wiring when the short-circuit inspection method according to the second embodiment is performed, following FIG. 10B. FIG. FIGS. 12A and 12B schematically show voltage application states to the first wiring and the second wiring when the short-circuit inspection method of the second embodiment is performed, following FIG. 11B. FIG. FIGS. 13A and 13B schematically show the voltage application state to the first wiring and the second wiring when the short-circuit inspection method of the second embodiment is performed following FIG. 12B. FIG. 14A and 14B schematically show the voltage application state to the first wiring and the second wiring when the short-circuit inspection method of Example 2 is performed, following FIG. 13B. FIG. FIGS. 15A and 15B schematically show voltage application states to the first wiring and the second wiring when the short-circuit inspection method according to the second embodiment is performed, following FIG. 14B. FIG. FIG. 16 is a diagram schematically illustrating a voltage application state to the first wiring and the second wiring when the short circuit inspection method according to the second embodiment is performed following FIG. FIGS. 17A and 17B are diagrams schematically illustrating a voltage application state to the first wiring and the second wiring when the short circuit inspection method according to the third embodiment is performed. 18A and 18B schematically show the voltage application state to the first wiring and the second wiring when the short-circuit inspection method of Example 3 is performed, following FIG. 17B. FIG. 19A and 19B schematically show the voltage application state to the first wiring and the second wiring when the short-circuit inspection method of Example 3 is carried out, following FIG. 18B. FIG. 20A and 20B schematically show the voltage application state to the first wiring and the second wiring when the short-circuit inspection method of Example 3 is performed, following FIG. 19B. FIG. FIGS. 21A and 21B schematically show voltage application states to the first wiring and the second wiring when the short-circuit inspection method of the third embodiment is performed, following FIG. 20B. FIG. 22A and 22B schematically show voltage application states to the first wiring and the second wiring when the short-circuit inspection method according to the third embodiment is performed, following FIG. 21B. FIG. 23A and 23B schematically show voltage application states to the first wiring and the second wiring when the short-circuit inspection method according to the third embodiment is performed, following FIG. 22B. FIG. 24A and 24B schematically show voltage application states to the first wiring and the second wiring when the short-circuit inspection method according to the third embodiment is performed, following FIG. 23B. FIG. FIGS. 25A and 25B schematically show voltage application states to the first wiring and the second wiring when the short-circuit inspection method according to the third embodiment is performed, following FIG. 24B. FIG. FIG. 26 is a conceptual partial end view of a cold cathode field emission display device to which a Spindt-type cold cathode field emission device is applied. FIG. 27 is a schematic exploded perspective view of a part of a cathode panel and an anode panel in a cold cathode field emission display. FIG. 28 is an arrangement diagram schematically showing the arrangement of barrier ribs, spacers and phosphor regions in an anode panel constituting a cold cathode field emission display. FIG. 29 is a layout diagram schematically showing the layout of barrier ribs, spacers, and phosphor regions in the anode panel constituting the cold cathode field emission display. FIG. 30 is a layout diagram schematically showing the layout of barrier ribs, spacers, and phosphor regions in the anode panel constituting the cold cathode field emission display. FIG. 31 is a layout diagram schematically showing the layout of barrier ribs, spacers, and phosphor regions in an anode panel constituting a cold cathode field emission display. FIG. 32 is a layout diagram schematically showing the layout of the barrier ribs, spacers, and phosphor regions in the anode panel constituting the cold cathode field emission display. FIG. 33 is a layout diagram schematically showing the layout of barrier ribs, spacers, and phosphor regions in the anode panel constituting the cold cathode field emission display. FIGS. 34A and 34B are schematic partial end views of a support and the like for explaining a method for manufacturing a Spindt-type cold cathode field emission device. FIGS. 35A and 35B are schematic partial end views of a support and the like for explaining the manufacturing method of the Spindt-type cold cathode field emission device following FIG. 34B. . FIG. 36 is a schematic partial end view of a Spindt-type cold cathode field emission device having a focusing electrode.

Explanation of symbols

CP ... cathode panel, AP ... anode panel, 10 ... support, 11 ... cathode electrode, 12 ... insulating layer, 13 ... gate electrode, 14, 14A, 14B, 44 ..Opening part, 15 ... electron emission part, 16 ... peeling layer, 17 ... conductive material layer, 20 ... substrate, 21 ... partition wall, 22, 22R, 22G, 22B ... Phosphor region, 23 ... black matrix, 24 ... anode electrode, 25 ... spacer, 26 ... spacer holding part, 27 ... frame, 30 ... cathode electrode control circuit, 31. ..Gate electrode control circuit, 32... Anode electrode control circuit, 42... Interlayer insulating layer, 43.

Claims (6)

(1) A ₁ (A ₁ ≧ 2) first wiring extending in the first direction, and
(2) B ₁ (provided that B ₁ ≧ 2) second wirings formed through an insulating layer and extending in a second direction different from the first direction;
In the wiring structure consisting of: a short circuit inspection method for inspecting a short circuit between the first wiring and the second wiring in the overlapping region of the first wiring and the second wiring,
(A-1) A _i first wirings are defined as a first wiring starting group, and the first wiring starting group is divided into a _i first wiring groups;
(A-2) A short-circuit test between all of the first wirings belonging to one first wiring group and all of the second wirings is performed in all of the a _i first wiring groups,
(A-3) If there is one short-circuit first wiring group in which a short circuit exists, select the short-circuit first wiring group as the next first wiring starting group,
(A-4) If there are two or more short-circuit first wiring groups in which a short circuit exists, record that there are two or more short-circuit first wiring groups, and that there are two or more short-circuit first wiring groups. Selecting one of the short-circuited first wiring groups in the next as the first wiring starting group,
After repeating the first short-circuit inspection step including each step from i = 1 until the number of first wires belonging to the short-circuit first wire group becomes one, the first wire in which the short-circuit has occurred is designated as i ′ ′. Recorded as the first short-circuited first wiring A _{i ′} (where i ′ = 1),
Then
(A-5) When two or more short-circuit first wiring groups exist, one short-circuit first wiring group other than the selected one short-circuit first wiring group is selected as the next first wiring start group. Based on the first wiring starting group, the first short-circuit inspection step is repeated until the number of first wirings belonging to the short-circuiting first wiring group becomes one, and the first wiring that has short-circuited is replaced with the i'th-th wiring. The step of recording as the short-circuit first wiring A _{i ′} (where i ′ = 2, 3,..., I ′) is sequentially repeated until there is no recorded short-circuit first wiring group.
after that,
(B-1) a second wire B _j present a second wire starting group, divided second interconnection starting group b _j-number of the second wire group,
(B-2) A short-circuit test between all of the second wirings belonging to one second wiring group and the i'th short-circuiting first wiring is performed in all of the b _j second wiring groups,
(B-3) If there is one short-circuited second wiring group in which a short circuit exists, select the short-circuited second wiring group as the next second wiring starting group,
(B-4) If there are two or more short-circuit second wiring groups in which a short circuit exists, record that there are two or more short-circuit second wiring groups, and that there are two or more short-circuit second wiring groups. Selecting one of the short-circuited second wiring groups in the second second wiring starting group,
After repeating the second short-circuit inspection step consisting of each step from j = 1 until the number of second wires belonging to the short-circuit second wire group becomes one, the second wire in which the short-circuit has occurred is designated as j ′ ′. The second short-circuited second wiring B _{j ′} (where j ′ = 1),
Then
(B-5) If there are two or more short-circuit second wiring groups, one short-circuit second wiring group other than the selected one short-circuit second wiring group is selected as the next second wiring start group. Based on the second wiring starting group, the second short-circuit inspection step is repeated until the number of second wirings belonging to the short-circuiting second wiring group becomes one, and the second wiring that has short-circuited is replaced with the j'th The step of recording as the short-circuited second wiring B _{j ′} (where j ′ = 2, 3,... J ′) is sequentially repeated until there is no recorded short-circuiting second wiring group.
(B-6) Further, steps (B-1) to (B-5) are repeated from i ′ = 1 to i ′ = I ′.
A short-circuit inspection method in a wiring structure characterized by the above. After the completion of the step (B-6), a short-circuit portion between the first wiring and the second wiring in the overlapping region of the first wiring and the second wiring is displayed as (A _{i ′} , B _{j ′} ). The short circuit inspection method in the wiring structure according to claim 1. The short circuit inspection method for a wiring structure according to claim 1, wherein a _{i has} a value of 2 and b _{j has} a value of 2. When the A _i first wiring start group is divided into two first wiring groups, the number of first wirings A _i−1 included in one first wiring group and the other first wiring group The number A _i-2 of the first wiring included is
A _i-1 = INT (A _i / 2) + mod (A _i , 2)
A _i−2 = A _i −A _i−1
And
When the B _j second wiring start groups are divided into two second wiring groups, the number of second wirings B _j−1 included in one second wiring group and the other second wiring group The number B _j-2 of the second wirings included is respectively
B _j-1 = INT (B _j / 2) + mod (B _j , 2)
B _j-2 = B _j -B _j-1
(However, INT (X / Y) is a function for obtaining the integer part of the quotient when the integer X is divided by the integer Y, and mod (X, Y) is when the integer X is divided by the integer Y. 2. The method for inspecting a short circuit in a wiring structure according to claim 1, wherein (A) a cathode electrode formed on a support;
(B) an insulating layer formed on the support and the cathode electrode;
(C) a gate electrode formed on the insulating layer;
(D) an opening provided in the gate electrode and the insulating layer in the overlapping region of the cathode electrode and the gate electrode, and
(E) an electron emission portion exposed at the bottom of the opening,
A cathode electrode in a cathode panel for a cold cathode field emission display device comprising a plurality of cold cathode field emission devices comprising: a cathode electrode corresponding to a first wiring; and a gate electrode corresponding to a second wiring. Item 5. A short circuit inspection method for the wiring structure according to Item 1. (A) a cathode electrode formed on a support;
(B) an insulating layer formed on the support and the cathode electrode;
(C) a gate electrode formed on the insulating layer;
(D) an opening provided in the gate electrode and the insulating layer in the overlapping region of the cathode electrode and the gate electrode, and
(E) an electron emission portion exposed at the bottom of the opening,
A cathode electrode in a cathode panel for a cold cathode field emission display device comprising a plurality of cold cathode field emission devices comprising: a cathode electrode corresponding to a second wiring; and a gate electrode corresponding to a first wiring. Item 5. A short circuit inspection method for the wiring structure according to Item 1.

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