JP2005294802A - 放熱モジュール - Google Patents
放熱モジュール Download PDFInfo
- Publication number
- JP2005294802A JP2005294802A JP2004362555A JP2004362555A JP2005294802A JP 2005294802 A JP2005294802 A JP 2005294802A JP 2004362555 A JP2004362555 A JP 2004362555A JP 2004362555 A JP2004362555 A JP 2004362555A JP 2005294802 A JP2005294802 A JP 2005294802A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- air
- chamber
- heat dissipation
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D9/00—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
- F28D9/04—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits being formed by spirally-wound plates or laminae
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
【解決手段】 空気輸送装置10と、空気吸入口と空気排気口とを有する放熱室とを備える。放熱室は、その内側壁面上に伝熱強化構造が形成され、その外側壁面は発熱素子28に密着される。空気輸送装置10は気流を放熱室へ出入りさせ、伝熱強化構造は気流が放熱室の内部を通る通路である。
【選択図】 図2
Description
12 放熱部材
14 板状部材
16、36 熱シンク
18 通り孔
18’、18” ノズル開口
19 板状部材表面
20、24 取り付け孔
21 渦巻き状バンプ構造
22、42a、42b フィン
23 フィン薄壁
26 通路出口
28 発熱素子
30 圧力コントローラ
32 ブロア
34 エアポンプ
38、48a、48b 空気吸入口
40 バンプ
Claims (5)
- 空気輸送装置と、
少なくとも一つの空気吸入口と少なくとも一つの空気排気口とを有し、その内側壁面上には伝熱強化構造が形成され、その外側壁面は発熱素子に密着される放熱室とを備える放熱モジュールであって、
前記空気輸送装置は気流を前記放熱室へ出入りさせ、前記伝熱強化構造は、気流が前記放熱室の内部を通る通路であることを特徴とする放熱モジュール。 - 前記放熱室は、第1部材と第2部材とを緊密に結合させることにより形成され、前記第1部材には少なくとも一つの通り孔が形成され、前記第2部材には前記伝熱強化構造が形成されることを特徴とする請求項1記載の放熱モジュール。
- 前記第1部材は、前記第2部材に対向する表面に、前記伝熱強化構造と相補な断面を有する嵌合構造が形成されることを特徴とする請求項2記載の放熱モジュール。
- 前記空気輸送装置は、空気圧縮機、ブロア、エアポンプおよび真空ポンプからなるグループから一つを選択することを特徴とする請求項1記載の放熱モジュール。
- 前記空気吸入口はノズル開口であり、前記ノズル開口の断面が、外部から前記放熱室内への方向に沿って段々細くなるか、外部から前記放熱室内へ向かって段々細くなってから又段々広がることを特徴とする請求項1記載の放熱モジュール。
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW093108925A TWI287700B (en) | 2004-03-31 | 2004-03-31 | Heat dissipation module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2005294802A true JP2005294802A (ja) | 2005-10-20 |
Family
ID=35054049
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004362555A Pending JP2005294802A (ja) | 2004-03-31 | 2004-12-15 | 放熱モジュール |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20050219815A1 (ja) |
| JP (1) | JP2005294802A (ja) |
| TW (1) | TWI287700B (ja) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI444130B (zh) | 2010-01-28 | 2014-07-01 | Delta Electronics Inc | 冷卻系統 |
| TWI505769B (zh) * | 2013-07-18 | 2015-10-21 | King Yuan Electronics Co Ltd | 電路板散熱模組 |
| CN104349573B (zh) * | 2013-07-30 | 2017-08-11 | 京元电子股份有限公司 | 电路板散热模块 |
| CN110230464B (zh) * | 2019-05-30 | 2024-06-04 | 北京石油机械有限公司 | 一种基于相变散热的顶驱装置 |
| CA3140764C (en) * | 2019-06-27 | 2025-06-10 | Hypertechnologie Ciara Inc. | MICRO-SLOT SYSTEM FOR DIRECT CONTACT COOLING ELECTRONICS |
| CN113436538B (zh) * | 2021-06-30 | 2023-04-21 | 上海天马微电子有限公司 | 显示模组及显示装置 |
| CN120326850B (zh) * | 2025-06-19 | 2025-09-16 | 浙江安布雷拉新材料制造有限公司 | 一种聚氨酯膜生成延展控温设备 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02108392U (ja) * | 1989-02-15 | 1990-08-29 | ||
| JPH08227953A (ja) * | 1994-11-30 | 1996-09-03 | Sumitomo Electric Ind Ltd | 基板およびこれを用いた放熱基板、半導体装置、素子搭載装置 |
| JP2001237357A (ja) * | 2000-02-24 | 2001-08-31 | Sts Kk | 蛇行通路付熱伝達装置 |
Family Cites Families (40)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4147299A (en) * | 1977-09-26 | 1979-04-03 | International Business Machines Corporation | Air flow system for a disk file |
| US4485429A (en) * | 1982-06-09 | 1984-11-27 | Sperry Corporation | Apparatus for cooling integrated circuit chips |
| EP0217676B1 (en) * | 1985-10-04 | 1993-09-01 | Fujitsu Limited | Cooling system for electronic circuit device |
| US5126919A (en) * | 1985-10-04 | 1992-06-30 | Fujitsu Limited | Cooling system for an electronic circuit device |
| US4838041A (en) * | 1987-02-05 | 1989-06-13 | Gte Laboratories Incorporated | Expansion/evaporation cooling system for microelectronic devices |
| US4896247A (en) * | 1988-07-25 | 1990-01-23 | Cozer Calmon S | Robot vision cooling/protection system |
| US4932467A (en) * | 1988-10-17 | 1990-06-12 | Sundstrand Corporation | Multi-channel heat exchanger with uniform flow distribution |
| US5271239A (en) * | 1990-11-13 | 1993-12-21 | Rocky Research | Cooling apparatus for electronic and computer components |
| US5125451A (en) * | 1991-04-02 | 1992-06-30 | Microunity Systems Engineering, Inc. | Heat exchanger for solid-state electronic devices |
| US5168348A (en) * | 1991-07-15 | 1992-12-01 | International Business Machines Corporation | Impingment cooled compliant heat sink |
| US5592363A (en) * | 1992-09-30 | 1997-01-07 | Hitachi, Ltd. | Electronic apparatus |
| US5441102A (en) * | 1994-01-26 | 1995-08-15 | Sun Microsystems, Inc. | Heat exchanger for electronic equipment |
| US5579828A (en) * | 1996-01-16 | 1996-12-03 | Hudson Products Corporation | Flexible insert for heat pipe freeze protection |
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| US5841634A (en) * | 1997-03-12 | 1998-11-24 | Delco Electronics Corporation | Liquid-cooled baffle series/parallel heat sink |
| IT1294293B1 (it) * | 1997-07-31 | 1999-03-24 | Maurizio Checchetti | Dissipatore di calore |
| DE29801275U1 (de) * | 1998-01-27 | 1998-05-07 | Wang, Daniel, Taipeh/T'ai-pei | Kühlvorrichtung für eine zentrale Verarbeitungseinheit |
| US6019165A (en) * | 1998-05-18 | 2000-02-01 | Batchelder; John Samuel | Heat exchange apparatus |
| JP2000077381A (ja) * | 1998-09-02 | 2000-03-14 | Toshiba Corp | エッチング方法、エッチング装置、及び分析方法 |
| US6175495B1 (en) * | 1998-09-15 | 2001-01-16 | John Samuel Batchelder | Heat transfer apparatus |
| US6666905B2 (en) * | 1998-10-16 | 2003-12-23 | Midwest Research Institute | Thermoelectric particle precipitator and method using same for collecting particles from fluid streams |
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| JP4122250B2 (ja) * | 2003-03-31 | 2008-07-23 | 山洋電気株式会社 | 電子部品冷却装置 |
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-
2004
- 2004-03-31 TW TW093108925A patent/TWI287700B/zh not_active IP Right Cessation
- 2004-12-15 JP JP2004362555A patent/JP2005294802A/ja active Pending
-
2005
- 2005-03-28 US US11/090,223 patent/US20050219815A1/en not_active Abandoned
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02108392U (ja) * | 1989-02-15 | 1990-08-29 | ||
| JPH08227953A (ja) * | 1994-11-30 | 1996-09-03 | Sumitomo Electric Ind Ltd | 基板およびこれを用いた放熱基板、半導体装置、素子搭載装置 |
| JP2001237357A (ja) * | 2000-02-24 | 2001-08-31 | Sts Kk | 蛇行通路付熱伝達装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI287700B (en) | 2007-10-01 |
| TW200532425A (en) | 2005-10-01 |
| US20050219815A1 (en) | 2005-10-06 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20071009 |
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| A521 | Request for written amendment filed |
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| A02 | Decision of refusal |
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| A521 | Request for written amendment filed |
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| A521 | Request for written amendment filed |
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| A911 | Transfer to examiner for re-examination before appeal (zenchi) |
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| A912 | Re-examination (zenchi) completed and case transferred to appeal board |
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