JP5050995B2 - Bumped electronic component mounting apparatus and mounting method - Google Patents

Description

  The present invention relates to a bumped electronic component mounting apparatus and mounting method for mounting a bumped electronic component having a plurality of bumps formed on a lower surface thereof on a substrate.

  In recent years, with the progress of miniaturization and high functionality of electronic devices, electronic components incorporated in the electronic devices are required to have a high mounting density and are miniaturized and thinned. For this reason, thin electronic components such as circuit boards and semiconductor packages mounted on these circuit substrates are also less rigid and more likely to be warped by heating. In some cases, warping deformation has already occurred at the stage where the chip is sealed with resin. When such an electronic component is mounted on a substrate as it is, the solder bump of the portion where the warp deformation occurred is in a state of being lifted with respect to the substrate, and there is a tendency to create a gap between the solder paste printed on the electrode of the substrate. . As a result, the solder bumps are not properly soldered to the electrodes on the substrate, and bonding failures such as poor conduction and insufficient bonding strength are likely to occur. Such poor bonding due to warp deformation is prominent when a stacked semiconductor device is formed by stacking a plurality of semiconductor devices in which a semiconductor element is mounted on a substrate and sealed with a resin. This problem becomes more prominent as the substrate module constituting the laminated structure becomes thinner.

For this reason, an inspection device for inspecting the warp deformation state of the electronic component to determine whether the component is good or not may be attached to the mounting device for the bumped electronic component that easily causes warpage deformation. . That is, three-dimensional measurement is performed on a plurality of bumps formed on the lower surface of the electronic component, and the warped deformation state of the electronic component is detected based on the obtained measurement data (see Patent Document 1). In the prior art example shown in this patent document, the position of the measurement target point in the height direction is measured by laser measurement that irradiates the measurement target point from two directions.
JP 2000-205818 A

  However, the method for detecting warpage deformation of an electronic component by the laser measurement shown in the above prior art example has the following difficulties due to the measurement principle and the equipment used. That is, the above-described method requires a complicated apparatus for scanning the laser beam on the bump forming surface of the electronic component, and an increase in equipment cost is inevitable. Further, in the measurement, since a laser scanning operation is required to scan the bump forming surface with the laser beam a plurality of times along the bump row, it takes a certain amount of time for the measurement processing, and it is difficult to improve the working efficiency. As described above, in the prior art including the above-mentioned patent document examples, it is difficult to efficiently measure the warp deformation of the electronic component with bumps with a simple and inexpensive apparatus.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a mounting apparatus and mounting method for an electronic component with bumps that can efficiently measure warp deformation of the electronic component with bumps using a simple and inexpensive apparatus.

A bumped electronic component mounting apparatus according to the present invention is a bumped electronic component mounting apparatus for mounting a bumped electronic component having a plurality of bumps formed on a lower surface thereof on a substrate, the substrate holding unit holding the substrate, A mounting head for holding the electronic component; a head moving mechanism for moving the mounting head; and a movement path of the mounting head, which is applied to the bumps of the electronic component held by the mounting head by transfer. A paste transfer portion for supplying a paste-like bonding material for bonding the bumps in the form of a coating film formed on the coating film forming surface of the transfer stage, and the above-mentioned from the paste transfer portion to the substrate holding portion. A component imaging camera that is disposed in the movement path of the mounting head and images the electronic component after the bonding material has been transferred from the lower surface side, and a recognition result of the imaging result by the component imaging camera. By performing the pass / fail judgment of the adhesion state of the bonding material to the bump, a process for obtaining an adhesion amount index value serving as an index representing the adhesion amount of the bonding material for each bump and outputting it as adhesion amount index data. A warp deformation index value indicating a warp deformation state of the bumped electronic component based on the recognition amount index data and the adhesion amount index data, and comparing the warp deformation index value with a preset threshold value And an arithmetic processing unit for determining whether the attached electronic component is good or bad.

  The bumped electronic component mounting method according to the present invention includes a substrate holding portion that holds a substrate, a mounting head that holds an electronic component with bumps on which a plurality of bumps are formed, and a head moving mechanism that moves the mounting head. And a paste-like bonding material for bonding the bump, which is disposed on the movement path of the mounting head and applied to the bump of the electronic component held by the mounting head by transfer. A paste transfer portion that is supplied in the form of a coating film formed on the substrate, and an electron after the bonding material has been transferred, disposed in the movement path of the mounting head from the paste transfer portion to the substrate holding portion A bumped electronic component mounting method for mounting a bumped electronic component on a substrate by a bumped electronic component mounting apparatus including a component imaging camera for imaging the component from the lower surface side. Then, by performing a recognition process on the imaging result of the component imaging camera, a process for determining the quality of the adhesion state of the bonding material to the bump and obtaining adhesion amount index data serving as an index indicating the adhesion amount of the bonding material is performed. A warping deformation index value indicating a warp deformation state of the electronic component with bump is obtained based on the recognition processing step to be performed and the obtained adhesion amount index data, and the warp deformation index value is compared with a preset threshold value. And an arithmetic processing step for determining pass / fail of the bumped electronic component.

  According to the present invention, the recognition processing unit performs recognition processing on the imaging result of the component imaging camera, thereby performing the pass / fail determination of the adhesion state of the bonding material to the bumps and serving as an index representing the adhesion amount of the bonding material An index value is obtained for each bump and output as adhesion amount index data. Based on the adhesion amount index data obtained by the arithmetic processing unit, a warp deformation index value indicating a warp deformation state of the bumped electronic component is obtained. By determining the quality of the bumped electronic component by comparing the warpage deformation index value with a preset threshold value, the component imaging camera already installed in the conventional equipment and the image recognition function / arithmetic processing function can be used. Thus, the measurement of the warp deformation of the bumped electronic component can be efficiently performed with a simple and inexpensive apparatus.

  FIG. 1 is an explanatory diagram of a configuration of a mounting apparatus for bumped electronic components according to an embodiment of the present invention, and FIG. 2 is an electronic component with bumps to be mounted by the mounting apparatus for bumped electronic components according to an embodiment of the present invention. FIG. 3 and FIG. 4 are explanatory views of the transfer state of the bonding material to the bumps in the mounting apparatus for the electronic component with bumps according to the embodiment of the present invention, and FIG. 5 and FIG. It is explanatory drawing of the quality determination of the curvature deformation state of the electronic component in the mounting apparatus of the electronic component with bump of form.

  First, the configuration of a mounting apparatus 1 for bumped electronic components will be described with reference to FIG. The mounting device 1 for bumped electronic components has a function of mounting a bumped electronic component having a plurality of bumps formed on the lower surface thereof on a substrate. In FIG. 1, the substrate holding unit 2 includes a substrate holding table 3, and the substrate holding table 3 holds a substrate 4 to be mounted. An electronic component 5 with bumps (hereinafter simply referred to as “component 5”) shown in FIG. The component 5 is a semiconductor package such as a BGA, and a plurality of bumps 6 for external connection made of metal such as solder are formed on the lower surface of the component 5.

  The component 5 is a thin package and does not maintain a correct planar state in a state where the bumps 6 are formed, and is in a deformed state as shown in FIGS. 2B, 2A, and 2B. That is, in the example shown in FIGS. 2B and 2A, the component 5 is warped and deformed in a convex state, and the bump 6b located at the edge is warped rather than the bump 6a located at the center. The position is higher by the deformation amount Δh1. In the example shown in FIGS. 2B and 2B, on the contrary, the component 5 is warped and deformed in a convex state, and the bump 6a located at the center is more than the bump 6b located at the edge. Is higher by the warp deformation amount Δh2. Such a deformed state is not necessarily uniform depending on factors such as the package configuration and thermal history in the manufacturing process, and may show a different deformed state for each product type and for each individual.

  When such a warped deformed component 5 is mounted on the substrate 4, the contact state between the bump 6 and the connection land is not uniform, and a gap may be partially generated, resulting in poor bonding. It becomes a factor to reduce the sex. In particular, in the case of stack mounting in which a plurality of components 5 are stacked to form a stacked semiconductor device, as shown in FIG. 2C, depending on the deformation state of the two components 5 stacked up and down, The gaps Δh1 and Δh2 between the bumps 6a and the lands overlap to generate an excessive gap (Δh1 + Δh2), which may cause serious problems such as poor conduction. For this reason, in this embodiment, the state of warpage deformation of the component 5 in the mounting operation is individually inspected, and the component 5 having large warpage deformation is excluded from the mounting target, thereby causing problems such as poor bonding and poor conduction. Try to prevent.

  Above the substrate holding unit 2, a mounting head 7 that holds the component 5 and a head moving mechanism 8 that moves the mounting head 7 are disposed. The mounting operation for mounting the component 5 on the substrate 4 is performed by moving the mounting head 7 holding the component 5 by the head moving mechanism 8. On the side of the substrate holding unit 2, a paste transfer unit 10 including a transfer stage 11 is disposed in the moving path of the mounting head 7 by the head moving mechanism 8. The paste transfer unit 10 is a coating film formed on the coating film forming surface 11 a of the transfer stage 11 with a bonding paste material 12 for bonding applied to the bumps 6 of the component 5 held by the mounting head 7 by transfer. It is supplied in the form of 12a. The bonding material 12 is selected in accordance with a bonding method for bonding the bump 6 to the land of the substrate 4. The bonding material 12 may be a flux, cream solder containing solder particles in the flux, an epoxy resin adhesive such as silver. Various things, such as a conductive paste containing conductive particles, can be selected.

  The transfer stage 11 is a concave container having a smooth coating film forming surface 11a, and performs a squeegeeing operation in which the squeegee 13 is reciprocated horizontally (arrow a) along the coating film forming surface 11a by the squeegee driving unit 14. Thus, the coating film 12a of the bonding material 12 having a predetermined film thickness is formed on the coating film forming surface 11a. Then, in this state, the mounting head 7 holding the component 5 is lowered with respect to the transfer stage 11 (arrow b), and the bump 6 is brought into contact with the coating film 12a and then moved upward, thereby performing the bump 6 The bonding material 12 is applied by transfer.

  A component imaging camera 15 is disposed below the movement path (arrows c and d) of the mounting head 7 from the paste transfer unit 10 to the substrate holding unit 2 where the mounting head 7 holding the component 5 after the transfer operation is located. Yes. The component imaging camera 15 images the component 5 after the bonding material 12 is transferred to the bump 6 from the lower surface side. The imaging result of the component imaging camera 15 is sent to the recognition processing unit 16 where it is recognized. The recognition processing unit 16 performs a recognition process on an imaging result obtained by the component imaging camera, thereby determining whether or not the bonding material 12 is attached to the bump 6 and determining an adhesion amount index serving as an index indicating the adhesion amount of the bonding material 12. A process of obtaining a value for each bump 6 and outputting it as adhesion amount index data is performed.

The recognition result processed by the recognition processing unit 16 is sent to the control unit 17. The control unit 17 controls the squeegee driving unit 14 and the head moving mechanism 8 to transfer the bonding material 12 to the component 5 held by the mounting head 7, and to mount on the substrate 4 held by the substrate holding unit 2. The mounting operation of mounting and mounting the component 5 by the head 7 is controlled. Further, the control unit 17 has a function as a calculation processing unit that executes numerical calculation and determination processing, and together with the above-described operation control processing, the recognition result of the recognition processing unit 16, that is, the above-described adhesion obtained by the recognition processing. Based on the amount index data, a warp deformation index value indicating the warp deformation state of the part 5 is obtained, and the warp deformation index value is compared with a preset threshold value to determine whether the part 5 is good or bad.

  Next, processing performed by the above-described recognition processing unit 16 and control unit 17 will be described with reference to FIG. FIG. 3A shows the transfer operation of the bonding material 12 in the paste transfer unit 10. In this transfer operation, the component 5 is held by the mounting head 7 and is lowered with respect to the coating film 12a formed on the transfer stage 11, and the lower end portion of the bump 6 is brought into contact with the coating film 12a. The bonding material 12 is applied by transfer. At this time, by finely adjusting the lowering stop position of the mounting head 7, the sinking height h for sinking the lower end portion of the bump 6 into the coating film from the liquid surface of the coating film 12 a is set to the bump 6 of the bonding material 12. Is set according to the desired transfer amount.

FIG. 3B is a side view showing a state in which the bonding material 12 is applied and adhered to the lower end portion of the bump 6 by this transfer operation. In other words, the lower end of the bump 6 of the bump height H _0, the bonding material 12 of the attachment height H corresponding to the height h sinking of the set coating film 12a in accordance with the H ₀ is applied . Then, the bump 6 in this state is imaged from below by the component imaging camera 15 to obtain an image shown in FIG. In this image, an image of the bonding material 12 separated from the bumps 6 by a substantially circumferential contour line 12c is obtained inside the contour line 6c indicating the outer shape of the bump 6. Note that the type of the bonding material 12 used here is selected on the assumption that the quality determination of the application state is performed by image recognition. Colors that can be distinguished from the bumps 6 on the image acquired by the component imaging camera 15 are selected. Those having characteristics are used.

  Based on the image acquired in this way, the recognition processing unit 16 determines whether the bonding material 12 is transferred or not by transferring the bonding material 12, and as shown in FIG. An amount index value is obtained for each bump, and output processing is performed as adhesion amount index data bundled for each component 5. Here, an example is shown in which the bonding material adhesion diameter d calculated by circularly approximating the range in which the bonding material 12 adheres to the bump 6 is obtained as the adhesion amount index value.

  That is, the recognition processing unit 16 calculates the area S of the planar adhesion range of the bonding material in each obtained bump by performing image processing on the contour line 12c in the image of the imaging result shown in FIG. To do. Further, the recognition processing unit 16 obtains an approximate circle 12d that approximates the adhesion range by a circle, and then obtains a bonding material adhesion diameter d defined by the diameter of the approximate circle 12d as an adhesion amount index value. Output. Then, the control unit 17 as an arithmetic processing unit, based on the bonding material adhesion diameter d obtained by the recognition processing unit 16 and the outer diameter D of the approximate sphere that approximates the outer shape of the bump 6 to a sphere, provides a plurality of bumps 6. The bonding material adhesion height H indicating the height dimension of the bonding material 12 adhered to the surface is calculated for each bump 6 individually.

As shown in FIG. 4, the bonding material adhesion height H is calculated using a calculation formula of H = (D− (D ² −d ² ) ^1/2 ) / 2. Then, by binding these individual bonding material adhesion heights H for each component 5, the bonding material adhesion height data for the component 5 is created. As the outer diameter D of the bump 6, a value given in advance as the component data of the component 5 may be uniformly used for all the bumps 6, and the recognition processing unit 16 performs recognition processing on the captured image. You may make it detect individually for every bump 6. FIG.

  Further, the control unit 17 performs a process of calculating a warp deformation amount in the height direction of the component 5 as a warp deformation index value based on the bonding material adhesion height data. Based on the calculated warp deformation index value, the control unit 17 determines whether the warp deformation state of the part 5 is acceptable. That is, here, an example is shown in which the amount of warpage in the height direction represented by the difference in height position of each part in the component 5 is used as the warp deformation index value.

  These processes will be described with reference to FIGS. FIG. 5 is a plan view of the bonding state of the bonding material 12 to the bump 6 as seen from the side cross section and the lower surface side of each of the warped deformation states of the component 5 shown in FIG. is there. Here, the side cross section of the component 5 shows an AA cross section in a plan view. FIG. 5A shows the distribution of the adhesion amount of the bonding material 12 to each bump 6 when the component 5 is warped upwardly. In this case, the adhesion amount of the bonding material 12 on the bump 6a located at the center of the component 5 is small, and the adhesion amount of the bonding material 12 on the bump 6b located at the edge is the largest. Therefore, the bonding material adhesion height H shown in FIG. 4 is the largest in the bump 6b and the smallest in the bump 6a. On the other hand, FIG. 5B shows the distribution of the adhesion amount of the bonding material 12 to each bump 6 when the component 5 is warped downwardly. In this case, since the adhesion amount of the bonding material 12 on the bump 6a located in the center of the component 5 is large and the adhesion amount of the bonding material 12 on the bump 6b located on the edge is the smallest, the bonding material shown in FIG. The adhesion height H is the smallest at the bump 6b and the largest at the bump 6a.

  Since the transfer of the bonding material 12 on each bump 6 is performed by sinking the bump 6 into the coating film 12a formed at the same liquid level, as shown in FIG. The difference ΔH between the bonding material adhesion heights Hi and Hj in the two bumps 6 (6i and 6j) is equal to the height difference ΔH of the component 5 at the positions of the bumps 6i and 6j.

  Therefore, the amount of warpage deformation of the component 5 can be detected by calculating the difference in the bonding material adhesion height H of the bumps at a plurality of positions specified in advance as the detection target positions of the warpage deformation state in the component 5. . That is, in the position of a plurality of bumps shown in FIG. 6B, for example, in the rectangular part 5, the bump 6a located at the center and the bump 6b at the edge located at the midpoint of each side, or diagonally with the bump 6a. In accordance with the deformation characteristics of the target component 5 such as the bump 6d that is positioned, the bump 6i and the bump 6j that can most appropriately evaluate the warpage deformation are set. The warpage deformation state can be estimated by obtaining the height difference ΔH of the component 5 at the positions of the bumps 6i and 6j.

  At this time, the setting of the bumps 6i and 6j that are the objects for which the height difference ΔH is obtained is appropriately set according to the characteristics of the target parts. In other words, the height difference ΔH of the bonding material adhesion height H between two predetermined specific bumps 6 such as the bump 6a and one bump 6b or the bump 6a and one bump 6d is used as a warp deformation index value. The warp deformation state may be determined based on the warp deformation index value, and an average value of a plurality of (here, four) bumps 6b and bumps 6d is obtained, and the average value of these bumps and the bonding material of the bumps 6a are obtained. You may make it use height difference (DELTA) H with the adhesion height H as a curvature deformation | transformation index value. Further, the bonding material adhesion height H is obtained for all the bumps 6 in the component 5, and the height difference ΔH between the maximum value Hmax and the minimum value Hmin among these bonding material adhesion heights H is used as the warp deformation index value. You may do it.

  Here, the control unit 17 as the arithmetic processing unit performs the bonding material adhesion height H in the bump 6 located at a plurality of preset specific positions or the bonding material adhesion height in the bonding material adhesion height data of the component 5. Based on the maximum value Hmax and the minimum value Hmin of the height H, a height difference ΔH as a warp deformation amount is calculated. In any case, if the calculated height difference ΔH is equal to or greater than a threshold value ΔHth determined in advance according to the type of the component 5, the component 5 cannot be used as an actual product. As an electronic component mounting line.

  That is, the mounting method of the electronic component with bump which mounts the component 5 on the substrate 4 by the mounting device 1 of the electronic component with bump shown in the present embodiment includes the following steps. First, the recognition processing unit 16 performs recognition processing on the imaging result of the component imaging camera 15 to determine whether the bonding material 12 is attached to the bump 6 and to determine whether the bonding material 12 is attached. Processing for obtaining quantity index data is performed (recognition processing step). Next, based on the obtained adhesion amount index data, a warp deformation index value indicating a warp deformation state of the part 5 is obtained, and the warp deformation index value is compared with a preset threshold value to thereby determine the warpage deformation index value of the part 5. A pass / fail judgment is performed (arithmetic processing step).

  In the recognition processing step, an approximate circle is obtained by approximating the planar adhesion range of the bonding material 12 on each bump 6 obtained from the imaging result of the component imaging camera 15 to a circle, and further defined by the diameter size of the approximate circle. The bonded material adhesion diameter d is output as adhesion amount index data. In the arithmetic processing step, the height dimension of the bonding material 12 attached to the plurality of bumps 6 is shown based on the bonding material attachment diameter d and the outer diameter D of an approximate sphere that approximates the outer shape of the bump 6 to a sphere. The bonding material adhesion height H is calculated individually for each bump 6 to obtain the bonding material adhesion height data of the component 5, and further, based on the bonding material adhesion height data, the height direction of the component 5 is calculated. The amount of warp deformation is calculated as a warp deformation index value. In the calculation processing step, as described above, in the method of calculating the warp deformation amount based on the bonding material adhesion height H in the bumps located at a plurality of preset specific positions, or in the bonding material adhesion height data Based on the maximum value Hmax and the minimum value Hmin, one of the methods for calculating the warp deformation amount is selected.

  In the above embodiment, the bonding material adhesion diameter d is obtained by recognizing an image obtained by imaging the lower surface of the component 5, and the bonding material adhesion height H is derived from the bonding material adhesion diameter d and the bump outer shape D. Further, although an algorithm for determining the warp deformation state of the part 5 from the variation state of the bonding material adhesion height H is used, the algorithm for determining the warp deformation state from the image of the lower surface of the part 5 is not necessarily limited to the bonding material adhesion height. It is not necessary to go through the process of calculating the height H.

  That is, the bonding material adhesion diameter d detected from the image is obtained by circularly approximating the application range of the bonding material 12 on each bump 6a and obtained as the diameter of this approximate circle. There is a correspondence represented by a mathematical formula between the approximate circular area indicating the application range of the material 12. Therefore, the application area of the bonding material 12 on each bump 6a may be obtained from the image of the lower surface of the component 5, and the warped deformation state of the component 5 may be directly estimated from the variation in the application area of the component 5.

  In this case, the application area calculated by the image recognition itself corresponds to an adhesion amount index value as an index representing the adhesion amount of the bonding material 12, and data in which the application area for each bump is bundled for the relevant part is attached. It becomes quantity index data. In the quality determination of the warp deformation state, similarly to the case where the above-described bonding material adhesion height is used as the adhesion amount index value, the difference in application area between bumps located at a plurality of preset specific positions, or the part concerned By comparing the difference between the maximum value and the minimum value of the application area in the adhesion amount index data, the quality of the warped deformation state of the part is determined.

As described above, in the mounting apparatus and mounting method for electronic components with bumps shown in the present embodiment, the recognition processing unit 16 performs recognition processing of the imaging result of the component imaging camera 15, thereby bonding the bump 6 to the bonding material. 12 is a calculation processing unit that performs a process of determining whether or not the adhesion state of the adhesive material 12 is acceptable and obtaining an adhesion amount index value that is an index representing the adhesion amount of the bonding material 12 for each bump 6 and outputting it as adhesion amount index data. Based on the adhesion amount index data obtained by the control unit 17, a warp deformation index value indicating the warp deformation state of the part 5 is obtained, and the warp deformation index value is compared with a preset threshold value, thereby the part 5. The quality of the warp deformation state is determined.

  This makes it possible to effectively utilize the functions already installed in a normal mounting device without requiring a complicated and expensive device such as a laser measuring device required for detecting the same warp deformation in the prior art. Thus, the quality of the warped deformation state can be determined. In addition, when detecting warping deformation, it does not require a laser scanning operation to scan the bump formation surface with a laser beam, and it can also detect warpage deformation in the part recognition processing that has been performed conventionally, so it is compared with the conventional technology. And work efficiency is excellent. That is, in the mounting of the electronic component with bump shown in the present embodiment, it is possible to efficiently measure the warp deformation of the electronic component with bump with a simple and inexpensive apparatus.

  The mounting apparatus and mounting method for a bumped electronic component according to the present invention has an effect that the measurement of warp deformation of the bumped electronic component can be efficiently performed with a simple and inexpensive apparatus, and the electronic component on which the bump is formed. This is useful in the field of mounting on a substrate.

Configuration explanatory diagram of a mounting apparatus for electronic components with bumps according to an embodiment of the present invention Explanatory drawing of the electronic component with bump used as the mounting object by the mounting apparatus of the electronic component with bump of one embodiment of this invention Explanatory drawing of the transfer state to the bump of the bonding | jointing material in the mounting apparatus of the electronic component with bump of one embodiment of this invention Explanatory drawing of the transfer state to the bump of the bonding | jointing material in the mounting apparatus of the electronic component with bump of one embodiment of this invention Explanatory drawing of the quality determination of the curvature deformation state of the electronic component in the mounting apparatus of the electronic component with bump of one embodiment of this invention Explanatory drawing of the quality determination of the curvature deformation state of the electronic component in the mounting apparatus of the electronic component with bump of one embodiment of this invention

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Mounting apparatus of electronic component with bump 2 Substrate holding part 4 Substrate 5 Component (electronic component with bump)
6, 6a, 6b, 6d Bump 7 Mounting head 8 Head moving mechanism 10 Paste transfer part 11 Transfer stage 11a Coating film forming surface 12 Bonding material 12a Coating film H Bonding material adhesion height d Bonding material adhesion diameter

Claims (6)

A bumped electronic component mounting apparatus for mounting a bumped electronic component having a plurality of bumps formed on a lower surface thereof on a substrate,
A substrate holding unit that holds the substrate, a mounting head that holds the electronic component, a head moving mechanism that moves the mounting head, and an electron that is disposed in the moving path of the mounting head and is held by the mounting head A paste transfer portion for supplying a paste-like bonding material for bonding the bumps applied by transfer to the bumps of the component in the form of a coating film formed on the coating film forming surface of the transfer stage;
A component imaging camera that is disposed in a movement path of the mounting head from the paste transfer unit to the substrate holding unit, and that images an electronic component after the bonding material has been transferred, from the lower surface side;
By performing recognition processing on the imaging result obtained by the component imaging camera, it is possible to determine whether the bonding material adheres to the bumps and to determine an adhesion amount index value for each bump, which serves as an index representing the bonding material adhesion amount. A recognition processing unit that performs processing to output as adhesion amount index data,
The warp deformation index value indicating the warp deformation state of the bumped electronic component is obtained based on the adhesion amount index data, and the pass / fail determination of the electronic component with bump is determined by comparing the warp deformation index value with a preset threshold value. A mounting apparatus for electronic components with bumps, comprising: The recognition processing unit obtains an approximate circle that approximates a circular adhesion range of the bonding material in each bump obtained from the imaging result, and further calculates a bonding material adhesion diameter defined by the diameter of the approximate circle. Obtained as the adhesion amount index value,
The arithmetic processing unit indicates a height dimension of the bonding material adhered to the plurality of bumps based on the obtained bonding material adhesion diameter and an outer diameter dimension of an approximate sphere that approximates the outer shape of the bump to a spherical shape. The bonding material adhesion height is calculated individually for each bump to obtain the bonding material adhesion height data for the bumped electronic component, and the height direction of the bumped electronic component is further calculated based on the bonding material adhesion height data. The apparatus for mounting a bumped electronic component according to claim 1, wherein the amount of warp deformation is calculated as the warp deformation index value.   The arithmetic processing unit calculates the warp deformation amount based on the bonding material adhesion height at bumps located at a plurality of preset specific positions, or the maximum value and the minimum value in the bonding material adhesion height data. The apparatus for mounting electronic components with bumps according to claim 2. A substrate holding portion for holding a substrate, a mounting head for holding an electronic component with bumps on which a plurality of bumps are formed on a lower surface, a head moving mechanism for moving the mounting head, and a moving path of the mounting head. A paste for supplying a paste-like bonding material for bonding the bump applied by transfer to the bump of the electronic component held by the mounting head in the form of a coating film formed on the coating film forming surface of the transfer stage A transfer unit, and a component imaging camera that is disposed in a movement path of the mounting head from the paste transfer unit to the substrate holding unit and images the electronic component after the bonding material has been transferred from the lower surface side. A bumped electronic component mounting method for mounting a bumped electronic component on a substrate by a bumped electronic component mounting apparatus comprising:
Recognition processing for recognizing the adhesion result of the bonding material to the bump by performing recognition processing on the imaging result of the component imaging camera, and performing processing for obtaining adhesion amount index data serving as an index representing the adhesion amount of the bonding material Processing steps;
Based on the obtained adhesion amount index data, a warp deformation index value indicating a warp deformation state of the bumped electronic component is obtained, and the warp deformation index value is compared with a preset threshold value, thereby the bumped electronic component. A method of mounting a bumped electronic component, comprising: an arithmetic processing step for determining whether the product is good or bad. In the recognition processing step, an approximate circle that approximates the planar adhesion range of the bonding material in each bump obtained from the imaging result to a circle is obtained, and a bonding material adhesion diameter defined by the diameter size of the approximate circle is further determined. Output as the adhesion amount index data,
In the calculation processing step, a bonding material adhesion height indicating a height dimension of the bonding material adhered to the plurality of bumps based on an outer diameter dimension of an approximate sphere that approximates a spherical shape of the bonding material adhesion diameter and the outer shape of the bump. The height is calculated individually for each bump and obtained as bonding material adhesion height data of the electronic component with bump, and the warping deformation amount in the height direction of the electronic component with bump is further calculated based on the bonding material adhesion height data. The method of mounting a bumped electronic component according to claim 4, wherein: is calculated as the warp deformation index value.   In the arithmetic processing step, the warpage deformation amount is calculated based on the bonding material adhesion height at bumps located at a plurality of preset specific positions, or the maximum value and the minimum value in the bonding material adhesion height data. The method for mounting a bumped electronic component according to claim 5.

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