JP2005311331A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2005311331A5 JP2005311331A5 JP2005082337A JP2005082337A JP2005311331A5 JP 2005311331 A5 JP2005311331 A5 JP 2005311331A5 JP 2005082337 A JP2005082337 A JP 2005082337A JP 2005082337 A JP2005082337 A JP 2005082337A JP 2005311331 A5 JP2005311331 A5 JP 2005311331A5
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- film transistor
- substrate
- antenna
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010409 thin film Substances 0.000 claims 16
- 239000000758 substrate Substances 0.000 claims 15
- 239000004065 semiconductor Substances 0.000 claims 13
- 239000010408 film Substances 0.000 claims 9
- 239000004020 conductor Substances 0.000 claims 7
- 239000000463 material Substances 0.000 claims 3
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- 229910052804 chromium Inorganic materials 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000000945 filler Substances 0.000 claims 1
- 239000011521 glass Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 229910052742 iron Inorganic materials 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 150000002736 metal compounds Chemical class 0.000 claims 1
- 150000002739 metals Chemical class 0.000 claims 1
- 229910052750 molybdenum Inorganic materials 0.000 claims 1
- 229910052763 palladium Inorganic materials 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 229910052715 tantalum Inorganic materials 0.000 claims 1
- 229910052718 tin Inorganic materials 0.000 claims 1
- 229910052719 titanium Inorganic materials 0.000 claims 1
- 229910052721 tungsten Inorganic materials 0.000 claims 1
- 229910052725 zinc Inorganic materials 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005082337A JP4566794B2 (ja) | 2004-03-26 | 2005-03-22 | 半導体装置 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004090743 | 2004-03-26 | ||
| JP2005082337A JP4566794B2 (ja) | 2004-03-26 | 2005-03-22 | 半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005311331A JP2005311331A (ja) | 2005-11-04 |
| JP2005311331A5 true JP2005311331A5 (enrdf_load_stackoverflow) | 2008-05-01 |
| JP4566794B2 JP4566794B2 (ja) | 2010-10-20 |
Family
ID=35439679
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005082337A Expired - Fee Related JP4566794B2 (ja) | 2004-03-26 | 2005-03-22 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4566794B2 (enrdf_load_stackoverflow) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4572343B2 (ja) * | 2006-03-03 | 2010-11-04 | セイコーエプソン株式会社 | 電子基板、半導体装置および電子機器 |
| JP4908899B2 (ja) * | 2006-04-07 | 2012-04-04 | ラピスセミコンダクタ株式会社 | 半導体装置及びその製造方法 |
| US7977170B2 (en) * | 2006-10-03 | 2011-07-12 | Eastman Kodak Company | Flexible substrate with electronic devices and traces |
| KR101180831B1 (ko) | 2006-11-14 | 2012-09-07 | 주식회사 엘지화학 | Ｒｆⅰｄ 태그용 다이본딩 장치 및 방법 |
| JP2008217776A (ja) * | 2007-02-09 | 2008-09-18 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
| JP5403903B2 (ja) | 2007-12-04 | 2014-01-29 | ルネサスエレクトロニクス株式会社 | 半導体装置、その製造方法、および当該半導体装置を用いた信号送受信方法 |
| JP5442950B2 (ja) | 2008-01-29 | 2014-03-19 | ルネサスエレクトロニクス株式会社 | 半導体装置、その製造方法、当該半導体装置を用いた信号送受信方法、およびテスタ装置 |
| JP2011171327A (ja) * | 2010-02-16 | 2011-09-01 | Toshiba Corp | 発光素子およびその製造方法、並びに発光装置 |
| ITMI20111416A1 (it) | 2011-07-28 | 2013-01-29 | St Microelectronics Srl | Circuito integrato dotato di almeno una antenna integrata |
| JP6390418B2 (ja) * | 2014-12-24 | 2018-09-19 | 株式会社ソシオネクスト | 半導体装置、半導体装置の製造方法、及び半導体装置の識別方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11135675A (ja) * | 1997-10-30 | 1999-05-21 | Kawasaki Steel Corp | 半導体装置及びその製造方法 |
| JP2000020665A (ja) * | 1998-06-30 | 2000-01-21 | Toshiba Corp | 半導体装置 |
| JP2000311226A (ja) * | 1998-07-28 | 2000-11-07 | Toshiba Corp | 無線ｉｃカード及びその製造方法並びに無線ｉｃカード読取り書込みシステム |
| JP4168597B2 (ja) * | 2001-03-13 | 2008-10-22 | 三菱マテリアル株式会社 | トランスポンダ用アンテナ |
-
2005
- 2005-03-22 JP JP2005082337A patent/JP4566794B2/ja not_active Expired - Fee Related