JP2005294619A - Wiring forming method and apparatus therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wiring forming method and an apparatus thereof capable of remarkably improving production efficiency capable of forming a wiring even if there is a displacement of an electronic component.
An XY axis includes a first electronic component having a first electrode and a second electronic component having a second electrode, with the relative positions of the first and second electrodes being fixed. It is arranged on the XY axis plane of the coordinate system including Data of the first point 254 indicating the position of the first electrode (electrode shape 252) and data of the second point 264 indicating the position of the second electrode (electrode shape 262) on the XY-axis plane are respectively obtained. get. A bitmap formed by dividing data of a line image connecting the first point 254 and the second point 264 into a plurality of pixels using the data of the first point 254 and the second point 264. Obtained as data 78. In accordance with the bitmap data 78, a dispersion liquid containing conductive fine particles is discharged to form a wiring connecting the first and second electrodes.
[Selection] Figure 4

Description

  The present invention relates to a wiring formation method and apparatus for an electronic component including a semiconductor chip such as an IC (integrated circuit) incorporated in an electronic device.

  2. Description of the Related Art In recent years, a wire bonder that correctly positions and mounts a semiconductor chip with respect to a lead frame and performs wire bonding as a wiring process is well known. In recent years, a so-called full-auto wire bonder, which performs bonding by automating a positioning operation for correcting the amount of misalignment of a semiconductor chip to a high-performance wire bonder, has been widely used in the semiconductor manufacturing field in recent years.

This is because an image processing device using an image sensor such as a CCD camera is provided, and a bonding object including a semiconductor chip such as an IC bonded on a lead frame is locally imaged, and the relative relationship between the semiconductor chip and the lead frame In this case, the amount of misregistration is detected from a position determined using an image captured before the start of bonding. For example, there is Patent Document 1 as a method of performing connection correction between two points.
JP 2001-267354 A

  However, a specific wiring method is not shown in the method of connecting the wiring between the electrodes of the electronic components arbitrarily arranged on the substrate with the conductive ink.

  Assuming that the electronic components arranged on the substrate are arranged at the positions as designed, wiring is performed by printing the conductor ink by the ink jet method or the like based on the data to be connected.

  However, there are errors such as mechanical equipment errors, component errors, board errors, board due to environment, shrinkage and expansion of parts, etc., on the placement position of electronic components placed on the board. It is impossible to come.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a wiring forming method and an apparatus therefor that can greatly improve the production efficiency capable of forming a wiring even if the electronic component is misaligned.

(1) In the wiring forming method according to the present invention, (a) a first electronic component having a first electrode and a second electronic component having a second electrode are connected to the first and second electrodes. With the relative position fixed, arranged on the XY axis plane of the coordinate system including the XY axes,
(B) obtaining data of a first point indicating the position of the first electrode and data of a second point indicating the position of the second electrode on the XY axis plane,
(C) Using the data of the first and second points, the data of the line image connecting the first and second points is converted into the bitmap data obtained by dividing the XY axis plane into a plurality of pixels. Obtaining as, and
(D) forming a wiring for connecting the first and second electrodes by discharging a dispersion liquid containing conductive fine particles according to the data of the bitmap;
including. According to the present invention, the electronic component to be mounted is placed on the substrate and fixed, and the electrode of the electronic component is exposed to form the wiring of the electrode on the substrate. Thus, the mounting process of wiring after fixing is realized. As a result, electronic components can be easily mounted on the printed wiring board in the reverse order of the conventional mounting process starting with component placement. Therefore, wiring can be formed even if the electronic components are misaligned, and production efficiency can be greatly improved. In addition, the wiring can be arbitrarily produced without depending on an external manufacturer, the inspection and correction can be easily performed, and the manufacturing cost can be reduced under the consistent production management.
(2) This wiring formation method
The first electronic component may be a semiconductor chip or a wiring board.
(3) This wiring formation method is:
The second electronic component may be a semiconductor chip or a wiring board.
(4) This wiring forming method is:
The step (c)
The geometric line data connecting the first and second points may be calculated, and the geometric line data may be converted into the bitmap data.
(5) This wiring forming method is:
The step (c)
Selecting the first and second pixels corresponding to the positions of the first and second points, and selecting a plurality of third pixels connecting the first and second pixels, whereby the bitmap You may acquire the data.
(6) The wiring forming apparatus according to the present invention includes a first electronic component having a first electrode and a second electronic component having a second electrode, the relative positions of the first and second electrodes. In a state where is fixed, a stage for placing on the XY axis plane of the coordinate system including the XY axes,
An imaging unit for imaging the first and second electrodes;
A storage unit for storing image data of the captured first and second electrodes;
Position data acquisition means for respectively acquiring data of a first point indicating the position of the first electrode and data of a second point indicating the position of the second electrode on the XY axis plane;
A drawing that uses the data of the first and second points to acquire data of a line image connecting the first and second points as bitmap data in which the XY-axis plane is divided into a plurality of pixels. Data acquisition means;
According to the data of the bitmap, a drawing unit that forms a wiring connecting the first and second electrodes by discharging a dispersion liquid containing conductive fine particles;
Is provided.
(7) This wiring forming apparatus
There may be provided bitmap conversion means for calculating data of a geometric line connecting the first and second points and converting the data of the geometric line into the bitmap data.
(8) This wiring forming apparatus
Selecting the first and second pixels corresponding to the positions of the first and second points, and selecting a plurality of third pixels connecting the first and second pixels, whereby the bitmap There may be provided bitmap selection means for acquiring the data.

  Embodiments of the present invention will be described below with reference to the drawings.

(First embodiment)
FIG. 1 is a diagram illustrating an electronic component according to a first embodiment to which the present invention is applied. In the present embodiment, a first electronic component (wiring board 50) and a second electronic component (semiconductor chip 60) are prepared. The wiring board 50 only needs to be resistant to heat treatment at about 300 ° C., and various types such as a silicon wafer, quartz glass, glass, a polyimide film, and a metal plate can be used. Further, a semiconductor film, a metal film, a dielectric film, an organic film, or the like may be formed on the substrate surface as a base layer. The shape, line width, and film thickness of lines formed by inkjet discharge largely depend on the lyophilicity and liquid repellency of the substrate. In order to form a stable line with little disturbance such as bulge, it is preferable that the substrate is lyophilic as much as possible. In that case, since the droplet spreads wet on the substrate, the line width is fine and the pressure film It becomes difficult to form the line. On the other hand, if the liquid repellency of the substrate is too strong, the liquid easily moves on the substrate and the occurrence rate of bulges (concentrated portions) becomes extremely large. Considering the above, it is preferable that the substrate has liquid repellency to such an extent that the contact angle of the liquid with respect to the substrate is 30 deg to 60 deg.

  The liquid repellency and lyophilic treatment on the substrate surface is preferably performed by a method such as UV irradiation, plasma polymerization treatment, Teflon (registered trademark) processing treatment, or formation of an organic molecular film. The organic molecular film here is a functional group that can bind to the substrate, a functional group that modifies the surface properties of the substrate, such as a lyophilic group or a repellent group, on the opposite side, and a linear chain that connects these functional groups. A branched carbon structure having a ring structure is preferable, and a molecular film, for example, a monomolecular film, which is bonded to a substrate and self-assembles to form a monomolecular film, for example, a silane coupling agent is preferable. The first electrode (electrode 52) is formed on one surface of the wiring substrate 50. In addition to the electrode 52 on one surface of the wiring board 50, an electrode may be formed on the other surface, but the electrode formed on the other surface is not an essential component of the present invention. The electrode 52 can be formed by depositing a conductive film such as copper on the wiring substrate 50 by sputtering or the like and etching it. In this case, the electrode 52 is directly formed on the wiring substrate 50 to form a two-layer substrate.

  An outline of the wiring forming apparatus according to the present embodiment will be described. FIG. 2 is a block diagram illustrating the wiring forming apparatus according to the present embodiment. As shown in FIG. 2, in the wiring substrate 50 and the semiconductor chip 60, the surface of the wiring substrate 50 on which the electrode 52 is formed and the surface of the semiconductor chip 60 on which the electrode 62 is formed face the same direction. . In other words, the surface of the wiring substrate 50 opposite to the surface on which the electrode 52 is formed and the surface of the semiconductor chip 60 on which the electrode 62 is formed face in the opposite direction, and the semiconductor chip 60 is disposed on the wiring substrate 50. Is placed.

  The imaging unit (camera 20) is a direction that can face the surface of the wiring substrate 50 on which the electrode 52 is formed and the surface of the semiconductor chip 60 on which the electrode 62 is formed. And is arranged. That is, the camera 20 is disposed so as to face the surface of the wiring board 50 on which the electrode 52 is formed. And it arrange | positions so that the surface in which the electrode 62 in the semiconductor chip 60 was formed may be faced.

  The wiring substrate 50 and the semiconductor chip 60 are held on the stage 10 so that they can be translated along the surface on which the electrode 52 is formed or the surface on which the electrode 62 is formed.

  In this state, the camera 20 images the formation surface of the electrode 52 and the formation surface of the electrode 62 along one axis orthogonal to the XY axis plane. The computer 30 performs a predetermined process based on the captured image data 70 (see FIG. 4A), and forms wirings for the electrodes 52 and 62 using the drawing unit (inkjet device 22). .

  Further, the process of forming the wiring of the electrode 52 and the electrode 62 in the form of software using the image data 70 of the formation surface of the electrode 52 and the formation surface of the electrode 62 imaged by the camera 20 according to the present embodiment will be described. FIG. 3 is a flowchart for explaining the wiring forming method according to the present embodiment.

  In the present embodiment, as shown in FIG. 3, first, in step S <b> 100, the wiring substrate 50 on which the semiconductor chip 60 is mounted is placed on the stage 10.

  Next, in step S110, the stage 10 on which the wiring board 50 on which the semiconductor chip 60 is mounted in step S100 is moved to a predetermined position using the drive control unit 14 and the carrier 12. The predetermined position indicates position information of the electrode 52 and the electrode 62 stored in advance in the basic information storage unit 44.

  Next, in step S120, the formation surface of the electrode 52 of the wiring board 50 and the formation surface of the electrode 62 of the semiconductor chip 60 placed at predetermined positions in step S110 are imaged using the camera 20. The captured image data 70 is taken into the image storage unit 42.

  Next, in step S130, the center position (first point 254) of the electrode shape 252 of the image data 70 is acquired by performing image processing on the image data 70 shown in FIG. 4A captured in step S120. . Alternatively, the center position (second point 264) of the electrode shape 262 of the image data 70 is acquired.

  Next, in step S140, the position information of the first point 254 of the image data 70 obtained in step S130 is taken into the storage unit 40. Alternatively, the position information of the second point 264 of the image data 70 obtained in step S130 is taken into the storage unit 40.

  Next, in step S <b> 150, the process of taking the position information of the first point 254 and the second point 264 stored in advance in the basic information storage unit 44 into the storage unit 40 ends for all the electrodes 52 and 62. This is a determination process for repeating the process from step S110 to step S140 until it is done. As for the determination contents, the process of taking the position information of the first point 254 and the second point 264 corresponding to the position information of the electrodes 52 and 62 stored in the basic information storage unit 44 in advance into the storage unit 40 is completed. The state that is in question is “YES”. In this case, the process proceeds to step S160. Alternatively, the process of capturing the position information of the first point 254 and the second point 264 corresponding to the position information of the electrode 52 and the electrode 62 stored in the basic information storage unit 44 in the storage unit 40 is not completed. The state is “NO”. In this case, the process proceeds to step S110.

  Next, in step S160, when “YES” is determined in step S150, the first point 254 and second point 254 are obtained using the data of the first point 254 and the second point 264 acquired in step S140. Line image data connecting the points 264 is acquired as bitmap data 78 in which the XY-axis plane is divided into a plurality of pixels. For example, as shown in FIG. 4A, geometric line data 76 connecting the first point 254 and the second point 264 is calculated, and as shown in FIG. Are converted into bitmap data 78 and acquired.

  Next, in step S170, using the bitmap data 78 acquired in step S160, the inkjet device 22 ejects a dispersion liquid containing conductive fine particles only at points marked in the bitmap under the control of the computer 30. Thus, a wiring for connecting the electrode 52 and the electrode 62 is formed.

  The wiring forming method according to this embodiment has the above-described contents, and the apparatus will be described below. As shown in FIG. 2, the wiring forming apparatus includes a stage 10, a carrier 12, a drive control unit 14, an imaging unit (camera 20), a computer 30, and a drawing unit (inkjet device 22).

  The stage 10 is a state in which the position of the wiring substrate 50 having the electrode 52 and the semiconductor chip 60 having the electrode 62 is relatively fixed on the XY axis plane of the coordinate system including the XY axes. Place with.

  The carrier 12 moves the stage 10 in parallel to the surface on which the electrode 52 of the wiring substrate 50 and the electrode 62 of the semiconductor chip 60 are formed.

  The drive control unit 14 is connected to the carrier 12 of the stage 10. The drive control unit 14 controls the drive in the XY coordinate directions of the stage 10 on which the wiring substrate 50 and the semiconductor chip 60 are arranged using the carrier 12 according to an instruction from the computer 30.

  The camera 20 images the formation surface of the electrode 52 of the wiring substrate 50 and the formation surface of the electrode 62 of the semiconductor chip 60.

  The computer 30 includes a calculation unit 32 and a storage unit 40.

  The calculation unit 32 obtains the center position (first point 254) of the electrode shape 252 of the image data 70 by performing image processing on the image data 70 stored in the image storage unit 42 as position data acquisition means. Alternatively, the center position (first point 264) of the electrode shape 262 of the image data 70 is obtained by performing image processing on the image data 70 stored in the image storage unit 42. In order to obtain the center position, position data from the origin is obtained for every fixed distance of the contour line representing the contour of the electrode shape, and the average value is obtained by adding the position data.

  Further, as drawing data acquisition means, the data of the first point 254 and the second point 264 is used, and the data of the line image connecting the first point 254 and the second point 264 is displayed in a plurality of XY-axis planes. It is obtained as bitmap data 78 divided into pixels. For example, as a bitmap conversion means, geometric line data 76 connecting the first point 254 and the second point 264 is calculated, and the geometric line data 76 is converted into bitmap data 78. get.

  The storage unit 40 includes a storage medium (recording medium) such as a RAM, a ROM, and a magnetic disk that can read data. The storage medium is configured by a magnetic or optical recording medium, a semiconductor memory, or the like. Yes. The storage unit 40 includes an image storage unit 42 and a basic information storage unit 44. The image storage unit 42 stores an image generated by capturing the electrodes 52 of the wiring board 50 and the electrodes 62 of the semiconductor chip 60 with the camera 20 as bitmap data. The electronic components read by the camera 20 are indicated by a wiring board shape 250, an electrode shape 252, a semiconductor chip shape 260, and an electrode shape 262 in the image data 70 as shown in FIG. . In FIG. 4A, for convenience of explanation, the wiring board shape 250 and the semiconductor chip shape 260 are shown slightly inclined. The basic information storage unit 44 acquires position information of the wiring substrate 50 and the semiconductor chip 60, position information of the electrodes 52 and 62, wiring information of the electrodes 52 and 62, and the like from a data server (not shown) via a network.

  The ink jet device 22 forms a wiring connecting the electrode 52 and the electrode 62 by discharging a dispersion liquid (for example, metal ink) containing conductive fine particles in accordance with the bitmap data 78. The conductive fine particles may be formed of a material that is difficult to oxidize, such as gold or silver, and has low electric resistance. “Perfect Gold” from Vacuum Metallurgical Co., Ltd. may be used as a dispersion containing fine gold particles, and “Perfect Silver” from the same may be used as a dispersion containing silver fine particles. The fine particles are not particularly limited in size, and are particles that can be discharged together with the dispersion medium. The wiring may be formed by discharging a dispersion liquid containing conductive fine particles such as an ink jet method or a bubble jet (registered trademark) method (for example, discharging a droplet thereof), or by mask printing or screen printing. Good. The conductive fine particles may be coated with a coating material in order to suppress the reaction. The dispersion medium may be hard to dry and re-dissolvable. The conductive fine particles may be uniformly dispersed in the dispersion medium.

  Further, the computer 30 is connected to the display unit 24 and the input unit 26.

  The display unit 24 includes, for example, a CRT (Cathode-Ray Tube), a liquid crystal display, and the like, and displays, for example, an operation screen, a data input screen, and the like. In addition to this, the display unit 24 also displays images of the formation surface of the electrode 52 and the formation surface of the electrode 62 captured by the camera 20, display of the processing status in the middle of image processing, and finally recognition. Shape images of the formation surface of the electrode 52 and the formation surface of the electrode 62 can be displayed.

  Although not shown, the input unit 26 can be connected to a keyboard for inputting characters and numbers, a mouse that performs various operations with a cursor displayed on the screen of the display unit 24, a host computer, etc. via a network. It is.

(Second Embodiment)
FIG. 5 is a flowchart for explaining a wiring forming method according to the second embodiment to which the present invention is applied.

  In this embodiment, as shown in FIG. 5, step S260 uses the data of the first point 254 and the second point 264 acquired in step S140 when it is determined “YES” in step S150. . Data of a line image connecting the first point 254 and the second point 264 is acquired as bitmap data 378 in which the XY axis plane is divided into a plurality of pixels. For example, as shown in FIG. 6A, data of the first point 254 and the second point 264 are used. As shown in FIG. 6B, the first pixel 354 and the second pixel 364 corresponding to the positions of the first point 254 and the second point 264 are selected. Bit map data 378 is obtained by selecting a plurality of third pixels 374 connecting the first pixel 354 and the second pixel 364 (see FIG. 6C). The contents described in the first embodiment can be applied to other wiring forming methods and configurations.

  The present invention is not limited to the above-described embodiments, and various modifications can be made. For example, the present invention includes configurations that are substantially the same as the configurations described in the embodiments (for example, configurations that have the same functions, methods, and results, or configurations that have the same purposes and results). In addition, the invention includes a configuration in which a non-essential part of the configuration described in the embodiment is replaced. In addition, the present invention includes a configuration that exhibits the same operational effects as the configuration described in the embodiment or a configuration that can achieve the same object. Further, the invention includes a configuration in which a known technique is added to the configuration described in the embodiment. Furthermore, the present invention includes contents that exclude any of the technical matters described in the embodiments in a limited manner. Or this invention includes the content which excluded the well-known technique limitedly from embodiment mentioned above.

It is a figure explaining the electronic component which concerns on 1st Embodiment. It is a block diagram explaining the wiring formation apparatus which concerns on 1st Embodiment. It is a flowchart explaining the wiring formation method which concerns on 1st Embodiment. It is a figure explaining the image data which concerns on 1st Embodiment. It is a flowchart explaining the wiring formation method which concerns on 2nd Embodiment. It is a figure explaining the bitmap data concerning a 2nd embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Stage 12 ... Carrier 14 ... Drive control part 20 ... Camera 22 ... Inkjet apparatus 24 ... Display part 26 ... Input part 30 ... Computer 32 ... Calculation part 40 ... Storage part 42 ... Image storage part 44 ... Basic information storage part 50 ... Wiring board 52 ... Electrode 60 ... Semiconductor chip 62 ... Electrode 70 ... Image data 76 ... Geometric line data 78 ... Bit map data 250 ... Wiring board shape 252 ... Electrode shape 254 ... First point 260 ... Semiconductor chip shape 262 ... Electrode shape 264 ... Second point 354 ... First pixel 364 ... Second pixel 374 ... Third pixel 378 ... Bitmap data

Claims (8)

(A) An XY axis of a first electronic component having a first electrode and a second electronic component having a second electrode, with the relative positions of the first and second electrodes fixed. Arranged in the XY axis plane of the coordinate system including
(B) obtaining data of a first point indicating the position of the first electrode and data of a second point indicating the position of the second electrode on the XY axis plane,
(C) Using the data of the first and second points, the data of the line image connecting the first and second points is converted into the bitmap data obtained by dividing the XY axis plane into a plurality of pixels. Obtaining as, and
(D) forming a wiring for connecting the first and second electrodes by discharging a dispersion liquid containing conductive fine particles according to the data of the bitmap;
A wiring forming method including: In the wiring formation method of Claim 1,
The wiring forming method, wherein the first electronic component is a semiconductor chip or a wiring board. In the wiring formation method of Claim 1 or Claim 2,
The wiring forming method, wherein the second electronic component is a semiconductor chip or a wiring board. In the wiring formation method in any one of Claims 1-3,
The step (c)
A wiring forming method of calculating data of a geometric line connecting the first and second points and converting the data of the geometric line into data of the bitmap. In the wiring formation method in any one of Claims 1-3,
The step (c)
Selecting the first and second pixels corresponding to the positions of the first and second points, and selecting a plurality of third pixels connecting the first and second pixels, thereby generating the bitmap; A wiring formation method for acquiring the data. Coordinates including the XY axes of the first electronic component having the first electrode and the second electronic component having the second electrode with the relative positions of the first and second electrodes fixed. A stage for placement on the XY axis plane of the system;
An imaging unit for imaging the first and second electrodes;
A storage unit for storing image data of the captured first and second electrodes;
Position data acquisition means for respectively acquiring data of a first point indicating the position of the first electrode and data of a second point indicating the position of the second electrode on the XY axis plane;
A drawing that uses the data of the first and second points to acquire data of a line image connecting the first and second points as bitmap data in which the XY-axis plane is divided into a plurality of pixels. Data acquisition means;
According to the data of the bitmap, a drawing unit that forms a wiring connecting the first and second electrodes by discharging a dispersion liquid containing conductive fine particles;
A wiring forming apparatus comprising: The wiring forming apparatus according to claim 6, wherein
The drawing data acquisition means includes
A wiring forming apparatus comprising bit map conversion means for calculating data of a geometric line connecting the first and second points and converting the data of the geometric line into data of the bit map. The wiring forming apparatus according to claim 6, wherein
The drawing data acquisition means includes
Selecting the first and second pixels corresponding to the positions of the first and second points, and selecting a plurality of third pixels connecting the first and second pixels, whereby the bitmap A wiring formation apparatus comprising bitmap selection means for acquiring the data of the above.

Images