JP2005294760A5 - - Google Patents

Download PDF

Info

Publication number
JP2005294760A5
JP2005294760A5 JP2004111380A JP2004111380A JP2005294760A5 JP 2005294760 A5 JP2005294760 A5 JP 2005294760A5 JP 2004111380 A JP2004111380 A JP 2004111380A JP 2004111380 A JP2004111380 A JP 2004111380A JP 2005294760 A5 JP2005294760 A5 JP 2005294760A5
Authority
JP
Japan
Prior art keywords
semiconductor
semiconductor device
insulating film
interlayer insulating
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2004111380A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005294760A (ja
JP4458906B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2004111380A priority Critical patent/JP4458906B2/ja
Priority claimed from JP2004111380A external-priority patent/JP4458906B2/ja
Publication of JP2005294760A publication Critical patent/JP2005294760A/ja
Publication of JP2005294760A5 publication Critical patent/JP2005294760A5/ja
Application granted granted Critical
Publication of JP4458906B2 publication Critical patent/JP4458906B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2004111380A 2004-04-05 2004-04-05 半導体装置 Expired - Fee Related JP4458906B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004111380A JP4458906B2 (ja) 2004-04-05 2004-04-05 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004111380A JP4458906B2 (ja) 2004-04-05 2004-04-05 半導体装置

Publications (3)

Publication Number Publication Date
JP2005294760A JP2005294760A (ja) 2005-10-20
JP2005294760A5 true JP2005294760A5 (enExample) 2007-05-10
JP4458906B2 JP4458906B2 (ja) 2010-04-28

Family

ID=35327313

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004111380A Expired - Fee Related JP4458906B2 (ja) 2004-04-05 2004-04-05 半導体装置

Country Status (1)

Country Link
JP (1) JP4458906B2 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007142276A (ja) * 2005-11-21 2007-06-07 Toshiba Corp 半導体装置及びその製造方法
TW200735308A (en) * 2005-12-23 2007-09-16 Koninkl Philips Electronics Nv On-chip interconnect-stack cooling using sacrificial interconnect segments
KR100737162B1 (ko) * 2006-08-11 2007-07-06 동부일렉트로닉스 주식회사 반도체 소자 및 그 제조방법
FR2951871B1 (fr) * 2009-10-23 2011-12-16 St Microelectronics Sa Plaque d'interface entre circuits integres
FR2961017B1 (fr) * 2010-06-02 2013-10-11 Commissariat Energie Atomique Puce electronique, composants electroniques et bras de commutation incorporant cette puce electronique
US8680674B2 (en) * 2012-05-31 2014-03-25 Freescale Semiconductor, Inc. Methods and structures for reducing heat exposure of thermally sensitive semiconductor devices
JP2018018908A (ja) * 2016-07-26 2018-02-01 パナソニックＩｐマネジメント株式会社 熱電変換器
JP6323527B2 (ja) * 2016-10-17 2018-05-16 Tdk株式会社 半導体チップおよび磁気記録装置
KR102652928B1 (ko) 2017-02-06 2024-03-29 엘지이노텍 주식회사 열전 소자
KR20200099795A (ko) * 2019-02-15 2020-08-25 에스케이하이닉스 주식회사 반도체 장치
US11908766B2 (en) * 2021-04-05 2024-02-20 Jmj Korea Co., Ltd. Cooling system where semiconductor component comprising semiconductor chip and cooling apparatus are joined
CN113249692B (zh) * 2021-04-29 2023-10-20 三河同飞制冷股份有限公司 一种大功率半导体元器件的冷却板
CN119289549B (zh) * 2024-12-10 2025-02-11 安徽农业大学 一种半导体制冷结构以及冷凝器

Similar Documents

Publication Publication Date Title
US7772692B2 (en) Semiconductor device with cooling member
CN100499089C (zh) 散热装置
CN201888063U (zh) 冷却装置及电子设备
US9807906B2 (en) Liquid-cooling device and system thereof
US8283773B2 (en) Semiconductor device having anti-warping sheet
TWI482244B (zh) 熱交換器以及半導體模組
EP2023390B1 (en) Semiconductor device
US7529089B2 (en) Heat-dissipating device connected in series to water-cooling circulation system
JP3851875B2 (ja) 冷却装置及び電子機器
US6867974B2 (en) Heat-dissipating device
JP2005294760A5 (enExample)
US9362199B2 (en) Chip thermal dissipation structure
WO2011096218A1 (ja) 放熱装置およびそれを用いた電子機器
US20060175045A1 (en) Heat dissipation device
CN101861082A (zh) 散热装置
CN104576567B (zh) 包括电子器件的集成电路芯片以及电子系统
CN101142866B (zh) 吸热构件、冷却装置及电子机器
US20100065249A1 (en) Heat sink
JP2861981B2 (ja) 半導体装置の冷却構造
US20090039382A1 (en) Light emitting diode package structure
KR100653605B1 (ko) 메탈 코어 히트싱크를 구비하는 반도체 칩 패키지와 그를포함하는 반도체 모듈
US20080156520A1 (en) Complex printed circuit board structure
US7705449B2 (en) Cooling apparatus for memory module
US7643302B2 (en) Electronic device, package having the same, and electronic apparatus
TWI729325B (zh) 散熱單元