JP2005302577A - Conductive paste - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide conductive paste whereby a sheet attack phenomenon is not generated and delamination is not easily caused, when it is laminated on a ceramic green sheet. <P>SOLUTION: This conductive paste is used for the internal electrode of a laminated ceramic capacitor containing a binder resin, an organic solvent, and metal powder. The binder resin is one containing at least a modified polyvinyl acetal resin, and the organic solvent contains at least one kind selected from a group comprising L-carbyl acetate, dihydrocarbyl acetate, dihyldroterpinyl acetate, isobornyl acetate, D-limonene-10-yl acetate, methyl acetate, myrtenyl acetate, 2-octyl acetate, 3-octyl acetate, perillyl acetate, terpinyl acetate, and 4-(1'-acetoxy-1'-methylethyl) cycrohexanol acetate. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

The present invention relates to a conductive paste that does not cause a sheet attack phenomenon and is less prone to delamination when laminated on a ceramic green sheet.

A multilayer electronic component, for example, a multilayer ceramic capacitor, is generally manufactured through the following steps.
First, after adding a plasticizer, a dispersing agent, etc. to a solution in which a binder resin such as polyvinyl butyral resin or poly (meth) acrylic ester resin is dissolved in an organic solvent, ceramic raw material powder is added and mixed uniformly by a ball mill or the like. A ceramic slurry composition having a constant viscosity after defoaming is obtained. This slurry composition is cast-molded on a support surface such as a polyethylene terephthalate film or a SUS plate which has been subjected to a release treatment using a doctor blade, a reverse roll coater or the like. This is heated to remove volatile components such as a solvent, and then peeled off from the support to obtain a ceramic green sheet.

Next, a plurality of sheets obtained by alternately applying a conductive paste serving as an internal electrode on the obtained ceramic green sheet by screen printing or the like, and thermocompression-bonded to obtain a laminate, the binder component contained in this laminate A multilayer ceramic capacitor is obtained through a process of thermally decomposing and removing a so-called degreasing process, and then sintering an external electrode on the end face of the fired ceramic product obtained by firing.

The conductive paste used at this time is usually composed of a conductive metal material such as copper, silver, palladium or nickel constituting the electrode, an organic binder such as ethyl cellulose, and an organic solvent such as terpineol. However, when such a conductive paste is applied onto a ceramic green sheet, the organic solvent in the conductive paste sometimes dissolves the binder resin contained in the ceramic green sheet. This phenomenon is called a sheet attack phenomenon. In recent years, multilayer ceramic capacitors have been required to have higher capacities, and further multilayering and thinning have been studied. In such a multilayer ceramic capacitor that has been extremely thinned, there has been a problem that holes and wrinkles are generated in the ceramic layer due to the sheet attack phenomenon, and the intended electrical characteristics may not be obtained.

On the other hand, for example, Patent Document 1 describes using a mixed solvent composed of an aliphatic hydrocarbon, an aliphatic higher alcohol, and an aromatic hydrocarbon. However, in this mixed solvent, the content of aliphatic hydrocarbons is adjusted to 75 to 9 in order to prevent the sheet attack phenomenon.
Since it is essential to make it 5% by weight, there is a low ability to dissolve, for example, polyvinyl acetal resin other than ethyl cellulose, a mixed resin of polyvinyl acetal resin and ethyl cellulose, and the like, and these resins cannot be used as a binder. was there.

In particular, polyvinyl acetal resin has attracted attention as a binder resin for a conductive paste having excellent adhesion to a ceramic green sheet. In recent years, when multilayered and thinned multilayer ceramic capacitors are manufactured using a conventional conductive paste using ethyl cellulose as a binder resin, the adhesiveness with ceramic green sheets using polyvinyl acetal resin as the binder resin is poor. In other words, the delamination is likely to occur, so-called delamination, and the thermal decomposition of ethyl cellulose itself is inferior. Therefore, when the above laminate is degreased, the carbon component remains after firing, and the electrical characteristics are impaired. there were. When a polyvinyl acetal resin is used as the binder resin of the conductive paste, it is expected that the occurrence of such delamination can be suppressed.

JP 11-273987 A

An object of the present invention is to provide a conductive paste that does not cause a sheet attack phenomenon and is less prone to delamination when laminated on a ceramic green sheet.

The present invention is a conductive paste for multilayer ceramic capacitor internal electrode containing a binder resin, an organic solvent and a metal powder, wherein the binder resin contains at least a modified polyvinyl acetal resin, the organic solvent, L-carbyl acetate, dihydrocarbyl acetate, dihydroterpinyl acetate, isobornyl acetate, D
-Limonen-10-yl acetate, menthyl acetate, myrtenyl acetate, 2-
It contains at least one selected from the group consisting of octyl acetate, 3-octyl acetate, perillyl acetate, terpinyl acetate and 4- (1′-acetoxy-1′-methylethyl) cyclohexanol acetate. It is a conductive paste.
The present invention is described in detail below.

The conductive paste of the present invention contains at least a binder resin containing a modified polyvinyl acetal resin and a specific organic solvent.
As a result of intensive studies, the present inventors have obtained a conductive paste in which a modified polyvinyl acetal resin is used as a binder resin and a sheet attack phenomenon does not occur and a delamination is less likely to occur by using a specific organic solvent. I found out.
In general, a polyvinyl acetal resin used as a binder resin for a ceramic green sheet has a hydroxyl group content of 30% or more so as to obtain high hydrogen bondability for the purpose of increasing the strength of the obtained ceramic green sheet. If a modified polyvinyl acetal resin is used as the binder resin of the conductive paste, the solubility in the organic solvent and the polyvinyl acetal resin used as the binder resin of the ceramic green sheet should be differentiated while maintaining excellent affinity for the ceramic green sheet. Can do. Therefore, if a specific organic solvent that dissolves the modified polyvinyl acetal resin that is the binder resin of the conductive paste but does not dissolve the polyvinyl acetal that is the binder resin of the ceramic green sheet, the occurrence of the sheet attack phenomenon can be suppressed. It is considered a thing.

Although it does not specifically limit as said modified polyvinyl acetal, For example, following General formula (1)
From a vinyl ester unit represented by the following general formula (2), an α-olefin unit represented by the following general formula (3) and an acetal unit represented by the following general formula (4) A modified polyvinyl acetal resin is preferable. Such a modified polyvinyl acetal resin has a configuration similar to that of polyvinyl acetal, and thus is extremely excellent in adhesiveness with a ceramic green sheet using the polyvinyl acetal resin as a binder resin. In addition, various properties such as viscosity and thixotropy can be adjusted by the ratio of each structural unit, selection of R ¹ and R ² , or selection of n, and a conductive paste excellent in screen printability can be obtained. it can.

式中、Ｒ^１は、炭素数１〜２０の直鎖又は枝分かれ状のアルキル基を表し、Ｒ^２は、水素
、炭素数１〜２０の直鎖、枝分かれ状若しくは環状のアルキル基又はアリール基を表す。
また、ｎは１〜８の整数を表す。更に、変性ポリビニルアセタール樹脂中、一般式（１）
で表される構造単位の含有量は０．００１〜２０モル％、一般式（２）で表される構造単
位の含有量は２０〜５８モル％、一般式（３）で表される構造単位の含有量は１〜２０モ
ル％、一般式（４）で表される構造単位の含有量は３２〜７８モル％である。

In the formula, R ¹ represents a linear or branched alkyl group having 1 to 20 carbon atoms, and R ² represents hydrogen, a linear, branched or cyclic alkyl group having 1 to 20 carbon atoms, or an aryl group. Represent.
N represents an integer of 1 to 8. Further, in the modified polyvinyl acetal resin, the general formula (1)
The content of the structural unit represented by the formula is 0.001 to 20 mol%, the content of the structural unit represented by the general formula (2) is 20 to 58 mol%, the structural unit represented by the general formula (3) Is 1 to 20 mol%, and the content of the structural unit represented by the general formula (4) is 32 to 78 mol%.

In the modified polyvinyl acetal resin, the preferable lower limit of the content of α-olefin units is 1 mol%, and the preferable upper limit is 20 mol%. If it is less than 1 mol%, the thermal paste of the resulting conductive paste may be inferior, and if it exceeds 20 mol%, the solvent solubility of the modified polyvinyl acetal resin is inferior and cannot be used as a binder resin. The viscosity stability over time of the conductive paste obtained may be deteriorated. A more preferred lower limit is 2 mol%, and a more preferred upper limit is 15 mol%.

The α-olefin unit is not particularly limited. For example, ethylene, propylene, 1-
Butene, 1-pentene, 1-hexene, 1-heptene, 1-octene, 4-methyl-1-
Examples include units derived from pentene and the like. Of these, ethylene units derived from ethylene are preferred.

The modified polyvinyl acetal resin further includes acrylic acid, methacrylic acid, (anhydrous) phthalic acid, (anhydrous) maleic acid, (anhydrous) itaconic acid, acrylonitrile methacrylonitrile, acrylamide, methacrylamide, trimethyl- (3-acrylamide- 3-dimethylpropyl) -ammonium chloride, acrylamido-2-methylpropanesulfonic acid and its sodium salt, ethyl vinyl ether, butyl vinyl ether, N-vinyl pyrrolidone, vinyl chloride, vinyl bromide, vinyl fluoride, vinylidene chloride, fluoride You may contain the component derived from ethylenically unsaturated monomers, such as vinylidene, tetrafluoroethylene, sodium vinyl sulfonate, and sodium allyl sulfonate. By containing a component derived from these ethylenically unsaturated monomers, it is possible to impart viscosity stability over time to the modified polyvinyl acetal resin. However, even if it contains a component derived from these ethylenically unsaturated monomers, the content is preferably less than 2.0 mol%.

The degree of polymerization of the modified polyvinyl acetal resin is not particularly limited, but a preferable lower limit is 300 and a preferable upper limit is 2400. If it is less than 300, the strength of the coating film obtained by screen printing is inferior, and cracks or the like may easily occur. If it exceeds 2400, the viscosity of the conductive paste becomes too high, and the handling property is lowered. Sometimes.

Such a modified polyvinyl acetal resin can be produced by acetalizing a modified polyvinyl alcohol having an α-olefin unit content of 1 to 20 mol% and a saponification degree of 80 mol% or more.
The modified polyvinyl alcohol can be obtained by saponifying a copolymer obtained by copolymerizing a vinyl ester and an α-olefin. Examples of the vinyl ester used in this case include vinyl formate, vinyl acetate, vinyl propionate, vinyl pivalate and the like. Among these, vinyl acetate is preferable from an economical viewpoint. Moreover, when obtaining the modified polyvinyl acetal containing the component derived from the said ethylenically unsaturated monomer, an ethylenically unsaturated monomer is further copolymerized. In addition, a terminal-modified polyvinyl alcohol obtained by copolymerizing a vinyl ester monomer such as vinyl acetate and an α-olefin in the presence of a thiol compound such as thiol acetic acid or mercaptopropionic acid, and saponifying it. Can be used.

The lower limit of the saponification degree of the modified polyvinyl alcohol is 80 mol%. If it is less than 80 mol%, the solubility of the modified polyvinyl alcohol in water becomes poor, making the acetalization reaction difficult, and if the amount of hydroxyl groups is small, the acetalization reaction itself becomes difficult.

When the modified polyvinyl alcohol is used, it is necessary to use a modified polyvinyl alcohol having an α-olefin content in the range of 1 to 20 mol%, but the α-olefin content is in the range of 1 to 20 mol%. For example, the modified polyvinyl alcohol may be used alone, and the finally obtained modified polyvinyl acetal resin has an α-olefin content of 1-20.
If it becomes mol%, you may mix and use modified polyvinyl alcohol and unmodified polyvinyl alcohol. Moreover, in the saponification degree, if the saponification degree of the modified polyvinyl alcohol when acetalizing is 80 mol% or more, the modified polyvinyl alcohol alone,
Alternatively, a modified polyvinyl alcohol having a saponification degree of 80 mol% or more and a modified polyvinyl alcohol having a saponification degree of less than 80 mol% may be mixed to adjust the saponification degree to 80 mol% or more as a whole.

The modified polyvinyl acetal resin can be produced by acetalizing the modified polyvinyl alcohol. The method for acetalization is not particularly limited, and a conventionally known method can be used. Examples thereof include a method of adding various aldehydes to the aqueous solution of the modified polyvinyl alcohol in the presence of an acid catalyst such as hydrochloric acid.

The aldehyde used for the acetalization is not particularly limited. For example, formaldehyde (including paraformaldehyde), acetaldehyde (including paraacetaldehyde),
Propionaldehyde, butyraldehyde, amylaldehyde, hexylaldehyde, heptylaldehyde, 2-ethylhexylaldehyde, cyclohexylaldehyde, furfural, glyoxal, glutaraldehyde, benzaldehyde, 2-methylbenzaldehyde, 3-methylbenzaldehyde, 4-methylbenzaldehyde, p-hydroxy Benzaldehyde, m-hydroxybenzaldehyde, phenylacetaldehyde, β-
Examples thereof include phenylpropionaldehyde. Of these, acetaldehyde or butyraldehyde is preferable in terms of productivity and property balance. These aldehydes may be used alone or in combination of two or more.

The acetalization degree of the acetalization is preferably in the range of 40 to 78 mol% in terms of the total acetalization degree regardless of whether a single aldehyde or a mixed aldehyde is used. If the total degree of acetalization is less than 40 mol%, the resin becomes water-soluble and insoluble in an organic solvent, which hinders paste production. When the total degree of acetalization exceeds 78 mol%, the residual hydroxyl group is decreased, the toughness of the modified polyvinyl acetal resin is impaired, and the coating strength during paste printing may be reduced.
In this specification, as a method for calculating the degree of acetalization, the acetal group of the modified polyvinyl acetal resin is formed by acetalization from two hydroxyl groups,
The mol% of the degree of acetalization is calculated by adopting a method of counting two acetalized hydroxyl groups.

The binder resin may be composed of the modified polyvinyl acetal resin alone, or may be a mixed resin with a resin usually used as a binder resin such as an acrylic resin, a cellulose resin, or a polyvinyl acetal resin. In this case, the minimum with preferable content of the said modified polyvinyl acetal resin is 30 weight%.

The above organic solvents are L-carbyl acetate, dihydrocarbyl acetate, dihydroterpinyl acetate, isobornyl acetate, D-limonene-10-yl acetate, menthyl acetate, myrtenyl acetate, 2-octyl acetate, 3-octyl Acetate, perillyl acetate, terpinyl acetate and 4- (1′-acetoxy-1 ′)
-Methylethyl) at least one selected from the group consisting of cyclohexanol acetate
Contains seeds. These organic solvents dissolve the modified polyvinyl acetal used as the binder resin of the conductive paste, but do not dissolve the binder resin of the ceramic green sheet. Therefore, when the conductive paste of the present invention using these organic solvents is used, the occurrence of the sheet attack phenomenon can be prevented.

The metal powder is not particularly limited as long as it exhibits sufficient conductivity, and examples thereof include powder made of nickel, palladium, platinum, gold, silver, copper, alloys thereof, and the like. These metal powders may be used alone or in combination of two or more.
As long as the conductive paste of the present invention does not impair the effects of the present invention, a plasticizer, a lubricant, a dispersant,
A conventionally known additive such as an antistatic agent may be contained.

Although it does not specifically limit as a compounding quantity of each component in the electrically conductive paste of this invention, It is preferable that 1-10 weight% of binder resins and 30-70 weight% of metal powders are contained, and all other quantity is a solvent component. When the content of the binder resin is less than 1% by weight, the resulting conductive paste may have poor film forming performance. When the content exceeds 10% by weight, the carbon component tends to remain after degreasing and firing. Further, if the content of the metal powder is less than 30% by weight, the conductive component is small and the organic component is large, so the change in shrinkage after firing is large and the carbon component tends to remain. If it exceeds 70% by weight, the viscosity of the conductive paste becomes too high,
Printing may not be possible.

The method for producing the conductive paste of the present invention is not particularly limited. For example, the organic binder, the organic solvent, the metal powder, and various additives to be added as needed are blended by a blender mill, a three-roll mixer, or the like. The method of using and mixing is mentioned.

ADVANTAGE OF THE INVENTION According to this invention, when it laminates | stacks on a ceramic green sheet, the sheet | seat attack phenomenon does not generate | occur | produce, Moreover, the electrically conductive paste which a delamination does not occur easily can be provided.

Hereinafter, the present invention will be described in more detail with reference to examples. However, the present invention is not limited to these examples.

(Example 1)
193 g of modified polyvinyl alcohol having a polymerization degree of 1700, an ethylene unit content of 10 mol% and a saponification degree of 88 mol% was added to 2900 g of pure water and stirred at a temperature of 90 ° C. for about 2 hours for dissolution. This solution is cooled to 28 ° C., 20 g of hydrochloric acid having a concentration of 35% by weight and 115 g of n-butyraldehyde are added thereto, the liquid temperature is lowered to 20 ° C., and this temperature is maintained to carry out an acetalization reaction. The product precipitated out. Thereafter, the liquid temperature was kept at 30 ° C. for 5 hours to complete the reaction, and neutralized, washed with water and dried by a conventional method to obtain a white powder of a modified polyvinyl acetal resin. The obtained polyvinyl acetal resin was DMSO-d ⁶ (dimethyl sulfoxide).
When the degree of acetalization was measured using 13C-NMR (nuclear magnetic resonance spectrum), the degree of butyralization was 65 mol%.

7 parts by weight of modified polyvinyl acetal resin obtained as a binder resin and 60 parts by weight of L-carbyl acetate as an organic solvent with respect to 100 parts by weight of nickel powder (Mitsui Metals Co., Ltd., “2020SS”) as metal powder Were mixed and then kneaded with three rolls to obtain a conductive paste.

(Examples 2 to 12)
A conductive paste was obtained in the same manner as in Example 1 except that the organic solvent shown in Table 1 was used instead of L-carbyl acetate.

(Comparative Example 1)
Ethyl cellulose as binder resin (Herkles, ethoxy group content 48-49
. 5%), and a conductive paste was obtained in the same manner as in Example 1 except that α-terpineol was used as the organic solvent.

(Comparative Example 2)
Polyvinyl acetal as a binder resin (Sekisui Chemical Co., Ltd., ESREC B "BM-
A conductive paste was obtained in the same manner as in Example 1, except that S-) was used and α-terpineol was used as the organic solvent.

(Comparative Example 3)
A conductive paste was obtained in the same manner as in Example 1 except that α-terpineol was used in place of L-carbyl acetate as the organic solvent.

(Evaluation)
The conductive paste produced in Examples 1 to 12 and Comparative Examples 1 to 3 was evaluated by the following method.
The results are shown in Table 1.

(1) Evaluation of sheet attack property Polyvinyl butyral resin (manufactured by Sekisui Chemical Co., Ltd., ESREC B "MB-2", polymerization degree 850)
) 10 parts by weight was added to a mixed solvent of 30 parts by weight of toluene and 15 parts by weight of ethanol and dissolved by stirring. Further, 3 parts by weight of dibutyl phthalate as a plasticizer was added and dissolved by stirring. To the obtained resin solution, 100 parts by weight of barium titanate (“BT-01 (average particle size: 0.3 μm)” manufactured by Sakai Chemical Industry) as ceramic powder is added and mixed for 48 hours by a ball mill to obtain a ceramic slurry composition. Obtained. The obtained slurry composition was applied on a release-treated polyester film so that the thickness after drying was about 5 μm, air-dried at room temperature for 1 hour, a hot-air dryer,
A ceramic green sheet was obtained by drying at 80 ° C. for 3 hours and then at 120 ° C. for 2 hours.

The conductive paste was printed on one side of the obtained ceramic green sheet by a screen printing method so that the thickness after drying was about 2 μm, and dried to form a conductive paste layer. The front surface (printed surface) and the back surface (polyester film surface) of the green sheet were observed visually and with a magnifying microscope, and evaluated according to the following criteria.
◯: No wrinkles or cracks were observed ×: Wrinkles or cracks were observed

(2) Evaluation of delamination property A ceramic green sheet produced by the same method as in (1) is cut to a size of 5 cm square, and screen printing is performed so that the thickness after drying the conductive paste on this side becomes about 2 μm. The conductive paste layer was formed by printing by the method and drying.
100 ceramic green sheets on which the obtained conductive paste layer was formed were stacked and pressed under thermocompression conditions of a temperature of 70 ° C. and a pressure of 150 kg / cm ² for 10 minutes to obtain a ceramic green sheet laminate.
The obtained ceramic green sheet laminate was 450 ° C. at a temperature rising rate of 3 ° C./min in a nitrogen atmosphere.
The temperature was raised to 1350 ° C. at a rate of temperature rise of 5 ° C./min and held for 10 hours to obtain a ceramic sintered body. After cooling this sintered body to room temperature, divide it in half, observe the state of the sheet in the vicinity of 50 layers with an electron microscope, observe the presence or absence of delamination between the ceramic layer and the conductive layer, and evaluate according to the following criteria did.
○: No delamination ×: Delamination

ADVANTAGE OF THE INVENTION According to this invention, when it laminates | stacks on a ceramic green sheet, the sheet | seat attack phenomenon does not generate | occur | produce, Moreover, the electrically conductive paste which a delamination does not occur easily can be provided.

Claims (2)

A conductive paste for a multilayer ceramic capacitor internal electrode containing a binder resin, an organic solvent and a metal powder,
The binder resin contains at least a modified polyvinyl acetal resin,
The organic solvent is L-carbyl acetate, dihydrocarbyl acetate, dihydroterpinyl acetate, isobornyl acetate, D-limonen-10-yl acetate, menthyl acetate, myrtenyl acetate, 2-octyl acetate, 3-octyl Acetate, perillyl acetate, terpinyl acetate and 4- (1′-acetoxy-1 ′)
-Methylethyl) at least one selected from the group consisting of cyclohexanol acetate
A conductive paste characterized by containing a seed. The electrically conductive paste according to claim 1, wherein the modified polyvinyl acetal is a modified polyvinyl acetal resin composed of structural units represented by the following general formulas (1), (2), (3) and (4).

In the formula, R ¹ represents a linear or branched alkyl group having 1 to 20 carbon atoms, and R ² represents hydrogen, a linear, branched or cyclic alkyl group having 1 to 20 carbon atoms, or an aryl group. Represent.
N represents an integer of 1 to 8. Further, in the modified polyvinyl acetal resin, the general formula (1)
The content of the structural unit represented by the formula is 0.001 to 20 mol%, the content of the structural unit represented by the general formula (2) is 20 to 58 mol%, the structural unit represented by the general formula (3) Is 1 to 20 mol%, and the content of the structural unit represented by the general formula (4) is 32 to 78 mol%.